Radiator

Abstract

The utility model relates to the technical field of camera equipment, in particular to a radiator. Comprising a shell, a fan assembly and a limiting assembly, a heat dissipation frame is arranged in the shell, and a hollow structure corresponding to the heat dissipation frame is arranged on the shell; the fan assembly is arranged on the heat dissipation frame in the shell; the limiting assembly is arranged on one side face in the length direction of the shell and comprises an elastic piece, a limiting rotary knob and a telescopic frame, the elastic piece is arranged between the telescopic frame and the shell, the limiting rotary knob and the telescopic frame are correspondingly arranged, the limiting rotary knob is in threaded connection with the shell, and the limiting rotary knob is in threaded connection with the shell. And the telescopic frame is limited by rotating the limiting knob. The problem that connection between a radiator and a camera is not firm and stable due to the connection mode of the radiator on the camera in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of camera equipment, in particular to a radiator. Background Art

[0002] A camera is a device that uses the principle of optical imaging to form images and uses film to record images. It is an optical instrument used for photography. The heat generated by the electronic components inside the camera after long-term use will affect the image quality.

[0003] Therefore, a radiator specially used for camera heat dissipation has appeared on the market. This type of radiator is directly installed on the corresponding heating area of ​​the camera. The heat inside the camera is taken away by the heat dissipation elements such as the fan inside the radiator, thereby achieving the effect of cooling the camera.

[0004] The heat sink of a traditional camera is detachably connected to the camera by means of snaps, sticking, etc. This connection method cannot ensure that the heat sink is firmly and stably connected to the camera. The heat sink is prone to shaking and displacement during the use of the camera, thereby affecting the heat dissipation effect of the heat sink on the camera. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the utility model is to provide a heat sink to solve the problem that the connection method of the heat sink on the camera in the prior art easily leads to a loose and unstable connection between the heat sink and the camera.

[0006] The utility model discloses a radiator, comprising: a shell, a fan assembly and a limit assembly, wherein a heat sink is arranged in the shell, and a hollow structure corresponding to the heat sink is arranged on the shell; the fan assembly is arranged on the heat sink in the shell; the limit assembly is arranged on a side surface of the shell in the length direction, and the limit assembly comprises an elastic member, a limit knob and a telescopic frame, the elastic member is arranged between the telescopic frame and the shell, the limit knob is arranged corresponding to the telescopic frame, and the limit knob is threadedly connected to the shell so as to limit the telescopic frame by rotating the limit knob.

[0007] Optionally, the heat sink includes a heat-conducting base and a plurality of heat sinks disposed on the heat-conducting base, and the heat sinks are disposed around the fan assembly.

[0008] Optionally, the limit knob includes a turntable and a screw rod connected to each other, the screw rod is threadedly connected to the shell, and the turntable is arranged between the shell and the telescopic frame.

[0009] Optionally, the telescopic frame includes two rod bodies and connecting arms arranged at the ends of the rod bodies, the rod bodies are provided with a limit platform, the elastic member is arranged between the limit platform and the shell, one side of the connecting arm is used to abut against the heating element, and the other side is used to abut against the turntable.

[0010] Optionally, a accommodating groove is respectively provided on two opposite sides along the width direction of the shell, a limiting protrusion is provided at the bottom of the accommodating groove, the rod body is arranged in the accommodating groove and is slidably connected to the accommodating groove, one end of the elastic member is sleeved on the limiting protrusion, and the other end is against the limiting platform.

[0011] Optionally, the shell includes an upper half and a lower half, the upper half is a hollow structure, the accommodating groove is arranged in the lower half, and the heat dissipation frame is arranged between the upper half and the lower half.

[0012] Optionally, the radiator further comprises a rubber pad and a heat conductive sheet, the rubber pad is respectively arranged on a side of the connecting arm away from the rod body and a side of the shell away from the limiting assembly, and the heat conductive sheet is arranged on a side of the lower body away from the heat dissipation frame.

[0013] Optionally, the radiator also includes a circuit board and a semiconductor refrigerator, the circuit board is electrically connected to the fan assembly, the circuit board is connected to the upper body, the lower body is provided with a through groove, the semiconductor refrigerator is arranged in the through groove, the cold surface of the semiconductor refrigerator is in contact with the heat conductive sheet, and the circuit board is connected to a connection port and a control button.

[0014] Optionally, a temperature sensor and a controller are electrically connected to the circuit board, and the controller is used to control the operating power of the fan assembly and the semiconductor refrigerator according to feedback from the temperature sensor.

[0015] Optionally, the temperature sensor is an infrared detection head or a thermistor. When the temperature sensor is a thermistor, the thermistor is arranged in a groove of the lower body facing the thermal conductive plate; when the temperature sensor is an infrared detection head, the infrared detection head is arranged in a channel connecting the lower body and the thermal conductive plate.

[0016] Compared with the prior art, the beneficial effect of the radiator provided by the embodiment of the utility model is that the fan assembly is arranged on the heat dissipation frame in the shell, and when the fan assembly is working, the camera can be effectively cooled, the operating temperature of the camera can be reduced, and the stability and service life of the camera can be improved. The hollow structure of the shell is arranged corresponding to the heat dissipation frame, which can be used to increase the contact area between the heat dissipation frame and the air, and improve the heat dissipation efficiency of the radiator. On the other hand, it can facilitate the fan assembly to guide the airflow into the fan assembly and blow it out to the outside, so that the fan assembly has a stronger ability to guide the airflow, thereby enhancing the heat dissipation effect of the radiator on the camera equipment, and also facilitates the maintenance and replacement of the fan assembly. In actual use, it is necessary to press the telescopic frame in the limit assembly first, so that the telescopic frame moves toward the shell, and the elastic member between the shell and the telescopic frame is squeezed and deformed during the movement of the telescopic frame, so that the elastic member has elastic force. After the adjusted radiator is placed at the corresponding position of the camera, the elastic member drives the telescopic frame to move in the direction away from the radiator due to the elastic force, so that the telescopic frame and the camera are offset, so that the radiator is clamped at the corresponding position of the camera. Then, the limit knob is rotated to move away from the housing and gradually abut against the telescopic frame, and finally the telescopic frame and the camera are abutted. The limit knob limits the telescopic frame, which can further improve the stability of the abutment between the telescopic frame and the camera, and avoid problems such as shaking or displacement of the radiator during use, which affects the heat dissipation effect of the radiator. The radiator remains stable on the camera, which can ensure that the radiator can dissipate heat stably and efficiently for the camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The technical solution of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0018] Figure 1 This is one of the schematic diagrams of the radiator provided by the embodiment of the utility model;

[0019] Figure 2 This is one of the exploded schematic diagrams of the radiator provided by the embodiment of the utility model;

[0020] Figure 3 It is a schematic diagram of the lower body, elastic member and telescopic frame provided by the embodiment of the utility model;

[0021] Figure 4 This is the second schematic diagram of the radiator provided by the embodiment of the utility model;

[0022] Figure 5 This is the second explosion diagram of the radiator provided in the embodiment of the utility model.

[0023] The reference numerals in the figures are:

[0024] 1000, radiator; 100, shell; 101, heat sink; 1011, thermal base; 1012, heat sink; 102, receiving groove; 1021, limiting protrusion; 103, upper body; 104, lower body; 1041, through groove; 1042, groove; 200, fan assembly; 300, limiting assembly; 301, elastic member; 302, limiting knob; 3021, turntable; 3022, screw; 303, telescopic frame; 3031, rod body; 30311, limiting platform; 3032, connecting arm; 400, rubber pad; 500, circuit board; 501, connection port; 502, control button; 600, semiconductor refrigerator; 601, cold surface; 700, thermistor; 800, thermal conductive sheet. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.

[0026] The present utility model embodiment provides a heat sink 1000, such as Figure 1-3 As shown, it includes: a shell 100, a fan assembly 200 and a limit assembly 300. The shell 100 is provided with a heat sink 101, and the shell 100 is provided with a hollow structure corresponding to the heat sink 101; the fan assembly 200 is arranged on the heat sink 101 in the shell 100; the limit assembly 300 is arranged on a side surface of the shell 100 in the length direction, and the limit assembly 300 includes an elastic member 301, a limit knob 302 and a telescopic frame 303. The elastic member 301 is arranged between the telescopic frame 303 and the shell 100, the limit knob 302 is arranged corresponding to the telescopic frame 303, and the limit knob 302 is threadedly connected to the shell 100 so as to limit the telescopic frame 303 by rotating the limit knob 302.

[0027] The fan assembly 200 is arranged on the heat sink 101 in the housing 100. When the fan assembly 200 is working, it can effectively dissipate heat for the camera, reduce the operating temperature of the camera, and improve the stability and service life of the camera. The hollow structure of the housing 100 is arranged corresponding to the heat sink 101. On the one hand, it can be used to increase the contact area between the heat sink 101 and the air, and improve the heat dissipation efficiency of the radiator 1000. On the other hand, it can facilitate the fan assembly 200 to guide the airflow into the fan assembly 200 and blow it out to the outside, so that the fan assembly 200 has a stronger ability to guide the airflow, thereby enhancing the heat dissipation effect of the radiator 1000 on the camera equipment, and also facilitates the maintenance and replacement of the fan assembly 200. In actual use, it is necessary to press the telescopic frame 303 in the limit assembly 300 first, so that the telescopic frame 303 moves toward the housing 100, and in the process of the telescopic frame 303 moving, the elastic member 301 between the housing 100 and the telescopic frame 303 is squeezed and deformed, so that the elastic member 301 has elastic force. After the adjusted radiator 1000 is placed at the corresponding position of the camera, the elastic member 301 drives the telescopic frame 303 to move away from the radiator 1000 due to the elastic force, so that the telescopic frame 303 abuts against the camera, so that the radiator 1000 is stuck at the corresponding position of the camera. Then, the limit knob 302 is rotated to make the limit knob 302 move away from the housing 100 and gradually abut against the telescopic frame 303, and finally the telescopic frame 303 abuts against the camera. The limit structure of the limit knob 302 limiting the telescopic frame 303 can further improve the stability of the abutment between the telescopic frame 303 and the camera, and avoid the radiator 1000 from shaking or displacement during use, which affects the heat dissipation effect of the radiator 1000. The radiator 1000 remains stable on the camera, which can ensure that the radiator 1000 can dissipate heat stably and efficiently for the camera.

[0028] It should be noted that, when the radiator 1000 is not in use, the elastic member 301 is fully extended, driving the telescopic frame 303 to extend to the maximum distance. When the radiator 1000 needs to be brought into contact with the camera, the telescopic frame 303 is pressed to press the elastic member 301, so that the elastic member 301 is deformed to generate elastic force. After the radiator 1000 is brought into contact with the camera, the elastic member 301 releases elastic potential energy to drive the telescopic frame 303 to move, and during the movement, it contacts the corresponding position of the camera, so that the radiator 1000 is stably connected to the camera. It is usually necessary to place the radiator 1000 in the groove of the camera's flip screen. This area contains a large number of the camera's heating components, so the radiator 1000 is placed in this area.

[0029] Specifically, the user can limit the telescopic frame 303 by turning the limit knob 302 to prevent the radiator 1000 from being affected by vibration, which causes the telescopic frame 303 to be retracted to a certain extent in the shell 100, further strengthening the connection stability between the telescopic frame 303 and the camera, and ensuring the accuracy and stability of the position of the radiator 1000 during installation.

[0030] Specifically, the fan assembly 200 includes a driving motor and fan blades.

[0031] refer to Figure 2 The heat sink 101 includes a heat conductive base 1011 and a plurality of heat sinks 1012 disposed on the heat conductive base 1011 . The heat sinks 1012 are disposed around the fan assembly 200 .

[0032] A plurality of heat sinks 1012 surrounding the fan assembly 200 are provided on the heat conductive base 1011, and an air duct guiding the air flow can be formed between two adjacent heat sinks 1012, so that the air can pass through the fan assembly 200 more effectively, thereby enhancing the heat dissipation efficiency and improving the heat dissipation performance of the heat sink 1000. The heat sink 1012 surrounding the fan assembly 200 can optimize the air flow path, reduce the resistance and eddy current of the air flow, ensure that the air can fully cover the corresponding area of ​​the camera, and improve the heat dissipation effect of the heat sink 1000. At the same time, the heat sink can increase the contact area between the heat sink 101 and the air, so that the heat on the heat sink 101 can be transferred to the surrounding air more quickly through the heat sink 1012, thereby improving the heat dissipation efficiency of the heat sink 101.

[0033] Specifically, by setting the heat sink 1012, the air flow direction is reasonably guided, which can reduce the noise generated by the fan assembly 200 when it is working, avoid affecting the shooting or recording of the camera, and improve the comfort and usage experience when using the radiator 1000.

[0034] On the other hand, a plurality of heat sinks are disposed in the housing 100 , which can increase the structural stability of the heat sink 1000 , reduce vibration and noise, and extend the service life of the heat sink 1000 .

[0035] refer to Figure 4 The limit knob 302 includes a turntable 3021 and a screw rod 3022 which are connected to each other. The screw rod 3022 is threadedly connected to the housing 100 . The turntable 3021 is arranged between the housing 100 and the telescopic frame 303 .

[0036] The rotating disk 3021 is rotated to rotate the screw rod 3022 relative to the housing 100 to adjust the position of the limit knob 302 relative to the housing 100. The screw rod 3022 is threadedly connected to the housing 100, so that the limit knob 302 can be accurately adjusted. The user can better and more accurately control the position of the limit knob 302 to ensure that the limit knob 302 abuts against the telescopic frame 303, and the limit knob 302 will not lose the limit effect due to the unstable contact caused by the gap between the rotating disk 3021 and the telescopic frame 303 being too large, and the telescopic frame 303 will not be deformed and damaged due to the excessive fit between the rotating disk 3021 and the telescopic frame 303.

[0037] Specifically, the threaded connection between the screw rod 3022 and the housing 100 is a relatively stable connection method, ensuring that the limit knob 302 will not loosen or fall off during the adjustment process or when the adjustment is completed to support the telescopic frame 303, thereby ensuring the reliability and stability of the limit assembly 300.

[0038] On the other hand, due to the threaded connection between the screw rod 3022 and the housing 100 , the user can adjust the limit knob 302 by simply rotating the turntable 3021 , making the operation of the limit knob 302 easy and convenient, thereby reducing the difficulty of installing and fixing the radiator 1000 .

[0039] refer to Figure 3 The telescopic frame 303 includes two rod bodies 3031, and a connecting arm 3032 arranged at the end of the rod body 3031, an upper limit platform 30311 on the rod body 3031, and the elastic member 301 is arranged between the limit platform 30311 and the shell 100. One side of the connecting arm 3032 is used to abut against the turntable 3021, and the other side is used to abut against the heating element.

[0040] The elastic member 301 is disposed between the limiting platform 30311 and the housing 100, and can drive the telescopic frame 303 to move relative to the housing 100 through the deformation of the elastic member 301. The limiting platform 30311 can realize the limiting function of the elastic member 301, and the elastic member 301 can be smoothly squeezed or stretched during the movement of the telescopic frame 303, ensuring that the elastic member 301 will not be displaced or misaligned during the squeezing or stretching process.

[0041] Specifically, the side of the rod body 3031 facing the housing 100 is used to abut against the turntable 3021 in the limit knob 302. The turntable 3021 can limit and position the telescopic frame 303, ensuring that the telescopic frame 303 will not shake or loosen when abutting against the camera, thereby improving the connection stability between the telescopic frame 303 and the camera.

[0042] Specifically, the elastic member 301 is disposed between the limiting platform 30311 and the housing 100 , and can provide a certain elastic buffering effect for the rod body 3031 , reduce the influence of external vibration on the telescopic frame 303 , and protect the radiator 1000 .

[0043] refer to Figure 3 A receiving groove 102 is respectively provided on two opposite sides along the width direction of the shell 100, and a limiting protrusion 1021 is provided at the bottom of the receiving groove 102. The rod body 3031 is disposed in the receiving groove 102 and is slidably connected to the receiving groove 102. One end of the elastic member 301 is sleeved on the limiting protrusion 1021, and the other end is against the limiting platform 30311.

[0044] The accommodating groove 102 is slidably connected to the rod body 3031, which can ensure that the rod body 3031 moves stably in the accommodating groove 102, prevent the rod body 3031 from shaking or falling off during use, and improve the stability of the overall structure. The elastic member 301 is arranged between the limiting protrusion 1021 and the limiting platform 30311, which can help improve the accurate positioning between the elastic member 301 and the rod body 3031, ensure that the rod body 3031 and the elastic member 301 are in the correct position, thereby ensuring the accuracy of assembly and use of the radiator 1000. On the other hand, the elastic member 301 and the limiting platform 30311 are offset against each other, which can ensure the reliability of the connection between the two, prevent the elastic member 301 from falling off or failing during use, and increase the durability of the overall structure.

[0045] Specifically, one end of the elastic member 301 is sleeved on the limiting protrusion 1021, so that the elastic member 301 can be stably connected to the limiting protrusion 1021, and the other end is abutted against the limiting platform 30311, so that the elastic member 301 can be squeezed following the movement of the rod body 3031, ensuring that the elastic structure of the elastic member 301 can help the telescopic frame 303 to move.

[0046] refer to Figure 2 The shell 100 includes an upper body 103 and a lower body 104 . The upper body 103 is a hollow structure. The receiving groove 102 is disposed in the lower body 104 . The heat dissipation frame 101 is disposed between the upper body 103 and the lower body 104 .

[0047] The upper body 103 adopts a hollow structure corresponding to the heat sink 101, which is not only conducive to heat dissipation, but also helps air circulation, avoids heat accumulation around the upper body 103, and improves the overall heat dissipation effect of the radiator 1000. At the same time, the overall weight of the radiator 1000 can be effectively reduced, making it easier to install and carry, and reducing the pressure on the overall support structure. The heat sink 101 is located between the upper body 103 and the lower body 104, making the installation of the heat sink 101 relatively simple and convenient, and improving the convenience and efficiency of installation. At the same time, there is also a certain amount of accommodation space between the upper body 103 and the heat sink 101, and between the heat sink 101 and the lower body 104, which can be used to accommodate components or structures such as the circuit board 500 and the semiconductor refrigerator 600.

[0048] Specifically, the hollow structure of the upper body 103 can increase air circulation, improve the heat dissipation efficiency of the radiator 1000, and reduce the operating temperature, thereby protecting the radiator 1000 and extending its service life. The heat dissipation frame 101 disposed between the upper body 103 and the lower body 104 can also increase the stability of the overall structure, effectively preventing the radiator 1000 from deformation or loosening during use, and ensuring its normal operation.

[0049] refer to Figure 2 The heat sink 1000 also includes a rubber pad 400 and a heat conductive sheet 800 . The rubber pad 400 is respectively arranged on a side of the connecting arm 3032 away from the rod body 3031 and a side of the shell 100 away from the limiting assembly 300 . The heat conductive sheet 800 is arranged on a side of the lower body 104 away from the heat sink 101 .

[0050] The rubber pad 400 can increase the friction between the housing 100 and the connecting arm 3032 and the camera respectively, prevent the radiator 1000 from sliding relative to the camera during use, and ensure the stability and reliability of the connection. The rubber pad 400 can also provide a certain shock-absorbing and buffering effect, reduce the impact of external vibration on the radiator 1000, protect the radiator 1000 from vibration damage, and avoid the radiator 1000 from shaking and displacement on the camera as much as possible. The heat conductive sheet 800 is set on the contact surface between the radiator 1000 and the camera, which can quickly transfer the temperature of the camera to the radiator 1000, and then the radiator 1000 transfers the heat to the surrounding air, thereby achieving a heat dissipation effect on the camera.

[0051] Specifically, the rubber pad 400 can protect the surface of the housing 100 and the connecting arm 3032 from being scratched or worn, thereby extending the service life of the heat sink 1000 and maintaining a beautiful appearance.

[0052] Specifically, the heat conductive sheet 800 is placed on a side of the lower half 104 of the heat sink 1000 away from the heat sink 101. This side needs to be in direct contact with the camera, so the heat conductive sheet 800 provided on this side can directly transfer the heat of the camera to the heat sink 1000, and then the fan assembly 200 takes away the heat by disturbing the airflow, thereby cooling the camera. The heat conductive sheet 800 can quickly transfer the heat inside the camera to the heat sink 1000, preventing the camera from malfunctioning or being damaged due to excessive internal temperature.

[0053] refer to Figure 2 and Figure 3 The radiator 1000 also includes a circuit board 500 and a semiconductor cooler 600. The circuit board 500 is electrically connected to the fan assembly 200. The circuit board 500 is arranged on the upper body 103. A through groove 1041 is provided on the lower body 104. The semiconductor cooler 600 is arranged in the through groove 1041. The cold surface 601 of the semiconductor cooler 600 is attached to the heat conductive sheet 800. The circuit board 500 is connected to a connection port 501 and a control button 502.

[0054] Through the control button 502 on the circuit board 500, the user can conveniently control the switch of the radiator 1000, the speed of the fan assembly 200 and other parameters, thereby improving the convenience and flexibility of the radiator 1000. The connection port 501 can be connected to an external device or charge the radiator 1000. The semiconductor refrigerator 600 provides a better heat dissipation effect for the radiator 1000. It is arranged in the through groove 1041, and the cold surface 601 is directly attached to the heat conductive sheet 800, so that it can directly dissipate heat for the camera, shortening the path between the camera and the semiconductor refrigerator 600, so as to improve the cooling ability of the semiconductor refrigerator 600 for the camera, thereby improving the heat dissipation effect of the radiator 1000. At this time, the fan assembly 200 is used to dissipate the heat generated by the hot surface of the semiconductor refrigerator 600. In this embodiment, the hot surface of the semiconductor refrigerator 600 is arranged opposite to the cold surface 601.

[0055] Specifically, the circuit board 500 connected to the fan assembly 200 can realize intelligent control of the fan assembly 200, so that the user can adjust the speed of the fan assembly 200 through the circuit board 500 according to temperature changes, or the circuit board 500 automatically adjusts the fan assembly 200 according to temperature changes, thereby improving heat dissipation efficiency and extending device life.

[0056] Specifically, the circuit board 500 is arranged on the circuit board 101, and the semiconductor cooler 600 is arranged in the through groove 1041 of the mounting lower half 104, which helps to optimize the internal structure layout of the radiator 1000, improve space utilization, and facilitate maintenance and replacement of the circuit board 500 and the semiconductor cooler 600.

[0057] It should be noted that, in the above-mentioned embodiment including the semiconductor refrigerator 600, the semiconductor refrigerator 600 is disposed in the through groove 1041, and its cold surface 601 is directly connected to the heat conducting sheet 800. In the embodiment not including the semiconductor refrigerator 600, the heat conducting sheet 800 is disposed on the lower body 104, or is directly connected to the fan assembly 200 or the heat sink 101.

[0058] In an optional embodiment of the present invention, a temperature sensor and a controller are electrically connected to the circuit board 500 , and the controller is used to control the operating power of the fan assembly 200 and the semiconductor cooler 600 according to the feedback of the temperature sensor.

[0059] A temperature sensor and a controller are electrically connected to the circuit board 500. The temperature sensor can detect the temperature change information of the camera and transmit the temperature information to the controller. The controller adjusts the power of the fan assembly 200 and the semiconductor cooler 600 according to the temperature change of the camera, thereby realizing intelligent automatic adjustment of the radiator 1000.

[0060] Specifically, the controller can monitor the temperature information of the heat conducting sheet 800 through the temperature sensor, and adjust the fan assembly 200 and the semiconductor cooler 600, which can effectively save energy consumption and reduce power consumption. The intelligent heat dissipation control formed by the temperature sensor, the controller, the semiconductor cooler 600 and the fan assembly 200 improves the user experience. There is no need to manually adjust the power of the fan assembly 200 and / or the semiconductor cooler 600. The radiator 1000 can automatically adjust according to the needs, simplifying the operation process.

[0061] refer to Figure 5 The temperature sensor is an infrared detection head or a thermistor 700. When the temperature sensor is the thermistor 700, the thermistor 700 is arranged in the groove 1042 of the lower body 104 facing the heat conducting plate 800; when the temperature sensor is an infrared detection head, the infrared detection head is arranged in the channel connecting the lower body 104 and the heat conducting plate 800.

[0062] The thermistor 700 is disposed in the groove 1042. The thermistor 700 can be directly attached to the heat conductive sheet 800, so the thermistor 700 can monitor the temperature change of the heat conductive sheet 800, that is, the temperature change of the camera, in real time. In actual use, the thermistor 700 feeds back the collected temperature information of the heat conductive sheet 800 to the controller, and the controller adjusts the fan assembly 200 and / or the semiconductor cooler 600 according to the temperature information to achieve intelligent heat dissipation control. Ensure that the radiator 1000 provides sufficient heat dissipation capacity when needed.

[0063] When the temperature sensor is an infrared detection head, the user can obtain the heating condition and temperature change of the camera through the infrared detection head, and understand the temperature information of the camera in real time, so as to make corresponding adjustments and controls to the radiator. The infrared detection head can accurately and contactlessly detect the temperature of the camera's heat source. By feeding this information back to the controller, the radiator 1000 can adjust the power of the fan assembly 200 and / or the semiconductor cooler 600 according to the real-time temperature data received by the controller to adapt to different heat dissipation scenarios and improve the heat dissipation efficiency of the radiator 1000.

[0064] In summary, no matter the temperature sensor is the thermistor 700 or the infrared detection head, it can detect the temperature of the camera and feed back to the controller, so that the radiator 1000 can adjust its own working power according to the actual temperature conditions, thereby saving energy consumption and protecting the stable operation of the camera.

[0065] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.

Claims

1. A radiator, characterized in that: include: A housing, wherein a heat sink is provided inside the housing, and a hollow structure corresponding to the heat sink is provided on the housing; A fan assembly, wherein the fan assembly is arranged on the heat dissipation frame in the housing; A limit assembly, wherein the limit assembly is arranged on a side surface of the shell in the length direction, and the limit assembly includes an elastic member, a limit knob and a telescopic frame, wherein the elastic member is arranged between the telescopic frame and the shell, the limit knob is arranged corresponding to the telescopic frame, and the limit knob is threadedly connected to the shell so that the telescopic frame can be limited by rotating the limit knob.

2. The heat sink according to claim 1, characterized in that: The heat sink comprises a heat-conducting base and a plurality of heat-dissipating fins arranged on the heat-conducting base, and the heat-dissipating fins are arranged around the fan assembly.

3. The heat sink according to claim 1, characterized in that: The limit knob comprises a rotating disk and a screw rod which are connected to each other. The screw rod is threadedly connected to the housing. The rotating disk is arranged between the housing and the telescopic frame.

4. The heat sink according to claim 3, characterized in that: The telescopic frame includes two rod bodies and connecting arms arranged at the ends of the rod bodies. A limit platform is provided on the rod body. The elastic member is arranged between the limit platform and the shell. One side of the connecting arm is used to abut against the heating element, and the other side is used to abut against the turntable.

5. The heat sink according to claim 4, characterized in that: A receiving groove is respectively provided on two opposite sides along the width direction in the shell, and a limiting protrusion is provided at the bottom of the receiving groove. The rod body is arranged in the receiving groove and is slidably connected to the receiving groove. One end of the elastic member is sleeved on the limiting protrusion, and the other end is against the limiting platform.

6. The heat sink according to claim 5, characterized in that: The shell comprises an upper half and a lower half, the upper half is a hollow structure, the containing groove is arranged in the lower half, and the heat dissipation frame is arranged between the upper half and the lower half.

7. The heat sink according to claim 6, characterized in that The radiator further comprises a rubber pad and a heat conducting sheet. The rubber pad is respectively arranged on a side of the connecting arm away from the rod body and a side of the shell away from the limiting assembly. The heat conducting sheet is arranged on a side of the lower body away from the heat dissipation frame.

8. The heat sink according to claim 7, characterized in that: The radiator also includes a circuit board and a semiconductor refrigerator. The circuit board is electrically connected to the fan assembly, and the circuit board is connected to the upper body. The lower body is provided with a through groove, and the semiconductor refrigerator is arranged in the through groove. The cold surface of the semiconductor refrigerator is in contact with the heat conductive sheet, and the circuit board is connected with a connection port and a control button.

9. The heat sink according to claim 8, characterized in that: The circuit board is electrically connected with a temperature sensor and a controller, and the controller is used to control the operating power of the fan assembly and the semiconductor refrigerator according to the feedback of the temperature sensor.

10. The heat sink according to claim 9, characterized in that The temperature sensor is an infrared detection head or a thermistor. When the temperature sensor is a thermistor, the thermistor is arranged in a groove of the lower body facing the thermal conductive sheet; when the temperature sensor is an infrared detection head, the infrared detection head is arranged in a channel connecting the lower body and the thermal conductive sheet.

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