Power supply case with efficient heat dissipation

Abstract

The utility model provides an efficient heat dissipation power supply case, and relates to the technical field of computer processors, the efficient heat dissipation power supply case comprises a circuit mainboard and a case body, blowing fans are vertically installed on both sides of the case body, the circuit mainboard is transversely installed in the middle of the case body, an installation notch is formed in the middle of the top end of the circuit mainboard, a CPU assembly is installed in the installation notch, and the CPU assembly is installed in the installation notch. A limiting clamping frame is connected to the outer portion of the CPU assembly in a sleeving mode, a cooling processing device is attached to the top of the limiting clamping frame, firstly, a patch temperature sensor can measure the temperature of the surface of the CPU assembly, detected temperature data can be directly transmitted to a temperature controller, and the temperature controller can recognize the detected temperature data; namely, the small computer is installed in the computer and mainly identifies and compares the data, and when the detected data is higher than a limit value, the CPU assembly needs to be rapidly cooled at the moment.

Description

Technical Field

[0001] The utility model relates to the technical field of computer processors, in particular to a power supply case with high-efficiency heat dissipation. Background Art

[0002] The power supply chassis is an important part of computer hardware. Its main function is to provide stable DC power to various components inside the computer, including the CPU, graphics card, motherboard, fan, hard disk and optical drive, etc. In addition, the power supply chassis also has an overload protection mechanism. When a short circuit or other electrical failure occurs during the operation of the computer, the power supply will cut off the power output in time to avoid excessive damage to the computer hardware.

[0003] There are many types of power supply cases, including ATX, ITX, and M-ATX. ATX is a more common type, with a larger internal space that can accommodate more hardware devices. ITX is relatively compact and suitable for scenarios that require space saving, but the choice of hardware devices may be limited. M-ATX is similar in design to a mid-tower case and can support some larger hardware devices, suitable for users who do not have high hardware requirements.

[0004] Existing power supply chassis are generally equipped with cooling fans to dissipate heat for internal circuit equipment. However, in existing power supply chassis, the internal processor does not have an efficient automatic heat dissipation function, resulting in the temperature inside the power supply chassis is still very high and the overall heat dissipation efficiency is low. Therefore, a power supply chassis with efficient heat dissipation that can self-dissipate heat is needed to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to solve the problem that the internal processor of the existing power supply chassis does not have an efficient automatic heat dissipation function, resulting in the temperature inside the power supply chassis being still very high and the overall heat dissipation efficiency being low, and to propose a power supply chassis with efficient heat dissipation.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a power supply chassis with efficient heat dissipation, including a circuit mainboard and a chassis, wherein blowing fans are vertically installed on both sides of the chassis, the circuit mainboard is horizontally installed in the middle of the chassis, an installation slot is opened in the middle of the top of the circuit mainboard, a CPU component is installed inside the installation slot, a limiting card frame is sleeved on the outside of the CPU component, and a cooling treatment device is attached to the top of the limiting card frame.

[0007] Preferably, a temperature controller is electrically connected to the top of the circuit mainboard near the back of the CPU component, one end of the temperature controller is electrically connected to a first communication module, and the top of the first communication module is electrically connected to a data connection socket.

[0008] Preferably, one end of the temperature controller is electrically connected to a patch temperature sensor, and the patch temperature sensor is attached to the top of the CPU component.

[0009] Preferably, the front, back and both sides of the limiting card frame are provided with bayonet holes, a fan controller is installed inside the bayonet hole, a fan drive motor is installed on the front of the fan controller, and heat dissipation microholes are provided on the back of the fan drive motor.

[0010] Preferably, the back side of the fan driving motor is electrically connected to a small fan unit, the top of the fan controller is electrically connected to a second communication module, and the top of the second communication module is electrically connected to a data connection plug.

[0011] Preferably, heat dissipation openings are provided on the tops of both sides of the limiting card frame.

[0012] Preferably, a water container is installed on the top of the cooling treatment device, a small water pump is installed on the bottom of one side of the water container, the bottom end of the small water pump is connected to a water pumping pipe, the bottom end of the water pumping pipe is connected to a liquid cooling box, a water absorber is installed on the top of one side of the liquid cooling box, the top of the water absorber is connected to a water suction pipe, the top of the water suction pipe passes through the interior of the water container, and a silicone thermal conductive sheet is installed on the bottom of the liquid cooling box, and the bottom of the silicone thermal conductive sheet is in contact with the surface of the CPU component.

[0013] Preferably, a water cooling plate is installed inside the water transfer container, and the water cooling plate is stepped.

[0014] Beneficial Effects

[0015] In the present invention, first, the surface temperature sensor of the CPU component will measure the temperature, and the detected temperature data will be directly transmitted to the temperature controller, which will identify the detected temperature data. That is, a small computer is installed inside to mainly identify and compare the data. When the detected data is higher than the limit value, it means that the CPU component needs to be cooled down quickly. At this time, the temperature controller will transmit a wireless signal through the data connection socket on the first communication module. The data connection plug is used to receive the signal. The received signal will be directly transmitted to the second communication module. The second communication module will directly transmit the received signal to the fan controller. The fan controller will control the fan drive motor to start and drive the small fan unit to rotate. In this device, there are small fan units in four directions. The small fan unit will dissipate the heat generated by the CPU component and dissipate it from the heat dissipation port. At the same time, the heat generated by the fan drive motor will also be dissipated from the heat dissipation port.

[0016] In the utility model, the processor adopts water cooling to dissipate heat from the CPU component. There is refrigerant in the water container and the liquid cooling box. At the same time, the refrigerant will maintain a circulating flow state to maintain a low temperature. A small water pump will pump the refrigerant in the liquid cooling box into the water container through a pumping pipe. The refrigerant entering the water container will pass through a flowing water cooling plate. The flowing water cooling plate will separate the refrigerant to achieve the purpose of cooling. This solves the problem that in the existing power supply chassis, the internal processor does not have an efficient automatic heat dissipation function, resulting in the temperature in the power supply chassis being still very high and the overall heat dissipation efficiency being low. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is the overall structure diagram of the utility model;

[0018] Figure 2 This is a structural diagram of the restriction card frame of the utility model;

[0019] Figure 3 This is a top structural diagram of the limiting card frame of the utility model;

[0020] Figure 4 It is a structural diagram of another viewing angle of the top of the limiting card frame of the utility model;

[0021] Figure 5 This is an internal structure diagram of the cooling treatment device of the utility model;

[0022] Figure 6 This is a diagram showing the internal structure of the water transfer container of the present utility model.

[0023] Legend:

[0024] 1. Circuit board; 2. Installation slot; 3. CPU assembly; 4. Limiting card frame; 5. First communication module; 6. Data connection socket; 7. Temperature controller; 8. Cooling treatment device; 9. SMD temperature sensor; 10. Card slot; 11. Fan controller; 12. Fan drive motor; 13. Heat dissipation micropores; 14. Second communication module; 15. Data connection plug; 16. Water flow container; 17. Small water pump; 18. Water pumping pipeline; 19. Liquid cooling box; 20. Silicone thermal conductive sheet; 21. Water suction pipe; 22. Water pump; 23. Water cooling plate; 24. Heat dissipation port; 25. Small fan unit; 26. Chassis; 27. Blowing fan. DETAILED DESCRIPTION

[0025] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.

[0026] The specific embodiments of the present utility model are described below in conjunction with the accompanying drawings. Specific embodiment one:

[0028] Reference Figure 1-6 A power supply chassis with efficient heat dissipation includes a circuit mainboard 1 and a chassis 26. Blowing fans 27 are vertically installed on both sides of the chassis 26. The circuit mainboard 1 is horizontally installed in the middle of the chassis 26. An installation slot 2 is opened in the middle of the top of the circuit mainboard 1. A CPU component 3 is installed inside the installation slot 2. A limiting card frame 4 is sleeved on the outside of the CPU component 3. A cooling treatment device 8 is attached to the top of the limiting card frame 4.

[0029] In this device, the fans 27 on both sides of the chassis 26 will dissipate heat inside the chassis as a whole. At the same time, there will be a component on the circuit board 1 specifically used to cool down and dissipate heat for the CPU component 3.

[0030] A temperature controller 7 is electrically connected to the top of the circuit main board 1 near the back of the CPU assembly 3 , one end of the temperature controller 7 is electrically connected to the first communication module 5 , and the top of the first communication module 5 is electrically connected to the data connection socket 6 .

[0031] One end of the temperature controller 7 is electrically connected to a patch temperature sensor 9 , and the patch temperature sensor 9 is attached to the top of the CPU component 3 .

[0032] The front, back and both sides of the limiting card frame 4 are provided with bayonet 10 , a fan controller 11 is installed inside the bayonet 10 , a fan drive motor 12 is installed on the front of the fan controller 11 , and heat dissipation micro holes 13 are provided on the back of the fan drive motor 12 .

[0033] The back of the fan driving motor 12 is electrically connected to a small fan unit 25, the top of the fan controller 11 is electrically connected to a second communication module 14, and the top of the second communication module 14 is electrically connected to a data connection plug 15. The data connection socket 6 and the data connection plug 15 are connected through a data line with a data connection plug at one end and a data connection socket at the other end. The second communication module 14 and the first communication module 5 can preferably adopt a half-duplex communication module. The communication module is one of the commonly used technical means in this field, and the utility model does not specifically limit which communication module is used.

[0034] Heat dissipation openings 24 are provided at the tops of both sides of the limiting card frame 4 .

[0035] A water container 16 is installed at the top of the cooling treatment device 8, and a small water pump 17 is installed at the bottom of one side of the water container 16. The bottom end of the small water pump 17 is connected to a water pumping pipe 18, and the bottom end of the water pumping pipe 18 is connected to a liquid cooling box 19. A water absorber 22 is installed at the top of one side of the liquid cooling box 19, and the top of the water absorber 22 is connected to a water suction pipe 21. The top of the water suction pipe 21 passes through the interior of the water container 16, and a silicone thermal conductive sheet 20 is installed at the bottom of the liquid cooling box 19. The bottom of the silicone thermal conductive sheet 20 is in contact with the surface of the CPU component 3.

[0036] A water cooling plate 23 is installed inside the water flow container 16 . Specific embodiment 2:

[0038] Reference Figure 1-5 The heat dissipation device in the present device mainly dissipates heat for the CPU component 3 by means of air cooling and water cooling. First, the surface temperature sensor 9 measures the temperature of the surface of the CPU component 3, and the detected temperature data is directly transmitted to the temperature controller 7. The temperature controller 7 identifies the detected temperature data. A computing chip is installed inside the temperature controller 7 to identify and compare the data. When the detected data is higher than the limit value, it means that the CPU component 3 needs to be cooled quickly. At this time, the temperature controller 7 transmits a wireless signal through the data connection socket 6 on the first communication module 5. The data connection plug 15 is used to receive the signal. The received signal is directly transmitted to the second communication module 14. The second communication module 14 directly transmits the received signal to the fan controller 11. The fan controller 11 controls the fan drive motor 12 to start and drive the small fan unit 25 to rotate. In the present device, there are small fan units 25 in four directions. The small fan unit 25 will blow away the heat generated by the CPU component 3 and dissipate it from the heat dissipation port 24. At the same time, the heat generated by the fan drive motor 12 will also dissipate from the heat dissipation port 24, and will not remain in the box in large quantities.

[0039] The cooling treatment device 8 uses water cooling to dissipate heat from the CPU component 3. There is refrigerant in the water transfer container 16 and the liquid cooling box 19. At the same time, the refrigerant will maintain a circulating flow state to maintain a low temperature. The small water pump 17 will pump the refrigerant in the liquid cooling box 19 into the water transfer container 16 through the pumping pipe 18. The refrigerant entering the water transfer container 16 will pass through the flowing water cooling plate 23. The flowing water cooling plate 23 will separate the refrigerant to achieve the purpose of cooling. At the same time, the water absorber 22 will pump the cooling-treated refrigerant into the liquid cooling box 19 through the water absorption pipe 21. The silicone heat conductive sheet 20 will guide the heat of the CPU component 3 to the liquid cooling box 19. The material of the liquid cooling box 19 is metal, and the purpose of cooling is achieved by the internally circulating refrigerant. It should be noted that the small water pump 17 and the water absorber 22 here are similar to small water pumps.

[0040] In summary:

[0041] 1. First, the surface mount temperature sensor 9 will measure the temperature of the surface of the CPU component 3, and the detected temperature data will be directly transmitted to the temperature controller 7. The temperature controller 7 will identify the detected temperature data, that is, a small computer is installed inside to mainly identify and compare the data. When the detected data is higher than the limit value, it means that the CPU component 3 needs to be cooled down quickly. At this time, the temperature controller 7 will transmit a wireless signal through the data connection socket 6 on the first communication module 5. The data connection plug 15 is used to receive the signal. The received signal will be directly transmitted to the second communication module 14. The second communication module 14 will directly transmit the received signal to the fan controller 11. The fan controller 11 will control the fan drive motor 12 to start and drive the small fan unit 25 to rotate. In this device, there are small fan units 25 in four directions. The small fan unit 25 will dissipate the heat generated by the CPU component 3 and dissipate it from the heat dissipation port 24. At the same time, the heat generated by the fan drive motor 12 will also be dissipated from the heat dissipation port 24.

[0042] 2. The cooling treatment device 8 uses water cooling to dissipate heat from the CPU component 3. There is refrigerant in the water container 16 and the liquid cooling box 19. At the same time, the refrigerant will maintain a circulating flow state to maintain a low temperature. The water will flow from high to low. The small water pump 17 will pump the refrigerant in the liquid cooling box 19 into the water container 16 through the pumping pipe 18. The refrigerant entering the water container 16 will pass through the flowing water cooling plate 23. The flowing water cooling plate 23 will separate the refrigerant to achieve the purpose of cooling. At the same time, the water absorber 22 will pump the cooling refrigerant into the liquid cooling box 19 through the water absorption pipe 21. The silicone heat conductive sheet 20 will guide the heat of the CPU component 3 to the liquid cooling box 19. The material of the liquid cooling box 19 is metal, and the purpose of cooling is achieved through the internal circulating refrigerant, so as to ensure better and more durable cooling of the refrigerant.

[0043] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0044] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A power supply chassis with high efficiency in heat dissipation, comprising a circuit board (1) and a chassis (26), characterized in that: Blowing fans (27) are vertically installed on both sides of the chassis (26); a circuit board (1) is horizontally installed in the middle of the chassis (26); a mounting slot (2) is opened in the middle of the top of the circuit board (1); a CPU component (3) is installed inside the mounting slot (2); a limiting card frame (4) is sleeved on the outside of the CPU component (3); a cooling treatment device (8) is attached to the top of the limiting card frame (4); a water container (16) is installed on the top of the cooling treatment device (8); a bottom of one side of the water container (16) is provided. A small water pump (17) is installed, the bottom end of the small water pump (17) is connected to a water pumping pipe (18), the bottom end of the water pumping pipe (18) is connected to a liquid cooling box (19), a water absorber (22) is installed on the top of one side of the liquid cooling box (19), the top end of the water absorber (22) is connected to a water suction pipe (21), the top end of the water suction pipe (21) passes through the interior of the water container (16), a silicone heat conductive sheet (20) is installed at the bottom of the liquid cooling box (19), and the bottom of the silicone heat conductive sheet (20) is in contact with the surface of the CPU component (3).

2. The power supply chassis with high efficiency heat dissipation according to claim 1, characterized in that: The top of the circuit main board (1) is electrically connected to a temperature controller (7) near the back of the CPU component (3); one end of the temperature controller (7) is electrically connected to a first communication module (5); and the top of the first communication module (5) is electrically connected to a data connection socket (6).

3. The power supply chassis with high efficiency heat dissipation according to claim 2, characterized in that: One end of the temperature controller (7) is electrically connected to a patch temperature sensor (9), and the patch temperature sensor (9) is attached to the top of the CPU component (3).

4. The power supply chassis with high heat dissipation efficiency according to claim 1, characterized in that: The front and back sides of the limiting card frame (4) are provided with card slots (10), a fan controller (11) is installed inside the card slot (10), a fan drive motor (12) is installed on the front side of the fan controller (11), a heat dissipation microhole (13) is provided on the back side of the fan drive motor (12), and the fan drive motor (12) is electrically connected to the fan controller (11).

5. The power supply chassis with high efficiency heat dissipation according to claim 4, characterized in that: The back of the fan drive motor (12) is electrically connected to a small fan unit (25), the top of the fan controller (11) is electrically connected to a second communication module (14), and the top of the second communication module (14) is electrically connected to a data connection plug (15).

6. The power supply chassis with high efficiency heat dissipation according to claim 1, characterized in that: The tops of both sides of the limiting card frame (4) are provided with heat dissipation openings (24).

7. The power supply chassis with high efficiency heat dissipation according to claim 1, characterized in that: A water flow cooling plate (23) is installed inside the water transfer container (16), and the water flow cooling plate (23) is in a stepped shape.

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