Silica gel chip packaging mold

Abstract

The utility model discloses a silica gel chip packaging mould, which comprises a lower mould and an upper mould, both the lower mould and the upper mould are connected with a packaging piece used for packaging a silica gel chip, the packaging piece comprises an adjusting piece which is arranged on the lower mould and used for storing and ejecting the chip, the adjusting piece comprises a first air cylinder assembly arranged at the bottom of the lower mould, and a second air cylinder assembly arranged at the bottom of the lower mould. The lower die is slidably connected with a plurality of groups of placing plates, and the bottoms of the placing plates are connected with dampers driven by first air cylinder assemblies; the liquid injection assembly is installed on the upper mold and used for injecting silica gel liquid, and the liquid injection assembly comprises an injection piece connected with the upper mold. According to the silica gel chip packaging mold, after a packaged chip is taken away, a heating wire heats and promotes liquidation of solidified silica gel retained in a spray head through heat transfer, and a second air cylinder assembly and a traction strip drive a plurality of groups of dredging rods to do reciprocating motion in the vertical direction, so that the silica gel retained in a liquid passing groove in the spray head is guided out.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging molds, in particular to a silicone chip packaging mold. Background Art

[0002] In chip manufacturing, an injection molding mold is usually used to encapsulate silicone in the chip, and a corresponding silicone chip encapsulation mold is required for this purpose. A silicone chip encapsulation mold with reference to publication number CN211492699U includes an upper mold and a lower mold, a top wall of the upper mold is provided with a glue injection channel, and a positioning block is fixedly installed on the bottom wall of the upper mold, which effectively avoids the phenomenon of chip bending and deformation caused by the impact force of the injected silicone. It is suitable for chip packaging of different specifications and is convenient for removing the chip after packaging. As described in the above patent, when the existing silicone chip encapsulation mold is used, it fails to export the solidified silicone retained in the glue injection channel after the chip is packaged and exported, which increases the subsequent cleaning steps and affects the subsequent packaging operation. Utility Model Content

[0003] In view of the deficiencies in the prior art, the utility model provides a silicone chip packaging mold, which solves the problem that the device fails to effectively handle the silicone retained in the injection channel, affecting the subsequent packaging operation, and the like.

[0004] To achieve the above purpose, the utility model is implemented by the following technical scheme: a silicone chip packaging mold, including a lower mold and an upper mold, the lower mold and the upper mold are both connected with a packaging part for silicone chip packaging, and the packaging part includes:

[0005] An adjusting member is installed on the lower die for chip storage and ejection, the adjusting member comprises a first cylinder assembly installed at the bottom of the lower die, a plurality of groups of placement plates are slidably connected to the inner end of the lower die, and a damper driven by the first cylinder assembly is connected to the bottom of the placement plate;

[0006] The liquid injection assembly is installed on the upper mold for injecting silicone liquid, the liquid injection assembly includes an injection piece connected to the upper mold, the injection piece includes a nozzle fixedly connected to the upper mold, a dredging rod is slidably connected to the upper side of the nozzle, a liquid passing groove is provided on the inner side of the nozzle corresponding to the dredging rod, a transition pipe connected to the liquid passing groove is installed on the upper right end of the nozzle, an array of heating wires is fixedly connected to the outer side of the injection piece corresponding to the upper mold, a second cylinder assembly is installed at both ends of the outer side of the upper mold, a traction bar for driving the dredging rod is fixedly connected to the top extended end of the second cylinder assembly, and a forked pipe assembly is connected to the rear side of the array of transition pipes.

[0007] Preferably, the upper die and the lower die match each other, the extended end of the damper is fixedly connected to the placement plate, and the extended end of the damper is connected to the extended end of the first cylinder assembly.

[0008] Preferably, the lower mold is provided with a plurality of movable grooves corresponding to the placement plate, the placement plate is slidably connected in the movable grooves, and a storage groove is provided at the upper end of the placement plate.

[0009] Preferably, the adjusting member also includes an array of vacuum columns installed on the upper end of the lower mold, a storage groove is provided on the lower side of the upper mold corresponding to the vacuum columns, a conduit is fixedly connected to the bottom of the vacuum column, and the conduit is fixedly connected to the vacuum end of an external vacuum pump, a cooling groove is provided in the clamping part near the outer side of the placement plate of the lower mold, and a liquid pipe for supplying liquid to the cooling groove is provided at the lower end of the lower mold.

[0010] Preferably, the lower mold is provided with a mold groove near the lower end of the nozzle, and the array of heating wires are electrically connected to an external controller.

[0011] Preferably, the traction strip is located at the upper front end of the transition pipe, and the top front side of the dredging rod is fixedly connected to the rear end of the traction strip.

[0012] Beneficial Effects

[0013] The utility model provides a silicone chip packaging mold. Compared with the prior art, it has the following beneficial effects:

[0014] (1) The silicone chip packaging mold is provided with an injection part in the device. After the packaged chip is taken away, the heating wire generates heat and promotes the liquefaction of the solidified silicone retained in the nozzle through heat transfer, so that the second cylinder assembly and the traction bar drive the array dredging rod to reciprocate in the vertical direction, thereby realizing the extraction of the silicone retained in the liquid tank in the nozzle, reducing the subsequent chip packaging operations due to the solidification of the silicone liquid in the nozzle, and improving the packaging efficiency.

[0015] (2) The silicone chip packaging mold is provided with an adjusting part in the device. After the lower mold and the upper mold are closed, the lower mold and the upper mold are vacuumed by the cooperation of the conduit, the vacuum column and the external vacuum pump, so as to reduce the impact of mixed bubbles on the packaging quality during the subsequent silicone liquid injection process. After the silicone liquid is injected into the outer side of the chip, the liquid pump and the liquid pipe cooperate with each other to draw the external coolant into the cooling tank and inject it. The coolant cools the silicone liquid through heat exchange, accelerates the molding of the silicone liquid, and thus improves. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a sectional stereoscopic diagram of the utility model after mold opening;

[0017] Figure 2 For this utility model Figure 1 A partial enlarged view of the middle A;

[0018] Figure 3 It is an enlarged cross-sectional view of the injection piece of the utility model;

[0019] Figure 4 It is a three-dimensional diagram of the utility model after mold closing.

[0020] In the figure: 1. lower mold; 2. upper mold; 3. adjusting part; 31. first cylinder assembly; 32. damper; 33. placement plate; 34. conduit; 35. vacuum column; 36. cooling trough; 37. liquid pipe; 4. liquid injection assembly; 41. injection part; 411. nozzle; 412. dredging rod; 413. liquid trough; 414. transition pipe; 42. heating wire; 43. bifurcated pipe assembly; 44. second cylinder assembly; 45. traction strip. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-4 The first embodiment shown is a silicone chip encapsulation mold, comprising a lower mold 1 and an upper mold 2, both of which are connected with a packaging component for silicone chip encapsulation, the packaging component comprising: an adjusting component 3, which is installed on the lower mold 1 for chip storage and ejection, the adjusting component 3 comprises a first cylinder assembly 31 installed at the bottom of the lower mold 1, a plurality of groups of placement plates 33 are slidably connected to the inner end of the lower mold 1, and a damper 32 driven by the first cylinder assembly 31 is connected to the bottom of the placement plate 33;

[0023] The liquid injection assembly 4 is installed on the upper mold 2 for injecting silicone liquid. The liquid injection assembly 4 includes an injection piece 41 connected to the upper mold 2. The injection piece 41 includes a nozzle 411 fixedly connected to the upper mold 2. A dredging rod 412 is slidably connected to the upper side of the nozzle 411. A liquid passing groove 413 is provided on the inner side of the nozzle 411 corresponding to the dredging rod 412. A transition pipe 414 connected to the liquid passing groove 413 is installed on the upper right end of the nozzle 411. An array of heating wires 42 is fixedly connected to the outer side of the injection piece 41 corresponding to the upper mold 2. Second cylinder assemblies 44 are installed at both ends of the outer side of the upper mold 2. A traction bar 45 for driving the dredging rod 412 is fixedly connected to the top extension end of the second cylinder assembly 44. The rear side of the array of transition pipes 414 is connected to a bifurcated pipe assembly 43;

[0024] The upper mold 2 and the lower mold 1 match each other, the extended end of the damper 32 is fixedly connected to the placement plate 33, and the extended end of the damper 32 is connected to the extended end of the first cylinder assembly 31; the lower mold 1 is provided with a plurality of movable grooves corresponding to the placement plate 33, the placement plate 33 is slidably connected in the movable grooves, and a storage groove is provided at the upper end of the placement plate 33; the lower mold 1 is provided with a mold groove near the lower end of the nozzle 411, and the array heating wires 42 are electrically connected to the external controller; the traction bar 45 is located at the upper front end of the transition pipe 414, and the top front side of the dredging rod 412 is fixedly connected to the rear end of the traction bar 45; after the packaged chip is removed, the heating wire 42 generates heat and promotes the liquefaction of the solidified silicone retained in the nozzle 411 through heat transfer, so that the second cylinder assembly 44 and the traction bar 45 drive the array dredging rod 412 to reciprocate in the vertical direction, so as to realize the extraction of the silicone retained in the liquid tank 413 in the nozzle 411;

[0025] like Figure 1-3 The second embodiment shown is mainly different from the first embodiment in that:

[0026] The adjusting member 3 also includes an array of vacuum columns 35 installed at the upper end of the lower mold 1, a storage groove is provided on the lower side of the upper mold 2 corresponding to the vacuum columns 35, a conduit 34 is fixedly connected to the bottom of the vacuum column 35, and the conduit 34 is fixedly connected to the vacuum end of the external vacuum pump. A cooling groove 36 is provided in the clamping of the lower mold 1 near the outer side of the placement plate 33, and a liquid pipe 37 for supplying liquid to the cooling groove 36 is provided at the lower end of the lower mold 1. A reflux pipe connected to the cooling groove 36 is provided at the end of the liquid pipe 37 corresponding to the inner side of the lower mold 1, and the liquid pipe 37 is connected to the liquid outlet end of the external liquid pump. The liquid pump is fixedly connected, and a liquid extraction pipe for extracting coolant is provided at the liquid extraction end. When the lower mold 1 and the upper mold 2 are closed, the lower mold 1 and the upper mold 2 are vacuumed through the cooperation of the conduit 34, the vacuum column 35, and the external vacuum pump to reduce the mixed bubbles in the subsequent silicone liquid injection process. After the silicone liquid is injected into the outer side of the chip, the liquid pump and the liquid pipe 37 cooperate with each other to draw the external coolant into and inject it into the cooling tank 36. The coolant cools the silicone liquid through heat exchange to accelerate the molding of the silicone liquid.

[0027] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art, and the model parameters of each electrical appliance are not specifically limited, and conventional equipment can be used.

[0028] When in use, the user places the chip to be packaged into the storage groove on the placement plate 33 in the lower mold 1, starts the external hydraulic cylinder to drive the upper mold 2 to close the lower mold 1, and allows the first cylinder assembly 31 to drive the damper 32, the placement plate 33, and the chip to move upward, so that the chip is close to the mold groove on the lower side of the injection piece 41, and the silicone liquid is introduced into the mold groove and the placement plate 33 through the bifurcated pipe assembly 43, the transition pipe 414, and the liquid groove 413 through the external liquid supply. The silicone liquid covers the outside of the chip and pushes the placement plate 33 and the chip downward, wherein the damper 32 provides a buffer for the placement plate 33 and the chip. After the injection is completed, it is sent to the cooling groove through the liquid pipe 37. Cooling liquid is introduced into 36 to promote the molding of silicone liquid on the outer side of the chip through heat exchange. After the silicone is molded, the upper mold 2 is separated from the lower mold 1, and the damper 32, the placement plate 33, and the packaged chip are driven upward by the first cylinder assembly 31 to eject the packaged chip and take away the packaged chip. After the chip is taken away, the heating wire 42 is powered, the heating wire 42 generates heat and promotes the liquefaction of the solidified silicone retained in the nozzle 411 through heat transfer, so that the second cylinder assembly 44 and the traction bar 45 drive the array dredging rod 412 to reciprocate in the vertical direction to realize the extraction of the silicone retained in the liquid tank 413 in the nozzle 411.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicone chip packaging mold, comprising a lower mold (1) and an upper mold (2), characterized in that: The lower mold (1) and the upper mold (2) are both connected to a packaging component for silicone chip packaging, and the packaging component includes: An adjusting member (3) is installed on the lower mold (1) for storing and ejecting chips, the adjusting member (3) comprising a first cylinder assembly (31) installed at the bottom of the lower mold (1), a plurality of groups of placement plates (33) are slidably connected to the inner end of the lower mold (1), and a damper (32) driven by the first cylinder assembly (31) is connected to the bottom of the placement plate (33); The liquid injection assembly (4) is installed on the upper mold (2) for injecting silicone liquid. The liquid injection assembly (4) includes an injection piece (41) connected to the upper mold (2). The injection piece (41) includes a nozzle (411) fixedly connected to the upper mold (2). A dredging rod (412) is slidably connected to the upper side of the nozzle (411). A liquid passage groove (413) is provided on the inner side of the nozzle (411) corresponding to the dredging rod (412). The nozzle (411) has a right upper end. A transition pipe (414) connected to the liquid passage groove (413) is installed, and a plurality of heating wires (42) are fixedly connected to the outer side of the injection piece (41) corresponding to the upper mold (2), and second cylinder assemblies (44) are installed at both ends of the outer side of the upper mold (2), and a traction bar (45) for driving the dredging rod (412) is fixedly connected to the top extension end of the second cylinder assembly (44), and the rear sides of the plurality of transition pipes (414) are connected to the bifurcated pipe assemblies (43).

2. The silicone chip packaging mold according to claim 1, characterized in that: The upper die (2) and the lower die (1) match each other, the extended end of the damper (32) is fixedly connected to the placement plate (33), and the extended end of the damper (32) is connected to the extended end of the first cylinder assembly (31).

3. The silicone chip packaging mold according to claim 1, characterized in that: The lower mold (1) is provided with a plurality of movable grooves corresponding to the placement plate (33), the placement plate (33) is slidably connected in the movable grooves, and a storage groove is provided at the upper end of the placement plate (33).

4. The silicone chip packaging mold according to claim 1, characterized in that: The regulating member (3) further comprises an array of vacuum columns (35) mounted on the upper end of the lower die (1); a receiving groove is provided on the lower side of the upper die (2) corresponding to the vacuum columns (35); a conduit (34) is fixedly connected to the bottom of the vacuum columns (35); the conduit (34) is fixedly connected to the vacuum end of an external vacuum pump; a cooling groove (36) is provided in the clamping portion of the lower die (1) near the outer side of the placement plate (33); and a liquid passage (37) for supplying liquid to the cooling groove (36) is provided at the lower end of the lower die (1).

5. The silicone chip packaging mold according to claim 1, characterized in that: The lower mold (1) is provided with a mold groove near the lower end of the nozzle (411), and the array of heating wires (42) are all electrically connected to an external controller.

6. The silicone chip packaging mold according to claim 1, characterized in that: The traction bar (45) is located at the upper front end of the transition pipe (414), and the top front side of the dredging rod (412) is fixedly connected to the rear end of the traction bar (45).

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