Three-dimensional vapor chamber element

Abstract

A three-dimensional vapor chamber element includes an upper cover having an opening and an upper surface, a lower plate opposite to the upper cover and having a lower plate upper surface, the lower plate upper surface having a recessed opening opposite to the opening and an annular cavity, the annular cavity forming a closed gas chamber when the upper cover is coupled to the lower plate, and a plurality of micro-channels disposed in the closed gas chamber. The open hole is communicated with the concave opening, the plurality of micro-channels are arranged on the upper surface of the upper cover, and the plurality of micro-channels are respectively communicated with the concave opening; therefore, compared with the prior art, the three-dimensional steam cavity element disclosed by the utility model can be applied to liquid cooling heat dissipation, and when the three-dimensional steam cavity element disclosed by the utility model is arranged in a liquid cooling semi-open shell, the structure of the three-dimensional steam cavity element disclosed by the utility model can directly enable cooling liquid to be splashed at a position with the highest temperature and then flow through the micro-channel, so that the heat dissipation efficiency is improved. Therefore, the overall heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to a three-dimensional steam chamber component, in particular to a three-dimensional steam chamber component in which a shovel-tooth micro-channel is arranged on the upper surface of an upper cover of the three-dimensional steam chamber component to increase the heat dissipation surface area and has a jet flow heat dissipation function. Background Art

[0002] As the thermal design power (TDP) and power density of high-computing chips and communication chips in servers and communication switches gradually increase, the temperature of the chips also gradually increases. The 3D stacked IC packaging also makes it more difficult to dissipate the heat generated by the bottom chip. Traditional air cooling technology has faced bottlenecks, and liquid cooling technology has emerged. Among them, cold plate liquid cooling technology has gradually become the mainstream.

[0003] However, conventional cold plate heat dissipation technologies can be roughly divided into shovel-tooth micro-channel cold plates, jet-flow cold plates, and two-phase flow cold plates. However, as chip power exceeds 1,000W, power density exceeds 100W / cm2, and it is a 3D stacked packaging structure, conventional cold plate heat dissipation technologies are also facing bottlenecks in heat dissipation and heat dissipation. Although a general pure jet-type cold plate can effectively reduce the chip temperature in the coolant impact area, it can also cause the problem of excessive temperature difference across the chip; the shovel-tooth micro-channel cold plate that generally relies on heat dissipation fins to dissipate heat also faces difficulties in reducing thermal resistance and temperature uniformity problems; and the two-phase flow cold plate also faces the problem of complex and expensive two-phase coolant circulation systems and insufficient heat dissipation area.

[0004] Therefore, in order to solve the heat dissipation and heat dissipation challenges brought about by various conventional cold plate liquid cooling radiators as chip power and power density gradually increase, it is necessary to invent and provide a more efficient three-dimensional vapor chamber element to solve the problem of chip heat dissipation and heat distribution. Utility Model Content

[0005] In view of this, the purpose of the present invention is to provide a three-dimensional vapor chamber element, which can set the shovel-tooth microchannel on the upper surface of the upper cover of the three-dimensional vapor chamber element to increase the heat dissipation surface area, while having the jet flow heat dissipation function. The present invention can be further combined with the heat exchange chamber shell of the liquid cooling cycle to form a radiator with phase change function and jet flow and microchannel heat dissipation function, so as to solve the shortcomings of various types of conventional liquid cooling radiators.

[0006] To achieve the above object, the utility model discloses a three-dimensional steam chamber element, which is characterized by comprising:

[0007] A top cover having an opening and an upper surface;

[0008] A lower plate, opposite to the upper cover, having a lower plate upper surface, the lower plate upper surface having a concave opening opposite to the opening and an annular cavity so that when the upper cover is coupled to the lower plate, the annular cavity forms a closed air cavity and the opening and the concave opening are interconnected; and

[0009] A plurality of micro channels are arranged on the upper surface of the upper cover, and the micro channels are respectively connected with the concave openings.

[0010] The lower plate further has a lower plate lower surface, and the lower plate lower surface opposite to the concave opening contacts a heat source.

[0011] The recessed opening has an opening surface for receiving a splash of cooling liquid.

[0012] The cooling liquid flows through the opening and the recessed opening to splash on the opening surface and then flows through the micro channels on the upper surface of the upper cover.

[0013] Wherein, the channel width of the microchannels is less than or equal to 1 mm.

[0014] Wherein, a plurality of heat dissipation structures are arranged on the opening surface, and the opening surface is located at a hot spot of the heat source.

[0015] The invention also comprises a continuous multi-porous capillary structure, and the multi-porous capillary structure is arranged on the upper cover and the lower plate in the closed air cavity.

[0016] The invention also comprises a plurality of support columns with porous capillary structures, and the support columns are respectively arranged between the upper cover and the lower plate in the closed air cavity.

[0017] The device further comprises a micro-channel buffer area, which is arranged between the upper surface of the upper cover and the micro-channels.

[0018] The upper cover is provided with a nozzle sealing structure, which is formed by sealing a liquid injection port pre-set on the upper cover after a working fluid is injected into the closed air cavity through the liquid injection port.

[0019] In summary, the utility model provides a three-dimensional vapor chamber element, which first absorbs the heat energy of the heat source by preferentially adhering to the lower surface of the lower plate that is closely attached to the heat source, and directly dissipates heat through the working fluid inside the lower plate in the porous capillary structure and the closed air cavity by phase change and two-phase flow circulation. Further, when the three-dimensional vapor chamber element of the utility model is applied to liquid cooling heat dissipation, the coolant can be directly splashed and impact the opening surface with the highest temperature, and the heat energy is preferentially transferred to the coolant for heat exchange. In addition, the microchannel structure on the upper cover can also increase the heat dissipation surface area by allowing the two-phase flow circulation inside the three-dimensional vapor chamber element, and the coolant can also be diverted and flow through the large-area fins along the direction of the microchannel setting and further forced heat exchange is performed, so that the coolant takes the heat away from the radiator. In summary, the utility model provides an innovative three-dimensional vapor chamber element that can be further combined with the heat exchange chamber shell of the liquid cooling cycle to form a radiator with phase change function and jet flow and microchannel heat dissipation function at the same time, so as to solve the shortcomings of various types of conventional liquid cooling radiators. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 An exploded view of a three-dimensional vapor chamber element according to a specific embodiment of the present invention is shown.

[0021] Figure 2 A schematic diagram of a three-dimensional vapor chamber element according to a specific embodiment of the present invention is shown.

[0022] Figure 3 A schematic diagram of a three-dimensional vapor chamber element according to another specific embodiment of the present invention is shown.

[0023] Figure 4 A schematic diagram of a three-dimensional vapor chamber element according to another specific embodiment of the present invention is shown.

[0024] Figure 5 A schematic diagram of a three-dimensional vapor chamber element according to another specific embodiment of the present invention is shown. DETAILED DESCRIPTION

[0025] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the attached drawings and specific embodiments. It should be noted that these specific embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, so it is necessary to explain them first.

[0026] See also Figure 1 , Figure 1FIG. 1 shows an exploded view of a three-dimensional vapor chamber element 1 according to a specific embodiment of the present invention. Figure 1 As shown, the three-dimensional steam chamber element 1 of this specific embodiment includes an upper cover 10, a lower plate 20 and a plurality of microchannels 30. The upper cover 10 has an opening 101 and an upper surface 102. The lower plate 20 has a lower plate upper surface 201, and the structure of the lower plate 20 corresponds to the upper cover 10. Among them, the lower plate upper surface 201 has a recessed opening 202 and an annular cavity 203 relative to the opening 101. A plurality of microchannels 30 are arranged on the upper surface 102 of the upper cover 10. When the upper cover 10 is coupled to the lower plate 20, the internal annular cavity 203 forms a closed air cavity, at which time the opening 101 and the recessed opening 202 are interconnected, and the plurality of microchannels 30 are respectively interconnected with the recessed opening 202.

[0027] In this specific embodiment, the three-dimensional vapor chamber element 1 further includes a continuous porous capillary structure and a plurality of support columns 41 having the porous capillary structure, and the upper cover 10 is provided with a nozzle sealing structure 103. The porous capillary structure is arranged on the lower surface of the upper cover 10 and the lower plate upper surface of the lower plate 20 corresponding to the closed air cavity. In detail, the porous capillary structure will not be completely laid on the lower surface of the upper cover 10, but will avoid the recessed opening 202 corresponding to the lower plate 20 to lay the porous capillary structure. Then, the plurality of support columns 41 will be pre-arranged on the lower plate 20. When the upper cover 10 is coupled with the lower plate 20, the plurality of support columns 41 having the porous capillary structure will be located between the upper cover 10 and the lower plate 20, and at this time, the plurality of support columns 41 having the porous capillary structure will form a continuous capillary structure with the porous capillary structure on the lower surface of the upper cover 10 and the porous capillary structure on the lower plate 20. Then, the working fluid is injected into the annular cavity 203 from the pre-set liquid injection port of the upper cover 10, and the interior is evacuated and the liquid injection port is sealed. The internal annular cavity 203 forms a closed air cavity and the sealed liquid injection port is the injection port sealing structure 103. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol, or a two-phase coolant, such as R134a.

[0028] Please continue reading Figure 1 The structure of the multiple microchannels 30 of the three-dimensional vapor chamber element of this specific embodiment is a quadrilateral as a whole, and the four corners of the quadrilateral are chamfered structures. In practice, the upper cover copper metal material can be first milled by a tooth-cutting process to form the specific contour of the overall microchannel structure, such as the chamfers of the four sides, the microchannel buffer area 31 and the opening 101 in the middle, and then the drainage channels of the microchannel 30 are cut and processed in sequence so that the coolant can flow through each microchannel 30 more evenly.

[0029] In practical applications, the three-dimensional vapor chamber element 1 of the present invention can be installed in a semi-open shell and placed in a coolant to simultaneously perform two-phase flow heat dissipation and liquid cooling inside the three-dimensional vapor chamber element. Figure 1 as well as Figure 2 , Figure 2 FIG. 1 is a schematic diagram showing a three-dimensional vapor chamber element 1 according to a specific embodiment of the present invention. Figure 2 As shown, the three-dimensional vapor chamber element 1 is installed in a semi-open shell 80. When the three-dimensional vapor chamber element 1 of the utility model is actually used for heat dissipation, the lower plate lower surface 205 of the lower plate 20 corresponding to the recessed opening 202 will contact the heat source 90. At this time, the working fluid in the closed air cavity 204 of the three-dimensional vapor chamber element 1 undergoes a phase change from a liquid working fluid to a gaseous working fluid after absorbing the heat energy of the heat source 90. Then, the gaseous working fluid moves upward to the condensation zone, cools down to undergo a phase change and turns back into a liquid working fluid. Finally, it flows back to the bottom along the porous capillary structure and the support column 41, thereby performing a two-phase flow circulation inside the three-dimensional vapor chamber element. Furthermore, the coolant flows in from the input port of the semi-open shell 80. At this time, the coolant can flow downward directly from the input port above the three-dimensional vapor chamber element, and pass through the opening 101 of the upper cover 10 and the recessed opening 202 of the lower plate 20, and then further splash on the opening surface 2021 of the recessed opening 202, so that the coolant can directly perform forced heat exchange and heat dissipation at the place with the highest temperature, greatly increasing the overall heat dissipation efficiency. Then, the coolant flows along the flow direction of the microchannel and further performs forced heat exchange with the large-area heat dissipation fins, thereby further greatly increasing the overall heat dissipation efficiency. Figure 2 The arrow direction shown in the figure is the coolant flow direction F. In practice, considering the heat exchange area of ​​the microchannel and the flow rate of the coolant, the flow channel width d of the microchannel is less than or equal to 1 mm. In practical applications, the overall outline of the microchannel structure, the flow channel width of the microchannel, the copper metal thickness between the microchannels, the drainage structure, etc. are not limited to this and can be adjusted according to the design.

[0030] The three-dimensional vapor chamber element 1 can be applied to electronic components with larger sizes near the heat source, but the three-dimensional vapor chamber element can also be in other forms. Figure 3 , Figure 3 FIG. 2 shows a schematic diagram of a three-dimensional vapor chamber element 2 of another specific embodiment of the present invention. Figure 3As shown, the lower plate lower surface 205 of the lower plate 20 of the three-dimensional steam chamber element 2 of this specific embodiment contacts the heat source 90. The size of the heat source 90 at this time is relatively large, and the three-dimensional steam chamber element 2 can be applied to any size of the heat source 90. The other devices of this specific embodiment are substantially the same as the corresponding devices of the above-mentioned specific embodiments, so they are not repeated here, and the three-dimensional steam chamber element 2 of this specific embodiment can also be installed in the above-mentioned semi-open shell to allow the three-dimensional steam chamber element 2 to perform liquid cooling and heat dissipation.

[0031] Next, the three-dimensional steam chamber element of the present invention further provides other aspects for users to choose according to their own needs and designs. Figure 4 , Figure 4 FIG. 2 shows a schematic diagram of a three-dimensional vapor chamber element 3 of another specific embodiment of the present invention. Figure 4 As shown, the opening surface 2021 of the three-dimensional vapor chamber element 3 of this specific embodiment is further provided with a plurality of heat dissipation structures 2022, wherein the positions where the plurality of heat dissipation structures 2022 and the opening surface 2021 are arranged correspond to the hot spot 901 with the highest temperature in the heat source 90. In practice, the heat dissipation structure 2022 can be a small cylinder, which can extend upward from the opening surface 2021 or be recessed downward, so as to increase the heat dissipation efficiency of the three-dimensional vapor chamber element 3, but the shape, number, and arrangement of the heat dissipation structure 2022 can be optimized and designed according to actual needs. The other devices of this specific embodiment are substantially the same as the devices corresponding to the aforementioned specific embodiments, so they are not repeated here, and the three-dimensional vapor chamber element 3 of this specific embodiment can also be installed in the above-mentioned semi-open shell to allow the three-dimensional vapor chamber element 3 to perform liquid cooling and heat dissipation.

[0032] For further information, see Figure 5 , Figure 5 FIG. 4 is a schematic diagram showing a three-dimensional vapor chamber element 4 of another specific embodiment of the present invention. Figure 5 As shown, the three-dimensional steam chamber element 4 of this specific embodiment includes three groups of upper covers 10 at the same time. At this time, the three groups of upper covers 10 can be coupled with one group of lower plates 20 to form a three-dimensional steam chamber element 4, and can be connected to three heat sources 90 at the same time. In practice, the number and arrangement of the three-dimensional steam chamber elements can be optimized according to actual needs. The other devices of this specific embodiment are roughly the same as the corresponding devices of the aforementioned specific embodiments, so they are not repeated here. Furthermore, the three-dimensional steam chamber element 4 of this specific embodiment can also be installed in a semi-open shell, and is provided with three groups of coolant openings corresponding to the heat source 90, so that the three-dimensional steam chamber element 4 can be liquid-cooled for heat dissipation.

[0033] In summary, the utility model provides a three-dimensional vapor chamber element that first absorbs the heat energy of the heat source by preferentially adhering to the lower surface of the lower plate that is closely attached to the heat source, and directly dissipates heat through the working fluid inside the lower plate in the porous capillary structure and the closed air cavity through phase change and two-phase flow circulation. Further, when the three-dimensional vapor chamber element of the utility model is applied to liquid cooling heat dissipation, the coolant can be directly splashed and impact the opening surface with the highest temperature, and the heat energy is preferentially transferred to the coolant for heat exchange. In addition, the microchannel structure on the upper cover can also increase the heat dissipation surface area by allowing the two-phase flow circulation inside the three-dimensional vapor chamber element, and the coolant can also be diverted and flow through the large-area fins along the direction of the microchannel setting and further forced heat exchange is performed, so that the coolant takes the heat away from the radiator. In summary, the utility model provides an innovative three-dimensional vapor chamber element that can be further combined with the heat exchange chamber shell of the liquid cooling cycle to form a radiator that has both phase change function and jet flow and microchannel heat dissipation function to solve the shortcomings of various types of conventional liquid cooling radiators.

[0034] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, but is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

Claims

1. A three-dimensional vapor chamber element, characterized in that Contains: A top cover having an opening and an upper surface; A lower plate, opposite to the upper cover, having a lower plate upper surface, the lower plate upper surface having a concave opening opposite to the opening and an annular cavity so that when the upper cover is coupled to the lower plate, the annular cavity forms a closed air cavity and the opening and the concave opening are interconnected; and A plurality of micro channels are arranged on the upper surface of the upper cover, and the micro channels are respectively connected with the concave openings.

2. The three-dimensional vapor chamber element according to claim 1, characterized in that: The lower plate further has a lower plate lower surface, and the lower plate lower surface opposite to the concave opening contacts a heat source.

3. The three-dimensional vapor chamber element according to claim 2, characterized in that: The recessed opening has an opening surface for receiving a splash of cooling liquid.

4. The three-dimensional vapor chamber element according to claim 3, characterized in that: The cooling liquid flows through the opening and the recessed opening to splash on the opening surface and then flows through the micro channels on the upper surface of the upper cover.

5. The three-dimensional vapor chamber element according to claim 1, characterized in that: The channel width of the micro channels is less than or equal to 1 mm.

6. The three-dimensional vapor chamber element according to claim 3, characterized in that: A plurality of heat dissipation structures are arranged on the opening surface, and the opening surface is located at a hot spot of the heat source.

7. The three-dimensional vapor chamber element according to claim 1, characterized in that: The invention also comprises a continuous multi-porous capillary structure, and the multi-porous capillary structure is arranged on the upper cover and the lower plate in the closed air cavity.

8. The three-dimensional vapor chamber element according to claim 1, characterized in that: The invention also comprises a plurality of supporting columns with multi-porous capillary structures, and the supporting columns are respectively arranged between the upper cover and the lower plate in the closed air cavity.

9. The three-dimensional vapor chamber element according to claim 1, wherein: The invention also comprises a micro-channel buffer area, and the micro-channel buffer area is arranged between the upper surface of the upper cover and the micro-channels.

10. The three-dimensional vapor chamber element according to claim 1, wherein: The upper cover is provided with a nozzle sealing structure, which is formed by sealing the liquid injection port after injecting a working fluid into the closed air cavity through a liquid injection port pre-arranged on the upper cover.

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