Wave guide structure, microwave transmission line and communication equipment

Abstract

The utility model provides a waveguide structure, a microwave transmission line and communication equipment, and the waveguide structure comprises a first conductive layer which is configured to be a concave groove structure with an opening at one end; the packaging layer covers the first conducting layer to form a cavity, and the packaging layer comprises a protruding part which extends towards the cavity; the second conductive layer is arranged on the surface of the protruding part, and the first distance between the second conductive layer and the first conductive layer is smaller than the second distance of the protruding part extending from the packaging layer to the cavity. According to the invention, the transmission efficiency can be improved, the signal loss can be reduced, and more reliable and efficient high-frequency signal transmission can be realized.

Description

Technical Field

[0001] The present application relates to the field of microwave transmission technology, and in particular to a waveguide structure, a microwave transmission line and a communication device. Background Art

[0002] In microwave transmission, there are three main forms of loss, namely conductor loss, dielectric loss and radiation loss. These losses will cause the signal to gradually weaken and distort during transmission, especially when the frequency increases, this effect becomes more significant, thereby reducing the performance of the entire system.

[0003] With the rapid development of modern wireless communication technology, the operating frequency band of communication systems is constantly increasing. The transmission loss of traditional open microwave transmission lines such as microstrip lines and coplanar waveguides in the millimeter wave frequency band is gradually increasing, which brings challenges to system performance. Therefore, in response to the needs of high frequency bands (especially millimeter wave bands and higher frequency bands), it is urgent to develop new low-loss waveguide structures. Utility Model Content

[0004] The present application provides a waveguide structure, a microwave transmission line and a communication device to solve the problem of increased transmission loss in high-frequency band communication systems.

[0005] In a first aspect, the present application provides a waveguide structure, the waveguide structure comprising:

[0006] The first conductive layer is configured as a concave groove structure with one end open;

[0007] A packaging layer covering the first conductive layer to form a cavity, wherein the packaging layer includes a protrusion extending toward the cavity;

[0008] The second conductive layer is disposed on the surface of the protrusion, and a first distance from the second conductive layer to the first conductive layer is smaller than a second distance of the protrusion extending from the packaging layer toward the cavity.

[0009] In an embodiment of the present application, the first conductive layer includes a bottom and a side wall portion disposed on the bottom, the side wall portion extends and is exposed in an external space and at least partially surrounds the second conductive layer.

[0010] In an embodiment of the present application, the first conductive layer includes a bottom and a side wall portion disposed on the bottom, the side wall portion extends toward the packaging layer and is disposed on an inner wall of the packaging layer, and at least partially surrounds the second conductive layer.

[0011] In the embodiment of the present application, the cavity formed between the packaging layer and the first conductive layer is a rectangular cavity, and the width of the second conductive layer is smaller than the width of the bottom of the cavity.

[0012] In an embodiment of the present application, the encapsulation layer includes a first part and a second part that are integrally arranged, the second part is the protrusion, which extends into the interior of the cavity so that the cavity is a concave cavity, and the width of the second conductive layer is smaller than the width of the bottom of the cavity and is smaller than or equal to the width of the protrusion.

[0013] In an embodiment of the present application, the encapsulation layer includes a first part and a second part that are integrally arranged, the second part is the protrusion, which extends into the interior of the cavity, and its cross-section is a partial circle, and the second conductive layer is an arc arranged on the partial circle, and the horizontal width corresponding to the length of the arc is smaller than the width of the bottom of the cavity, and the length of the arc is smaller than the arc length of the partial circle.

[0014] In an embodiment of the present application, the packaging layer includes a first part and a second part that are integrally arranged, the second part is the protrusion, which extends into the interior of the cavity, and its cross-section is an inverted trapezoid, and the width of the second conductive layer is smaller than the width of the bottom of the cavity, and is smaller than or equal to the width of the bottom of the trapezoid.

[0015] In an embodiment of the present application, a ratio of the first distance to the second distance is greater than or equal to one half.

[0016] In a second aspect, the present application further provides a microwave transmission line, which comprises a waveguide structure as described in any one of the first aspects.

[0017] In a third aspect, the present application further provides a communication device, comprising a waveguide structure as described in any one of the first aspects.

[0018] The waveguide structure, microwave transmission line and communication equipment provided by the present application solve the problem of large transmission loss in high-frequency band communication systems by adopting the design of the first conductive layer and the second conductive layer. Specifically, through the design of the first conductive layer and the second conductive layer, and the cavity formed by the relative arrangement of the encapsulation layer and the first conductive layer, the propagation range of electromagnetic waves in the structure can be controlled and limited, and the transmission loss can be reduced. At the same time, the second conductive layer is arranged on the surface of the protrusion of the encapsulation layer and is located inside the cavity, providing a transmission path, further reducing the transmission loss. Moreover, the first distance between the second conductive layer and the first conductive layer is less than the second distance of the protrusion extending from the encapsulation layer toward the cavity, that is, there is a smaller distance (first distance) between the second conductive layer and the first conductive layer. Such a design can make the electric field more concentrated and optimize the electric field distribution, improve the transmission efficiency and reduce the loss of the signal, and achieve more reliable and efficient high-frequency signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present application or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 is a structural schematic diagram of the waveguide structure provided in Example 1 of the present application;

[0021] Figure 2 is a structural schematic diagram of the waveguide structure provided in Example 2 of the present application;

[0022] Figure 3 is a structural schematic diagram of the waveguide structure provided in Example 3 of the present application;

[0023] Figure 4 is a structural schematic diagram of the waveguide structure provided in Example 4 of the present application;

[0024] Figure 5 is a structural schematic diagram of the waveguide structure provided in Example 5 of the present application;

[0025] Figure 6 yes Figure 5 Stereoscopic image of

[0026] Figure 7 yes Figure 6 Cross-sectional view of . DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with the drawings in this application. Obviously, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein.

[0029] In microwave transmission, the total loss α is composed of three different sources of loss, namely, conductor loss α a , dielectric loss α b and radiation loss α c Specifically, the conductor loss αa It is caused by the fact that actual metals are non-ideal conductors and the skin effect; actual metals will produce a certain resistance during the transmission process, causing part of the electromagnetic wave energy to be converted into heat energy and generate losses. Dielectric loss α b It is caused by the polarization of dielectric molecules and the collision with the lattice under the action of high-frequency electromagnetic field, resulting in heat energy loss; high-frequency electromagnetic field can cause dielectric molecules to polarize, resulting in energy loss. c It is the energy loss due to electromagnetic radiation or transmission leakage on the waveguide structure; part of the energy is lost through radiation or leakage.

[0030] Combining the above three loss sources, the total loss α can be expressed as the sum of these three losses:

[0031] α=α a +α b +α c .

[0032] The above losses will cause signal attenuation and distortion during transmission, especially at high frequencies, thereby increasing the power consumption of the entire system and reducing system performance.

[0033] In order to solve the problem of large transmission loss in high-frequency band communication systems, the present application provides a waveguide structure, a microwave transmission line and a communication device, which solve the problem of large transmission loss in high-frequency band communication systems through a combination of a first conductive layer and a second conductive layer.

[0034] Specifically, the first conductive layer is configured as a concave groove structure with one end open, which creates a waveguide channel, reducing the scattering of energy in other directions and the loss during transmission. The encapsulation layer covers the first conductive layer to form a cavity, so that the encapsulation layer is arranged relative to the first conductive layer, limiting the propagation range of electromagnetic waves in the structure, thereby reducing the transmission loss. The encapsulation layer includes a protrusion extending toward the cavity, which provides support for the arrangement of the second conductive layer, and the protrusion extends toward the cavity to create a transmission path. The second conductive layer is arranged on the surface of the protrusion and is located inside the cavity, so that the arrangement of the second conductive layer further reduces the transmission loss and provides effective waveguide transmission through the transmission path. Furthermore, the first distance from the second conductive layer to the first conductive layer is less than the second distance from the protrusion extending from the encapsulation layer toward the cavity, that is, there is a smaller distance (first distance) between the second conductive layer and the first conductive layer. Such a design can make the electric field more concentrated and optimize the electric field distribution, so that the transmission efficiency is improved, and the signal loss is reduced, so as to achieve more reliable and efficient high-frequency signal transmission.

[0035] Combine the following Figure 1-Figure 7 The waveguide structure, microwave transmission line and communication equipment described in this application are described.

[0036] Embodiment 1:

[0037] A waveguide structure is a physical structure used to guide and propagate electromagnetic waves or light waves, which can optimize signal transmission, reduce transmission losses, and control wave propagation characteristics. Different types of waveguide structures are suitable for electromagnetic waves or light waves in different frequency bands (such as microwaves, millimeter waves, light waves, etc.). Common waveguide structures can include transmission lines (such as microstrip lines, coaxial cables, parallel lines, etc., used to transmit RF and microwave signals), waveguides (a closed metal pipe or cavity, in which electromagnetic waves can propagate and transmit in a specific way, commonly used in millimeter wave and microwave communication systems), optical waveguides (used in the optical field, which can be optical fibers, optical waveguide plates, etc., used to guide and control the transmission of optical signals), dielectric waveguides (waveguide structures that use the refractive index difference of the medium to cause optical waveguides, such as waveguides based on photonic crystals, optical waveguide gratings, etc.), etc.

[0038] These waveguide structures play an important role in different fields and applications. By designing and optimizing parameters such as shape, material and size of the waveguide structures, the guidance, regulation and transmission of electromagnetic waves can be achieved, thereby meeting the needs of various communication, sensing, imaging and other systems.

[0039] Please refer to Figure 1 , Figure 1 1 is a schematic diagram of the structure of the waveguide structure provided in the first embodiment of the present application. A waveguide structure 10 includes a packaging layer (which may be referred to as a dielectric cover) 11, a first conductive layer (which may be referred to as a metal outer wall) 12, and a second conductive layer (which may be referred to as a metal conductive strip) 13. Exemplarily, the first conductive layer 12 is configured as a concave groove structure with one end open. The packaging layer 11 covers the first conductive layer 12 to form a cavity 14, and the packaging layer 11 includes a protrusion extending toward the cavity 14. The second conductive layer 13 is disposed on the surface of the protrusion, and a first distance H between the second conductive layer 13 and the first conductive layer 12 is air is smaller than a second distance H of the protrusion extending from the encapsulation layer 11 toward the cavity 14 med .

[0040] Specifically, the encapsulation layer 11 has a first side facing the internal space and a second side facing the external space. The first conductive layer 12 has a first side facing the internal space and a second side facing the external space. The first side of the first conductive layer 12 is matched with the first side of the encapsulation layer 11 to form the internal space, and the internal space includes a cavity 14. The second conductive layer 13 is located inside the cavity 14, and has a first surface (i.e., an upper surface) and a second surface (i.e., a lower surface) opposite thereto. The first surface is arranged on the surface of the second side of the encapsulation layer 11 and does not contact the first conductive layer 12. The first distance H between the second conductive layer 13 and the first conductive layer 12 is airis smaller than a second distance H of the protrusion extending from the encapsulation layer 11 toward the cavity 14 med .

[0041] It should be noted that the internal space is a space surrounded by the packaging layer 11 and the first conductive layer 12, and the external space is a free space outside the guiding wave structure.

[0042] Specifically, the encapsulation layer 11 is used to provide external covering protection for the waveguide structure 10 to prevent the external environment from affecting the waveguide structure 10, and at the same time, different dielectric materials can be selected to specifically guide and transmit electromagnetic waves. The first conductive layer 12, as a part of the waveguide structure 10, constitutes the boundary of the waveguide structure 10 with the second conductive layer 13. The guidance and transmission of electromagnetic waves are achieved through the interaction between the first conductive layer 12 and the second conductive layer 13. The second conductive layer 13 is used for conducting electricity and transmitting electromagnetic wave signals, and is combined with the cavity formed between the encapsulation layer 11 and the first conductive layer 12, and is in contact with the encapsulation layer 11 so that the second conductive layer 13 is supported by the encapsulation layer 11 to form a transmission line of the waveguide structure 10.

[0043] Metal waveguides have the characteristics of low loss, high power transmission and strong anti-interference ability, while microstrip transmission lines have the characteristics of simple structure and easy integration. The waveguide structure described in the present application fully utilizes the advantages of both metal waveguides and microstrip transmission lines, and combines the advantages of the two. In addition, the waveguide structure described in the present application has a wide frequency band characteristic, can transmit signals in a wider frequency band, and adopts a quasi-closed cavity, which can effectively reduce the radiation and leakage loss during the electromagnetic wave transmission process. Furthermore, through process adjustment, the width of the second conductive layer and the distance from the first conductive layer can be easily changed, thereby realizing the adjustment of the impedance and propagation phase of the waveguide structure, and improving adaptability and adjustability.

[0044] For example, in a traditional microstrip line, the surface current is mainly concentrated on the lower surface of the microstrip line (i.e., the side where the microstrip line is attached to the dielectric layer, which is equivalent to the first surface of the second conductive layer 13 of the present application), and the lower surface has a large roughness. This will cause the current on the lower surface to be unevenly distributed, increasing additional conductor losses. The waveguide structure of the present application adopts an inverted manner, so that the current of the second conductive layer 13 is mainly concentrated on the second surface in contact with the air, and then the large electric field is mainly concentrated on the left and right sides of the second conductive layer 13 and in the cavity 14 at the bottom, while only a small part of the electric field is distributed inside the packaging layer 11, and the second surface is relatively smooth, thus avoiding the problem of additional losses caused by the uneven surface, and further reducing the loss of the waveguide structure. Therefore, this design of the present application can greatly reduce the loss of the medium, thereby achieving low-loss transmission.

[0045] Exemplarily, the cross section of the first conductive layer 12 is a concave groove structure, and the matching design of the concave groove structure and the packaging layer 11 can form a rectangular cavity 14. The first conductive layer 12 includes a bottom 121 and a side wall portion 122 disposed on the bottom 121, the side wall portion 122 extends toward the packaging layer 11 and is exposed in the external space, and the first conductive layer 12 at least partially surrounds the second conductive layer 13.

[0046] Wherein, S represents the horizontal distance from the second conductive layer 13 to the side wall portion 122, H sub represents the vertical distance from the encapsulation layer 11 to the side wall portion 122 of the first conductive layer 12 .

[0047] The concave groove structure can provide a good electromagnetic shielding effect. By enclosing the second conductive layer 13 in the concave groove, the radiation and leakage of electromagnetic waves can be effectively limited, and the influence of external interference on the system can be reduced. In addition, the design of the concave groove can optimize and adjust the characteristics of the waveguide structure, such as impedance matching and propagation phase adjustment of the waveguide structure.

[0048] That is to say, the design of the concave groove can change the geometric shape and size of the waveguide structure, thereby affecting the characteristic impedance of the waveguide structure. By adjusting the shape and size of the concave groove, the characteristic impedance of the waveguide structure can be matched with the input / output impedance of the device connected to it, so as to achieve the best power transfer of signal transmission. In addition, the presence of the concave groove will change the distribution of the electromagnetic field in the waveguide structure, thereby changing the propagation speed and propagation phase of the electromagnetic wave in the waveguide structure. Through the design of the concave groove, the phase delay of the electromagnetic wave in the waveguide structure can be adjusted, the phase adjustment can be achieved, the signal can be compensated and corrected, so that the signal in the waveguide structure maintains a consistent phase relationship to meet the needs of the system.

[0049] Therefore, the design of the concave groove can affect the characteristics of the waveguide structure, such as the transmission loss, radiation loss, etc. of the waveguide structure. By reasonably designing the shape, size and position of the concave groove, these characteristics can be optimized and adjusted. For example, by designing the shape and structure of the concave groove, the electromagnetic field distribution can be changed, thereby realizing parameter control of the waveguide structure. In addition, the concave groove can also enhance the stability and rigidity of the structure, so that the first conductive layer 12 has better mechanical support and fixing capabilities. At the same time, the side wall portion 124 of the first conductive layer 12 of the present application has better isolation than the traditional microstrip line, so that the second conductive layer 13 close to the first conductive layer 12 can better restrain the electric field and reduce radiation loss.

[0050] As one embodiment, the first distance H between the second conductive layer 13 and the bottom of the cavity 14 is air A second distance H from the farthest point of the second conductive layer 13 from the second side of the first conductive layer 12 medA ratio greater than or equal to one-half can achieve better transmission performance, for example, the ratio can be set to about two-thirds.

[0051] Specifically, by adjusting the distance H between the second conductive layer 13 and the bottom of the cavity 14 air and the distance H from the farthest point of the first conductive layer 12 med , the electromagnetic field distribution and parameters of the waveguide structure can be optimized, thereby improving the transmission performance. A specific ratio relationship (such as two-thirds) can make the electromagnetic wave have a better propagation effect and reduce the transmission loss during the transmission process. By properly designing H air and H med The ratio of H can make the electromagnetic field more concentrated inside the waveguide structure, reduce the radiation loss of electromagnetic waves and interference to the outside world, and improve the anti-interference ability of the waveguide structure. air and H med The ratio of H can improve the structural stability of the waveguide structure and reduce the impact of electromagnetic waves on the structure, thereby improving the reliability and stability of the waveguide structure. air and H med The ratio can reduce the loss in the waveguide structure, reduce the energy loss during signal transmission, and improve the efficiency and performance of the overall system.

[0052] Therefore, by designing H air and H med A waveguide structure with a ratio equal to or greater than one-half can optimize transmission performance, reduce radiation and interference, improve reliability and stability, and reduce losses. Such a design can effectively solve the problem of high loss in the waveguide structure and achieve better technical effects.

[0053] As another embodiment, the width W of the second conductive layer 13 is feed Smaller than the width W of the bottom of the cavity 14 slot Such a design can change the characteristic impedance of the waveguide structure, which is beneficial to achieve impedance matching between the waveguide structure and an external system or device. By reasonably adjusting the width W of the second conductive layer 13 feed , which can make the impedance adaptation of the input / output ports of the waveguide structure more accurate and improve the efficiency and performance of signal transmission.

[0054] Embodiment 2:

[0055] Please refer to Figure 2 , Figure 2 1 is a schematic diagram of the structure of the waveguide structure provided in the second embodiment of the present application. The packaging layer 11 includes a first portion 111 and a second portion 112 which are integrally arranged. The second portion 112 serves as the protrusion, which extends into the interior of the cavity 14 so that the cavity 14 is a concave cavity. Figure 1Similar structures and their functions will not be described in detail here.

[0056] Figure 2 and Figure 1 The difference is: Figure 1 The cavity 14 is a rectangular cavity. Figure 2 The cavity 14 is a concave cavity.

[0057] Figure 1 The close-fitting structure formed by the encapsulation layer 11 and the first conductive layer 12 is shown. However, in the complex circuit assembly process, it is difficult to control the assembly tolerance of the waveguide structure. Therefore, the rectangular cavity is changed to a concave cavity. This can avoid mutual squeezing of the encapsulation layer 11 and the first conductive layer 12 during assembly, reducing the risk of structural deformation and damage. In addition, during the high and low temperature experiments, the thermal expansion coefficients of the medium of the encapsulation layer 11 and the metal of the first conductive layer 12 are quite different. By designing a concave cavity, the direct contact between the medium and the metal can be reduced, the stress and deformation caused by thermal expansion can be reduced, and the stability and reliability of the structure can be improved. In addition, relative to Figure 1 The rectangular cavity shown, Figure 2 The concave cavity shown makes the structure of the second part 114 of the packaging layer 11 become a rectangle, thereby reducing the proportion of the medium, which can reduce the dielectric loss of the waveguide structure, reduce energy attenuation, and improve signal transmission efficiency.

[0058] For example, the width W of the second conductive layer 13 is feed Smaller than the width W of the bottom of the cavity 14 slot , and is less than or equal to the width of the second portion 112.

[0059] Laser engraving is a high-precision processing technology that fixes the position of the second conductive layer 13 by retaining a portion of the medium of the packaging layer 11, that is, the width W of the second conductive layer 13 feed Being smaller than the width of the second portion 112 can ensure the stability and positioning accuracy of the metal guide strip during processing, ensure the complete processing of the waveguide structure, and reduce errors in the manufacturing process.

[0060] Embodiment three:

[0061] Please refer to Figure 3 , Figure 3 1 is a schematic diagram of the structure of the waveguide structure provided in the third embodiment of the present application. The packaging layer 11 includes a first portion 111 and a second portion 112 that are integrally arranged, the second portion 112 being the protrusion that extends to the interior of the cavity 14, and the cross-section of the second portion 112 is a partial circle. For example, a semicircle. Other structures and functions similar to the previous embodiments are not described in detail here.

[0062] Figure 3 and Figure 2 The difference is: Figure 2 The cross section of the second portion 112 is rectangular, Figure 3 The cross-section of the second portion 112 is partially circular.

[0063] and Figure 2 For the same reason, Figure 1 The rectangular cavity shown, Figure 3 The cavity shown makes the structure of the second part 112 of the encapsulation layer 11 become a part of a circle, thereby reducing the proportion of the medium, which can reduce the dielectric loss of the waveguide structure, reduce energy attenuation, and improve signal transmission efficiency.

[0064] Exemplarily, the second conductive layer 13 is an arc arranged on a part of a circle, and the length of the arc corresponds to a horizontal width W of feed Smaller than the width W of the bottom of the cavity 14 slot , and the length of the arc segment is smaller than the length of the arc of the partial circle.

[0065] Similarly, by retaining a portion of the dielectric of the packaging layer 11 to fix the position of the second conductive layer 13, that is, the arc length of this segment is smaller than the arc length of the circular portion, the stability and positioning accuracy of the metal guide strip during processing can be ensured. This ensures the integrity of the processing of the waveguide structure and reduces errors during the manufacturing process.

[0066] By designing the second conductive layer 13 to be an arc, the geometric shape of the waveguide structure can be changed, thereby adjusting the electromagnetic properties of the waveguide structure, such as impedance matching, transmission loss, etc. Limiting the horizontal width W corresponding to the arc length feed Smaller than the width W of the bottom of the cavity 14 slot , which helps to control the impedance of the line within a certain range and optimize the signal transmission efficiency. In addition, the design of the arc structure can affect the distribution of the electromagnetic field, so that the electromagnetic waves propagate in the waveguide structure in a more appropriate manner. By controlling the arc length and horizontal width, the distribution of the electromagnetic field in the waveguide structure can be adjusted, thereby affecting the performance and characteristics of the waveguide structure. Therefore, a reasonable design of the arc structure can reduce electromagnetic interference and signal loss in the waveguide structure. By limiting the arc length of the second conductive layer to be less than the arc length of the partial circle, and making the horizontal width corresponding to the arc length less than the width of the bottom of the cavity, the stability and anti-interference ability of the waveguide structure can be improved.

[0067] Embodiment 4:

[0068] Figure 2 The waveguide structure shown in the figure requires a certain tilt angle to completely carve out the bottom groove when using laser engraving in actual processing. In order to meet the processing requirements, a Figure 4The structure is provided, and a certain inclination angle is added to both sides of the second portion 112 of the encapsulation layer 11. Other structures and functions similar to the previous embodiment are not described in detail here.

[0069] Please refer to Figure 4 , Figure 4 The packaging layer 11 includes a first portion 111 and a second portion 112 which are integrated, the second portion 112 being the protrusion extending into the cavity 14, and the cross section of the second portion 112 is an inverted trapezoid.

[0070] Figure 4 and Figure 2 The difference is: Figure 2 The cross section of the second portion 112 is rectangular, Figure 3 The cross section of the second portion 112 is an inverted trapezoid. An inverted trapezoid means that the width of the upper base is greater than the width of the lower base (i.e., the bottom).

[0071] By increasing the inclination angle on both sides of the second part 112 of the encapsulation layer 11, and extending the second part 112 into the cavity 14, an inverted trapezoidal cross-sectional shape is designed to better meet the needs of laser engraving processing. The design of the inclination angle helps to ensure that the bottom groove is completely engraved, thereby improving the processing accuracy and quality. Moreover, the inverted trapezoidal cross-sectional shape helps to enhance the structural stability of the encapsulation layer 11. Such a design can make the second part 112 more solid during processing and use, reduce the risk of structural deformation and damage, and improve the reliability of the waveguide structure. Therefore, by increasing the inclination angle on both sides of the second part 112 of the encapsulation layer 11 and designing it as an inverted trapezoidal cross-section, the processing efficiency and accuracy can be improved during the laser engraving process. Such a structural design can better adapt to the processing technology, thereby improving the stability and effect of the processing process.

[0072] For example, the width W of the second conductive layer 13 is feed Smaller than the width W of the bottom of the cavity 14 slot , and the width W of the second conductive layer 13 feed Less than or equal to the width of the bottom of the trapezoid.

[0073] Similarly, the position of the second conductive layer 13, that is, the width W of the second conductive layer 13 is fixed by retaining a portion of the dielectric of the encapsulation layer 11. feed Being smaller than or equal to the width of the bottom of the trapezoid can ensure the stability and positioning accuracy of the metal guide strip during processing, thus ensuring the processing integrity of the waveguide structure and reducing errors during the manufacturing process.

[0074] Embodiment five:

[0075] Despite the adoption Figure 4Although the waveguide structure is a waveguide structure, there is still a problem of inserting the second part 112 of the packaging layer 11 into the slot of the first conductive layer 12. When the first conductive layer 12 and the packaging layer 11 are assembled, it is difficult to ensure that the second conductive layer 13 is located at the center of the cavity. In addition, when the waveguide structure becomes complicated, the close fit between the second part 112 of the packaging layer 11 and the first conductive layer 12 also becomes difficult and the processing is complicated.

[0076] In order to solve this problem and consider the trade-offs in structure, process and reliability, a Figure 5 Please refer to Figure 5 , Figure 6 , Figure 7 , Figure 5 is a structural schematic diagram of the waveguide structure provided in Example 5 of the present application, Figure 6 yes Figure 5 A stereogram of Figure 7 yes Figure 6 . Exemplarily, the encapsulation layer 11 includes an integrated first portion 111 and a second portion 112, the second portion 112 is divided into the protrusion, which extends into the cavity 14. The first conductive layer 12 includes a bottom 121 and a side wall portion 122 disposed on the bottom 121, the side wall portion 122 extends toward the encapsulation layer and is disposed on the inner wall of the encapsulation layer 11, and the first conductive layer 12 at least partially surrounds the second conductive layer 12. Other structures and functions similar to the previous embodiments are not repeated here.

[0077] Figure 5 and Figure 4 The difference is: Figure 4 The side wall portion 122 and Figure 5 The side wall portion 122 is different. In terms of process implementation, Figure 5 A flat first conductive layer 12 may be used instead Figure 4 The concave first conductive layer 12 is formed, and a cavity 14 is opened on the packaging layer 11 to realize the basic structure of the waveguide structure. At the same time, a metal surface is plated on the inner wall of the medium on both sides of the packaging layer 11 to form a side wall portion 122, thereby replacing Figure 4 A side wall portion 122 is shown for confining the electric field.

[0078] By using a flat first conductive layer 12, assembly becomes more compact and easier, and the requirement that the second conductive layer 13 is located at the center of the cavity 14 is also easier to achieve. Figure 5 The waveguide structure shown makes the process on the packaging layer 11 more complicated, but it improves the fit between the packaging layer 11 and the first conductive layer 12 and can better meet the design requirements and functions. Figure 5The assembly structure shown can solve the difficulty of inserting the second portion 112 (which can be called dielectric ridge) of the encapsulation layer 11 into the slot of the first conductive layer 12 and provide better assembly performance. Figure 5 The waveguide structure shown can make the bonding between the packaging layer 11 and the first conductive layer 12 tighter and easier, and help to achieve the requirement that the second conductive layer 13 is located at the center of the cavity 14 .

[0079] Exemplarily, the cross section of the second portion 112 of the encapsulation layer 11 is an inverted trapezoid, and the width W of the second conductive layer 13 is feed Smaller than the width W of the bottom of the cavity 14 slot , and the width W of the second conductive layer 13 feed Less than or equal to the width of the bottom of the trapezoid.

[0080] Similarly, the position of the second conductive layer 13, that is, the width W of the second conductive layer 13 is fixed by retaining a portion of the dielectric of the encapsulation layer 11. feed Being smaller than or equal to the width of the bottom of the trapezoid can ensure the stability and positioning accuracy of the metal guide strip during processing, thereby ensuring the processing integrity of the waveguide structure and reducing errors during the manufacturing process.

[0081] In addition, if Figure 7 As shown, since the protrusion of the encapsulation layer 11 has an inverted trapezoidal cross section and forms a cavity 14 with the first conductive layer 12, the second conductive layer 13 is closely attached to the surface of the protrusion of the encapsulation layer 11, so that the electromagnetic field can be effectively limited and guided in the cavity 14. The first distance H from the second conductive layer 13 to the first conductive layer 12 air It can be changed from left to right. This method can be used to adjust the impedance of the waveguide structure transmission line and perform impedance transformation and matching.

[0082] That is, by adjusting the distance H between the second conductive layer 13 and the first conductive layer 12 air , the characteristic impedance of the waveguide structure can be changed. For example, when the distance H air When the distance H decreases, the distribution of the electromagnetic field will be affected, thereby changing the impedance of the waveguide structure. air , the impedance of the transmission line can be accurately adjusted.

[0083] According to the design requirements of the waveguide structure transmission line, the distance H from the second conductive layer 13 to the first conductive layer 12 can be adjusted. air For example, when one impedance needs to be matched to another unmatched impedance, the impedance conversion can be achieved by using this distance change.

[0084] By flexibly changing the distance from the second conductive layer 13 to the first conductive layer 12, impedance matching of the waveguide structure transmission line can be achieved. air , so that the impedance of the input and output ends of the waveguide structure transmission line are matched, achieving the maximum transmission efficiency of the signal.

[0085] Therefore, by controlling the distance H between the second conductive layer 13 and the first conductive layer 12 air , the impedance of the waveguide structure transmission line can be flexibly adjusted to achieve impedance transformation and matching, thereby meeting the needs of different application scenarios. This design method provides greater flexibility and adjustability for the application of waveguide structures.

[0086] The following is a simulation test of the different waveguide structures of the above embodiments 1 to 5.

[0087] A wave port is an interface for simulating electromagnetic waves to be introduced into or output from a radio frequency device. The size of the wave port is related to the wavelength K and the dielectric constant ε. In the design of waveguide structures, the size of the wave port will affect the impedance, loss and other performance indicators of the waveguide structure.

[0088] The dielectric constant ε is the equivalent dielectric constant in the waveguide structure, which characterizes the influence of the entire waveguide structure on the transmission of electromagnetic waves. In microwave transmission, the dielectric constant ε is an important parameter, which reflects the material's ability to respond to the electric field. Materials with different dielectric constants will have different effects on the transmission characteristics of electromagnetic waves. By calculating the equivalent dielectric constant ε, the influence of the dielectric of the encapsulation layer and the air area of ​​the cavity in the waveguide structure on the electromagnetic wave can be effectively described, thereby optimizing the design parameters of the waveguide structure to achieve the required specific transmission characteristics, such as impedance matching, loss reduction, etc.

[0089] Exemplarily, the calculation formula of the equivalent dielectric constant ε of the waveguide structure described in the present application is as follows:

[0090] Equivalent dielectric constant ε=S 空气 / S 横截面 *ε 空气 *k1+S 介质 / S 横截面 *ε 介质 *k2;

[0091] The calculation formula includes two parts:

[0092] Part I: S 空气 / S 横截面 *ε 空气 *k1 is used to calculate the contribution of the air region of the cavity to the equivalent dielectric constant ε, S 空气 / S 横截面 represents the cross-sectional ratio occupied by the air region, ε 空气Represents the dielectric constant of air, k1 is a preset coefficient, for example, the value is 1.2.

[0093] Part II: S 介质 / S 横截面 *ε 介质 *k2 is used to calculate the contribution of the dielectric area of ​​the encapsulation layer to the equivalent dielectric constant, S 介质 / S 横截面 represents the cross-sectional ratio occupied by the dielectric area, ε 介质 Represents the dielectric constant of the medium, k2 is a preset coefficient, for example, the value is 0.57.

[0094] Exemplarily, S of the waveguide structure described in the present application is 横截面 The calculation formula is as follows:

[0095] S 横截面 =(H sub +H med +H air )*W slot ;

[0096] Among them, S 横截面 represents the total cross-sectional area of ​​the waveguide structure, H sub +H med +H air represents the height from the bottom of the first conductive layer to the first side surface of the encapsulation layer, W slot Indicates the width of the cavity bottom. For example, H sub +H med +H ai The value can be set to 1mm, W slot The value can be set to 0.9mm.

[0097] For example, for the above Figures 1 to 5 The various cross sections shown are simulated and the test results are as follows:

[0098] Figure 1 Middle: When H air =0.2mm, H med =0.3mm, the cross-sectional area is 0.9mm*1mm, the dielectric constant of the packaging layer is 3.4, and the loss tangent is 0.003. The loss of the waveguide structure at 18GHz is about 0.005dB / mm, the characteristic impedance is 81.4 ohms, and the equivalent dielectric constant is about 1.95.

[0099] Figure 2 Middle: When H air =0.2mm, H med=0.3mm, the cross-sectional area is 0.9mm*1mm, the dielectric constant of the packaging layer is 3.4, and the loss tangent is 0.003. The loss of the waveguide structure at 18GHz is about 0.003dB / mm, the characteristic impedance is 91.3 ohms, and the equivalent dielectric constant is about 1.57.

[0100] Figure 3 Middle: When H air =0.2mm, H med =0.3mm, the cross-sectional area is 0.9mm*1mm, the dielectric constant of the packaging layer is 3.4, and the loss tangent is 0.003. The loss of the waveguide structure at 18GHz is about 0.0032dB / mm, the characteristic impedance is 88.9 ohms, and the equivalent dielectric constant is about 1.66.

[0101] Figure 4 Middle: When H air =0.2mm, H med =0.3mm, the cross-sectional area is 0.9mm*1mm, the dielectric constant of the packaging layer is 3.4, and the loss tangent is 0.003. The loss of the waveguide structure at 18GHz is about 0.004dB / mm, the characteristic impedance is 93.9 ohms, and the equivalent dielectric constant is about 1.7.

[0102] Figure 5 Middle: When H air =0.2mm, H med =0.3mm, the cross-sectional area is 0.9mm*1mm, the dielectric constant of the packaging layer is 3.4, and the loss tangent is 0.003. The loss of the waveguide structure at 18GHz is about 0.0033dB / mm, the characteristic impedance is 89.5 ohms, and the equivalent dielectric constant is about 1.67.

[0103] It can be seen that based on Figures 1 to 5 H air , H med , cross-sectional area, dielectric properties and other parameters, and measured the loss, characteristic impedance and equivalent dielectric constant of the waveguide structure under different parameters. From these measurement results, it can be seen that by adjusting the design parameters, the characteristics of the waveguide structure described in this application, such as impedance, loss, etc., can be controlled and optimized.

[0104] In summary, by adjusting the design parameters such as wave port size, dielectric properties and geometric shape, the characteristics of the waveguide structure such as impedance and loss can be controlled and optimized. Such control and optimization can adjust the performance of the waveguide structure according to specific needs to meet the requirements of high-frequency communication systems.

[0105] In some other embodiments of the present application, the present application further provides a microwave transmission line, which includes the waveguide structure as described in any of the above embodiments.

[0106] Specifically, a microwave transmission line is a medium used to transmit high-frequency electromagnetic signals (such as microwaves). The waveguide structure it contains has a specific geometry and design parameters for effectively transmitting high-frequency electromagnetic energy and maintaining signal stability and integrity.

[0107] In some other embodiments of the present application, the present application also provides a communication device, which includes the waveguide structure as described in any of the above embodiments.

[0108] Specifically, microwave transmission lines are used to transmit high electromagnetic signals and can play a role in signal transmission in applications such as communication equipment. The waveguide structure described in this application has good electromagnetic shielding and transmission characteristics, can reduce signal loss and distortion, and maintain signal integrity. In addition, specific impedance matching can be achieved to ensure effective signal transmission and maximum power transfer, reduce signal reflection and interference, and improve system performance and stability.

[0109] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A waveguide structure, characterized in that: The waveguide structure comprises: The first conductive layer is configured as a concave groove structure with one end open; a packaging layer covering the first conductive layer to form a cavity, the packaging layer comprising a protrusion extending toward the cavity; The second conductive layer is disposed on the surface of the protrusion, and a first distance from the second conductive layer to the first conductive layer is smaller than a second distance of the protrusion extending from the packaging layer toward the cavity.

2. The waveguide structure according to claim 1, characterized in that: The first conductive layer includes a bottom and a side wall portion disposed on the bottom, the side wall portion extends toward the packaging layer and is exposed in an external space, and at least partially surrounds the second conductive layer.

3. The waveguide structure according to claim 1, characterized in that: The first conductive layer includes a bottom portion and a side wall portion disposed on the bottom portion, wherein the side wall portion extends toward the packaging layer and is disposed on an inner wall of the packaging layer and at least partially surrounds the second conductive layer.

4. The waveguide structure according to claim 2, characterized in that: The cavity formed between the packaging layer and the first conductive layer is a rectangular cavity, and the width of the second conductive layer is smaller than the width of the bottom of the cavity.

5. The waveguide structure according to claim 2, characterized in that: The packaging layer includes a first part and a second part that are integrally arranged, the second part is the protrusion, which extends into the cavity so that the cavity is a concave cavity, and the width of the second conductive layer is smaller than the width of the bottom of the cavity and is smaller than or equal to the width of the protrusion.

6. The waveguide structure according to claim 2, characterized in that: The packaging layer includes a first part and a second part that are integrally arranged. The second part is the protrusion, which extends into the interior of the cavity and has a partial circle cross-section. The second conductive layer is an arc arranged on the partial circle. The horizontal width corresponding to the length of the arc is smaller than the width of the bottom of the cavity, and the length of the arc is smaller than the arc length of the partial circle.

7. The waveguide structure according to claim 2 or 3, characterized in that: The packaging layer includes a first part and a second part that are integrally arranged. The second part is the protrusion, which extends into the cavity and has a cross-section of an inverted trapezoid. The width of the second conductive layer is smaller than the width of the bottom of the cavity and is smaller than or equal to the width of the bottom of the trapezoid.

8. The waveguide structure according to claim 1, characterized in that: A ratio of the first distance to the second distance is greater than or equal to one half.

9. A microwave transmission line, characterized in that: The microwave transmission line comprises the waveguide structure according to any one of claims 1 to 8.

10. A communication device, characterized in that: The communication device comprises the waveguide structure according to any one of claims 1 to 8.

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