Folding fin radiator

Abstract

The utility model relates to a folding fin radiator which comprises folding radiating fins, a shaping assembly and a heat pipe. The folding cooling fin is provided with a first through groove, a second through groove and a third through groove. The first through grooves and the second through grooves are located in the bottoms of the folding cooling fins. The third through groove is located in the top of the folding cooling fin. The shaping assembly comprises a pull rod, a fixed baffle, a movable baffle and an adjusting screw rod. The pull rod penetrates through the first through groove. Mounting parts are arranged at the bottoms of the pull rods. And the fixed baffle plate and the movable baffle plate are clamped at two ends of the folding radiating fin. The movable baffle is connected to the pull rod in series through the adjusting screw rod. And the heat pipe is U-shaped and is arranged on the second through groove and the third through groove in a penetrating manner. A clamping structure is adopted to achieve compression adjustment, length reduction and compactness improvement of the folded cooling fins, traditional substrate connection is abandoned, the circuit board can be directly attached to the folded cooling fins, the heat pipe is introduced to improve the heat transfer efficiency, and the purposes of improving the compactness and the cooling efficiency are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a folded sheet radiator. Background Art

[0002] At present, the heat sink structures commonly used for circuit board heat dissipation are mainly divided into three categories, including: fin heat sink, folded sheet heat sink, and die-cast or cold-forged shell heat sink. The characteristic of the folded sheet heat sink is that the main body used to dissipate heat is a folded sheet formed by bending a metal sheet. The advantages of this folded heat sink are its light weight, integrated design, low processing difficulty (it can be obtained by processing a whole piece of metal sheet through a processing machine tool), and low installation difficulty.

[0003] The disadvantage of the traditional folded heat sink is that the cross section of the folded heat sink is a rectangular wave, and the length along the direction of its wave extension is large, which cannot be applied to compact installation space. At the same time, the folded heat sink needs to be connected to the circuit board through a substrate (that is, the circuit board is attached to the substrate, and then the substrate is installed on the folded heat sink). The substrate forms a thermal resistance between the circuit board and the folded heat sink, reducing the heat dissipation efficiency. Utility Model Content

[0004] Based on this, the utility model provides a folded-fin heat sink, which adopts a clamping structure to achieve compression adjustment of the folded heat sink, shorten its length, and improve its compactness. In addition, the traditional substrate connection is abandoned so that the circuit board can be directly attached to the folded heat sink, and a heat pipe is introduced to improve the heat transfer efficiency, thereby achieving the purpose of improving compactness and heat dissipation efficiency.

[0005] A folded fin heat sink comprising:

[0006] A folded heat sink; the folded heat sink is provided with a first through slot, a second through slot, and a third through slot arranged along the wave-shaped extension direction of the folded heat sink; the first through slot and the second through slot are both located at the bottom of the folded heat sink and penetrate the bottom surface of the folded heat sink; the third through slot is located at the top of the folded heat sink;

[0007] A shaping component installed on the folding heat sink; the shaping component includes: a pull rod, a fixed baffle located at one end of the pull rod, a movable baffle located at the other end of the pull rod, and an adjusting screw connected between the pull rod and the movable baffle; the pull rod is inserted into the first through slot, and the bottom surface of the pull rod is flush with the bottom surface of the folding heat sink; a mounting portion for connecting a circuit board is provided at the bottom of the pull rod; the fixed baffle and the movable baffle are clamped at both ends of the folding heat sink; the fixed baffle is locked at the end of the pull rod; the adjusting screw connects the movable baffle to the pull rod in series, and the distance between the movable baffle and the fixed baffle is adjusted by rotating the adjusting screw; and

[0008] A heat pipe installed on a folded heat sink; the heat pipe is U-shaped and is passed through the second through slot and the third through slot; the heat pipe passes through the fixed baffle and passes through the movable baffle; the bottom surface of the heat pipe section located on the second through slot is flush with the bottom surface of the folded heat sink.

[0009] In the above-mentioned folding fin heat sink, the pull rod is passed through the folding fin, and an I-shaped clamping structure is formed by using a fixed baffle, a pull rod, and a movable baffle, so that the folding fin is clamped between the fixed baffle and the movable baffle, thereby compressing the length of the folding fin and forcing the folding fin to be more compact. In addition, the compression degree of the folding fin can be adjusted by rotating the adjustment screw to adapt to different installation spaces. At the same time, the bottom surface of the folding fin, the bottom surface of the pull rod, and the bottom surface of the heat pipe are all flush, so that the circuit board can be installed at the bottom of the pull rod, and the circuit board is attached to the folding fin and the heat pipe without using a substrate, thereby reducing the thermal resistance between the circuit board and the folding fin. At the same time, the U-shaped heat pipe improves the heat transfer efficiency between the circuit board and the folding fin, thereby improving the heat dissipation efficiency. Through the above design, a clamping structure is used to achieve compression adjustment of the folded heat sink, shorten its length, and improve its compactness. In addition, the traditional substrate connection is abandoned so that the circuit board can be directly attached to the folded heat sink, and a heat pipe is introduced to improve the heat transfer efficiency, thereby achieving the purpose of improving compactness and heat dissipation efficiency.

[0010] In one embodiment, an auxiliary heat dissipation port is provided on the top of the folded heat sink, which can form a heat dissipation channel connected to the inside of the folded heat sink at the top of the folded heat sink, thereby improving the heat dissipation efficiency of the folded heat sink.

[0011] In one embodiment, the mounting portion is a plurality of screw holes evenly arranged on the pull rod. When installing the circuit board, the mounting holes on the circuit board are aligned with the screw holes on the pull rod, and then the mounting holes are connected and fixed by screws.

[0012] In one embodiment, the mounting portion is a strip-shaped slot disposed on the top of the pull rod. When installing the circuit board, the mounting hole on the circuit board is made to face the strip-shaped slot on the pull rod, and then the circuit board is fixed by screws.

[0013] In one embodiment, the pull rod is an aluminum alloy tube or a copper alloy tube. The aluminum alloy tube or the copper alloy tube has a strong structural stability and good thermal conductivity.

[0014] In one embodiment, the fixed baffle is fixed to the end of the pull rod by a first screw. The first screw can realize a detachable connection between the fixed baffle and the pull rod, which is convenient for disassembly and assembly.

[0015] In one embodiment, one end of the heat pipe located on the movable baffle is locked on the movable baffle by a clamping member. The clamping member can be used to reinforce the connection of the heat pipe and reduce the risk of the heat pipe falling off.

[0016] In one embodiment, the clamping member includes: a clamping ring sleeved on the end of the heat pipe and a second screw passing through the clamping ring. The tightening degree of the clamping ring can be adjusted by rotating the second screw to fix the end of the heat pipe, which has a simple structure and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A three-dimensional view of a folded fin heat sink according to an embodiment of the utility model;

[0018] Figure 2 for Figure 1 A perspective view of another perspective of the folded fin heat sink shown;

[0019] Figure 3 for Figure 2 An enlarged view of a portion A of the folded fin heat sink shown;

[0020] Figure 4 for Figure 2 An exploded view of a folded fin heat sink is shown;

[0021] Figure 5 for Figure 4 A perspective view of a folded fin in a folded fin heat sink is shown;

[0022] Figure 6 for Figure 4 A combined view of a molded component, a heat pipe, and a clip in a folded fin heat sink shown;

[0023] Figure 7 for Figure 6 A perspective view of a tie rod in a folded fin heat sink is shown;

[0024] Figure 8 for Figure 1 The semi-assembled schematic of the folded fin heat sink shown Figure 1 ;

[0025] Fig. 9 for Figure 8 The semi-assembled schematic of the folded fin heat sink shown Figure 2 ;

[0026] Fig.10 for Figure 1 A combined view of a folded-fin heat sink and circuit board is shown.

[0027] The meanings of the symbols in the accompanying drawings are:

[0028] 100-folded fin radiator;

[0029] 10-folded heat sink, 11-first through slot, 12-second through slot, 13-third through slot, 14-auxiliary heat dissipation port;

[0030] 20-forming component, 21-pull rod, 211-installation part, 22-fixed baffle, 23-movable baffle, 24-adjusting screw, 25-first screw;

[0031] 30-heat pipe;

[0032] 40-clip part, 41-clip ring, 42-second screw;

[0033] 200-Circuit Board. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0040] like Figures 1 to 10 As shown, it is a folded-fin heat sink 100 according to an embodiment of the present invention.

[0041] like Figure 1 , Figure 2 ,as well as Figure 4 As shown, the folded fin heat sink 100 comprises: a folded fin 10, a shaping assembly 20 mounted on the folded fin 10, and a heat pipe 30 mounted on the folded fin 10. Fig.10As shown, when in use, the folded heat sink 10 is used to be directly attached to the circuit board 200, and absorbs the heat generated by the circuit board 200 and dissipates it into the surrounding environment. The shaping component 20 is used to compress the length of the folded heat sink 10 and shape the folded heat sink 10. At the same time, when in use, the circuit board 200 is installed on the shaping component 20. The heat pipe 30 is used to be attached to the circuit board 200 and serves as a heat transfer medium between the circuit board 200 and the folded heat sink 10, thereby improving the heat transfer efficiency between the circuit board 200 and the folded heat sink 10.

[0042] Below, combined Figures 1 to 10 , the above-mentioned folded-fin heat sink 100 is further described.

[0043] like Figure 5 As shown, the folded heat sink 10 is provided with a first through slot 11, a second through slot 12, and a third through slot 13 arranged along the wave-shaped extension direction of the folded heat sink 10. The first through slot 11 and the second through slot 12 are both located at the bottom of the folded heat sink 10 and penetrate the bottom surface of the folded heat sink 10, and the third through slot 13 is located at the top of the folded heat sink 10. In this embodiment, the cross section of the first through slot 11 is an inverted trapezoid as a whole, the cross section of the second through slot 12 is a semicircular shape, and the cross section of the third through slot 13 is a circular shape.

[0044] In order to improve the heat dissipation efficiency of the folded heat sink 10, as Figure 1 As shown, in this embodiment, an auxiliary heat dissipation port 14 may be provided at the top of the folded heat sink 10, that is, a hole is opened at the crest of the folded heat sink 10. The auxiliary heat dissipation port 14 may form a heat dissipation channel connected to the inside of the folded heat sink 10 at the top, which is beneficial to improving the heat dissipation efficiency of the folded heat sink 10.

[0045] like Figure 6 As shown, the shaping assembly 20 includes: a tie rod 21, a fixed baffle 22 located at one end of the tie rod 21, a movable baffle 23 located at the other end of the tie rod 21, and an adjusting screw 24 connected between the tie rod 21 and the movable baffle 23. Figure 2 As shown, the tie rod 21 is disposed on the first through slot 11, and the bottom surface of the tie rod 21 is flush with the bottom surface of the folded heat sink 10. Figure 7 As shown, the bottom of the pull rod 21 is provided with a mounting portion 211 for connecting the circuit board 200. Figure 1 and Figure 2 As shown, the fixed baffle 22 and the movable baffle 23 are clamped at both ends of the folded heat sink 10. Figure 6 As shown, the fixed baffle 22 is locked at the end of the pull rod 21. The adjusting screw 24 connects the movable baffle 23 to the pull rod 21 in series, and the distance between the movable baffle 23 and the fixed baffle 22 can be adjusted by rotating the adjusting screw 24.

[0046] Since the tie rod 21 needs to bear the reaction force generated by the compression of the folded heat sink 10, and the tie rod 21 also needs to be attached to the circuit board 200, based on the dual considerations of structural stability and heat dissipation efficiency, in this embodiment, the tie rod 21 is preferably an aluminum alloy tube or a copper alloy tube. The aluminum alloy tube or the copper alloy tube has strong structural stability and good thermal conductivity.

[0047] In this solution, there are many ways to implement the mounting portion 211 on the pull rod 21 .

[0048] For example, in some embodiments, the mounting portion 211 is a plurality of screw holes opened on the pull rod 21. For example, a plurality of matching screw holes are prefabricated on the pull rod 21 in advance according to the size of the circuit board to be matched (here mainly refers to the case where the width is the same but the length is different). When installing the circuit board 200, the mounting holes on the circuit board 200 are aligned with the screw holes on the pull rod 21, and then they are fixed by screws.

[0049] For example, Figure 7 As shown, in this embodiment, the mounting portion 211 is a strip-shaped slot disposed on the top of the pull rod 21. When installing the circuit board 200, the mounting hole on the circuit board 200 is aligned with the strip-shaped slot on the pull rod 21, and then the mounting hole is fixed by screws. The advantage of this design is that there is no need to pre-drill holes for circuit boards 200 of several specific sizes. During installation, the strip-shaped slot can be adapted to all sizes within its range, and is more versatile.

[0050] In the present embodiment, the fixed baffle 22 and the pull rod 21 can be connected by welding, riveting, clamping, or screwing. Taking the screw connection as an example, the fixed baffle 22 is locked to the end of the pull rod 21 by the first screw 25. The first screw 25 can realize a detachable connection between the fixed baffle 22 and the pull rod 21, which is convenient for disassembly and assembly. If clamping is adopted, for example, a limit block is set at the end of the pull rod 21, and during assembly, the fixed baffle 22 is connected to the end of the pull rod 21 in a direction perpendicular to the length of the pull rod 21, and the reaction force applied to the fixed baffle 22 by the folded heat sink 10 is used to press the fixed baffle 22 onto the limit block.

[0051] like Figure 1 and Figure 2 As shown, the heat pipe 30 is U-shaped and is arranged on the second through groove 12 and the third through groove 13. The heat pipe 30 passes through the fixed baffle 22 and passes through the movable baffle 23. Figure 3 As shown, the bottom surface of the pipe section of the heat pipe 30 located on the second through groove 12 is flush with the bottom surface of the folded heat sink 10 .

[0052] In this solution, when in use, the section of the heat pipe 30 that passes through the second through slot 12 will be sandwiched between the folded heat sink 10 and the circuit board 200. Therefore, it is generally not necessary to set a special reinforcement structure for the heat pipe 30. If it is necessary to prevent the heat pipe 30 from falling off, an adaptive reinforcement structure can be added. For example, Figure 6 As shown, in this embodiment, one end of the heat pipe 30 located at the movable baffle 23 is locked on the movable baffle 23 by a clamping member 40. The clamping member 40 can be used to reinforce the connection of the heat pipe 30, thereby reducing the risk of the heat pipe 30 falling off. Furthermore, it is only necessary to set the clamping member 40 at one end of the U-shaped structure of the heat pipe 30.

[0053] Furthermore, considering the stability of the connection and the convenience of operation, Figure 6 As shown, in this embodiment, the clamping member 40 may include: a clamping ring 41 sleeved on the end of the heat pipe 30 and a second screw 42 passed through the clamping ring 41. By rotating the second screw 42, the tightening degree of the clamping ring 41 can be adjusted to fix the end of the heat pipe 30, which has a simple structure and is easy to operate.

[0054] Brief description of working principle:

[0055] Combination Figure 2 , Figure 8 ,as well as Fig. 9 As shown, the tie rod 21 is inserted into the folded heat sink 10, and the fixed baffle 22, the tie rod 21, and the movable baffle 23 form an I-shaped clamping structure, so that the folded heat sink 10 is clamped between the fixed baffle 22 and the movable baffle 23, thereby compressing the length of the folded heat sink 10 and forcing the folded heat sink 10 to be more compact. For example, in the natural state, the width of the crest, the width of the trough, the distance between two adjacent crests, and the distance between two adjacent troughs of the folded heat sink 10 are all the same. Figure 3 As shown, under the restriction of the shaping component 20, the distance between two adjacent troughs is compressed (corresponding to the bottom surface of the folded heat sink 10), so that the two adjacent troughs are close to each other. In addition, the compression degree of the folded heat sink 10 can be adjusted by rotating the adjusting screw 24 to adapt to different installation spaces. Figure 2 and Fig.10 As shown, the bottom surface of the folded heat sink 10, the bottom surface of the pull rod 21, and the bottom surface of the heat pipe 30 are all flush, so that the circuit board 200 can be installed on the bottom of the pull rod 21, and the circuit board 200 is attached to the folded heat sink 10 and the heat pipe 30 without using a substrate, thereby reducing the thermal resistance between the circuit board 200 and the folded heat sink 10. At the same time, the U-shaped heat pipe 30 improves the heat transfer efficiency between the circuit board 200 and the folded heat sink 10, thereby improving the heat dissipation efficiency.

[0056] The above-mentioned folded heat sink 100 adopts a clamping structure to achieve compression adjustment of the folded heat sink 10, shorten its length, and improve its compactness. In addition, the traditional substrate connection is abandoned so that the circuit board 200 can be directly attached to the folded heat sink 10, and the heat pipe 30 is introduced to improve the heat transfer efficiency, thereby achieving the purpose of improving compactness and heat dissipation efficiency.

[0057] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above embodiments only express the preferred implementation of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A folded fin heat sink, characterized in that: include: A folded heat sink; the folded heat sink is provided with a first through slot, a second through slot, and a third through slot arranged along the wave-shaped extension direction of the folded heat sink; The first through slot and the second through slot are both located at the bottom of the folded heat sink and penetrate the bottom surface of the folded heat sink; The third through groove is located at the top of the folded heat sink; A shaping component mounted on the folded heat sink; The shaping component comprises: a pull rod, a fixed baffle plate at one end of the pull rod, a movable baffle plate at the other end of the pull rod, and an adjusting screw connected between the pull rod and the movable baffle plate; the pull rod is inserted into the first through slot, and the bottom surface of the pull rod is flush with the bottom surface of the folded heat sink; a mounting portion for connecting a circuit board is provided at the bottom of the pull rod; the fixed baffle plate and the movable baffle plate are clamped at both ends of the folded heat sink; the fixed baffle plate is locked at the end of the pull rod by a first screw; the adjusting screw connects the movable baffle plate to the pull rod in series, and the distance between the movable baffle plate and the fixed baffle plate is adjusted by rotating the adjusting screw; and A heat pipe installed on the folded heat sink; the heat pipe is U-shaped and is passed through the second through slot and the third through slot; the heat pipe passes through the fixed baffle and exits from the movable baffle; the bottom surface of the pipe section of the heat pipe located on the second through slot is flush with the bottom surface of the folded heat sink; one end of the heat pipe located on the movable baffle is locked on the movable baffle by a clamping piece; the clamping piece includes: a clamping ring sleeved on the end of the heat pipe and a second screw passed through the clamping ring.

2. The folded fin heat sink according to claim 1, characterized in that: An auxiliary heat dissipation opening is provided on the top of the folded heat sink.

3. The folded fin heat sink according to claim 1, characterized in that: The mounting portion is a plurality of screw holes evenly arranged on the pull rod.

4. The folded fin heat sink according to claim 1, characterized in that: The mounting portion is a strip-shaped slot arranged on the top of the pull rod.

5. The folded fin heat sink according to claim 1, characterized in that: The pull rod is an aluminum alloy tube or a copper alloy tube.

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