Defoaming device for wet process of integrated circuit
By designing a bubble removal device containing a 45° deflector and a grate brush in the integrated circuit wet process, the bubble removal problem is solved, and a low-cost and efficient defoaming effect is achieved, and quality problems and environmental pollution are avoided.
Patent Information
- Application Number
- CN202420899528.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-04-28
AI Technical Summary
The prior art is difficult to effectively remove bubbles in the wet process of integrated circuits, resulting in quality problems such as electroplating pinholes and water marks. In addition, traditional defoaming methods have high equipment costs, large footprints, long defoaming time, or may cause secondary Pollution problem.
An integrated circuit wet process bubble removal device is designed, including a box, inner groove, outer groove, hole, bubble remover and a 45° inclined deflector. The deflector and grate-shaped brush structure are used to reduce the weight of the liquid. Impact to achieve fast and effective defoaming effect.
It achieves low equipment cost and fast defoaming, avoids quality problems caused by bubbles, and reduces environmental pollution. It is suitable for various wafer wet process defoaming applications.
Smart Images
Figure CN222286469U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of defoaming, in particular to a defoaming device for integrated circuit wet process. Background Art
[0002] Due to the difference in liquid levels in the inner and outer tanks, the liquid splashes due to gravity when overflowing to produce a large amount of foam, but the stability of the foam is due to the presence of surfactants, resulting in two effects: ● Marangoni effect: refers to the flow phenomenon of liquid from the bottom tension to the high surface tension
[0003] The liquid in the step 1 membrane flows to the liquid layer due to the influence of gravity.
[0004] Step 2 flow causes the top of the layer to be sparser than other parts, and reduces the surfactant at the top.
[0005] Step 3: Surface tension difference occurs because the surface tension at the top is higher than that at other parts. The transfer of low surface tension to high surface tension parts results in the generation of opposing forces, and the liquid will flow back to the top.
[0006] Step 4 The downward flow and the backflow will reach equilibrium, and if this equilibrium is sufficient to occur before the critical film thickness of the layer is reached, the bubbles will stabilize.
[0007] There are two methods for eliminating foam: chemical defoaming. The chemical defoaming method achieves the purpose of defoaming by adding chemicals to the foam base liquid to change certain properties of the foaming agent. However, secondary pollution may occur after defoaming, and the mechanical defoaming method requires the use of special mechanical equipment, which increases the equipment cost. The natural defoaming method occupies a large area and takes a long time to defoam. For this reason, an integrated circuit wet process defoaming device is proposed. Utility Model Content
[0008] The utility model aims to solve the shortcomings in the prior art and proposes an integrated circuit wet process defoaming device.
[0009] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit wet process defoaming device, comprising a box body, the box body is provided with an inner groove and an outer groove, the top of the box body is provided with a hole, a defoamer is installed on the top of the outer groove close to the hole, and a guide plate is installed on the top of the outer groove.
[0010] As a further description of the above technical solution:
[0011] The guide plate is located above the debubbler, and the guide plate and the debubbler are made of acid- and alkali-resistant plastics.
[0012] As a further description of the above technical solution:
[0013] The brush on the defoamer is a comb-like structure + needle-like fine thorns.
[0014] As a further description of the above technical solution:
[0015] The guide plate is inclined at 45°.
[0016] As a further description of the above technical solution:
[0017] The defoamer (5) comprises a fixing plate, a brush and a supporting column.
[0018] The utility model has the following beneficial effects:
[0019] 1. The utility model is to introduce a 45° guide plate and a defoamer to comprehensively produce an innovative defoaming effect, introduce a micro device, and have extremely low equipment cost. It can effectively and quickly achieve a good defoaming effect, avoid quality problems caused by bubbles in the wafer wet process, such as electroplating pinholes and water marks, and eliminate production line process troubles and environmental pollution caused by foam generated by the solution. This method can be widely used in various defoaming applications in wafer wet processes. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A three-dimensional diagram of the integrated circuit wet process defoaming device proposed by the utility model;
[0021] Figure 2 The utility model is a schematic diagram of the internal structure of the integrated circuit wet process defoaming device.
[0022] Legend:
[0023] 1. Box body; 2. Inner tank; 3. Outer tank; 4. Holes; 5. Debubbler; 6. Guide plate. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] Reference Figure 1-Figure 2 The utility model provides an embodiment: an integrated circuit wet process debubbling device, comprising a box body 1, an inner groove 2 and an outer groove 3 are provided on the box body 1, a hole 4 is provided on the top of the box body 1, a debubbler 6 is installed on the top of the outer groove 3 near the hole 4, and a guide plate 5 is installed on the top of the outer groove 3.
[0026] The guide plate 6 is located above the debubbler 5. The guide plate 6 and the debubbler 5 are made of acid-resistant and alkali-resistant plastics. The brush on the debubbler 5 is a comb-like structure + needle-like fine thorns. The debubbler 5 includes a fixed plate, a brush, and a support column. The guide plate 6 is set at a 45° tilt. The guide plate 6 is set to reduce liquid gravity impact and splashing.
[0027] Working principle: Defoaming is to take certain measures to break up the foam that has been formed or reduce the thickness of the foam layer. The premise of recycling foam fluid is that there must be a feasible defoaming method. There are many commonly used defoaming methods, which can be divided into: chemical defoaming, physical defoaming, mechanical defoaming and natural defoaming according to the principle. Physical defoaming cannot handle a large amount of foam and is only suitable for certain emergency measures; mechanical defoaming requires additional equipment and usually cannot completely defoam; natural defoaming occupies a large area and takes a long time to defoam, so it is not suitable for defoaming of foam drilling fluid; chemical defoaming is simple to construct and has a high defoaming rate, but the defoaming agent consumption is large, the cost is high, and it may change the performance of the base fluid. The following is a comparison of several defoaming methods.
[0028] (1) Physical defoaming method. The defoaming principle is to break the foam by changing its viscosity or physical properties. Commonly used methods include thermal method, sonic method, and electric method. The characteristics are: special equipment is required, the cost of use and maintenance is high, the processing volume per unit time is small, and the defoaming effect is good.
[0029] (2) Mechanical defoaming method. The defoaming principle is to use the rapid change of pressure such as shear force, compression force and impact force to break the bubbles. According to the characteristics of its effect on foam, it can be divided into centrifugal method, hydrodynamic method, pneumatic method and air pressure method. The characteristics are: special equipment is required, but it has no effect on the properties of the foam base liquid. If the principle and parameters are properly selected, it can fully meet the requirements of foam defoaming.
[0030] (3) Chemical defoaming method. The defoaming principle is to add chemical agents to the foam base liquid to change certain properties of the foaming agent to achieve the purpose of defoaming, including adding surfactants of opposite types, adjusting pH value and adding defoaming agents. Features: good defoaming effect, easy to use, no need for special equipment, and secondary pollution may occur after defoaming.
[0031] (4) Natural defoaming method. The defoaming principle is to use the liquid of the liquid film between bubbles to seep out along the plateau interface, the gas diffusion between bubbles and the rupture of some single bubble films. Features: large footprint and long defoaming time.
[0032] In view of the above-mentioned references and technical data, improvements are made to the debubbling process of wafer bumping wet process: a debubbler 5 and a guide plate 6 are provided, wherein the guide plate 6 is inclined at 45°.
[0033] When working, firstly, the liquid to be treated is input into the defoaming device through a specific pipeline. In this process, it is necessary to ensure that the flow rate and flow velocity of the liquid are precisely controlled to adapt to the processing capacity of the defoaming device. After the liquid enters the inner tank 2, due to the difference in liquid level between the inner tank 2 and the outer tank 3, the liquid will splash due to gravity impact when overflowing to produce a large amount of foam. The bubbles will separate from the liquid and rise to the top of the box 1. The bubbles will enter the outer tank 3 through the hole 4 along the defoamer 5. The bubbles can be blocked and punctured by the 45° guide plate 6. The guide plate 6 is set to reduce the splashing of the liquid gravity impact. Compared with the traditional chemical industry, the volume of the liquid is relatively small in the wet process of wafer bumping, and the foam is also less! Therefore, in the existing process equipment, the physical defoaming method is selected and the micro device is introduced, which does not require expensive equipment costs and can achieve good defoaming effects.
[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An integrated circuit wet process defoaming device, comprising a housing (1), characterized in that: The box body (1) is provided with an inner tank (2) and an outer tank (3), the top of the box body (1) is provided with a hole (4), a debubbler (5) is installed on the top of the outer tank (3) near the hole (4), and a guide plate (6) is installed on the top of the outer tank (3).
2. The integrated circuit wet process defoaming device according to claim 1, characterized in that: The guide plate (6) is located above the debubbler (5), and the guide plate (6) and the debubbler (5) are made of acid-resistant and alkali-resistant plastic.
3. The integrated circuit wet process defoaming device according to claim 1, characterized in that: The brush on the defoamer (5) is a comb-like structure + needle-like fine thorns.
4. The integrated circuit wet process defoaming device according to claim 1, characterized in that: The guide plate (6) is arranged to be inclined at 45°.
5. The integrated circuit wet process defoaming device according to claim 1, characterized in that: The debubbler (5) comprises a fixing plate, a brush and a supporting column.