High-utilization-rate semiconductor sealing and testing silver colloid outlet pipe

By introducing an extrusion head and sealing plug into the semiconductor sealing and testing silver glue outlet hose, the oxidation problem caused by the contact between the rubber outlet of the silver glue equipment and the problem of low utilization rate of silver glue is achieved, and a higher silver Glue utilization and product reliability.

CN222287761UActive Publication Date: 2025-01-03ANHUI FENGXIN SEMICON CO LTD
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Patent Information

Application Number
CN202420953772.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-06
Publication Date
2025-01-03
Estimated Expiration
2034-05-06

AI Technical Summary

Technical Problem

During the semiconductor packaging and testing process, the rubber outlet of the silver glue equipment contacts the air and causes oxidation, the silver glue component is damaged, and the piston push end is hemispherical, which makes some silver glue unable to be used, and silver powder is expensive and has low utilization rate.

Method used

A semiconductor sealed and tested silver glue hose is designed, including an extrusion head, a micro motor, a retractor, a drawstring, a spring rod and a sealing plug. The silver glue is fully utilized through the extrusion head and sealed by the seal when the piston rises. The plug forms a sealed space to prevent air from entering and reduce the reaction between silver glue and air.

Benefits of technology

Effectively utilize silver glue to reduce the reaction of silver glue ingredients with air, improve product reliability and yield, avoid waste of silver glue, and reduce the cost of silver powder.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a high-utilization-rate semiconductor sealing and testing silver adhesive outlet pipe which comprises an adhesive pipe communicated with a die bonding and dispensing device, the bottom of the adhesive pipe is communicated with an adhesive outlet nozzle, and an inner cavity of the adhesive pipe is connected with a piston end driven by a driving device in a sliding mode. And the tail end of the piston end is fixedly connected with an extrusion head matched with the inner cavity of the glue outlet nozzle. The utility model relates to the technical field of semiconductor sealing and testing. According to the high-utilization-rate semiconductor sealing and testing elargol outlet pipe, the two sealing plugs stretch out and extrude the two sides of the elargol outlet nozzle to form a sealed space, external air is prevented from entering the sealed space, then the piston end rises, at the moment, the sealing plugs are used for blocking, air is prevented from entering the sealed space, reaction between elargol components and air is reduced, and the product reliability and yield are improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging and testing, in particular to a semiconductor packaging and testing silver glue outlet tube with high utilization rate. Background Art

[0002] The following problems exist in the process of semiconductor packaging and testing die bonding and dispensing:

[0003] (1) The silver glue is squeezed out by the die bonding dispensing equipment. The outlet of the glue will oxidize when in contact with the air, and the components of the silver glue will be destroyed in the air, resulting in poor connection between the product chip and the frame after the die bonding is completed.

[0004] (2) During the semiconductor packaging and testing die bonding dispensing process, the die bonding dispensing equipment pushes the piston to squeeze out the silver glue. The piston pushing end is hemispherical and is pushed to the glue outlet. Some of the silver glue cannot be used at the glue outlet, and the silver glue contains a large amount of silver powder, which is expensive. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a semiconductor packaging and testing silver glue outlet tube with high utilization rate, which solves the above-mentioned problems.

[0006] To achieve the above purpose, the utility model is implemented through the following technical solutions: a semiconductor packaging and testing silver glue outlet hose with high utilization rate, including a hose connected to a solid crystal dispensing device, the bottom of the hose is connected to a glue outlet nozzle, the inner cavity of the hose is slidably connected to a piston end driven by a driving device, the end of the piston end is fixedly connected to an extrusion head adapted to the inner cavity of the glue outlet nozzle, through the setting of the extrusion head, when the piston end is started to extrude the silver glue inside the hose, the silver glue inside the end glue outlet nozzle is squeezed out through the extrusion head, during the semiconductor packaging and solid crystal dispensing process, the solid crystal dispensing device pushes the piston to extrude the silver glue, the piston pushing end is hemispherical, and is pushed to the glue outlet, some of the silver glue cannot be used at the glue outlet, and the silver glue contains a large amount of silver powder, which is expensive. Through the setting of the extrusion head, the internal silver glue can be effectively fully utilized, the side of the hose is fixedly connected to a micro motor, the output end of the micro motor is fixedly connected to a take-up wheel, both sides of the bottom of the hose are fixedly connected to fixed cylinders, and the inner cavities of the two fixed cylinders are slidably connected to the piston end. The cam is connected to the spring rod, and the ends of the two spring rods are fixedly connected with sealing plugs. The inner cavities of the two sealing plugs are provided with grooves, and the two grooves form a receiving slot adapted to the surface of the glue outlet nozzle. The surface of the take-up wheel is transmission-connected with a pull rope connected to the end of the spring rod. When in use, the silver glue in the hose is squeezed out through the piston end, and then the silver glue in the inner cavity of the glue outlet nozzle is squeezed out through the extrusion head. After the extrusion is completed, when the piston end is ready to rise, the micro motor rotates, driving the take-up wheel to rotate, and the pull rope is released. At this time, the spring rod extends from the fixed cylinder under the thrust of the spring, driving the two sealing plugs to extend out, and squeezes on both sides of the glue outlet nozzle to form a sealed space to prevent outside air from entering. Then the piston end rises. At this time, the sealing plug is blocked to prevent air from entering, reduce the reaction of the silver glue component with the air, and improve product reliability and yield. Then when the piston end descends, the take-up wheel rotates, drives the pull rope to retract, pulls the spring rod to squeeze the spring back into the fixed cylinder, drives the sealing plug to rise, and then performs glue dispensing.

[0007] As a further solution of the utility model: the two fixing cylinders are arranged obliquely and symmetrically on both sides of the glue outlet nozzle.

[0008] As a further solution of the utility model: when the spring rod is completely retracted into the inner cavity of the fixing cylinder, the lowest position of the sealing plug is located in the middle section of the glue outlet nozzle.

[0009] As a further solution of the utility model: when the piston end moves to the bottom, the lowest position of the extrusion head is flush with the bottom of the glue outlet nozzle.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] 1. The utility model extends two sealing plugs and squeezes on both sides of the glue outlet nozzle to form a sealed space to prevent outside air from entering. Then the piston end rises. At this time, the sealing plug is blocked to prevent air from entering, reduce the reaction between the silver glue component and the air, and improve product reliability and yield.

[0012] 2. In the semiconductor packaging and testing die bonding dispensing process, the die bonding dispensing equipment pushes the piston to extrude the silver glue. The piston pushing end is hemispherical and is pushed to the glue outlet. Some of the silver glue cannot be used at the glue outlet, and the silver glue contains a large amount of expensive silver powder. The setting of the extrusion head can effectively make full use of the internal silver glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural sectional view of the utility model;

[0014] Figure 2 It is a schematic diagram of the structure of the utility model;

[0015] Figure 3 For this utility model Figure 1 A partial enlarged view of point A in the middle.

[0016] In the figure: 1. hose; 2. piston end; 3. extrusion head; 4. micro motor; 5. take-up wheel; 6. pull rope; 7. glue nozzle; 8. fixing cylinder; 9. spring rod; 10. sealing plug; 11. groove. DETAILED DESCRIPTION

[0017] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0018] See also Figure 1-3The utility model provides a technical solution: a semiconductor packaging and testing silver glue dispensing tube with high utilization rate, comprising a hose 1 connected to a solid crystal dispensing device, the bottom of the hose 1 is connected to a glue dispensing nozzle 7, the inner cavity of the hose 1 is slidably connected to a piston end 2 driven by a driving device, and the end of the piston end 2 is fixedly connected to an extrusion head 3 adapted to the inner cavity of the glue dispensing nozzle 7. Through the setting of the extrusion head 3, when the piston end 2 is started to extrude the silver glue inside the hose 1, the silver glue inside the end glue dispensing nozzle 7 is squeezed out through the extrusion head 3, and the semiconductor packaging and testing solid crystal is discharged. During the dispensing process, the solid crystal dispensing equipment pushes the piston to extrude the silver glue. The piston push end is hemispherical and is pushed to the glue outlet. Some of the silver glue cannot be used at the glue outlet, and the silver glue contains a large amount of silver powder, which is expensive. The setting of the extrusion head 3 can effectively make full use of the internal silver glue. The side of the hose 1 is fixedly connected with a micro motor 4, and the output end of the micro motor 4 is fixedly connected with a take-up wheel 5. Both sides of the bottom of the hose 1 are fixedly connected with fixed cylinders 8. The inner cavities of the two fixed cylinders 8 are slidably connected with spring rods 9. The ends of the two spring rods 9 are fixedly connected with the inner cavities of the two fixed cylinders 8. The two ends are fixedly connected with sealing plugs 10, and the inner cavities of the two sealing plugs 10 are provided with grooves 11. The two grooves 11 form a receiving slot adapted to the surface of the glue outlet nozzle 7. The surface of the take-up wheel 5 is transmission-connected with a pull rope 6 connected to the end of the spring rod 9. When in use, the silver glue in the rubber tube 1 is squeezed out through the piston end 2, and then the silver glue in the inner cavity of the glue outlet nozzle 7 is squeezed out through the extrusion head 3. After the extrusion is completed, when the piston end 2 is ready to rise, the micro motor 4 rotates, driving the take-up wheel 5 to rotate, and the pull rope 6 is released. At this time, the spring rod 9 Under the thrust of the spring, the spring rod 9 extends from the fixed tube 8, driving the two sealing plugs 10 to extend, and squeezes on both sides of the glue outlet nozzle 7 to form a sealed space to prevent outside air from entering. Then the piston end 2 rises. At this time, the sealing plug 10 is blocked to prevent air from entering, reduce the reaction between the silver glue component and the air, and improve product reliability and yield. Then, when the piston end 2 descends, the take-up wheel 5 rotates, driving the pull rope 6 to be retracted, pulling the spring rod 9 to squeeze the spring back into the fixed tube 8, driving the sealing plug 10 to rise, and then dispensing is carried out.

[0019] The two fixing cylinders 8 are arranged obliquely and symmetrically on both sides of the glue outlet nozzle 7 .

[0020] When the spring rod 9 is completely retracted into the inner cavity of the fixing tube 8 , the lowest position of the sealing plug 10 is located at the middle section of the glue outlet nozzle 7 .

[0021] When the piston end 2 moves to the lowest position, the lowest position of the extrusion head 3 is flush with the bottom of the glue outlet nozzle 7.

[0022] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A semiconductor packaging and testing silver glue outlet tube with high utilization rate, comprising a hose (1) connected to a die bonding glue dispensing device, the bottom of the hose (1) is connected to a glue outlet nozzle (7), the inner cavity of the hose (1) is slidably connected to a piston end (2) driven by a driving device, characterized in that: The end of the piston end (2) is fixedly connected to an extrusion head (3) adapted to the inner cavity of the glue outlet nozzle (7). Through the setting of the extrusion head (3), the side of the rubber hose (1) is fixedly connected to a micro motor (4), and the output end of the micro motor (4) is fixedly connected to a take-up wheel (5). Both sides of the bottom of the rubber hose (1) are fixedly connected to fixed cylinders (8), and the inner cavities of the two fixed cylinders (8) are slidably connected to spring rods (9). The ends of the two spring rods (9) are fixedly connected to sealing plugs (10). The inner cavities of the two sealing plugs (10) are provided with grooves (11). The two grooves (11) form a receiving slot adapted to the surface of the glue outlet nozzle (7). The surface of the take-up wheel (5) is drivingly connected to a pull rope (6) connected to the end of the spring rod (9).

2. The semiconductor packaging and testing silver glue outlet tube with high utilization rate according to claim 1, characterized in that: The two fixing cylinders (8) are arranged obliquely and symmetrically on both sides of the glue outlet nozzle (7).

3. The semiconductor packaging and testing silver glue outlet tube with high utilization rate according to claim 1, characterized in that: When the spring rod (9) is completely retracted into the inner cavity of the fixed cylinder (8), the lowest position of the sealing plug (10) is located in the middle section of the glue outlet nozzle (7).

4. The semiconductor packaging and testing silver glue outlet tube with high utilization rate according to claim 1, characterized in that: When the piston end (2) moves to the lowest position, the lowest position of the extrusion head (3) is flush with the bottom of the glue outlet nozzle (7).