Wafer forming device

Abstract

A wafer forming device comprises an upper die base and a lower die base, the upper die base is provided with an upper die assembly, the lower die base is provided with a lower die assembly, and the upper die assembly and the lower die assembly are matched to punch and press a wafer. A suction and release mechanism used for grabbing a wafer is further fixed to one side of the lower die base and comprises a motor, an output shaft of the motor is fixedly connected with a rotating rod, a mounting base is arranged on the rotating rod, and the mounting base is fixedly connected with an electromagnetic chuck through a horizontal moving mechanism. By arranging the sucking and releasing mechanism, automatic grabbing and releasing of the wafer can be achieved in the wafer forming process, and the production efficiency of wafer forming is improved; and moreover, an operator does not need to take and place the wafer with the hand, the hand does not need to be exposed below a punching machine, the safety is high, the operator does not need to wear special gloves, the controller panel can be directly operated with the hand, the operation is flexible, and the error rate is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wheel hubs, in particular to a disc forming device. Background Art

[0002] When making car spokes, workers need to place a high-strength disc on a large punching machine, and then the giant punching machine will perform a series of die pressing on the disc. The first punching will press a concave surface and screw holes on the disc; after spraying lubricating oil, a second punching will be performed, this time a hole in the center of the disc and eight holes around it, which is the so-called wheel window; then a ring pattern is embossed around the wheel window; the last punching is to press the disc into a specific bowl shape to facilitate the installation of brakes, so that the disc is basically formed. Finally, a small punching machine is used to press out the outline of the screw hole outlined earlier, and then the disc is rotated and the edge of the disc is trimmed with tools, so that the disc is completed.

[0003] In the process of making the disc, the disc needs to be placed manually on the giant punching machine. Generally, the operator needs to wear gloves on both hands, hold the two ends of the disc with both hands, place the disc on the lower die, and then operate the control box by hand to punch and press the disc. On the one hand, this operation method has low manual operation efficiency, and the hands are exposed under the punch, which poses a great safety hazard. On the other hand, the operator wears rubber gloves on his hands and then operates the control panel of the controller, which is prone to mistakes. This is the deficiency of the existing technology. Utility Model Content

[0004] The purpose of the utility model is to solve the problems raised in the above background technology, and then propose a disc forming device.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a wafer forming device, including an upper die base and a lower die base, the upper die base is provided with an upper die assembly, the lower die base is provided with a lower die assembly, the upper die assembly and the lower die assembly cooperate to punch and press the wafer; one side of the lower die base is also fixed with a suction and release mechanism for grabbing the wafer, the suction and release mechanism includes a motor, the output shaft of the motor is fixedly connected to a rotating rod, a mounting seat is provided on the rotating rod, and the mounting seat is fixedly connected to the electromagnetic suction cup through a horizontal moving mechanism.

[0006] A further improvement of the utility model is that the horizontal moving mechanism includes a rodless cylinder fixed on a mounting seat, a slide plate of the rodless cylinder is fixed to one end of a connecting plate, and the other end of the connecting plate is fixed to an electromagnetic chuck.

[0007] A further improvement of the utility model is that the lower die assembly includes a lower die fixed on a lower die base, a die cavity is provided in the middle of the upper surface of the lower die, and a plurality of die holes are provided on the bottom surface of the die cavity; spring holes are evenly provided in the circumferential direction in the lower die, and a ejecting spring for ejecting the workpiece is provided in the spring hole; a positioning seat is provided on the outside of the lower die, and the top end of the positioning seat is connected to the positioning rod through a knob, and the workpiece is resting against the positioning rod on all sides.

[0008] A further improvement of the utility model is that the upper die assembly includes a first punch fixed to the upper die base, the first punch matches the die cavity, and a second punch matching the die hole is arranged at the lower part of the first punch.

[0009] A further improvement of the present invention is that the connecting plate is in an "L" shape.

[0010] A further improvement of the utility model is that the upper die seat is provided with a guide column, the lower die seat is provided with a guide sleeve, and the guide column cooperates with the guide sleeve.

[0011] Compared with the prior art, the utility model has the following beneficial effects: the utility model is also fixed with a suction and release mechanism for grabbing the disc on one side of the lower die seat, the suction and release mechanism includes a motor, the output shaft of the motor is fixedly connected to the rotating rod, a mounting seat is arranged on the rotating rod, and the mounting seat is fixedly connected to the electromagnetic sucker through a horizontal moving mechanism. By arranging the suction and release mechanism, the disc can be automatically grabbed and put down during the disc forming process, thereby improving the production efficiency of the disc forming; and the operator does not need to use his hands to take and place the disc, and the hands do not need to be exposed under the punching machine, which is highly safe, and the operator does not need to wear special gloves, and can directly operate the controller panel with his hands, which is flexible to operate and reduces the error rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of a specific implementation method of the utility model;

[0013] Figure 2 It is a schematic diagram of the top view of the structure of the concave mold of the utility model;

[0014] Figure 3 for Figure 1 A-section structure enlarged view.

[0015] Among them: 1 is a punching machine, 3 is an upper die base, 31 is a guide column, 33 is a first punch, 34 is a second punch, 4 is a lower die base, 42 is a guide sleeve, 43 is a knob, 44 is a spring hole, 45 is a lower die, 451 is a die cavity, 452 is a die hole, 46 is a ejector spring, 47 is a disc, 48 is a positioning rod, 49 is a positioning seat, 5 is an electric motor, 6 is a rotating rod, 7 is a mounting seat, 8 is a rodless cylinder, 9 is a slide plate, 10 is a connecting plate, and 11 is an electromagnetic suction cup. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. The utility model is further described in combination with the drawings and embodiments:

[0017] like Figure 1-3 As shown, a wafer forming device comprises an upper die base 3 and a lower die base 4, wherein the upper die base 3 is provided with an upper die assembly, and the lower die base 4 is provided with a lower die assembly, and the upper die assembly and the lower die assembly cooperate to punch and press a wafer 47;

[0018] Specifically, the lower die assembly includes a lower die 45 fixed on the lower die base 4, a die cavity 451 is provided in the middle of the upper surface of the lower die 45, and a plurality of die holes 452 are provided on the bottom surface of the die cavity 451; the upper die assembly includes a first punch 33 fixed to the upper die base 3, the first punch 33 matches the die cavity 451, and a second punch 34 matching the die hole 452 is provided at the lower part of the first punch 33. When the punching machine 1 is turned on, the first punch 33 and the second punch 34 move downward, cooperate with the die cavity 451 and the die hole 452, and press a concave surface and a plurality of screw holes on the disc 47.

[0019] In order to facilitate the removal of the workpiece after the stamping is completed, the utility model is provided with spring holes 44 evenly arranged along the circumference in the lower die 45, and the spring holes 44 are provided with a ejection spring 46 for ejecting the workpiece, and the lower end of the ejection spring 46 is fixed in the spring hole 44. During the stamping process, the ejection spring 46 is in a compressed state, and after the stamping is completed, the ejection spring 46 is in an uncompressed state, that is, it can lift the workpiece and make a certain distance between the workpiece and the die. Figure 1 The middle lifting spring 46 is in the state of lifting the workpiece before processing.

[0020] In order to position the workpiece during the stamping process, a positioning seat 49 is provided on the outside of the lower die 45 in the utility model. The top of the positioning seat 49 is connected to the positioning rod 48 through the knob 43, and the periphery of the workpiece abuts against the positioning rod 48. Specifically, a positioning hole is provided in the positioning seat 49, and the positioning rod 48 is slidably provided in the positioning hole. A threaded hole is provided on the positioning seat 49, and a screw used in conjunction with the threaded hole is provided on the knob 43. By adjusting the knob 43, the positioning rod 48 can be adjusted in the height direction to meet the needs of discs 47 of different thicknesses.

[0021] In order to realize automatic grasping and placement of workpieces, the utility model further fixes a suction and placement mechanism for grasping a wafer 47 on one side of the lower die base 4, and the suction and placement mechanism comprises a motor 5, the output shaft of the motor 5 is fixedly connected to a rotating rod 6, a mounting seat 7 is arranged on the rotating rod 6, and the mounting seat 7 is fixedly connected to an electromagnetic suction cup 11 through a horizontal moving mechanism. When in use, the electromagnetic suction cup 11 is controlled to be energized, and the electromagnetic suction cup 11 can absorb the wafer; the electromagnetic suction cup 11 is controlled to be deenergized, and the electromagnetic suction cup 11 can put down the wafer.

[0022] The horizontal moving mechanism includes a rodless cylinder 8 fixed on a mounting seat 7, a slide plate 9 of the rodless cylinder 8 is fixed to one end of a connecting plate 10, and the other end of the connecting plate 10 is fixed to an electromagnetic suction cup 11. Specifically, the connecting plate 10 is in an "L" shape. When the rodless cylinder 8 is working, the slide plate 9 will slide in the horizontal direction along the guide rail of the rodless cylinder 8, driving the connecting plate 10 to move, thereby causing the electromagnetic suction cup 11 to move in the horizontal direction.

[0023] The utility model is provided with a guide mechanism. Specifically, the upper die seat 3 is provided with a guide column 31 , and the lower die seat 4 is provided with a guide sleeve 42 . The guide column 31 cooperates with the guide sleeve 42 .

[0024] When working, the motor 5 rotates to drive the rotating rod 6 to rotate, and then the electromagnetic chuck 11 rotates around the rotating rod 6 to adjust the angle of the electromagnetic chuck 11; when the rodless cylinder 8 works, the slide plate 9 can move in the horizontal direction, driving the electromagnetic chuck 11 to move in the horizontal direction. Through the above composite movement, the electromagnetic chuck 11 can place the unprocessed workpiece on the lower mold 45, and can place the processed workpiece at the specified position.

[0025] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer forming device, comprising an upper die base (3) and a lower die base (4), wherein the upper die base (3) is provided with an upper die assembly, and the lower die base (4) is provided with a lower die assembly, wherein the upper die assembly and the lower die assembly cooperate to punch and press a wafer (47); characterized in that: A suction and release mechanism for grabbing the wafer (47) is also fixed on one side of the lower die base (4), and the suction and release mechanism comprises a motor (5), the output shaft of the motor (5) is fixedly connected to a rotating rod (6), a mounting seat (7) is provided on the rotating rod (6), and the mounting seat (7) is fixedly connected to the electromagnetic suction cup (11) via a horizontal moving mechanism.

2. A wafer forming device according to claim 1, characterized in that: The horizontal movement mechanism comprises a rodless cylinder (8) fixed on a mounting seat (7), a slide plate (9) of the rodless cylinder (8) being fixed to one end of a connecting plate (10), and the other end of the connecting plate (10) being fixed to an electromagnetic suction cup (11).

3. A wafer forming device according to claim 1 or 2, characterized in that: The lower die assembly comprises a lower die (45) fixed on a lower die base (4); a die cavity (451) is provided in the middle of the upper surface of the lower die (45); a plurality of die holes (452) are provided on the bottom surface of the die cavity (451); spring holes (44) are evenly arranged in the circumferential direction in the lower die (45); a ejection spring (46) for ejecting a workpiece is arranged in the spring hole (44); a positioning seat (49) is provided outside the lower die (45); the top end of the positioning seat (49) is connected to a positioning rod (48) through a knob (43), and the workpiece is resting against the positioning rod (48) on all sides.

4. A wafer forming device according to claim 3, characterized in that: The upper die assembly comprises a first punch (33) fixed to the upper die base (3), the first punch (33) matches the die cavity (451), and a second punch (34) matching the die hole (452) is arranged at the lower part of the first punch (33).

5. A wafer forming device according to claim 2, characterized in that: The connecting plate (10) is in an "L" shape.

6. A wafer forming device according to claim 1, characterized in that: The upper die seat (3) is provided with a guide column (31), and the lower die seat (4) is provided with a guide sleeve (42), and the guide column (31) cooperates with the guide sleeve (42).

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