Surface quality inspection device for wafer production

Abstract

The utility model provides a surface quality inspection device for wafer production, which comprises a base, the top of the base is fixedly connected with a fixed rod, the outer side of the fixed rod is provided with an adjusting piece, the outer side of the adjusting piece is provided with a clamping sleeve, the top of the base is provided with a movable plate, and the movable plate is provided with a clamping groove. And a first moving part for adjusting the position of the moving plate is arranged on the outer side of the moving plate. According to the surface quality inspection device for wafer production, the inspection lamp is clamped in the clamping sleeve, the height of the inspection lamp is adjusted through the adjusting piece, the wafer is placed on the supporting disc, the first moving piece drives the moving plate to move, and the position of the wafer is transversely adjusted; the second moving part is used for driving the supporting disc to move on the moving plate, the position of the wafer is vertically adjusted, the rotating part is used for driving the supporting disc to rotate, the wafer is driven to rotate, the detection position is adjusted, and the inspection efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a surface quality inspection device for wafer production. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon crystal rod is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. After the initial processing of the wafer is completed, its surface needs to be inspected for defects to ensure the quality of the wafer.

[0003] Comparative document CN217033690U discloses a wafer surface inspection machine, which uses a negative pressure mechanism to firmly adsorb the wafer on a platform, and is auxiliaryly provided with a clamp to further fix the wafer to avoid the wafer from moving during the inspection process. In addition, during the inspection process, a cleaning mechanism can continuously blow gas to the wafer surface, and the attachments on the wafer surface are blown away by the airflow to achieve the purpose of cleaning. However, in the above device, the wafer is fixed on the platform, the position of the wafer is fixed, and the angle of the inspection machine is also fixed. It is impossible to inspect the surface of the wafer from multiple angles, and the inspection range is limited.

[0004] Therefore, it is necessary to provide a new surface quality inspection device for wafer production to solve the above technical problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a surface quality inspection device for wafer production with adjustable detection position.

[0006] The utility model provides a surface quality inspection device for wafer production, comprising a base, a fixed rod fixedly connected to the top of the base, an adjusting piece is arranged on the outer side of the fixed rod, a clamping sleeve is arranged on the outer side of the adjusting piece, a movable plate is arranged on the top of the base, a first movable piece for adjusting the position of the movable plate is arranged on the outer side of the movable plate, a rotating piece is arranged on the top of the movable plate, a supporting plate is arranged on the outer side of the rotating piece, and a second movable piece is arranged on the outer side of the supporting plate.

[0007] As a surface quality inspection device for wafer production provided by the utility model, preferably, the adjusting part includes a fixing plate fixedly connected to the outside of a fixing rod, a sliding sleeve is slidably connected to the outside of the fixing plate, a fixing bolt is threadedly connected to the outside of the sliding sleeve, and the clamping sleeve is fixedly connected to the outside of the sliding sleeve.

[0008] As a surface quality inspection device for wafer production provided by the utility model, preferably, the first movable part includes a limit sleeve fixedly connected to the outside of the base, the outside of the base is fixedly connected to a first motor, the output end of the first motor is fixedly connected to a screw, the bottom of the movable plate is fixed with a slider, and the outside of the slider is fixedly connected to a screw sleeve.

[0009] As a surface quality inspection device for wafer production provided by the utility model, preferably, the rotating part includes a connecting block slidably connected to the top of the movable plate, a clamping plate is fixedly connected to the bottom of the connecting block, a sliding groove is opened on the outer side of the movable plate, and the clamping plate slides inside the sliding groove.

[0010] As a surface quality inspection device for wafer production provided by the utility model, preferably, the rotating member also includes a second motor fixedly connected to the inside of the connecting block, and the output end of the second motor is fixedly connected to the bottom of the supporting plate.

[0011] As a surface quality inspection device for wafer production provided by the utility model, preferably, the second movable part includes a third motor fixedly connected to the outside of the connecting block, the output end of the third motor is fixedly connected with a gear, the top of the movable plate is fixedly connected with a gear plate, and the gear and the gear plate are meshingly connected.

[0012] As a surface quality inspection device for wafer production provided by the utility model, preferably, a limiting rod is inserted into the interior of the support plate, and a bolt is inserted into the interior of the limiting rod.

[0013] As a surface quality inspection device for wafer production provided by the utility model, preferably, a protection pad is fixedly connected to the top of the support plate.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The surface quality inspection device for wafer production connects the inspection light to the inside of the card sleeve, uses an adjusting member to adjust the height of the inspection light, places the wafer on a supporting plate, uses a first moving member to drive a moving plate to move, and adjusts the position of the wafer laterally, uses a second moving member to drive the supporting plate to move on the moving plate, and adjusts the position of the wafer vertically, uses a rotating member to drive the supporting plate to rotate, drives the wafer to rotate, adjusts the detection position, and improves the inspection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a preferred embodiment of a surface quality inspection device for wafer production provided by the utility model;

[0017] Figure 2 It is a structural schematic diagram of the second moving member in the utility model;

[0018] Figure 3 It is a structural schematic diagram of the adjusting member in the utility model;

[0019] Figure 4 It is a structural schematic diagram of the rotating part in the utility model;

[0020] Figure 5 It is a structural schematic diagram of the limiting rod in the utility model.

[0021] Numbers in the figure: 1. base; 2. fixing rod; 3. adjusting part; 301. fixing plate; 302. sliding sleeve; 303. fixing bolt; 4. clamping sleeve; 5. moving plate; 6. first moving part; 601. limiting sleeve; 602. first motor; 603. screw rod; 604. sliding block; 605. screw sleeve; 7. rotating part; 701. connecting block; 702. clamping plate; 703. second motor; 8. supporting plate; 9. second moving part; 901. third motor; 902. gear; 903. tooth plate; 10. limiting rod; 11. protective pad; 12. bolt. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in Figure 1 A schematic structural diagram of a preferred embodiment of a surface quality inspection device for wafer production provided by the utility model; Figure 2 It is a structural schematic diagram of the second moving member in the utility model; Figure 3 It is a structural schematic diagram of the adjusting member in the utility model; Figure 4 It is a structural schematic diagram of the rotating part in the utility model; Figure 5 A surface quality inspection device for wafer production includes a base 1, a fixed rod 2 is fixedly connected to the top of the base 1, an adjusting member 3 is arranged on the outside of the fixed rod 2, a clamping sleeve 4 is arranged on the outside of the adjusting member 3, a moving plate 5 is arranged on the top of the base 1, a first moving member 6 for adjusting the position of the moving plate 5 is arranged on the outside of the moving plate 5, a rotating member 7 is arranged on the top of the moving plate 5, a supporting plate 8 is arranged on the outside of the rotating member 7, and a second moving member 9 is arranged on the outside of the supporting plate 8.

[0024] It should be noted that: the inspection light is connected to the inside of the card sleeve 4, the height of the inspection light is adjusted by using the adjusting part 3, the wafer is placed on the supporting plate 8, the first moving part 6 is used to drive the moving plate 5 to move, and the position of the wafer is adjusted laterally, the second moving part 9 is used to drive the supporting plate 8 to move on the moving plate 5, and the position of the wafer is adjusted vertically, and the supporting plate 8 is driven to rotate by the rotating part 7, and the wafer is driven to rotate to adjust the detection position.

[0025] In the specific implementation process, Figure 3 As shown, the adjusting member 3 includes a fixing plate 301 fixedly connected to the outside of the fixing rod 2, a sliding sleeve 302 is slidably connected to the outside of the fixing plate 301, a fixing bolt 303 is threadedly connected to the outside of the sliding sleeve 302, and a clamping sleeve 4 is fixedly connected to the outside of the sliding sleeve 302.

[0026] It should be noted that: the sleeve 302 is slid up and down on the fixed plate 301, and the sleeve 302 can drive the sleeve 4 to move, so as to adjust the height of the detection light inside the sleeve 4. A through groove is provided inside the fixed plate 301, and the sleeve 302 slides inside the through groove. After the position adjustment is completed, the fixing bolt 303 on the outside of the sleeve 302 is tightened. The fixed plate 301 is provided with a screw hole adapted to the fixing bolt 303, and the fixing bolt 303 is used to limit the sleeve 302.

[0027] refer to Figure 1 and Figure 2 As shown, the first movable member 6 includes a limiting sleeve 601 fixedly connected to the outside of the base 1, a first motor 602 is fixedly connected to the outside of the base 1, a screw 603 is fixedly connected to the output end of the first motor 602, a slider 604 is fixed to the bottom of the movable plate 5, and a screw sleeve 605 is fixedly connected to the outside of the slider 604.

[0028] It should be noted that: turning on the first motor 602 drives the screw 603 to rotate, the screw 603 drives the screw sleeve 605 threadedly connected to its outer side to move, and the bottom of the movable plate 5 is symmetrically fixed with two sliders 604, the screw sleeve 605 is fixed to the outer side of the slider 604 on the right side, the screw sleeve 605 drives the slider 604 to slide inside the limiting sleeve 601, and the slider 604 on the other side moves synchronously inside the limiting sleeve 601, which can improve the stability of the movable plate 5, and the movable plate 5 is driven by the slider 604 to move to a suitable position on the upper part of the base 1.

[0029] refer to Figure 4 As shown, the rotating member 7 includes a connecting block 701 slidably connected to the top of the moving plate 5, a clamping plate 702 is fixedly connected to the bottom of the connecting block 701, a sliding groove is provided on the outer side of the moving plate 5, and the clamping plate 702 slides inside the sliding groove; the rotating member 7 also includes a second motor 703 fixedly connected to the inside of the connecting block 701, and the output end of the second motor 703 is fixedly connected to the bottom of the support plate 8.

[0030] It should be noted that: turning on the second motor 703 drives the support plate 8 to rotate, so that the position of the wafer on the support plate 8 can be adjusted to adjust the detection range, and the sliding of the clamping plate 702 inside the slide groove can adjust the position of the connecting block 701 on the movable plate 5.

[0031] refer to Figure 2 As shown, the second moving member 9 includes a third motor 901 fixedly connected to the outside of the connecting block 701, the output end of the third motor 901 is fixedly connected with a gear 902, the top of the moving plate 5 is fixedly connected with a toothed plate 903, and the gear 902 and the toothed plate 903 are meshingly connected.

[0032] It should be noted that: when the third motor 901 is turned on, the gear 902 is driven to mesh with the tooth plate 903 , and the gear 902 moves on the tooth plate 903 , driving the third motor 901 and the connecting block 701 to move on the moving plate 5 .

[0033] refer to Figure 5 As shown, a limit rod 10 is inserted into the interior of the support plate 8, and a bolt 12 is inserted into the interior of the limit rod 10; a protection pad 11 is fixedly connected to the top of the support plate 8.

[0034] It should be noted that: after the wafer is placed on the support plate 8, the position of the limit rod 10 is moved inside the support plate 8 so that the limit rod 10 is clamped on the outside of the wafer, and then the limit rod 10 is limited by the bolt 12 that passes through the limit rod 10 and is threadedly connected to the inside of the support plate 8. The protective pad 11 can provide protection for the contact surface between the wafer and the support plate 8.

[0035] The working principle of a surface quality inspection device for wafer production provided by the utility model is as follows:

[0036] When inspecting the wafer, the user first places the wafer on the supporting plate 8, and then moves the position of the limiting rod 10 inside the supporting plate 8 so that the limiting rod 10 is clamped on the outside of the wafer, and then uses the bolt 12 that passes through the limiting rod 10 and is threadedly connected to the inside of the supporting plate 8 to limit the limiting rod 10. The protective pad 11 can provide protection for the contact surface between the wafer and the supporting plate 8, and the inspection light is clamped inside the ferrule 4. The sliding sleeve 302 slides up and down on the fixed plate 301. The sliding sleeve 302 can drive the ferrule 4 to move, so as to adjust the height of the inspection light inside the ferrule 4. A through groove is provided inside the fixed plate 301, and the sliding sleeve 302 slides inside the through groove. After the position adjustment is completed, the fixing bolt 303 on the outside of the sliding sleeve 302 is tightened. The fixing plate 301 is provided with a screw hole adapted to the fixing bolt 303. The sliding sleeve 302 is limited by the fixing bolt 303, so as to fix the position of the inspection light, and the first motor 602 is turned on to drive the screw rod 60 3 rotates, the screw rod 603 drives the screw sleeve 605 threadedly connected to its outer side to move, and the bottom of the movable plate 5 is symmetrically fixedly connected with two sliders 604, the screw sleeve 605 is fixed on the outer side of the slider 604 on the right side, the screw sleeve 605 drives the slider 604 to slide inside the limiting sleeve 601, and the slider 604 on the other side moves synchronously inside the limiting sleeve 601, which can improve the stability of the movable plate 5, and the movable plate 5 is driven by the slider 604 to move to a suitable position on the upper part of the base 1, and the second motor 703 is turned on to drive the supporting plate 8 to rotate, so that the position of the wafer on the supporting plate 8 can be adjusted to adjust the detection range, and the card plate 702 slides inside the slide groove to adjust the position of the connecting block 701 on the movable plate 5, and the third motor 901 is turned on to drive the gear 902 to mesh with the tooth plate 903, and the gear 902 moves on the tooth plate 903, driving the third motor 901 and the connecting block 701 to move on the movable plate 5.

[0037] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A surface quality inspection device for wafer production, characterized in that: include: A base (1), wherein a fixed rod (2) is fixedly connected to the top of the base (1), an adjusting member (3) is arranged on the outer side of the fixing rod (2), a clamping sleeve (4) is arranged on the outer side of the adjusting member (3), a moving plate (5) is arranged on the top of the base (1), a first moving member (6) for adjusting the position of the moving plate (5) is arranged on the outer side of the moving plate (5), a rotating member (7) is arranged on the top of the moving plate (5), a supporting plate (8) is arranged on the outer side of the rotating member (7), and a second moving member (9) is arranged on the outer side of the supporting plate (8).

2. The surface quality inspection device for wafer production according to claim 1, characterized in that: The adjusting member (3) comprises a fixing plate (301) fixedly connected to the outside of the fixing rod (2); a sliding sleeve (302) is slidably connected to the outside of the fixing plate (301); a fixing bolt (303) is threadedly connected to the outside of the sliding sleeve (302); and the clamping sleeve (4) is fixedly connected to the outside of the sliding sleeve (302).

3. The surface quality inspection device for wafer production according to claim 1, characterized in that: The first moving member (6) comprises a limiting sleeve (601) fixedly connected to the outside of the base (1); a first motor (602) is fixedly connected to the outside of the base (1); a screw rod (603) is fixedly connected to the output end of the first motor (602); a slider (604) is fixedly connected to the bottom of the moving plate (5); and a screw sleeve (605) is fixedly connected to the outside of the slider (604).

4. The surface quality inspection device for wafer production according to claim 1, characterized in that: The rotating member (7) comprises a connecting block (701) slidably connected to the top of the moving plate (5); a clamping plate (702) is fixedly connected to the bottom of the connecting block (701); a sliding groove is provided on the outer side of the moving plate (5), and the clamping plate (702) slides inside the sliding groove.

5. The surface quality inspection device for wafer production according to claim 4, characterized in that: The rotating member (7) further comprises a second motor (703) fixedly connected to the inside of the connecting block (701), and an output end of the second motor (703) is fixedly connected to the bottom of the supporting plate (8).

6. The surface quality inspection device for wafer production according to claim 1, characterized in that: The second moving member (9) comprises a third motor (901) fixedly connected to the outside of the connecting block (701), the output end of the third motor (901) is fixedly connected to a gear (902), the top of the moving plate (5) is fixedly connected to a toothed plate (903), and the gear (902) and the toothed plate (903) are meshingly connected.

7. The surface quality inspection device for wafer production according to claim 1, characterized in that: A limiting rod (10) is inserted into the interior of the support plate (8), and a bolt (12) is inserted into the interior of the limiting rod (10).

8. The surface quality inspection device for wafer production according to claim 1, characterized in that: A protection pad (11) is fixedly connected to the top of the support plate (8).

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