Projector heat dissipation device with active cooling function

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a projector heat dissipation device with an active cooling function, which comprises a vapor chamber fixedly mounted on an LED lamp base of an LED lamp on a projector body; the device comprises a heat conducting plate, a TEC semiconductor radiator is fixedly installed on the heat conducting plate, the cold end of the TEC semiconductor radiator is attached to the heat conducting plate, connecting plates are fixedly connected to the two sides of the heat conducting plate, the sides, away from the heat conducting plate, of the two connecting plates are jointly and fixedly connected with a fan mounting plate, and an electric fan is fixedly installed on the fan mounting plate. An air suction port of the electric fan is arranged right above the hot end of the TEC semiconductor radiator and is used for sucking and discharging heat; and a convenient-to-disassemble mechanism is mounted on the fan mounting plate. A TEC semiconductor radiator is used for assisting in heat dissipation, and the device is better in heat dissipation through active cooling and heat dissipation of an electric fan; the device can be used for conveniently, safely and stably replacing new TEC semiconductor radiators and electric fans.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation device for a projector with an active cooling function. Background Art

[0002] Projectors are widely used in our daily lives. Their projection effects are affected by environmental factors. Under the influence of different projection light sources, imaging components, heat dissipation methods and other factors, the brightness, clarity, refresh rate and other performance of the projector will be different, resulting in the projector being unable to present the best projection effect. In order to make the projection performance of the projector meet the standard, shorten the projector heat dissipation time and improve the projection effect, it is necessary to mix and match the existing projector heat dissipation technologies to give full play to the advantages of each heat dissipation technology.

[0003] Traditional LED projector heat dissipation technologies include heat sinks, fan cooling, and water cooling.

[0004] The traditional heat dissipation effect is not very good. For this reason, we designed a structure that uses TEC semiconductor radiator for auxiliary heat dissipation, so as to achieve better heat dissipation effect. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the defects of the prior art. The utility model proposes a projector heat dissipation device with active cooling function, which uses a TEC semiconductor heat sink for auxiliary heat dissipation, thereby achieving better heat dissipation effect.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is: a projector heat dissipation device with active cooling function, comprising:

[0007] A heat spreader, the heat spreader is fixedly mounted on the LED lamp base of the LED lamp on the projector body;

[0008] A heat conducting plate, on which a TEC semiconductor heat sink is fixedly mounted, the cold end of the TEC semiconductor heat sink is in contact with the heat conducting plate, both sides of the heat conducting plate are fixedly connected with connecting plates, and a fan mounting plate is fixedly connected to one side of the two connecting plates away from the heat conducting plate, and an electric fan is fixedly mounted on the fan mounting plate, and the air suction port of the electric fan is placed just above the hot end of the TEC semiconductor heat sink, so as to absorb and discharge the heat;

[0009] The fan mounting plate is provided with a convenient disassembly mechanism, and the convenient disassembly mechanism is used to disassemble and remove the TEC semiconductor radiator and the electric fan from the projector body or to make the heat conducting plate fit the heat spreader to perform active heat dissipation.

[0010] Furthermore, the easy disassembly mechanism comprises an auxiliary mounting plate, a sliding column is fixedly connected to the auxiliary mounting plate, and a side of the fan mounting plate away from the connecting plate is fixedly connected to the sliding column;

[0011] A second notch is provided on the shell of the projector body, the sliding column passes through the second notch, and the auxiliary mounting plate is fixedly mounted on the shell of the projector body through a fixing mechanism;

[0012] An air outlet is provided on the auxiliary mounting plate, and an air outlet filter is fixedly installed at the air outlet.

[0013] Furthermore, an air inlet is provided on the shell of the projector body, and an air inlet filter is fixedly installed at the air inlet.

[0014] Furthermore, the fixing mechanism includes screws and a limiting slider, a long groove is provided on the auxiliary mounting plate, a limiting sliding groove is provided on the shell of the projector body, the limiting sliding groove is connected to the limiting slider in a left and right limiting sliding manner, the projector body is provided with a first slot connected to the limiting sliding slot, the limiting slider is provided with a threaded groove, the screw passes through the long groove and the first slot and is threadedly connected in the threaded groove, so as to fix the auxiliary mounting plate on the shell of the projector body.

[0015] Furthermore, a pull frame is fixedly mounted on the auxiliary mounting plate.

[0016] Furthermore, a conical groove is formed on the heat conducting plate, and a conical block is fixedly connected to the heat spreader. The conical block can be inserted into the conical groove to guide the heat conducting plate so that the heat conducting plate and the surface of the heat spreader are better fitted.

[0017] Compared with the prior art, the beneficial effects of the utility model include:

[0018] The structure uses TEC semiconductor radiator to assist heat dissipation, thus achieving better heat dissipation effect;

[0019] Active cooling through electric fans allows for better heat dissipation of the device;

[0020] The device can facilitate the safe and stable replacement of new TEC semiconductor radiators and electric fans. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The disclosure of the present invention is described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the accompanying drawings, the same reference numerals are used to refer to the same components. Among them:

[0022] Figure 1Schematically shows a cross-sectional structural diagram of a device proposed according to one embodiment of the utility model;

[0023] Figure 2 Schematically shows a method according to an embodiment of the present invention Figure 1 A schematic diagram of a local enlarged structure;

[0024] Figure 3 Schematically shows an enlarged structural diagram of A of a device proposed according to one embodiment of the utility model;

[0025] Figure 4 The enlarged structural diagram of the B portion of the device proposed according to one embodiment of the utility model is schematically shown.

[0026] Numbers in the figure: 1. Projector body; 2. LED lamp base; 3. Heat spreader; 4. Heat conducting plate; 5. TEC semiconductor radiator; 6. Connecting plate; 7. Fan mounting plate; 8. Electric fan; 9. Sliding column; 10. Air outlet filter; 11. Limit sliding groove; 12. Auxiliary mounting plate; 13. Pull frame; 14. Conical groove; 15. Conical block; 16. Long groove; 17. Screw; 18. First notch; 19. Limit slider; 20. Threaded groove; 21. Second notch; 22. Air inlet filter. DETAILED DESCRIPTION

[0027] It is easy to understand that according to the technical solution of the utility model, without changing the essential spirit of the utility model, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the utility model, and should not be regarded as the entirety of the utility model or as a limitation or restriction to the technical solution of the utility model.

[0028] Example:

[0029] like Figure 1-4 As shown, an air inlet is provided on the shell of the projector body 1, and an air inlet filter 22 is fixedly installed on the air inlet.

[0030] A heat spreader 3 is fixedly mounted on the LED lamp base 2 of the LED lamp in the projector body 1 , and a conical block 15 is fixedly connected to the heat spreader 3 .

[0031] The auxiliary mounting plate 12 is provided with an air outlet, and an air outlet filter 10 is fixedly mounted on the air outlet. A sliding column 9 is fixedly connected to the auxiliary mounting plate 12, and a fan mounting plate 7 is fixedly connected to the side of the sliding column 9 away from the auxiliary mounting plate 12, and an electric fan 8 is fixedly mounted on the fan mounting plate 7, and the electric fan 8 is placed directly below the air outlet filter 10.

[0032] The fan mounting plate 7 is fixedly connected to connecting plates 6 on both sides away from the sliding column 9, and the two connecting plates 6 are fixedly connected to the heat conducting plate 4 on one side away from the fan mounting plate 7. The TEC semiconductor radiator 5 is fixedly installed on the heat conducting plate 4, the cold end of the TEC semiconductor radiator 5 is attached to the heat conducting plate 4, and the hot end of the TEC semiconductor radiator 5 is placed at the air intake of the electric fan 8, and the air outlet filter 10 is placed at the air outlet of the electric fan 8.

[0033] A conical groove 14 is formed on a side of the heat conducting plate 4 away from the connecting plate 6 .

[0034] The conical block 15 can be inserted into the conical groove 14 to guide the heat conducting plate 4 so that the heat conducting plate 4 can be well attached to the heat spreader 3 .

[0035] A long groove 16 is provided on the auxiliary mounting plate 12. A limited sliding groove 11 is provided on the shell of the projector body 1. A limited sliding block 19 is connected to the limited sliding groove 11 for limited sliding movement. A threaded groove 20 is provided on the limited sliding block 19. A first notch 18 communicating with the limited sliding groove 11 is provided on the shell of the projector body 1. A screw 17 passes through the long groove 16 and the first notch 18 and is threadedly connected in the threaded groove 20, so as to fix the auxiliary mounting plate 12 on the projector body 1. A pull frame 13 is fixedly connected to the auxiliary mounting plate 12.

[0036] A second slot 21 is formed on the shell of the projector body 1 , and the sliding post 9 passes through the second slot 21 .

[0037] In a specific implementation, when the device needs to be used for heat dissipation, first rotate the heat conducting plate 4 ninety degrees and insert it into the projector body 1 from the second notch 21, and then rotate it ninety degrees again to return the heat conducting plate 4 to its initial direction. At this time, the conical groove 14 of the heat conducting plate 4 cooperates with the conical block 15 for guidance, so that the heat conducting plate 4 fits perfectly on the heat spreader 3, so that the device can conduct heat and dissipate heat better. Then, in order to better fix the device, a limit slider 19 that can move left and right is used so that the device can be well fixed, and the fixed device will not produce excessive vibrations by the electric fan 8. The electric fan 8 is used to absorb the hot air passing through the TEC semiconductor radiator 5 to dissipate the heat of the TEC semiconductor radiator 5, thereby cooling the LED lamp base 2. And when a new TEC semiconductor radiator 5 and the electric fan 8 need to be replaced, they are also easy to disassemble and replace.

[0038] The technical scope of the present invention is not limited to the contents described above. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical concept of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A projector heat dissipation device with active cooling function, characterized in that: include: A heat spreader (3), wherein the heat spreader (3) is fixedly mounted on an LED lamp base (2) of an LED lamp on a projector body (1); A heat conducting plate (4), a TEC semiconductor heat sink (5) is fixedly mounted on the heat conducting plate (4), a cold end of the TEC semiconductor heat sink (5) is in contact with the heat conducting plate (4), connecting plates (6) are fixedly connected to both sides of the heat conducting plate (4), a fan mounting plate (7) is fixedly connected to the two connecting plates (6) on one side away from the heat conducting plate (4), an electric fan (8) is fixedly mounted on the fan mounting plate (7), and an air intake port of the electric fan (8) is placed directly above the hot end of the TEC semiconductor heat sink (5) for absorbing and discharging heat; The fan mounting plate (7) is provided with a disassembly mechanism, which is used to disassemble and remove the TEC semiconductor heat sink (5) and the electric fan (8) from the projector body (1) or to make the heat conducting plate (4) fit the heat spreader (3) to perform active heat dissipation.

2. The projector heat dissipation device with active cooling function according to claim 1, characterized in that: The convenient disassembly mechanism comprises an auxiliary mounting plate (12), a sliding column (9) is fixedly connected to the auxiliary mounting plate (12), and a side of the fan mounting plate (7) away from the connecting plate (6) is fixedly connected to the sliding column (9); A second notch (21) is provided on the shell of the projector body (1), the sliding column (9) passes through the second notch (21), and the auxiliary mounting plate (12) is fixedly mounted on the shell of the projector body (1) by a fixing mechanism; An air outlet is provided on the auxiliary mounting plate (12), and an air outlet filter (10) is fixedly mounted at the air outlet.

3. The projector heat dissipation device with active cooling function according to claim 2, characterized in that: An air inlet is provided on the shell of the projector body (1), and an air inlet filter (22) is fixedly installed at the air inlet.

4. The projector heat dissipation device with active cooling function according to claim 3, characterized in that: The fixing mechanism comprises a screw (17) and a limit slide block (19); a long groove (16) is provided on the auxiliary mounting plate (12); a limit slide groove (11) is provided on the shell of the projector body (1); the limit slide groove (11) is connected to the limit slide block (19) in a left-right limit sliding manner; a first notch (18) connected to the limit slide groove (11) is provided on the projector body (1); a threaded groove (20) is provided on the limit slide block (19); the screw (17) passes through the long groove (16) and the first notch (18) and is threadedly connected in the threaded groove (20), so as to fix the auxiliary mounting plate (12) on the shell of the projector body (1).

5. The projector heat dissipation device with active cooling function according to claim 2, characterized in that: A pull frame (13) is fixedly mounted on the auxiliary mounting plate (12).

6. The projector heat dissipation device with active cooling function according to claim 4, characterized in that: The heat conducting plate (4) is provided with a conical groove (14), and the heat spreader (3) is fixedly connected with a conical block (15). The conical block (15) can be inserted into the conical groove (14) to guide the heat conducting plate (4) so ​​that the heat conducting plate (4) and the surface of the heat spreader (3) are better fitted.

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