Wafer film covering positioning mechanism

Abstract

The utility model relates to the technical field of wafer laminating positioning, in particular to a wafer laminating positioning mechanism, which comprises a positioning table and a fixing sheet, a sliding groove is arranged at the top end of the positioning table, a sliding block is slidably connected in the sliding groove, a positioning block is fixedly connected at the top end of the sliding block, a bolt is in threaded connection in the positioning block, and the fixing sheet is fixedly connected with the positioning block. A fixing piece is arranged at the top end of the positioning table, a through hole penetrating through the positioning table is formed in the top end of the positioning table, a vertical rod is fixedly connected to the bottom end of the positioning table, a fixing frame rotationally connected with the vertical rod through a round hole is arranged on the outer side of the vertical rod, a strip hole penetrating through the fixing frame is formed in the top end of the fixing frame, and an air nozzle is arranged in the strip hole. By arranging the sliding grooves, the sliding blocks, the positioning blocks and the bolts, fixing pieces of different sizes can be positioned, the distance between the two positioning blocks can be adjusted by adjusting the bolts, the fixing pieces of different sizes can be well positioned, and follow-up machining of wafers is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer coating positioning, in particular to a wafer coating positioning mechanism. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and infiltrated into silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. The main processing methods of wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. At the same time, the reduction in feature size makes the number of particles in the air during wafer processing increase the impact on the quality and reliability of the wafer after processing. As the cleanliness improves, new data characteristics have also emerged in the number of particles.

[0003] After the wafer is coated, it needs to be cut in a laser cutting device. Since the cutting precision is extremely high, there are high requirements for the positioning accuracy when fixing the wafer. The traditional positioning mechanism only positions the wafer by direct manual placement, and the positioning accuracy is low. Secondly, after the fixing plate is placed in the appropriate position, the devices such as the air nozzle that play a fixing role cannot fine-tune their own position. When the size of the fixing plate changes, it cannot be fixed well. Finally, after the wafer is positioned and fixed on the positioning mechanism, there is no device to clean the wafer. Dust and other debris on the surface of the wafer will affect its subsequent processing. Therefore, a wafer coating positioning mechanism is proposed to address the above problems. Utility Model Content

[0004] The utility model aims to provide a wafer coating positioning mechanism to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A wafer coating positioning mechanism comprises a positioning platform and a fixing plate, a slide groove is provided at the top of the positioning platform, a slider is slidably connected inside the slide groove, a positioning block is fixedly connected to the top of the slider, a bolt is threadedly connected inside the positioning block, a fixing plate is provided at the top of the positioning platform, a through hole is provided at the top of the positioning platform that penetrates the positioning platform, a vertical rod is fixedly connected to the bottom end of the positioning platform, a fixing frame rotatably connected through a circular hole is provided on the outside of the vertical rod, a strip hole that penetrates the fixing frame is provided on the top of the fixing frame, an air nozzle is provided inside the strip hole, and a nut is threadedly connected to the outside of the air nozzle.

[0007] Preferably, a support frame is fixedly connected to the top of the positioning platform, a slide rail is fixedly connected to the bottom of the support frame, a movable frame is slidably connected to the outer side of the slide rail, and a cleaning brush is provided at the bottom of the movable frame.

[0008] Preferably, there are two slide grooves, which are symmetrically arranged on the top of the positioning platform, and the size of the slider is smaller than that of the slide groove.

[0009] Preferably, the number of the through holes is two, and the diameter of the through holes is larger than the diameter of the air nozzle.

[0010] Preferably, the support frames are C-shaped, and there are two of them, which are symmetrically arranged on the top of the positioning platform.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. In the utility model, the fixed sheets of different sizes can be positioned by the provided slide grooves, sliders, positioning blocks and bolts, and the distance between the two positioning blocks can be adjusted by adjusting the bolts, so that the fixed sheets of different sizes can be better positioned, which is convenient for the subsequent processing of the wafer;

[0013] 2. In the utility model, the horizontal position of the gas nozzle in the through hole can be adjusted by setting the through hole, the vertical rod, the fixing frame, the round hole, the strip hole, the gas nozzle and the nut. The vertical height of the gas nozzle can be adjusted by adjusting the nut, so that the fixing plate can be better fixed. Moreover, there are two sets of fixing devices, which can firmly fix the fixing plate above the positioning platform;

[0014] 3. In the utility model, by providing a support frame, a slide rail, a movable frame and a cleaning brush, the wafer can be cleaned after being fixed. The cleaning brush can remove dust on the surface of the wafer without damaging the wafer. The cleaning brush can be replaced after being used for a period of time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the installation of the slider structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the installation of the mobile rack structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the installation of the gas nozzle structure of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the fixing frame of the utility model.

[0020] In the figure: 1. positioning table; 2. slide groove; 3. slider; 4. positioning block; 5. bolt; 6. fixing plate; 7. through hole; 8. vertical rod; 9. fixing frame; 10. round hole; 11. strip hole; 12. air nozzle; 13. nut; 14. support frame; 15. slide rail; 16. movable frame; 17. cleaning brush. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0023] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0024] See also Figure 1-5 , the utility model provides a technical solution:

[0025] A wafer coating positioning mechanism comprises a positioning platform 1 and a fixing plate 6, a slide groove 2 is provided at the top of the positioning platform 1, a slider 3 is slidably connected inside the slide groove 2, a positioning block 4 is fixedly connected to the top of the slider 3, a bolt 5 is threadedly connected inside the positioning block 4, a fixing plate 6 is provided at the top of the positioning platform 1, a through hole 7 penetrating the positioning platform 1 is provided at the top of the positioning platform 1, a vertical rod 8 is fixedly connected to the bottom end of the positioning platform 1, a fixing frame 9 rotatably connected through a circular hole 10 is provided on the outer side of the vertical rod 8, a strip hole 11 penetrating the fixing frame 9 is provided on the top of the fixing frame 9, an air nozzle 12 is provided inside the strip hole 11, and a nut 13 is threadedly connected to the outer side of the air nozzle 12.

[0026] A support frame 14 is fixedly connected to the top of the positioning platform 1, a slide rail 15 is fixedly connected to the bottom of the support frame 14, a movable frame 16 is slidably connected to the outer side of the slide rail 15, and a cleaning brush 17 is provided at the bottom of the movable frame 16; there are two slide grooves 2, which are symmetrically arranged at the top of the positioning platform 1, and the size of the slider 3 is smaller than the size of the slide groove 2; there are two through holes 7, and the diameter of the through hole 7 is larger than the diameter of the air nozzle 12; the support frame 14 is C-shaped, and there are two of them, which are symmetrically arranged at the top of the positioning platform 1.

[0027] Working process: The device is installed at a designated position, and an external vacuum generator provides an air source to the air nozzle 12. There are two symmetrically arranged slide grooves 2 at the top of the positioning platform 1, and the slider 3 slides inside the slide groove 2. The positioning block 4 is fixed at the top of the slider 3. The position of the positioning block 4 can be adjusted in the slide groove 2 by adjusting the bolt 5, so that the fixed plates 6 of different sizes can be positioned. The distance between the two positioning blocks 4 can be adjusted at any time according to the size of the fixed plate 6. A vertical rod 8 is provided at the bottom end of the positioning platform 1, and a fixing frame 9 is installed on the outside of the vertical rod 8 through a circular hole 10. The fixing frame 9 can be rotated on the outside of the vertical rod 8 through the circular hole 10. A strip hole 11 is provided on the fixing frame 9, and the air nozzle 12 passes through the strip hole 11. The air nozzle 12 can be fixed by two nuts 13, and the relative height between the air nozzle 12 and the positioning platform 1 can be adjusted by adjusting the two nuts 13. The air nozzle 12 is arranged inside the through hole 7, and the straightness of the through hole 7 is The larger diameter can ensure that the air nozzle 12 can change the horizontal position inside the through hole 7 at will. When the fixed plate 6 is placed on the top of the positioning platform 1, the positioning block 4 will be stuck on both sides of the fixed plate 6, which has a good positioning effect on the fixed plate 6. The air nozzle 12 is adjusted to make the air nozzle 12 close to the bottom of the fixed plate 6. The vacuum generator is connected to the air nozzle 12, which can adsorb and fix the fixed plate 6 to prevent the fixed plate 6 from moving during the wafer processing and affecting the wafer processing effect. After the fixed plate 6 is fixed, the mobile frame 16 under the support frame 14 is pulled, and the wafer can be cleaned by the cleaning brush 17 to remove dust attached to the surface of the wafer. The mobile frame 16 and the support frame 14 are connected by a slide rail 15, and the mobile frame 16 is suspended under the slide rail 15. When the cleaning brush 17 needs to be replaced, the cleaning brush 17 can be replaced. Different cleaning brushes 17 can be used for different wafers, which can better clean the wafer without damaging the wafer.

[0028] The contents not described in detail in this specification belong to the prior art known to the professional and technical personnel in this field. The standard parts used in this utility model can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt the conventional means such as bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0029] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer coating positioning mechanism, comprising a positioning platform (1) and a fixing plate (6), characterized in that: The top of the positioning platform (1) is provided with a slide groove (2), a slider (3) is slidably connected inside the slide groove (2), a positioning block (4) is fixedly connected to the top of the slider (3), a bolt (5) is threadedly connected inside the positioning block (4), a fixing plate (6) is provided at the top of the positioning platform (1), a through hole (7) penetrating the positioning platform (1) is provided at the top of the positioning platform (1), a vertical rod (8) is fixedly connected to the bottom of the positioning platform (1), a fixing frame (9) rotatably connected through a circular hole (10) is provided on the outside of the vertical rod (8), a strip hole (11) penetrating the fixing frame (9) is provided at the top of the fixing frame (9), an air nozzle (12) is provided inside the strip hole (11), and a nut (13) is threadedly connected to the outside of the air nozzle (12).

2. The wafer coating positioning mechanism according to claim 1, characterized in that: The top end of the positioning platform (1) is fixedly connected to a support frame (14), the bottom end of the support frame (14) is fixedly connected to a slide rail (15), the outer side of the slide rail (15) is slidably connected to a movable frame (16), and a cleaning brush (17) is provided at the bottom end of the movable frame (16).

3. The wafer coating positioning mechanism according to claim 1, characterized in that: There are two slide grooves (2) which are symmetrically arranged at the top of the positioning platform (1), and the size of the slider (3) is smaller than that of the slide groove (2).

4. The wafer coating positioning mechanism according to claim 1, characterized in that: The number of the through holes (7) is two, and the diameter of the through holes (7) is greater than the diameter of the air nozzle (12).

5. The wafer coating positioning mechanism according to claim 2, characterized in that: The support frames (14) are C-shaped, two in number, and are symmetrically arranged on the top of the positioning platform (1).

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