Laser module and laser equipment

Abstract

The utility model relates to a laser module and laser equipment. The laser module comprises a substrate, a laser chip and a support. The laser chip is arranged on the substrate; the support comprises a sleeve part and an optical collimation part arranged in the sleeve part, the sleeve part and the optical collimation part are of an integrated structure, the sleeve part is arranged on the substrate and surrounds the laser chip, the sleeve part is provided with a light outlet located in the side, opposite to the laser chip, of the optical collimation part, and the laser chip is arranged in the light outlet. And laser emitted by the laser chip can be emitted to the optical collimation part in the sleeve part, and is emitted from the light outlet after being collimated by the optical collimation part. According to the laser module, the assembly process of the laser module is simplified, and the manufacturing cost of the laser module is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of laser equipment, and in particular to a laser module and laser equipment. Background Art

[0002] With the rapid development of line laser modules, line laser modules are increasingly widely used in laser equipment such as sweeping robots, laser radars, and 3D recognition devices. Current line laser modules usually include a copper tube and multiple components such as a collimator, a wave mirror, and a laser chip on the copper tube. The assembly accuracy and assembly strength between the components have an important impact on the performance of the line laser module. However, in order to improve the assembly accuracy and assembly strength, the current line laser module manufacturing process is complex and the manufacturing cost is high. Summary of the invention

[0003] Based on this, it is necessary to provide a laser module and laser equipment to address the problems of complex manufacturing process and high manufacturing cost of the current line laser module.

[0004] A laser module, comprising:

[0005] substrate;

[0006] a laser chip, disposed on the substrate; and

[0007] The bracket includes a sleeve portion and an optical collimation portion arranged in the sleeve portion, the sleeve portion and the optical collimation portion are an integrated structure, the sleeve portion is arranged on the substrate and surrounds the laser chip, the sleeve portion is provided with a light outlet located on the side of the optical collimation portion facing away from the laser chip, the laser emitted by the laser chip can be projected onto the optical collimation portion in the sleeve portion, and can be emitted from the light outlet after being collimated by the optical collimation portion.

[0008] The above-mentioned laser module integrates the collimating lens, that is, the optical collimation part and the sleeve part into an integrated structure through one-piece molding, so that the sleeve part and the optical collimation part can be prepared by using one mold. During the assembly process of the laser module, there is no need to align the optical collimation part and the sleeve part, which is beneficial to simplify the assembly process of the laser module and reduce the manufacturing cost of the laser module.

[0009] In one embodiment, the optical collimation part includes an optical effective diameter portion and a supporting portion, the supporting portion is arranged around the optical effective diameter portion, the supporting portion is connected to the optical effective diameter portion and the sleeve portion, and is an integral structure with the optical effective diameter portion and the sleeve portion, and the bracket also includes a protrusion, the protrusion is arranged on the side of the supporting portion facing away from the laser chip, the protrusion is arranged around the optical effective diameter portion, and is integrally connected to the inner wall surface of the sleeve portion and the surface of the supporting portion facing away from the laser chip. Providing a protrusion to connect the sleeve portion and the supporting portion can improve the connection strength between the optical collimation part and the sleeve portion, thereby facilitating the improvement of the structural strength of the laser module.

[0010] In one embodiment, the laser module further comprises a light homogenizing element disposed on the side of the optical collimating portion facing away from the laser chip, the light homogenizing element comprises a light homogenizing portion and a fixing portion, the light homogenizing portion is opposite to the optical effective diameter portion, the fixing portion is disposed around the light homogenizing portion, and is fixedly disposed on the protruding portion. The fixing portion of the light homogenizing element is fixedly disposed on the protruding portion, and the light homogenizing element, the protruding portion, and the optical collimating portion are mutually positioned, which can improve the structural strength and assembly accuracy of the laser module.

[0011] In one embodiment, the light homogenizing element further includes an embedding portion, the embedding portion is connected to a side of the fixing portion facing the optical collimating portion, and the embedding portion is embedded in the protruding portion. The embedding arrangement of the embedding portion and the protruding portion is conducive to further improving the assembly accuracy and structural reliability of the light homogenizing element in the laser module.

[0012] In one embodiment, the inner wall surface of the sleeve portion is provided with an inclined curved surface portion, the inclined curved surface portion is located on the side of the optical collimation portion facing the laser chip, and is connected to the optical collimation portion, and the radial dimension of the inclined curved surface portion gradually decreases in the direction in which the laser chip points to the optical collimation portion. Such a configuration is not likely to affect the light output of the laser module, and is also conducive to improving the structural strength of the sleeve portion and the connection reliability between the optical collimation portion and the sleeve portion.

[0013] In one embodiment, the outer wall surface of the sleeve portion is provided with a plurality of positioning portions, wherein at least two of the positioning portions are opposite to each other and parallel to each other, the laser chip comprises a line laser, and the positioning portions are used to provide a reference for alignment between the sleeve portion and the laser chip. The provision of the positioning portions is conducive to improving the assembly accuracy and assembly efficiency of the laser module.

[0014] In one embodiment, the laser module further comprises an electrode layer disposed on the side of the substrate facing the bracket, and the electrode layer is provided with a plurality of arc-shaped positioning grooves, which are arranged around the laser chip and adapted to the inner wall surface of the sleeve portion. The provision of the arc-shaped positioning grooves is conducive to improving the assembly accuracy and assembly efficiency of the bracket on the substrate.

[0015] In one embodiment, the optical collimating portion has positive optical power and an optical axis, and the optical axis passes through the inner space of the sleeve portion and is parallel to the axial direction of the sleeve portion.

[0016] In one embodiment, the material of the bracket includes plastic or glass.

[0017] A laser device comprises the laser module as described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG. 1 is a schematic diagram of the structure of a laser module in some embodiments.

[0019] FIG. 2 is a schematic diagram of an explosion of the laser module shown in FIG. 1 .

[0020] FIG. 3 is a schematic structural diagram of the laser module shown in FIG. 1 from another angle.

[0021] FIG. 4 is a schematic cross-sectional view of the laser module shown in FIG. 3 along the AA direction.

[0022] FIG. 5 is a schematic diagram of the structure of a bracket in some embodiments.

[0023] Reference numerals:

[0024] 10. Laser module; 11. Laser chip; 12. Substrate; 13. Bracket; 131. Sleeve portion; 1311. Inclined curved surface portion; 1312. Positioning portion; 132. Optical collimation portion; 1321. Optical effective diameter portion; 1322. Supporting portion; 133. Raised portion; 14. Light homogenizing element; 141. Light homogenizing portion; 142. Fixing portion; 15. Electrode layer; 151. Arc-shaped positioning groove. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0026] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0027] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0029] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0031] Please refer to Figures 1-3, Figure 1 is a schematic diagram of the structure of the laser module 10 in some embodiments, Figure 2 is an exploded schematic diagram of the laser module 10 shown in Figure 1, and Figure 3 is a schematic diagram of the structure of the laser module 10 shown in Figure 1 from another angle. The laser module 10 provided in the present application can be used in any applicable laser equipment such as a sweeping robot, a laser radar, a 3D recognition device, etc. The laser module 10 includes but is not limited to a line laser module, and the laser module 10 includes a laser chip 11 that can be used to emit a line laser, and the laser chip 11 includes but is not limited to a line laser. In some embodiments, the laser device may also include a laser sensing module, and the laser sensing module may include an image sensor. The laser module 10 can project a line laser to a target object, and the laser sensing module can receive the laser reflected by the target object through the image sensor to obtain the three-dimensional information of the target object and realize the detection of the target object. The laser module 10 and the laser sensing module can both be installed on the housing of the laser device. Of course, the types of laser chip 11 and laser module 10 are not limited, and the application scenarios of laser module 10 are not limited to the records of this application. It can be used in any applicable scene requiring laser scanning. The specific types of laser chip 11 and laser module 10 can be designed according to the scene detection requirements.

[0032] As shown in FIG. 3 , FIG. 4 and FIG. 5 , the dotted arrow in FIG. 4 indicates the light output of the laser module 10. In some embodiments, the laser module 10 further includes a substrate 12 and a bracket 13. The laser chip 11 is disposed on the substrate 12. The substrate 12 can be used as a carrier of the laser chip 11. The electrode layer 15 and the wiring of the laser chip 11 can also be disposed on the substrate 12. The bracket 13 includes a sleeve portion 131 and an optical collimation portion 132 disposed in the sleeve portion 131. The sleeve portion 131 is disposed on the substrate 12 and surrounds the laser chip 11. The sleeve portion 131 can be used as a structural member of the laser module 10 for mounting various optical shaping elements of the laser module 10. The laser emitted by the laser chip 11 can be shaped by various optical shaping elements in the sleeve portion 131 and then emitted from the sleeve portion 131 and projected onto the target object.

[0033] The optical collimation part 132 is one of the optical shaping elements of the laser module 10. At least a part of the optical collimation part 132 may have positive focal power. At least a part of the optical collimation part 132 may be in the shape of a convex lens, which is used to optically collimate the laser emitted by the laser chip 11 and improve the beam quality of the laser projected by the laser module 10. The optical collimation part 132 may have an optical axis. The straight line where the optical axis is located passes through the internal space of the sleeve part 131 and is parallel to the axial direction of the sleeve part 131, so that the laser emitted by the laser chip 11 can be emitted from the light outlet after being collimated by the optical collimation part 132. The sleeve part 131 is provided with a light outlet located on the side of the optical collimation part 132 facing away from the laser chip 11. The laser emitted by the laser chip 11 can be transmitted in the sleeve part 131 and emitted from the light outlet after being collimated by the optical collimation part 132.

[0034] Furthermore, in some embodiments, the sleeve portion 131 and the optical collimation portion 132 are an integrated structure. For example, the sleeve portion 131 and the optical collimation portion 132 are made of the same material and are simultaneously manufactured by any applicable integrated molding process such as integrated injection molding. The material of the sleeve portion 131 can meet the light transmission requirements of the optical collimation portion 132, for example, the material of the bracket 13 includes but is not limited to any applicable light-transmitting material such as plastic and glass.

[0035] The above-mentioned laser module 10 integrates the collimator, that is, the optical collimation part 132 and the sleeve part 131 into an integrated structure by integral molding, so that the sleeve part 131 and the optical collimation part 132 can be prepared at the same time using one mold, and the sleeve part 131 and the optical collimation part 132 after preparation are aligned and fixed to each other. Therefore, during the assembly process of the laser module 10, it is not necessary to perform complex alignment and assembly procedures for the optical collimation part 132 and the sleeve part 131, which is conducive to simplifying the assembly process of the laser module 10 and reducing the manufacturing cost of the laser module 10. At the same time, it is also conducive to improving the alignment accuracy of the optical collimation part 132 and the sleeve part 131, avoiding the alignment accuracy being affected by errors during the assembly process, resulting in a decrease in the quality of the projected beam.

[0036] In some embodiments, the optical collimating portion 132 includes an optical effective diameter portion 1321 and a supporting portion 1322, the supporting portion 1322 is arranged around the optical effective diameter portion 1321, the supporting portion 1322 is connected to the optical effective diameter portion 1321 and the sleeve portion 131, and is an integrated structure with the optical effective diameter portion 1321 and the sleeve portion 131. It can be understood that the supporting portion 1322 can be a structural portion connecting the optical collimating portion 132 and the sleeve portion 131, the optical effective diameter portion 1321 can be a portion of the optical collimating portion 132 that has a collimating function, and the shape of the optical effective diameter portion 1321 can be roughly a convex lens shape, and the laser emitted by the laser chip 11 is collimated when passing through the optical effective diameter portion 1321.

[0037] In some embodiments, the bracket 13 further includes a protrusion 133, which is disposed on the side of the supporting portion 1322 facing away from the laser chip 11, and the protrusion 133 is disposed around the optical effective diameter portion 1321. The protrusion 133 is connected to the inner wall surface of the sleeve portion 131 and the surface of the supporting portion 1322 facing away from the laser chip 11, and the protrusion 133 can be integrally formed with the sleeve portion 131 and the supporting portion 1322. Providing the protrusion 133 can increase the connection area between the optical collimation portion 132 and the sleeve portion 131, which is conducive to improving the connection strength between the optical collimation portion 132 and the sleeve portion 131, thereby improving the structural strength of the laser module 10.

[0038] In some embodiments, the laser module 10 further includes a light homogenizing element 14 disposed on the side of the optical collimating portion 132 facing away from the laser chip 11. The light homogenizing element 14 includes but is not limited to any applicable optical element capable of expanding and homogenizing light, such as a wave mirror. The laser emitted by the laser chip 11 is sequentially emitted after being collimated by the optical collimating portion 132 and homogenized by the light homogenizing element 14, which can achieve a larger scanning range and improve the quality of the projected beam.

[0039] Further, in some embodiments, the light homogenizing element 14 includes a light homogenizing portion 141 and a fixing portion 142. The light homogenizing portion 141 may be an optical shaping portion of the light homogenizing element 14 having a line expansion and homogenizing effect. The cross section of the light homogenizing portion 141 may be roughly wavy, and the light homogenizing portion 141 is opposite to the optical effective diameter portion 1321. The fixing portion 142 may be a structural member for fixing the light homogenizing element 14 in the sleeve portion 131. The fixing portion 142 is arranged around the light homogenizing portion 141 and is fixedly arranged on the protrusion 133. For example, the fixing portion 142 contacts the surface of the protrusion 133 facing away from the laser chip 11 and is relatively fixed to the protrusion 133 through optical glue. The cooperation of the fixing portion 142 and the protrusion 133 can realize the mutual positioning and mutual fixing of the light homogenizing element 14, the protrusion 133 and the optical collimation portion 132, which is conducive to improving the structural strength and assembly accuracy of the laser module 10.

[0040] In some embodiments, the light homogenizing element 14 further includes a fitting portion (not shown), which is connected to the side of the fixing portion 142 facing the optical collimating portion 132, and is embedded in the raised portion 133. Both the raised portion 133 and the fitting portion can be roughly annular, and the fitting portion is located in the space formed by the raised portion 133, and the outer peripheral surface of the fitting portion can be in contact with the inner peripheral surface of the raised portion 133. Of course, the fitting portion should be located outside the shaping optical path range of the optical effective diameter portion 1321 to avoid blocking the laser emitted by the laser chip 11. The fitting portion can also be fixed to the raised portion 133 by optical glue, and the fitting arrangement of the fitting portion and the raised portion 133 is conducive to further improving the assembly accuracy and structural reliability of the light homogenizing element 14 in the laser module 10.

[0041] In some embodiments, a portion of the inner wall surface of the sleeve portion 131 is configured as an inclined curved surface portion 1311, the inclined curved surface portion 1311 is inclined to the optical axis of the optical collimation portion 132, the inclined curved surface portion 1311 is located on the side of the optical collimation portion 132 facing the laser chip 11, and is connected to the supporting portion 1322 of the optical collimation portion 132. In the direction in which the laser chip 11 points to the optical collimation portion 132, the radial dimension of the inclined curved surface portion 1311 gradually decreases. Such a configuration is not easy to affect the light output of the laser module 10, and can also improve the structural strength of the sleeve portion 131, and further improve the connection area between the optical collimation portion 132 and the sleeve portion 131, thereby improving the structural reliability of the laser module 10.

[0042] It can be understood that the inner wall surface located on the side of the optical collimation portion 132 facing the laser chip 11 can be regarded as having a portion connected to the optical collimation portion 132 and a portion connected to the end face of the sleeve portion 131, wherein the portion connected to the optical collimation portion 132 is the inclined curved surface portion 1311. In some embodiments, the radial dimension of the portion of the inner wall surface connected to the end face of the sleeve portion 131 facing the substrate 12 is greater than the maximum radial dimension of the inclined curved surface portion 1311. Thus, while improving the structural strength and structural reliability of the laser module 10, the portion of the inner wall surface connected to the end face of the sleeve portion 131 can also have enough space to install other optical elements or accommodate the packaging structure of the laser chip 11, and at the same time, there is enough space in the sleeve portion 131 to meet the light output requirements of the laser chip 11.

[0043] It should be noted that when the laser chip 11 is a line laser, the relative position of the laser chip 11, the sleeve portion 131 and the light homogenizing element 14 will affect the shape and size of the line laser projected by the laser module 10. According to different laser scanning requirements, the sleeve portion 131, the light homogenizing element 14 and the laser chip 11 need to be aligned and assembled during the assembly process of the laser module 10. In some embodiments, the outer wall surface of the sleeve portion 131 is provided with a plurality of positioning portions 1312, wherein at least two positioning portions 1312 are opposite to each other and parallel to each other. The positioning portion is used to provide a reference for the alignment between the sleeve portion 131, the laser chip 11 and the homogenizing element. For example, the positioning portion 1312 may be parallel to the extension direction of the laser chip 11 and perpendicular to the wavy line of the light homogenizing element 14.

[0044] In some embodiments, the outer wall surface of the sleeve portion 131 may be provided with four positioning portions 1312, wherein two positioning portions 1312 are opposite to each other and parallel, and the other two positioning portions 1312 are opposite to each other and parallel, and two of the positioning portions 1312 are perpendicular to the other two positioning portions 1312. In other words, the sleeve may be roughly square, and the four positioning portions 1312 are respectively located on the four sides of the square, and the four positioning portions 1312 may be transitioned by any suitable shape such as arc chamfers, bevels or right angles. Two of the positioning portions 1312 are parallel to the extension direction of the laser chip 11, and the other two positioning portions 1312 are perpendicular to the extension direction of the laser chip 11. The positioning and assembly accuracy of each component in the laser module 10 can be effectively improved through multi-dimensional positioning reference.

[0045] In some embodiments, the laser module 10 further includes an electrode layer 15 disposed on the side of the substrate 12 facing the bracket 13. The electrode layer 15 includes but is not limited to a copper layer. The electrode layer 15 can be divided into a positive electrode part and a negative electrode part, and is used to achieve conduction between the laser chip 11 and an external power supply. A plurality of arc-shaped positioning grooves 151 are disposed on the electrode layer 15. The plurality of arc-shaped positioning grooves 151 are disposed around the laser chip 11 and are adapted to the inner wall surface of the sleeve portion 131. For example, the outer circumference of the circle formed by the plurality of arc-shaped positioning grooves 151 is adapted to the shape and size of the portion of the inner wall surface of the sleeve portion 131 corresponding to the end surface of the sleeve portion 131 facing the substrate 12. That is, when the sleeve portion 131 is mounted on the substrate 12, the inner wall surface just surrounds the outer circumference of the circle formed by the plurality of arc-shaped positioning grooves 151. Therefore, the arc-shaped positioning groove 151 can provide a positioning reference for the installation of the bracket 13 on the substrate 12, which is beneficial to improving the assembly accuracy and assembly efficiency of the bracket 13 on the substrate 12. Multiple arc-shaped positioning grooves 151 are spaced apart, so that the single electrode layer 15 is a whole, and will not affect the electrical connection performance of the laser chip 11.

[0046] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A laser module, characterized in that: The laser module comprises: substrate; a laser chip, disposed on the substrate; and The bracket includes a sleeve portion and an optical collimation portion arranged in the sleeve portion, the sleeve portion and the optical collimation portion are an integrated structure, the sleeve portion is arranged on the substrate and surrounds the laser chip, the sleeve portion is provided with a light outlet located on the side of the optical collimation portion facing away from the laser chip, the laser emitted by the laser chip can be projected onto the optical collimation portion in the sleeve portion, and can be emitted from the light outlet after being collimated by the optical collimation portion.

2. The laser module according to claim 1, characterized in that: The optical collimation portion includes an optically effective diameter portion and a supporting portion, wherein the supporting portion is arranged around the optically effective diameter portion, the supporting portion is connected to the optically effective diameter portion and the sleeve portion, and is an integrated structure with the optically effective diameter portion and the sleeve portion, and the bracket also includes a protrusion, which is arranged on the side of the supporting portion facing away from the laser chip, the protrusion is arranged around the optically effective diameter portion, and is integrally connected to the inner wall surface of the sleeve portion and the surface of the supporting portion facing away from the laser chip.

3. The laser module according to claim 2, characterized in that: The laser module also includes a light homogenizing element arranged on the side of the optical collimation portion facing away from the laser chip, the light homogenizing element includes a light homogenizing portion and a fixing portion, the light homogenizing portion is opposite to the optical effective diameter portion, the fixing portion is arranged around the light homogenizing portion and is fixedly arranged on the protruding portion.

4. The laser module according to claim 3, characterized in that: The light homogenizing element further includes an embedding portion, which is connected to a side of the fixing portion facing the optical collimating portion, and is embedded in the protruding portion.

5. The laser module according to claim 1, characterized in that: The inner wall surface of the sleeve portion is provided with an inclined curved surface portion, which is located on the side of the optical collimation portion facing the laser chip and is connected to the optical collimation portion. In the direction in which the laser chip points to the optical collimation portion, the radial size of the inclined curved surface portion gradually decreases.

6. The laser module according to claim 1, characterized in that: The outer wall surface of the sleeve portion is provided with a plurality of positioning parts, wherein at least two of the positioning parts are opposite to each other and parallel to each other, the laser chip comprises a line laser, and the positioning parts are used to provide a reference for alignment between the sleeve portion and the laser chip.

7. The laser module according to claim 1, characterized in that: The laser module further comprises an electrode layer disposed on the side of the substrate facing the bracket, wherein the electrode layer is provided with a plurality of arc-shaped positioning grooves, which are arranged around the laser chip and adapted to the inner wall surface of the sleeve portion.

8. The laser module according to claim 1, characterized in that: The optical collimating portion has positive optical power and an optical axis. The optical axis passes through the inner space of the sleeve portion and is parallel to the axial direction of the sleeve portion.

9. The laser module according to claim 1, characterized in that: The material of the bracket includes plastic or glass.

10. A laser device, characterized in that: Comprising the laser module as described in any one of claims 1-9.

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