Chip protection shell and circuit board assembly

Abstract

The utility model relates to the technical field of chips, particularly provides a chip protection shell and a circuit board assembly, and aims to solve the problem that a current sensor chip protection shell on a circuit board cannot fundamentally solve the problem that a current sensor chip shakes relative to the circuit board due to vibration of the circuit board. In order to achieve the purpose, the utility model provides a chip protection shell, the chip protection shell is used for reinforcing a chip connected to a substrate, and the chip protection shell comprises a cavity, a first connecting part and a second connecting part; one end of the cavity is provided with an opening; the first connecting part is arranged in the cavity and can be in interference fit with the side wall of the chip; the second connecting part is arranged at the outer edge of the opening and can be fixedly connected with the substrate, so that in the vibration process of the substrate, even if the side wall of the chip has the tendency of shaking relative to the substrate, the shaking amplitude of the side wall of the chip relative to the substrate due to the vibration of the substrate can be effectively reduced under the action of the chip protection shell, and the vibration resistance of the substrate is improved. Therefore, the stability of the chip is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, and specifically provides a chip protection shell and a circuit board assembly. Background Art

[0002] Current sensor chips are semiconductor devices used to detect, measure and feedback circuit current information. They are widely used in power management, battery monitoring, motor control and overload protection. They are mainly used to measure the current passing through a conductor. The accuracy of the measurement is affected by many factors, such as temperature changes, electromagnetic interference and vibration. Moreover, vibration not only affects the detection accuracy of the current sensor, but also causes fatigue cracking at the connection between the lead of the current sensor chip and the circuit board due to long-term vibration.

[0003] In order to reduce the risk of the current sensor chip's detection accuracy being affected by vibration and cracking at the connection, a protective shell is usually placed on the outside of the current sensor chip, and several vibration-damping components are installed between the inner wall of the protective shell and the side wall of the current sensor chip, so that the current sensor chip and the protective shell are elastically connected to reduce the amplitude of the current sensor chip's own shaking relative to the circuit board due to the vibration of the circuit board, thereby reducing the risk of the current sensor chip's detection accuracy being affected by vibration and cracking at the connection. However, the above-mentioned connection of several vibration-damping components between the protective shell and the current sensor chip can only reduce the amplitude and frequency of the current sensor's shaking relative to the circuit board to a certain extent, and cannot fundamentally solve the problem of the current sensor's detection accuracy and service life being affected by the vibration of the circuit board.

[0004] Accordingly, this field requires a new technical solution to solve the above problems. Summary of the invention

[0005] The utility model aims to solve the above technical problem, that is, to solve the problem that the existing chip protection shell on the circuit board cannot fundamentally solve the shaking of the chip relative to the circuit board caused by the vibration of the circuit board.

[0006] In a first aspect, the utility model provides a chip protection shell, the chip protection shell is used to reinforce a chip connected to a substrate, and the protection shell includes:

[0007] a cavity having an opening at one end thereof;

[0008] A first connecting portion, which is disposed inside the cavity and is configured to be interference-fitted with a side wall of the chip; and

[0009] The second connecting portion is arranged at the outer edge of the opening and is configured to be fixedly connected to the substrate.

[0010] In the preferred technical solution of the above chip protection shell, the first connecting portion includes a convex rib, and the convex rib is extended from the opening to the inside of the cavity.

[0011] In the preferred technical solution of the above chip protection shell, there are multiple convex ribs, and the multiple convex ribs are evenly distributed on the inner wall of the cavity.

[0012] In the preferred technical solution of the above chip protection shell, the second connection portion includes a flange, the flange is arranged at the edge of the opening and is turned outward, and the flange is welded and fixed to the substrate.

[0013] In the preferred technical solution of the above chip protection shell, the end of the flange close to the opening is integrally formed with the end surface of the opening close to the substrate.

[0014] In the preferred technical solution of the above chip protection shell, the protection structure further includes a positioning portion, which is arranged on the substrate or correspondingly arranged on the substrate and the flange, so that the chip protection shell is positioned and connected to the substrate.

[0015] In the preferred technical solution of the above chip protection shell, the positioning portion includes a positioning protrusion and / or a positioning groove.

[0016] In the preferred technical solution of the chip protection shell, the number of the flanges and the number of the positioning portions are both multiple, and the multiple flanges correspond to the multiple positioning portions one by one.

[0017] In the preferred technical solution of the above chip protection shell, the side wall of the chip protection shell further includes ventilation holes, and the ventilation holes, the inner wall of the cavity, the ribs, the side wall of the chip and the opening together form a heat dissipation duct.

[0018] In a second aspect, the utility model further provides a circuit board assembly, the circuit board assembly comprising a substrate and a current sensor chip, the current sensor chip being connected to the substrate via the above-mentioned chip protection shell.

[0019] When the above technical solution is adopted, the first connecting portion of the chip protection shell of the utility model is interference fit with the side wall of the chip, and the second connecting portion is fixedly connected to the substrate. In this way, after the chip protection shell and the chip are installed, the side wall of the chip is fixedly connected to the chip protection shell through the first connecting portion, and the chip protection shell is fixedly connected to the substrate through the second connecting portion, so that the side wall of the chip is indirectly fixedly connected to the substrate through the chip protection shell. Therefore, during the vibration of the substrate, even if the side wall of the chip has a tendency to shake relative to the substrate, the chip protection shell can effectively prevent the side wall of the chip from shaking relative to the substrate due to the vibration of the substrate, thereby effectively improving the stability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The preferred implementation of the present utility model is described below in conjunction with the current sensor chip and the accompanying drawings, in which:

[0021] Figure 1 It is a structural schematic diagram of a circuit board assembly of the utility model.

[0022] Figure 2 It is an assembly diagram of a chip protection shell and a chip of the utility model.

[0023] Figure 3 It is a structural schematic diagram of another embodiment of the chip protection shell of the utility model.

[0024] Figure 4 yes Figure 3 A cross-sectional view along line AA after the chip protection shell is connected to the substrate.

[0025] The symbols in the figure mean the following:

[0026] 100. Circuit board assembly; 1. Chip protection shell; 11. Cavity; 12. Opening; 13. Second connection part; 131. Positioning part; 1311. Positioning protrusion; 1312. Positioning groove; 14. First connection part; 15. Ventilation hole; 2. Substrate; 3. Current sensor chip. DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments as needed to adapt to specific applications. For example, although the specification is described in conjunction with a current sensor chip, it is obviously also applicable to other sensor chips that require a high-precision operating environment, such as an acceleration sensor chip, a pressure sensor chip, or a gyroscope.

[0028] It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0029] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] The traditional chip protection chip protective shell cover is buckled on the outside of the chip, and several vibration-damping components are installed between the inner wall of the protective shell and the side wall of the chip, so that the chip and the protective shell are elastically connected to reduce the amplitude of the chip itself shaking relative to the circuit board due to the vibration of the circuit board, thereby reducing the risk of the chip's detection accuracy being affected by vibration and cracking at the connection. However, the above-mentioned connection of several vibration-damping components between the protective shell and the chip can only reduce the amplitude and frequency of the current sensor shaking relative to the circuit board to a certain extent, and cannot fundamentally solve the problem of the current sensor's detection accuracy and service life being affected by the vibration of the circuit board. Therefore, it is urgent to develop a chip protective shell to fundamentally solve the problem of the chip shaking relative to the circuit board due to the vibration of the circuit board.

[0031] Figure 1 It is a structural schematic diagram of a circuit board assembly according to an embodiment of the utility model. Figure 2 It is an assembly diagram of a chip protection shell and a chip of the utility model. Figure 2 This is another structural schematic diagram of a chip protection shell according to an embodiment of the utility model. Figure 4 yes Figure 3 A cross-sectional view along line AA after the chip protection shell is connected to the substrate.

[0032] like Figure 1 and Figure 2As shown, in order to solve the problem that the current sensor chip protective shell on the existing circuit board cannot fundamentally solve the problem that the current sensor chip shakes relative to the circuit board due to the vibration of the circuit board. The utility model provides a chip protective shell 1, which is used to reinforce the current sensor chip 3 connected to the substrate 2. The chip protective shell 1 includes a cavity 11, a first connecting portion 14 and a second connecting portion 13. An opening 12 is opened at one end of the cavity 11. The first connecting portion 14 is arranged inside the cavity 11 and can be interference fit with the side wall of the current sensor chip 3. The second connection portion 13 is arranged at the outer edge of the opening 12 and can be fixedly connected to the substrate 2. In this way, after the chip protection shell 1 is respectively connected to the current sensor chip 3 and the substrate 2, the chip protection shell 1 is connected to the side wall of the current sensor chip 3 and the substrate 2 through the first connection portion 14 in an interference fit manner, and the chip protection shell 1 is also fixedly connected to the substrate 2 through the second connection portion 13. In this way, the current sensor chip 3 is fixedly connected to the substrate 2 through the chip protection shell 1, so that during the vibration of the substrate 2, even if the side wall of the current sensor chip 3 has a tendency to shake relative to the substrate 2, the chip protection shell 1 can effectively prevent the side wall of the current sensor chip 3 from shaking relative to the substrate 2 due to the vibration of the substrate 2, thereby effectively improving the stability of the current sensor chip 3.

[0033] As a possible implementation, Figure 2 See also Figure 3 The first connecting portion 14 includes a convex rib arranged inside the cavity 11, and the convex rib extends from the opening 12 of the cavity 11 to the inside of the cavity 11, wherein the height of the convex rib protruding from the inner wall of the cavity 11 and the length of the convex rib extending into the cavity 11 are determined according to the specific usage scenario, for example, according to parameter information such as the size of the chip protection shell 1, the size of the current sensor chip 3 and the type of the current sensor chip 3, as long as the chip protection shell 1 can be interference-fitted with the side wall of the current sensor chip 3 through the convex rib while ensuring the stable operation of the current sensor chip 3.

[0034] As a possible implementation, Figure 2 See also Figure 3 The number of convex ribs is multiple, and the multiple convex ribs are evenly distributed on the inner wall of the cavity 11, so that the chip protection shell 1 can be stably connected to the current sensor chip 3 through the multiple convex ribs. Moreover, through the multiple convex ribs, when the chip protection shell 1 is buckled on the outside of the current sensor chip 3, a gap is formed between the side wall of the current sensor chip 3 and the inner wall of the cavity 11, which helps to dissipate the heat of the current sensor chip 3, so as to ensure the stable operation of the current sensor chip 3.

[0035] As a possible implementation, Figure 1 See also Figure 2 and Figure 3 The second connection portion 13 includes a flange arranged outward at the edge of the opening 12, and the flange is welded and fixed to the base plate 2.

[0036] It should be noted that although the above combination Figure 1 The second connection portion 13 described is a flange arranged outward at the edge of the opening 12, but this is not restrictive. In other embodiments of the utility model, the second connection portion 13 can also be a fastening bolt movably connected to the side wall of the chip protection shell 1, so that the chip protection shell 1 can be fixed on the substrate 2 by the fastening bolt, or the second connection portion 13 can also include a pin arranged on the edge of the opening 12 and a socket arranged on the substrate 2, so that the chip protection shell 1 can be connected to the socket on the substrate 2 through the pin, thereby connecting the chip protection shell 1 and the substrate 2 together.

[0037] As a possible implementation, see Figure 1-Figure 3 , the end of the flange close to the opening 12 is integrally formed with the end surface of the opening 12 close to the substrate 2. Specifically, when the utility model is implemented, the number of flanges is multiple. At this time, the flanges are evenly distributed on the edge of the opening 12, so that when the substrate 2 is subjected to mechanical stress or vibration, the flanges can evenly disperse the stress, thereby reducing the deformation of the chip protection shell 1 due to the force, and then reducing the amplitude of the current sensor chip 3 shaking relative to the substrate 2, so as to ensure the stable operation and service life of the current sensor chip 3. Moreover, since the multiple flanges of the utility model are connected to the edge of the opening 12 in a uniform manner and turned outward, when the end of the flange away from the chip protection shell 1 is welded to the substrate 2, the end of the edge of the opening 12 of the chip protection shell 1 is still a certain distance from the substrate 2, that is, at least a distance of one times the thickness of the flange, so that the heat generated by the current sensor chip 3 during operation can be dissipated to the outside of the chip protection shell 1 through the opening 12, thereby further improving the heat dissipation performance of the chip protection shell 1.

[0038] As a possible implementation, Figure 4 As shown, the chip protection shell 1 also includes a positioning portion 131, which is arranged at a position of the substrate 2 corresponding to the flange, so that when the chip protection shell 1 is buckled on the current sensor chip 3, the positioning portion 131 can be engaged with the flange, so that the flange is more firmly connected to the substrate 2, thereby reducing the risk of fatigue fracture of the substrate 2 and the flange due to the substrate 2 being in a vibrating environment for a long time.

[0039] As a possible implementation, Figure 4As shown in the figure, the positioning portion 131 includes a positioning protrusion 1311 provided on the flanging and a positioning groove 1312 provided on the substrate 2. In this way, when the chip protective case 1 is buckled on the substrate 2, the positioning protrusion 1311 is cooperatively connected with the positioning groove 1312, so that the chip protective case 1 is more precisely and firmly fixedly connected to the substrate 2, thereby reducing the risk that the chip protective case 1 cracks from the substrate 2 due to the vibration of the circuit board assembly 100.

[0040] It should be noted that although the positioning portion 131 described in combination with the above Figure 4 is the positioning protrusion 1311 provided on the flanging and the positioning groove 1312 provided on the substrate 2, this is not restrictive. Those skilled in the art can also consider, according to needs, that the positioning portion 131 is an "L"-shaped positioning protrusion provided on the substrate 2, and the position of the positioning protrusion is set such that when the flanging abuts against the substrate 2, the edge of the positioning protrusion can cooperate with the edge of the flanging, so that when the chip protective case 1 is buckled outside the current sensor chip 3 and connected to the substrate 2, the positioning portion 131 on the substrate 2 and the positioning portion 131 on the flanging can be cooperatively connected to realize the positioning connection between the chip protective case 1 and the substrate 2. Although the positioning protrusion 1311 described in combination with the above Figure 4 is "L"-shaped, this is not restrictive. Obviously, the positioning protrusion 1311 can also be "凵"-shaped or "-"-shaped. Without departing from the basic principle of the present application, those skilled in the art can flexibly select the specific setting manner of the positioning portion 131 according to the specific application scenario as long as the positioning of the flanging can be realized.

[0041] As a possible implementation manner, as Figure 3 shown, it can also be seen in Figure 4 that the number of the flangings and the positioning portions 131 is multiple, and the flangings and the positioning portions 131 are arranged in one-to-one correspondence, so that when the flangings are connected to the substrate 2, they can be more firmly connected to the substrate 2 through the positioning portions 131.

[0042] As a possible implementation manner, as Figure 3 shown, the side wall of the chip protective case 1 further includes a ventilation hole 15. In this way, the ventilation hole 15 and the inner wall of the cavity 11, the rib and the side wall of the current sensor chip 3 and the opening 12 form a heat dissipation air duct, thereby accelerating the heat dissipation speed of the current sensor chip 3.

[0043] In addition, those skilled in the art can understand that although some of the embodiments described herein include certain features included in other embodiments rather than other features, the combination of the features of different embodiments means that it is within the scope of the present invention and forms different embodiments. For example, in the claims of the present invention, any one of the claimed embodiments can be used in any combination manner.

[0044] So far, the technical solution of the present invention has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A chip protection shell, characterized in that: The chip protection shell is used to reinforce the chip connected to the substrate, and the protection shell includes: a cavity having an opening at one end thereof; A first connecting portion, which is disposed inside the cavity and is configured to be interference-fitted with a side wall of the chip; and The second connecting portion is arranged at the outer edge of the opening and is configured to be fixedly connected to the substrate.

2. The chip protection shell according to claim 1, characterized in that: The first connection portion includes a convex rib, and the convex rib extends from the opening toward the interior of the cavity.

3. The chip protection shell according to claim 2, characterized in that: The number of the convex ribs is multiple, and the multiple convex ribs are evenly distributed on the inner wall of the cavity.

4. The chip protection shell according to any one of claims 1 to 3, characterized in that: The second connection portion includes a flange, the flange is arranged at the edge of the opening and is turned outward, and the flange is welded and fixed to the base plate.

5. The chip protection shell according to claim 4, characterized in that: The end of the flange close to the opening is integrally formed with the end surface of the opening close to the substrate.

6. The chip protection shell according to claim 4, characterized in that: The chip protection shell further comprises a positioning portion, and the positioning portion is arranged on the substrate or correspondingly arranged on the substrate and the flange, so that the chip protection shell is positioned and connected with the substrate.

7. The chip protection shell according to claim 6, characterized in that: The positioning portion includes a positioning protrusion and / or a positioning groove.

8. The chip protection shell according to claim 6, characterized in that: The number of the flanges and the positioning parts are both multiple, and the multiple flanges correspond to the multiple positioning parts one by one.

9. The chip protection shell according to claim 2, characterized in that: The side wall of the chip protection shell further comprises ventilation holes, and the ventilation holes, the inner wall of the cavity, the convex ribs, the side wall of the chip and the opening together form a heat dissipation duct.

10. A circuit board assembly, characterized in that: The circuit board assembly comprises: substrate; and A current sensor chip, wherein the current sensor chip is connected to the substrate through a chip protection shell according to any one of claims 1 to 9.

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