Air-cooled condenser, cooling system and electronic equipment

Abstract

The utility model relates to the field of electronic equipment and cooling systems, in particular to an air-cooled condenser, a cooling system and electronic equipment, and aims to solve the problem of how to realize light weight and miniaturization of the condenser while meeting the refrigeration requirement. In order to achieve the purpose, according to the air-cooled condenser, the pre-cooling device is arranged on the air inlet side of the condenser main body, the pre-cooling device can cool air entering the condenser main body, the cooled air can cool the condenser main body, the heat exchange efficiency of the condenser main body is improved, the condenser can cope with short-time high-temperature weather, and the service life of the condenser is prolonged. Stable operation of the condenser in the high-temperature environment is kept, and meanwhile the condenser can meet the refrigeration requirement and achieve light weight and miniaturization at the same time. In addition, by arranging a baffle, the heat dissipation effect of the pre-cooling device can be guaranteed under the condition that the baffle is opened, so that the heat exchange efficiency of the condenser is improved, and then it is guaranteed that the condenser stably operates in the high-temperature environment.

Description

Technical Field

[0001] The utility model relates to the field of electronic equipment and cooling systems, and specifically provides an air-cooled condenser, a cooling system and electronic equipment. Background Art

[0002] Driven by energy security and dual carbon goals, the demand for energy-saving and efficient heat dissipation of motors and power electronic equipment is getting higher and higher, and the demand for temperature uniformity and equipment miniaturization is becoming more and more urgent. The traditional air cooling system has limited capacity and is difficult to solve local hot spots. The self-circulating evaporative cooling system can solve the above contradictions.

[0003] In order to ensure the stability and reliability of the self-circulating evaporative cooling system in hot weather, the air-cooled condenser is usually designed with high temperature (such as 40°C) as a restriction. This redundant design enables the self-circulating evaporative cooling system to better adapt to different climate conditions and environmental changes. However, the air-cooled condenser is restricted by extremely high temperatures, which will greatly increase its volume and weight, which conflicts with the goal of lightweight and miniaturization of the air-cooled condenser.

[0004] Therefore, this field needs a new technical solution to solve the above problems. Utility Model Content

[0005] In order to solve at least one problem in the prior art, that is, to solve how to achieve lightweight and miniaturization of an air-cooled condenser while meeting refrigeration requirements, the present application provides an air-cooled condenser, the air-cooled condenser comprising:

[0006] A condenser body, the condenser body having an air inlet side and an air outlet side, and a condensation air duct and a first heat dissipation air duct respectively and independently connecting the air inlet side and the air outlet side;

[0007] A precooling device, wherein the precooling device is arranged on the air inlet side, and a precooling air duct connected to the condensing air duct and a second heat dissipation air duct connected to the first heat dissipation air duct are formed inside the precooling device;

[0008] A baffle, wherein the baffle is configured to block or open the first heat dissipation air duct and / or the second heat dissipation air duct.

[0009] In the preferred technical solution of the above air-cooled condenser, the precooling device comprises:

[0010] a first outer wind cover, the first outer wind cover being arranged on the air inlet side;

[0011] A semiconductor pre-cooling plate, wherein the semiconductor pre-cooling plate is arranged in the first outer wind cover and has a cold end and a hot end, the second heat dissipation air duct is formed between the hot end and the first outer wind cover, and the pre-cooling air duct is formed between the cold end and the first outer wind cover.

[0012] In the preferred technical solution of the above air-cooled condenser, the semiconductor pre-cooling sheet further comprises:

[0013] A first inner wind hood is arranged on the cold end, and an area surrounded by the first inner wind hood is the pre-cooling air duct.

[0014] In the preferred technical solution of the above-mentioned air-cooled condenser, the pre-cooling device further includes a first support member, and the first support member is arranged between the first inner wind hood and the first outer wind hood.

[0015] In the preferred technical solution of the above air-cooled condenser, the precooling device further comprises:

[0016] A guide plate is arranged at the cold end.

[0017] In the preferred technical solution of the above air-cooled condenser, the precooling device further comprises:

[0018] A fin is provided at the hot end.

[0019] In the preferred technical solution of the above air-cooled condenser, the condenser body comprises:

[0020] a second outer air hood, the second outer air hood being arranged on the precooling device;

[0021] A condensation core is disposed in the second outer wind cover, and the first heat dissipation air duct is formed between the outer wall of the condensation core and the second outer wind cover, and the condensation air duct is provided inside the condensation core.

[0022] In the preferred technical solution of the above air-cooled condenser, the condenser body further comprises:

[0023] A second inner wind hood is sleeved on the condensing core, and the first heat dissipation air duct is formed between the second inner wind hood and the second outer wind hood.

[0024] In the preferred technical solution of the above air-cooled condenser, the condenser body further comprises:

[0025] A heat-insulating layer is arranged on the outer wall of the second inner air hood.

[0026] In the preferred technical solution of the above air-cooled condenser, the condenser body further comprises:

[0027] A second support member is disposed between the second inner wind shield and the second outer wind shield.

[0028] In the preferred technical solution of the above air-cooled condenser, the air-cooled condenser further comprises:

[0029] A fan assembly is arranged on the air outlet side of the condenser body.

[0030] In the preferred technical solution of the above air-cooled condenser, the fan assembly includes:

[0031] A shell, wherein the shell is arranged on the air outlet side of the condenser body, and the inner space of the shell is respectively connected with the condensation air duct and the first heat dissipation air duct;

[0032] An induced draft fan is arranged in the internal space.

[0033] In the preferred technical solution of the above-mentioned air-cooled condenser, the baffle is arranged in the housing and / or in the first heat dissipation duct, and is arranged to enable the first heat dissipation duct to be connected to or disconnected from the internal space; and / or

[0034] The baffle is disposed in the second heat dissipation duct, and is configured to enable the second heat dissipation duct to be connected to or disconnected from the internal space through the first heat dissipation duct.

[0035] In the preferred technical solution of the above-mentioned air-cooled condenser, there are multiple pre-cooling devices, and the multiple pre-cooling devices are arranged in sequence from the air inlet side to the air outlet side.

[0036] In the preferred technical solution of the above-mentioned air-cooled condenser, the baffle is associated with the pre-cooling device so that when the pre-cooling device is turned on, the baffle opens the first heat dissipation air duct and the second heat dissipation air duct.

[0037] The utility model also provides a cooling system, which comprises the air-cooled condenser described in the above preferred technical solution.

[0038] The utility model also provides an electronic device, which comprises the cooling system described in the above preferred solution.

[0039] Solution 1. An air-cooled condenser, characterized in that the air-cooled condenser comprises:

[0040] A condenser body, the condenser body having an air inlet side and an air outlet side, and a condensation air duct and a first heat dissipation air duct respectively and independently connecting the air inlet side and the air outlet side;

[0041] A precooling device, wherein the precooling device is arranged on the air inlet side, and a precooling air duct connected to the condensing air duct and a second heat dissipation air duct connected to the first heat dissipation air duct are formed inside the precooling device;

[0042] A baffle, wherein the baffle is configured to block or open the first heat dissipation air duct and / or the second heat dissipation air duct.

[0043] Solution 2. The air-cooled condenser according to Solution 1, characterized in that the precooling device comprises:

[0044] a first outer wind cover, the first outer wind cover being arranged on the air inlet side;

[0045] A semiconductor pre-cooling plate, wherein the semiconductor pre-cooling plate is arranged in the first outer wind cover and has a cold end and a hot end, the second heat dissipation air duct is formed between the hot end and the first outer wind cover, and the pre-cooling air duct is formed between the cold end and the first outer wind cover.

[0046] Solution 3. The air-cooled condenser according to Solution 2 is characterized in that the semiconductor pre-cooling sheet further comprises:

[0047] A first inner wind hood is arranged on the cold end, and an area surrounded by the first inner wind hood is the pre-cooling air duct.

[0048] Solution 4. The air-cooled condenser according to Solution 3 is characterized in that the pre-cooling device also includes a first support member, and the first support member is arranged between the first inner wind hood and the first outer wind hood.

[0049] Solution 5. The air-cooled condenser according to Solution 2, characterized in that the precooling device further comprises:

[0050] A guide plate is arranged at the cold end.

[0051] Solution 6. The air-cooled condenser according to Solution 2, characterized in that the precooling device further comprises:

[0052] A fin is provided at the hot end.

[0053] Solution 7. The air-cooled condenser according to Solution 1 is characterized in that the condenser body comprises:

[0054] a second outer air hood, the second outer air hood being arranged on the precooling device;

[0055] A condensation core is disposed in the second outer wind cover, and the first heat dissipation air duct is formed between the outer wall of the condensation core and the second outer wind cover, and the condensation air duct is provided inside the condensation core.

[0056] Solution 8. The air-cooled condenser according to Solution 7, characterized in that the condenser body further comprises:

[0057] A second inner wind hood is sleeved on the condensing core, and the first heat dissipation air duct is formed between the second inner wind hood and the second outer wind hood.

[0058] Solution 9. The air-cooled condenser according to Solution 8, characterized in that the condenser body further comprises:

[0059] A heat-insulating layer is arranged on the outer wall of the second inner air hood.

[0060] Solution 10. The air-cooled condenser according to Solution 8, characterized in that the condenser body further comprises:

[0061] A second support member is disposed between the second inner wind shield and the second outer wind shield.

[0062] Solution 11. The air-cooled condenser according to Solution 1, characterized in that the air-cooled condenser further comprises:

[0063] A fan assembly is arranged on the air outlet side of the condenser body.

[0064] Solution 12. The air-cooled condenser according to Solution 11, characterized in that the fan assembly comprises:

[0065] A shell, wherein the shell is arranged on the air outlet side of the condenser body, and the inner space of the shell is respectively connected with the condensation air duct and the first heat dissipation air duct;

[0066] An induced draft fan is arranged in the internal space.

[0067] Solution 13. The air-cooled condenser according to Solution 12 is characterized in that the baffle is arranged in the shell and / or in the first heat dissipation duct, and is arranged to enable the first heat dissipation duct to be connected to or disconnected from the internal space; and / or

[0068] The baffle is disposed in the second heat dissipation duct, and is configured to enable the second heat dissipation duct to be connected to or disconnected from the internal space through the first heat dissipation duct.

[0069] Solution 14. The air-cooled condenser according to Solution 1 is characterized in that there are multiple pre-cooling devices, and the multiple pre-cooling devices are arranged in sequence from the air inlet side to the air outlet side.

[0070] Solution 15. The air-cooled condenser according to Solution 1 is characterized in that the baffle is associated with the pre-cooling device so that when the pre-cooling device is turned on, the baffle opens the first heat dissipation air duct and the second heat dissipation air duct.

[0071] Option 16. A cooling system, characterized in that the cooling system includes the air-cooled condenser described in any one of Options 1-15.

[0072] Solution 17. An electronic device, characterized in that the electronic device includes the cooling system described in Solution 16.

[0073] Those skilled in the art can understand that the air-cooled condenser of the present application is provided with a pre-cooling device on the air inlet side of the condenser body, and the pre-cooling device can cool the gas entering the condenser body, so that the cooled gas can cool the condenser body, thereby improving the heat exchange efficiency of the condenser body, enabling the air-cooled condenser to cope with short-term high temperature weather, maintaining the stable operation of the air-cooled condenser in a high temperature environment, enhancing the adaptability and reliability of the air-cooled condenser, and at the same time enabling the air-cooled condenser to be lightweight and miniaturized while meeting the refrigeration requirements. In addition, by providing a baffle, the heat dissipation effect of the pre-cooling device can be guaranteed when the baffle is opened, thereby improving the heat exchange efficiency of the air-cooled condenser, thereby ensuring the stable operation of the air-cooled condenser in a high temperature environment.

[0074] Furthermore, by arranging a guide plate in the first inner wind hood, the guide plate can increase the heat exchange area between the gas and the semiconductor pre-cooling plate, thereby improving the cooling effect of the pre-cooling device on the gas.

[0075] Furthermore, by providing fins at the hot end, the heat dissipation area of ​​the precooling device can be increased, thereby improving the cooling effect of the precooling device, thereby improving the heat dissipation efficiency of the air-cooled condenser.

[0076] Furthermore, by setting up a condensation air duct connected to the pre-cooling air duct in the condensation core, the gas cooled by the pre-cooling device can cool the condensation core, thereby improving the condensation effect of the condensation body, and then improving the performance of the air-cooled condenser, so that the cooling system can achieve the preset cooling effect in a shorter time, reduce energy consumption, maintain the stable operation of the air-cooled condenser in a high temperature environment, enhance the adaptability and reliability of the air-cooled condenser, and at the same time enable the air-cooled condenser to be lightweight and miniaturized while meeting the refrigeration needs.

[0077] Furthermore, by providing a heat-insulating layer on the outer wall of the second inner air hood, heat exchange between high-temperature air and the condensation core can be avoided, thereby preventing the heat exchange effect of the condensation body from being affected.

[0078] Furthermore, by setting up a fan assembly, on the one hand, it can promote air flow and improve the heat dissipation effect, and on the other hand, it can accelerate the heat transfer of the condenser body, thereby improving the heat exchange efficiency of the air-cooled condenser and ensuring the efficient and stable operation of the air-cooled condenser.

[0079] Furthermore, by providing a plurality of pre-cooling devices, the cooling effect can be further improved, and the cooling effect on the condenser body can be enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, in which:

[0081] Figure 1 It is a plan view of the air-cooled condenser of the utility model;

[0082] Figure 2 yes Figure 1 Sectional view at AA in the middle;

[0083] Figure 3 It is a plan view of the precooling device of the utility model;

[0084] Figure 4 It is a plan view of the main body of the condenser of the utility model.

[0085] List of reference numerals:

[0086] 1. Condenser body; 11. Second outer air hood; 12. Second inner air hood; 13. Condenser core; 131. Working fluid flow channel; 132. Inlet; 133. Outlet; 14. Condensation air duct; 15. First heat dissipation air duct; 16. Second support member; 2. Precooling device; 21. First outer air hood; 22. First inner air hood; 23. Semiconductor precooling plate; 24. Precooling air duct; 25. Fin; 26. Guide plate; 27. Second heat dissipation air duct; 28. First support member; 3. Baffle; 4. Fan assembly; 41. Shell; 42. Draft fan. DETAILED DESCRIPTION

[0087] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. For example, although the present embodiment is introduced in conjunction with the self-circulating evaporative cooling system, this is not intended to limit the scope of protection of the present application. Without departing from the principles of the present application, those skilled in the art may apply the present application to other cooling systems. For example, an air-cooled cooling system, a pump-driven cooling system, a compression refrigeration cooling system, etc.

[0088] It should be noted that, in the description of the present application, terms such as "upper", "lower", "inner", "bottom", "end" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present application.

[0089] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "disposed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0090] First refer to Figure 1-4 , the air-cooled condenser of the present application is described. Among them, Figure 1 It is a plan view of the air-cooled condenser of the utility model; Figure 2 yes Figure 1 Sectional view at AA in the middle;

[0091] Figure 3 It is a plan view of the precooling device of the utility model; Figure 4 It is a plan view of the main body of the condenser of the utility model.

[0092] like Figure 1-4 As shown, in order to solve how to achieve lightweight and miniaturization of the air-cooled condenser while meeting the refrigeration requirements, the air-cooled condenser of the present application includes a condenser body 1, a precooling device 2 and a baffle 3. Among them, a condensing air duct 14 and a first heat dissipation air duct 15 are formed inside the condenser body 1, and the condenser body 1 has an air inlet side and an air outlet side. The precooling device 2 is arranged on the air inlet side, and a precooling air duct 24 connected to the condensing air duct 14 and a second heat dissipation air duct 27 connected to the first heat dissipation air duct 15 are formed inside the precooling device 2. The baffle 3 is configured to be able to block or open the first heat dissipation air duct 15 and / or the second heat dissipation air duct 27.

[0093] The present application sets a precooling device 2 on the air inlet side of the condenser body 1. The precooling device 2 can cool the gas entering the condenser body 1, so that the cooled gas can cool the condenser body 1, thereby improving the heat exchange efficiency of the condenser body 1, so that the air-cooled condenser can cope with short-term high temperature weather, maintain the stable operation of the air-cooled condenser in a high temperature environment, enhance the adaptability and reliability of the air-cooled condenser, and at the same time, enable the air-cooled condenser to achieve lightweight and miniaturization while meeting the refrigeration requirements. In addition, by setting the baffle 3, the baffle 3 can ensure the heat dissipation effect of the precooling device 2 when it is opened, thereby improving the heat exchange efficiency of the air-cooled condenser, thereby ensuring the stable operation of the air-cooled condenser in a high temperature environment.

[0094] See below for further reference Figure 1-4 , a preferred embodiment of the air-cooled condenser of the present application is introduced. Those skilled in the art will understand that the embodiments described below are only used to illustrate the principles of the present application and are not intended to limit the scope of protection of the present application. On the premise that the air-cooled condenser at least includes a condenser body 1, a precooling device 2 and a baffle 3, those skilled in the art can adjust the following settings so that the present application can be applied to more specific application scenarios.

[0095] Reference Figure 1-4 In a more preferred embodiment, the air-cooled condenser includes a condenser body 1, a precooling device 2, a fan assembly 4 and a baffle 3.

[0096] Reference Figure 4 The condenser body 1 includes a condensing core 13, a second outer wind cover 11, a second inner wind cover 12, and a second support member 16. The second outer wind cover 11 has a chamber with two open ends, one of which is open (such as Figure 2 The right side shown) is the air inlet side, and the other open end (such as Figure 2 The left side shown) is the air outlet side. The second inner wind hood 12, the condensing core 13 and the second support member 16 are all arranged in the second outer wind hood 11. The second inner wind hood 12 is arranged on the outer wall of the condensing core 13, and the second inner wind hood 12 is arranged around the condensing core 13, so that the second inner wind hood 12 is sleeved on the outer wall of the condensing core 13. A plurality of second support members 16 are arranged between the second inner wind hood 12 and the second outer wind hood 11, so as to support the second inner wind hood 12, so that the condensing core 13 can be stably arranged in the second outer wind hood 11.

[0097] It should be noted that the present application does not limit the number of second support members 16, as long as the second support members 16 can support the second inner wind hood 12. In other preferred embodiments, the provision of the second outer wind hood 11 and / or the second inner wind hood 12 is not necessary, and those skilled in the art can choose as needed. In the case where the second outer wind hood 11 and the second inner wind hood 12 are not provided, the second support member 16 is necessarily not provided. In the case where the second inner wind hood 12 is not provided, the second support member 16 is provided between the first outer wind hood 21 and the condensation core 13. In the case where the second outer wind hood 11 is not provided, the second support member 16 is also not provided.

[0098] See next Figure 4 , a heat-insulating layer is arranged on the outer wall of the second inner wind hood 12, and the heat-insulating layer is arranged around the second inner wind hood 12, so as to prevent the gas in the first heat-dissipating air duct 15 from contacting the condensing core 13, thereby affecting the condensing effect of the condensing core 13. A first heat-dissipating air duct 15 is formed between the outer wall of the heat-insulating layer and the inner wall of the second outer wind hood 11, a condensing air duct 14 is formed inside the condensing core 13, and the first heat-dissipating air duct 15 is arranged around the condensing air duct 14, and the two extend in the same direction. Among them, one end of the first heat-dissipating air duct 15 and the condensing air duct 14 are both located on the air inlet side, and the other end are both located on the air outlet side, so that the gas can enter the first heat-dissipating air duct 15 and the condensing air duct 14 through the air inlet side.

[0099] It should be noted that the present application has no limitation on the material of the thermal insulation layer, as long as the thermal insulation layer can prevent the gas in the first heat dissipation duct 15 from transferring heat with the condensation core 13 .

[0100] Reference Figure 2 and 4 The condensing core 13 includes a first air-cooled condenser header, a second air-cooled condenser header, and a plurality of working fluid channels 131 disposed in the two air-cooled condenser headers. Each working fluid channel 131 is connected to the two air-cooled condenser headers respectively. An inlet 132 is provided on the first air-cooled condenser header, and an outlet 133 is provided on the second air-cooled condenser header. The plurality of working fluid channels 131 are disposed along the length direction of the air-cooled condenser header (e.g. Figure 4 The working fluid flow channels 131 are regularly spaced from top to bottom (in the upper and lower directions shown). The condensation air duct 14 is between adjacent working fluid flow channels 131. The arrangement of multiple working fluid flows can increase the contact area between the condensation core 13 and the gas, thereby improving the condensation effect of the condensation core 13. The working fluid enters the first air-cooled condenser header from the inlet 132, passes through the working fluid flow channel 131, the second air-cooled condenser header, and finally flows out from the outlet 133. The working fluid in the working fluid flow channel 131 can be cooled by the gas cooled by the precooling device 2, thereby improving the condensation effect of the condenser body 1.

[0101] Of course, the arrangement of the working fluid flow channel 131 in the present application is not fixed, and those skilled in the art can adjust it as needed. For example, multiple working fluid flow channels 131 are arranged at unequal intervals along the length direction of the air-cooled condenser header. In addition, multiple working fluid flow channels 131 can be arranged along the length direction of the condensing core 13 (such as Figure 2 In addition, the plurality of working medium flow channels 131 can be regularly spaced along the length direction of the condensing core 13 from the inlet 132 to the outlet 133, as long as the condensing air duct 14 is connected to the pre-cooling air duct 24.

[0102] See next Figure 2 and Figure 3 The precooling device 2 is arranged on the air inlet side of the condenser body 1, and includes a semiconductor precooling plate 23, a first outer air hood 21, a first inner air hood 22, a first support member 28, a guide plate 26 and a fin 25. Among them, the first outer air hood 21 and the second outer air hood 11, the first inner air hood 22 and the second inner air hood 12 are all connected by screw connection, and the air hoods are connected by screw connection, which is convenient for maintenance and disassembly. The first inner air hood 22 is arranged in the first outer air hood 21, and the semiconductor precooling plate 23 has a cold end and a hot end. The cold end is sleeved on the outer wall of the first inner air hood 22, and the hot end is arranged away from the first inner air hood 22, so that a second heat dissipation air duct 27 is formed between the outer wall of the first inner air hood 22 and the inner wall of the first outer air hood 21, and the area surrounded by the inner wall of the first inner air hood 22 is the precooling air duct 24. The present application installs a precooling device 2 on the air inlet side of the condenser body 1. Under short-term extremely high air temperature conditions, the precooling device 2 is started for cooling, thereby quickly reducing the air temperature on the air inlet side of the air-cooled condenser to pass through the short extremely high temperature period. During the normal temperature period, the precooling device 2 is turned off to maintain the temperature and pressure on the working medium side of the air-cooled condenser stable, thereby achieving efficient heat exchange of the air-cooled condenser and miniaturization of the equipment.

[0103] For example: Due to the presence of the pre-cooling device 2, the maximum temperature of the air can be reduced from 40°C to 30°C during design, the temperature of the working fluid in the condenser body 1 remains unchanged at 50°C, and the heat exchange temperature difference ΔT increases from 10°C (50°C-40°C) to 20°C (50°C-30°C). Assuming that the heat exchange coefficient h remains unchanged, under the same heat exchange amount Q, the heat exchange area A=Q / (h×ΔT) will be reduced by 50%. In this case, the volume of the condensing core 13 will also be reduced, thereby achieving miniaturization and lightweight of the air-cooled condenser. Since the air-cooled condensing core 13 is reduced, the performance parameters of the induced draft fan 42 are also reduced, so the manufacturing cost of the air-cooled condenser is reduced. As for the required parameters of the induced draft fan 42, the windward surface of the original induced draft fan 42 is 1m 2 , wind speed 10m / s, the fan needs to provide an air volume of 10m 3 / s. After adding the pre-cooling device, the windward side is 0.5m 2, wind speed 10m / s, the fan needs to provide air volume of 5m 3 / s. Due to the heat dissipation duct, the fan air volume will be 5-10m 3 / s, the fan selection parameters are reduced, and the fan cost is reduced. Although the short-term energy consumption increases when the precooling device 2 is turned on, in the long run (for example, if there are 10 days of extreme high temperature weather in a year, the precooling device 2 can be turned on for 10 days and turned off for 355 days), the cost of the air-cooled condenser of the present application is relatively low, and it has obvious comprehensive economic benefits.

[0104] Of course, the present application does not have a fixed connection method for the first outer wind hood 21 and the second outer wind hood 11, and the first inner wind hood 22 and the second inner wind hood 12, and those skilled in the art can adjust it according to the setting needs. For example, the first outer wind hood 21 and the second outer wind hood 11 can be connected by other fixing methods such as welding and bonding, or the first outer wind hood 21 and the second outer wind hood 11 can also be integrally formed. And / or, the first inner wind hood 22 and the second inner wind hood 12 can be connected by other fixing methods such as welding and bonding, or the first inner wind hood 22 and the second inner wind hood 12 can also be integrally formed. When the first outer wind hood 21 and the second outer wind hood 11 are connected by screwing, in order to ensure the sealing performance of the first heat dissipation duct 15 and the second heat dissipation duct 27, washers can be set at the connection of the two outer wind hoods and the connection of the two inner wind hoods, and then connected by screws and nuts. In addition, the present application has no limitation on the size of the first outer wind hood 21 and the second outer wind hood 11, and the first inner wind hood 22 and the second inner wind hood 12, as long as the first outer wind hood 21 and the second outer wind hood 11 can be connected, and the first inner wind hood 22 and the second inner wind hood 12 can be connected. For example, the cross-sectional size of the first outer wind hood 21 can be the same as the cross-sectional size of the second outer wind hood 11, or it can be larger than the cross-sectional size of the second outer wind hood 11, or it can be smaller than the cross-sectional size of the second outer wind hood 11. And / or, the cross-sectional size of the first inner wind hood 22 can be the same as the cross-sectional size of the second inner wind hood 12, or it can be larger than the cross-sectional size of the second inner wind hood 12, or it can be smaller than the cross-sectional size of the second inner wind hood 12. Taking the example where the cross-sectional dimension of the first outer wind hood 21 is smaller than the cross-sectional dimension of the second outer wind hood 11, the connection method of the two wind hoods when the cross-sectional dimensions are different is explained. When the cross-sectional dimension of the first outer wind hood 21 is smaller than the cross-sectional dimension of the second outer wind hood 11, a connecting edge may be provided at the edge of the second outer wind hood 11, and the connecting edge may extend along the inner wall of the second outer wind hood 11 toward the central axis direction of the second outer wind hood 11, so that the first outer wind hood 21 can contact the connecting edge, thereby connecting the first outer wind hood 21 to the second outer wind hood 11.

[0105] In addition, the configuration shape of the semiconductor pre-cooler 23 is not fixed in this application, and those skilled in the art can adjust it according to the specific impact scenario. For example, the configuration shape of the semiconductor pre-cooler 23 can be frame-shaped, and the semiconductor pre-cooler 23 of this structure can be sleeved on the first inner wind hood 22.

[0106] It should be noted that the present application has no limitation on the number of precooling devices 2, which can be 1, 2 or other numbers. The number of precooling devices 2 is 2 for illustration. When the number of precooling devices 2 is 2, one precooling device 2 is arranged on the air inlet side of the condenser body 1, and the other precooling device 2 is arranged on the side of the precooling device 2 away from the condenser body 1, and the first outer wind hoods 21 and the first inner wind hoods 22 of the two precooling devices 2 are connected.

[0107] In addition, in other preferred embodiments, the first inner wind cover 22 is not necessarily provided, and those skilled in the art can select it according to the need of the provision. In the case where the inner wind cover is not provided, the semiconductor precooler 23 is a plate-like structure, which is provided in the first outer wind cover 21, and can divide the internal space of the first outer wind cover 21 into two areas, and the cold end and the hot end of the semiconductor precooler are respectively provided in this area, wherein the cold end and the first outer wind cover 21 form a precooling air duct, and the hot end and the first outer wind cover 21 form a second heat dissipation air duct 27, and the guide plate 26 is directly provided at the cold end.

[0108] See next Figure 2 and Figure 3 , a plurality of fins 25 are provided on the hot end of the semiconductor precooler 23, the plurality of fins 25 are arranged at intervals, the plurality of fins 25 all extend along the direction of the semiconductor precooler 23 toward the first outer wind hood 21, and the fins 25 are arranged perpendicular to the semiconductor precooler 23. The plurality of fins 25 divide the second heat dissipation air duct 27 into a plurality of regions, and the extension direction of the regions is consistent with the extension direction of the second heat dissipation air duct 27, so as to facilitate the gas to dissipate heat to the semiconductor precooler 23. By arranging a plurality of fins 25 at the hot end of the semiconductor precooler 23, the contact area between the gas and the semiconductor precooler can be increased, thereby ensuring the heat dissipation effect of the semiconductor precooler 23. A plurality of guide plates 26 are provided in the first inner wind hood 22, and the plurality of guide plates 26 are all arranged horizontally, and along the height direction of the first inner wind hood 22 (such as Figure 3 The upper and lower directions (as shown) are arranged at intervals, thereby dividing the pre-cooling air duct 24 into several sections, and the extension direction of each section is consistent with the extension direction of the pre-cooling air duct 24, thereby improving the cooling effect of the gas.

[0109] Of course, the present application does not have a fixed arrangement for the fins 25 and the guide plates 26, and those skilled in the art can adjust them according to the arrangement requirements. For example, the fins 25 can be arranged along the semiconductor precooler 23 in an inclined direction toward the first outer air hood 21, as long as the area formed between adjacent fins 25 is consistent with the extension direction of the second heat dissipation duct 27. And / or, the plurality of guide plates 26 are arranged longitudinally, and along the length direction of the first inner air hood 22 (such as Figure 3 The guide plates 26 may be arranged at intervals (in the left and right direction shown), or the guide plates 26 may be arranged at an angle, as long as the extension direction of the multiple sections of the pre-cooling air duct 24 separated by the guide plates 26 is consistent with the extension direction of the pre-cooling air duct 24.

[0110] See next Figure 2 and Figure 3 A plurality of first support members 28 are arranged between the first inner wind cover 22 and the first outer wind cover 21, so as to support the first inner wind cover 22, so that the semiconductor pre-cooling sheet 23 can be stably arranged in the first outer wind cover 21, which is conducive to cooling the gas. The first end of the first support member 28 is arranged on the outer wall of the first inner wind cover 22 between adjacent semiconductor pre-cooling sheets 23, and the second end is arranged on the inner wall of the first outer wind cover 21.

[0111] It should be noted that the present application has no restrictions on the manner in which the first support member 28 is arranged in the first inner wind hood 22 and the second outer wind hood 11, as long as the first support member 28 can enable the first inner wind hood 22 to be arranged in the first outer wind hood 21. For example, the first end of the first support member 28 can be connected to the first inner wind hood 22 by means of snap-on, screw-on, etc., and / or the second end of the first support member 28 can be connected to the first outer wind hood 21 by means of snap-on, screw-on, etc. In addition, in other preferred embodiments, the provision of the first inner wind hood 22 is not necessary, and those skilled in the art can make a choice as needed. In the case where the first inner wind hood 22 is not provided, one end of the first support frame is connected to the inner wall of the first outer wind hood 21, and the other end is connected to the semiconductor pre-cooling plate 23.

[0112] In addition, when the semiconductor pre-cooling plate 23 is arranged in a frame shape, the first end of the first support member 28 can be aligned with the end surface of the first inner wind shield 22 (such as Figure 3 Front and rear faces shown) are connected.

[0113] See next Figure 1The fan assembly 4 is arranged at the air outlet side of the condenser body 1, and includes a shell 41 and an induced draft fan 42. An internal space is formed inside the shell 41, and one end of the shell is closed and the other end is open. The open end is connected to the second outer wind cover 11, and the closed end is provided with an exhaust port. The internal space of the shell 41 is connected to the condensation air duct 14 and the first heat dissipation air duct 15 respectively. The induced draft fan 42 is arranged in the internal space, so that the gas in the heat dissipation air duct and the gas in the condensation air duct 14 can be discharged through the induced draft fan 42.

[0114] Of course, the present application does not have a fixed arrangement for the housing 41, and those skilled in the art can adjust it as needed. For example, both ends of the housing 41 are open. When both ends of the housing 41 are open, one open end is connected to the second outer wind cover 11, and the other open end is used as an exhaust port.

[0115] See next Figure 2 , the baffle 3 is arranged at a position near the first heat dissipation duct 15 in the internal space of the shell 41, and the baffle 3 is arranged to enable the first heat dissipation duct 15 to be connected to or disconnected from the internal space. The baffle 3 is arranged in association with the precooling device 2, that is, the baffle 3 is interlocked with the precooling device 2, and the two are opened or closed at the same time. When the precooling device 2 is turned on, the baffle 3 opens the first heat dissipation duct 15, so that when the precooling device 2 is working, the baffle 3 is opened, and the first heat dissipation duct 15 and the second heat dissipation duct 27 are connected to the internal space, so that while the precooling device 2 cools the gas, the heat at the hot end can be dissipated under the action of the induced draft fan 42, thereby improving the cooling effect of the precooling device 2. When the precooling device 2 is not working, the baffle 3 is closed so that the first heat dissipation duct 15 is not connected to the internal space.

[0116] The use of pre-cooling devices to cope with short-term high-temperature weather processes can significantly reduce the core volume and weight in the design of air-cooled condensers, reduce the fan grade and power consumption, and has obvious comprehensive economic performance.

[0117] It should be noted that there is no limitation on the way in which the baffle 3 of the present application connects or disconnects the first heat dissipation duct 15 and the internal space, as long as the baffle 3 can connect or disconnect the first heat dissipation duct 15 and the internal space. For example, a telescopic rod can be provided on the outer wall of the second outer wind hood 11, and the movable end of the telescopic rod is connected to the baffle 3. The baffle 3 is driven by the telescopic rod to approach the first heat dissipation duct 15, so that the first heat dissipation duct 15 can be blocked, so that the first heat dissipation duct 15 is disconnected from the internal space. When the telescopic rod drives the baffle 3 away from the first heat dissipation duct 15, that is, the baffle 3 is placed in the internal space, the first heat dissipation duct 15 can be opened, so that the first heat dissipation duct 15 is connected to the internal space.

[0118] Of course, the present application does not fix the setting position of the baffle 3, and those skilled in the art can adjust it according to the setting needs. For example, the baffle 3 is set in the first heat dissipation duct 15, and is set to enable the first heat dissipation duct 15 to be connected or disconnected with the internal space, and / or the baffle 3 is set in the second heat dissipation duct 27, and is set to enable the second heat dissipation duct 27 to be connected or disconnected with the internal space through the first heat dissipation duct 15. Alternatively, baffles 3 are respectively set in the housing 41 and in the first heat dissipation duct 15. Alternatively, baffles 3 are respectively set in the first heat dissipation duct 15 and in the second heat dissipation duct 27. Alternatively, baffles 3 are respectively set in the housing 41, the first heat dissipation duct 15, and the second heat dissipation duct 27. Alternatively, baffles 3 are respectively set in the housing 41, the first heat dissipation duct 15, the second heat dissipation duct 27, and the side of the second heat dissipation duct 27 away from the first heat dissipation duct 15.

[0119] Combination Figure 1-4 Explain the working principle of the air-cooled condenser in this application:

[0120] When the air temperature is higher than the set value, the semiconductor precooler 23 works and the baffle 3 connects the first heat dissipation duct 15 with the internal space. At this time, the first heat dissipation duct 15 and the second heat dissipation duct 27 are connected with the internal space. When the external gas flows through the second heat dissipation duct 27 and the precooling duct 24 at the same time, in the precooling duct 24, the gas contacts the guide plate 26 and the first inner wind cover 22 to exchange heat, so that the temperature of the gas is reduced. The gas with reduced temperature flows through the condensation duct 14 and exchanges heat with the working medium in the condensation core 13, so that the temperature of the working medium is reduced, thereby improving the condensation effect of the condenser body 1, and the temperature of the gas that exchanges heat with the working medium increases, and is discharged from the air-cooled condenser under the action of the induced draft fan 42. The gas in the second heat dissipation duct 27 exchanges heat with the fins 25, and the temperature increases. The increased gas flows through the first heat dissipation duct 15 and the internal space to be discharged from the air-cooled condenser, so that the cooling system can work normally in high temperature weather, the air-cooled condenser, the cooling system and the overall equipment.

[0121] When the air temperature is lower than the set value, the semiconductor precooler 23 does not work, and the baffle 3 disconnects the first heat dissipation duct 15 from the internal space. At this time, the second heat dissipation duct 27 is not connected to the internal space, and the precooling duct 24 only serves as a passage for the gas to flow through. The semiconductor precooler 23 does not cool the gas. The gas enters the condensation duct 14 through the precooling duct 24, condenses the working medium in the condenser body 1, and is finally discharged by the induced draft fan 42 to ensure the system operation under normal temperature conditions.

[0122] In addition, the utility model also provides a cooling system, which is an air-cooled condenser in any of the above embodiments.

[0123] It should be noted that the cooling system has all the technical effects of the aforementioned air-cooled condenser, which will not be described in detail here.

[0124] In addition, the utility model also provides an electronic device, which includes the cooling system in any of the above embodiments.

[0125] Those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims of the present application, any one of the claimed embodiments may be used in any combination.

[0126] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. An air-cooled condenser, characterized in that: The air-cooled condenser comprises: A condenser body, the condenser body having an air inlet side and an air outlet side, and a condensation air duct and a first heat dissipation air duct respectively and independently connecting the air inlet side and the air outlet side; A precooling device, wherein the precooling device is arranged on the air inlet side, and a precooling air duct connected to the condensing air duct and a second heat dissipation air duct connected to the first heat dissipation air duct are formed inside the precooling device; A baffle, wherein the baffle is configured to block or open the first heat dissipation air duct and / or the second heat dissipation air duct.

2. The air-cooled condenser according to claim 1, characterized in that: The precooling device comprises: a first outer wind cover, the first outer wind cover being arranged on the air inlet side; A semiconductor pre-cooling plate, wherein the semiconductor pre-cooling plate is arranged in the first outer wind cover and has a cold end and a hot end, the second heat dissipation air duct is formed between the hot end and the first outer wind cover, and the pre-cooling air duct is formed between the cold end and the first outer wind cover.

3. The air-cooled condenser according to claim 2, characterized in that: The semiconductor pre-cooler also includes: A first inner wind hood is arranged on the cold end, and an area surrounded by the first inner wind hood is the pre-cooling air duct.

4. The air-cooled condenser according to claim 3, characterized in that: The precooling device further includes a first support member, and the first support member is arranged between the first inner wind hood and the first outer wind hood.

5. The air-cooled condenser according to claim 2, characterized in that: The precooling device also includes: A guide plate is arranged at the cold end.

6. The air-cooled condenser according to claim 2, characterized in that: The precooling device also includes: A fin is provided at the hot end.

7. The air-cooled condenser according to claim 1, characterized in that: The condenser body comprises: a second outer air hood, the second outer air hood being arranged on the precooling device; A condensation core is disposed in the second outer wind cover, and the first heat dissipation air duct is formed between the outer wall of the condensation core and the second outer wind cover, and the condensation air duct is provided inside the condensation core.

8. The air-cooled condenser according to claim 7, characterized in that: The condenser body also includes: A second inner wind hood is sleeved on the condensing core, and the first heat dissipation air duct is formed between the second inner wind hood and the second outer wind hood.

9. The air-cooled condenser according to claim 8, characterized in that: The condenser body also includes: A heat-insulating layer is arranged on the outer wall of the second inner air hood.

10. The air-cooled condenser according to claim 8, characterized in that: The condenser body also includes: A second support member is disposed between the second inner wind shield and the second outer wind shield.

11. The air-cooled condenser according to claim 1, characterized in that: The air-cooled condenser also includes: A fan assembly is arranged on the air outlet side of the condenser body.

12. The air-cooled condenser according to claim 11, characterized in that: The fan assembly comprises: A shell, wherein the shell is arranged on the air outlet side of the condenser body, and the inner space of the shell is respectively connected with the condensation air duct and the first heat dissipation air duct; An induced draft fan is arranged in the internal space.

13. The air-cooled condenser according to claim 12, characterized in that: The baffle is disposed in the housing and / or in the first heat dissipation duct, and is configured to enable the first heat dissipation duct to be connected to or disconnected from the internal space; and / or The baffle is disposed in the second heat dissipation duct, and is configured to enable the second heat dissipation duct to be connected to or disconnected from the internal space through the first heat dissipation duct.

14. The air-cooled condenser according to claim 1, characterized in that: There are multiple pre-cooling devices, and the multiple pre-cooling devices are arranged in sequence from the air inlet side to the air outlet side.

15. The air-cooled condenser according to claim 1, characterized in that: The baffle is associated with the precooling device so that when the precooling device is turned on, the baffle opens the first heat dissipation duct and the second heat dissipation duct.

16. A cooling system, characterized in that: The cooling system comprises the air-cooled condenser according to any one of claims 1-15.

17. An electronic device, characterized in that: The electronic device comprises the cooling system of claim 16.

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