Solder paste blocking device used in substrate printing machine

Abstract

The utility model discloses a solder paste blocking device used in a substrate printing machine, and relates to the field of substrate printing equipment. According to the technical scheme, the solder paste blocking device is characterized by comprising the solder paste blocking device, and the solder paste blocking device is arranged in the substrate printing machine in a removable mode and located above an anti-pollution area. When an operator carries out operation, the solder paste blocking device is placed in the substrate printing machine and located above the anti-pollution area, the solder paste blocking device covers the anti-pollution area, protection of the anti-pollution area is achieved, and solder paste accidentally falling off can fall on the solder paste blocking device instead of falling on the anti-pollution area when the operator carries out operation. Therefore, adverse accidents caused by pollution of the anti-pollution area can be avoided; after the operation is completed, an operator removes the solder paste blocking device from the inside of the substrate printing machine and places the solder paste blocking device at a position outside the machine, so that the substrate printing machine can work smoothly.

Description

Technical Field

[0001] The utility model relates to the field of substrate printing equipment, and more specifically, to a solder paste blocking device used in a substrate printing machine. Background Art

[0002] Reference Figure 1 The existing substrate printer is usually equipped with a cleaning paper mechanism 2. When the operator switches the production machine, replaces the scraper, or removes the solder paste on the steel mesh, there may be adverse accidents caused by the solder paste falling. For example, the solder paste falls on the cleaning paper mechanism, causing the cleaning paper to be contaminated, affecting the cleaning effect. The solder paste may also fall on the substrate in the machine, causing the substrate to short-circuit.

[0003] Therefore, how to solve the problem of accidents caused by accidental dropping of solder paste is an urgent problem to be solved. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a solder paste blocking device for use in a substrate printing machine, which covers the anti-pollution area through the solder paste blocking device to achieve protection of the anti-pollution area. When the operator accidentally drops solder paste during operation, the solder paste will fall on the solder paste blocking device instead of on the anti-pollution area, thereby preventing the anti-pollution area from being contaminated and causing adverse accidents.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A solder paste blocking device for a substrate printer, wherein an anti-pollution area is formed in the substrate printer; the solder paste blocking device is removably arranged in the substrate printer and is located above the anti-pollution area.

[0007] Further, the solder paste blocking device can extend along the X-axis direction, and / or the solder paste blocking device can extend along the Y-axis direction.

[0008] Furthermore, the solder paste blocking device includes a first baffle, a second baffle and a third baffle; the second baffle can move along the X-axis direction relative to the first baffle, and the third baffle can move along the Y-axis direction equivalent to the first baffle.

[0009] Further, a first position-limiting fastening assembly is provided between the first baffle plate and the second baffle plate, and / or a second position-limiting fastening assembly is provided between the first baffle plate and the third baffle plate.

[0010] Furthermore, the second baffle plate and the third baffle plate are both located below the first baffle plate, and the bottom wall of the first baffle plate is provided with a receiving groove that cooperates with the second baffle plate.

[0011] Furthermore, two vertical plates extending along the Y-axis direction are arranged in the substrate printing machine, and the first baffle plate and the second baffle plate are overlapped on the two vertical plates respectively.

[0012] Further, the first baffle plate is provided with a first limiting portion in contact with the end of the vertical plate, and / or the second baffle plate is provided with a second limiting portion in contact with the end of the vertical plate.

[0013] Furthermore, a limit block is provided on the top wall of the vertical plate; a first clearance notch cooperating with the limit block is provided on the side wall of the first baffle plate, and / or a second clearance notch cooperating with the limit block is provided on the side wall of the second baffle plate.

[0014] Furthermore, a center of gravity offset pin is provided on the third baffle plate, so that the solder paste blocking device overlapped on the two vertical plates can be deflected.

[0015] Furthermore, a screen frame is arranged between the two vertical plates; after the solder paste blocking device is deflected, the center of gravity offset pin can contact the top wall of the screen frame.

[0016] In summary, the utility model has the following beneficial effects:

[0017] 1. When the operator is working, the solder paste blocking device is placed in the substrate printer and located above the anti-pollution area. The solder paste blocking device covers the anti-pollution area to protect the anti-pollution area. When the operator is working, the solder paste accidentally dropped will fall on the solder paste blocking device instead of the anti-pollution area, thereby preventing the anti-pollution area from being contaminated and causing adverse accidents. After the work is completed, the operator removes the solder paste blocking device from the substrate printer and places it outside the machine, so that the substrate printer can work smoothly.

[0018] 2. The solder paste blocking device can be extended along the X-axis direction and the Y-axis direction respectively to expand the blocking range, thereby improving the protection effect, increasing the applicable scope of the solder paste assembly device, and reducing the cost;

[0019] 3. The solder paste blocking device is directly placed in the substrate printer without using a connection structure, so that it is easy to remove and does not require the substrate printer to be modified, thereby increasing the application range of the solder paste blocking device and reducing costs;

[0020] 4. Under the action of the center of gravity offset pin, the inner end of the solder paste blocking device along the Y-axis direction is deflected downward, thereby improving the placement stability of the solder paste blocking device and preventing the solder paste blocking device from falling from the vertical plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1It is a structural schematic diagram of a substrate printing machine in the prior art;

[0022] Figure 2 The structure of the solder paste blocking device used in the substrate printer in the embodiment is shown in FIG. Figure 1 ;

[0023] Figure 3 The structure of the solder paste blocking device in the embodiment is shown in FIG. Figure 1 ;

[0024] Figure 4 The structure of the solder paste blocking device in the embodiment is shown in FIG. Figure 2 ;

[0025] Figure 5 The structure of the solder paste blocking device in the embodiment is shown in FIG. Figure 3 ;

[0026] Figure 6 The structure of the solder paste blocking device used in the substrate printer in the embodiment is shown in FIG. Figure 2 ;

[0027] Figure 7 The structure of the solder paste blocking device used in the substrate printer in the embodiment is shown in FIG. Figure 3 .

[0028] In the figure: 1. substrate printer; 2. cleaning paper mechanism; 3. vertical plate; 31. limit block; 4. screen frame; 5. solder paste blocking device; 51. first baffle; 511. accommodating groove; 512. first limit part; 513. first clearance notch; 514. third limit groove; 52. second baffle; 521. first limit groove; 522. second clearance notch; 523. second limit part; 53. third baffle; 531. second limit groove; 54. first fastening screw; 55. first fastening plate; 56. second fastening screw; 57. second fastening plate; 58. center of gravity offset pin. DETAILED DESCRIPTION

[0029] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0030] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention. Example

[0031] A solder paste blocking device for a substrate printer, referring to Figures 1 to 7, a cleaning paper mechanism 2 is provided in the substrate printer 1; the solder paste blocking device 5 is removably provided in the substrate printer 1 and is located above the cleaning paper mechanism 2; when the operator is working, the solder paste blocking device 5 is placed in the substrate printer 1 and is located above the cleaning paper mechanism 2, and the solder paste blocking device 5 covers the cleaning paper mechanism 2 to protect the cleaning paper mechanism 2, so that the solder paste accidentally dropped by the operator during the operation will fall on the solder paste blocking device 5 instead of the cleaning paper mechanism 2, thereby avoiding the cleaning paper mechanism 2 from being contaminated and causing adverse accidents; after the operation is completed, the operator removes the solder paste blocking device 5 from the substrate printer and places it outside the machine, so that the substrate printer can work smoothly.

[0032] Reference Figures 1 to 7 Specifically, the blocking range of the solder paste blocking device 5 is larger than the area of ​​the cleaning paper mechanism 2; that is, the solder paste blocking device 5 in this embodiment is mainly used to cover the cleaning paper mechanism 2, and can also cover other areas in the substrate printing machine 1 that are close to the cleaning paper mechanism; preferably, the solder paste blocking device 5 in this embodiment can be extended along the X-axis direction and the Y-axis direction respectively to expand the blocking range, thereby improving the protection effect, and can increase the applicable scope of the solder paste assembly device and reduce the cost; preferably, the blocking range of the solder paste blocking device is larger than the operator's working area, that is, the operator is on the solder paste blocking device The operation can be performed in this way, so that the solder paste accidentally dropped during the operation will fall on the solder paste blocking device instead of falling inside the substrate printer, thereby avoiding adverse accidents caused by the falling of solder paste; of course, the operator can also adjust the working area according to the blocking range of the solder paste blocking device; in addition, the blocking range of the solder paste blocking device 5 can be adjusted according to the specifications of the substrate printer and the actual working area, which is not limited here; in other optional embodiments, the blocking range of the solder paste blocking device can also be fixed, or it can only extend along the X-axis direction, or only extend along the Y-axis direction, which is not limited here.

[0033] Reference Figures 1 to 7 An anti-pollution area is formed in the substrate printing machine 1, that is, an area that is prevented from being contaminated by dropped solder paste; more specifically, an area that is prevented from being contaminated by dropped solder paste generated when the operator is working; that is, the anti-pollution area is related to the operator's working area, and dropped solder paste will only be generated when the operator is working; the area where the cleaning paper mechanism 2 is located is also the anti-pollution area, and the area where the substrate is located is also the anti-pollution area; of course, other mechanisms or components in the substrate printing machine can also form the anti-pollution area; in addition, multiple solder paste blocking devices can also be used to cover the same anti-pollution area, or multiple solder paste blocking devices can be used to cover multiple anti-pollution areas respectively, which is not limited here.

[0034] Reference Figures 1 to 7Specifically, the solder paste blocking device 5 in this embodiment includes a first baffle 51, a second baffle 52 and a third baffle 53; the second baffle 52 can move relative to the first baffle 51 along the X-axis direction, and the third baffle 53 can move equivalent to the first baffle 51 along the Y-axis direction, so as to expand the blocking range; specifically, in this embodiment, the X-axis and the Y-axis are located on a horizontal plane, the width direction of the substrate printer is the X-axis direction, and the length direction of the substrate printer is the Y-axis direction; in addition, the axial direction (length direction) of the cleaning paper mechanism is also the X-axis direction; therefore, by moving the second baffle 52 relative to the first baffle 51 along the X-axis direction, the cleaning paper mechanism 2 can be completely covered; that is, in this embodiment The first baffle 51 and the second baffle 52 are used in combination to achieve covering and protection of the cleaning paper mechanism 2, and the third baffle 53 is used to expand the blocking range along the Y-axis direction to improve the protection effect; after the second baffle 52 and the third baffle 53 are extended respectively, the first baffle 51, the second baffle 52 and the third baffle 53 are L-shaped, thereby forming an L-shaped blocking range; the solder paste blocking device in this embodiment is combined with three baffles, which has the advantages of simple structure and convenient adjustment, and can meet the protection needs during operation; of course, in other optional embodiments, in order to achieve the adjustment of the blocking range, the solder paste blocking device can also adopt other structures, which are not limited here.

[0035] Reference Figures 1 to 7 Preferably, a first limiting fastening assembly is provided between the first baffle plate 51 and the second baffle plate 52, and the first limiting fastening assembly is used to limit the moving direction of the second baffle plate 52, and the first baffle plate 51 and the second baffle plate 52 can be fastened; a second limiting fastening assembly is provided between the first baffle plate 51 and the third baffle plate 53, and the second limiting fastening assembly is used to limit the moving direction of the third baffle plate 53, and the first baffle plate 51 and the third baffle plate 53 can be fastened.

[0036] Reference Figures 1 to 7 Specifically, the first limiting fastening assembly in this embodiment includes a first fastening screw 54, a first limiting groove 521 provided on the second baffle plate 52, and a first fastening plate 55; the first baffle plate 51 and the first fastening plate 55 are respectively located at the upper and lower sides of the second baffle plate 52, and the first fastening screw 54 passes through the first baffle plate 51 and the first limiting groove 521 and is connected to the first fastening plate 55; the first limiting groove 521 extends along the X-axis direction; specifically, two first limiting grooves 521 are provided on the second baffle plate 52, and the number of the first fastening plates 55 is two; after loosening the first fastening screw 54, the position of the second baffle plate 52 can be adjusted; after tightening the first fastening screw 54, the first baffle plate 51 and the first fastening plate 55 clamp the second baffle plate 52 to achieve fastening.

[0037] Reference Figures 1 to 7Specifically, in this embodiment, the second limiting fastening assembly includes a second fastening screw 56, a second limiting groove 531 provided on the third baffle plate 53, and a second fastening plate 57; the first baffle plate 51 and the second fastening plate 57 are respectively located at the upper and lower sides of the third baffle plate 53, and the second fastening screw 56 passes through the first baffle plate 51 and the second limiting groove 531 and is connected to the second fastening plate 57; the second limiting groove 531 extends along the Y-axis direction; preferably, a third limiting groove 514 cooperating with the second fastening screw 56 is provided on the first baffle plate 51, and the third limiting groove 514 extends along the Y-axis direction, thereby increasing the adjustment range; after loosening the second fastening screw 56, the position of the third baffle plate 53 can be adjusted; after tightening the second fastening screw 56, the first baffle plate 51 and the second fastening plate 57 clamp the third baffle plate 53 to achieve fastening.

[0038] Reference Figures 1 to 7 Preferably, the second baffle plate 52 and the third baffle plate 53 are both located below the first baffle plate 51, and the bottom wall of the first baffle plate 51 is provided with a receiving groove 511 that cooperates with the second baffle plate 52; placing the second baffle plate 52 in the receiving groove 511 can prevent interference between the second baffle plate 52 and the third baffle plate 53, thereby facilitating adjustment.

[0039] Reference Figures 1 to 7 Specifically, in the present embodiment, two vertical plates 3 extending along the Y-axis direction are arranged in the substrate printing machine 1, and a screen frame 4 is arranged between the two vertical plates 3; the spacing between the two vertical plates 3 along the X-axis direction is adjustable so as to match screen frames of different specifications; the structure of the vertical plates and the screen frame belongs to the prior art and will not be described in detail here; the screen frame 4 can move relative to the vertical plates 3 along the Y-axis direction; specifically, the solder paste blocking device 5 in the present embodiment is placed on the two vertical plates 3, that is, the first baffle 51 and the second baffle 52 are respectively overlapped on the two vertical plates 3; the second baffle 52 can move relative to the first baffle 51 along the X-axis direction so as to match vertical plates with different spacings; in the present embodiment, the solder paste blocking device 5 is directly placed in the substrate printing machine without using a connecting structure, so as to facilitate removal, and there is no need to modify the substrate printing machine, thereby increasing the application range of the solder paste blocking device and reducing the cost; of course, in other optional embodiments, a connecting structure can also be provided between the solder paste blocking device and the substrate printing machine so that the solder paste blocking device is detachable, which is not limited here.

[0040] Reference Figures 1 to 7Specifically, the outer end of the first baffle plate 51 along the Y-axis direction is bent to form a first limiting portion 512, and the outer end of the second baffle plate 52 along the Y-axis direction is bent to form a second limiting portion 523; the first limiting portion 512 and the second limiting portion 523 are respectively in contact with the ends of the two vertical plates 3 to achieve limiting along the Y-axis direction; a limiting block 31 is provided on the top wall of the vertical plate 3; the first baffle plate 51 is provided with a first clearance notch 513 matched with the limiting block 31 at both ends along the X-axis direction, and the second baffle plate 52 is provided with a second clearance notch 522 matched with the limiting block 31 at one end along the X-axis direction; that is, limiting along the X-axis direction is achieved by two limiting blocks 31; the use of two limiting structures can improve the stability of the solder paste blocking device on the one hand, and facilitate the placement of the solder paste blocking device on the other hand.

[0041] Reference Figures 1 to 7 Preferably, three center of gravity offset pins 58 are provided at the inner end of the third baffle plate 53 along the Y-axis direction; the first baffle plate 51 and the second baffle plate 52 are respectively overlapped on the two vertical plates 3, and under the action of the center of gravity offset pins 58, the inner end of the solder paste blocking device along the Y-axis direction is deflected downward, thereby improving the placement stability of the solder paste blocking device and preventing the solder paste blocking device from falling from the vertical plate; the inner end of the solder paste blocking device along the Y-axis direction is deflected downward, which can prevent the solder paste blocking device from sliding horizontally and falling from the vertical plate, and can also prevent the solder paste assembly device from flipping and falling from the vertical plate.

[0042] Reference Figures 1 to 7 Preferably, after the solder paste blocking device is deflected, the center of gravity offset pin 58 can contact the top wall of the screen frame 4, thereby further improving stability; specifically, when the third baffle 53 is in a retracted state, the center of gravity offset pin 58 can contact the top wall of the screen frame 4; after the screen frame 4 moves along the Y-axis direction, the third baffle 53 is extended to make the center of gravity offset pin 58 contact the top wall of the screen frame 4; of course, in other optional embodiments, the center of gravity offset pin may not contact the screen frame, which is not limited here; specifically, in this embodiment, a reserved gap is formed between the center of gravity offset pin 58 and the screen frame 4, so that the solder paste blocking device can be deflected; that is, when the solder paste blocking device is in a horizontal state, a reserved gap is formed between the bottom end of the center of gravity offset pin 58 and the top wall of the screen frame 4; after the solder paste blocking device is deflected, the bottom end of the center of gravity offset pin 58 contacts the top wall of the screen frame 4.

[0043] Reference Figures 1 to 7Preferably, the first baffle plate 51 and the second fastening plate 57 are respectively provided with a clearance groove that cooperates with the center of gravity offset pin 58; in this embodiment, the third baffle plate 53 can be equivalent to the first baffle plate 51 moving along the Y-axis direction, so the center of gravity offset pin 58 is set on the third baffle plate 53, which can effectively ensure that the solder paste blocking device is deflected; of course, in other optional embodiments, the center of gravity offset pin can also adopt other structural forms, and the purpose of center of gravity offset can also be achieved by designing the shape of the baffle. The position of the center of gravity offset pin can be adjusted as needed, and there is no limitation here, and it can be that the solder paste blocking device has a desired deflection; that is, the outer end of the solder paste blocking device along the Y-axis direction cannot be deflected downward, which will cause it to fall; in addition, in other optional embodiments, if both ends of the solder paste blocking device along the Y-axis direction can be supported, then the outer end of the solder paste blocking device can also be deflected downward, and there is no limitation here; preferably, the inner end of the solder paste blocking device along the Y-axis direction is deflected downward.

Claims

1. A solder paste blocking device for a substrate printer, characterized in that: An anti-pollution area is formed in the substrate printer; the solder paste blocking device is removably arranged in the substrate printer and is located above the anti-pollution area.

2. The solder paste blocking device for a substrate printer according to claim 1, characterized in that: The solder paste blocking device can extend along the X-axis direction, and / or the solder paste blocking device can extend along the Y-axis direction.

3. The solder paste blocking device for a substrate printer according to claim 2, characterized in that: The solder paste blocking device includes a first baffle, a second baffle and a third baffle; the second baffle can move along the X-axis direction relative to the first baffle, and the third baffle can move along the Y-axis direction equivalent to the first baffle.

4. The solder paste blocking device for a substrate printer according to claim 3, characterized in that: A first position-limiting fastening assembly is disposed between the first baffle plate and the second baffle plate, and / or a second position-limiting fastening assembly is disposed between the first baffle plate and the third baffle plate.

5. The solder paste blocking device for a substrate printer according to claim 3, characterized in that: The second baffle plate and the third baffle plate are both located below the first baffle plate, and the bottom wall of the first baffle plate is provided with a receiving groove matched with the second baffle plate.

6. The solder paste blocking device for a substrate printer according to claim 3, characterized in that: Two vertical plates extending along the Y-axis direction are arranged in the substrate printing machine, and the first baffle plate and the second baffle plate are overlapped on the two vertical plates respectively.

7. The solder paste blocking device for a substrate printer according to claim 6, characterized in that: The first baffle plate is provided with a first limiting portion in contact with the end of the vertical plate, and / or the second baffle plate is provided with a second limiting portion in contact with the end of the vertical plate.

8. The solder paste blocking device for a substrate printer according to claim 6, characterized in that: The top wall of the vertical plate is provided with a limit block; the side wall of the first baffle is provided with a first clearance notch cooperating with the limit block, and / or the side wall of the second baffle is provided with a second clearance notch cooperating with the limit block.

9. The solder paste blocking device for a substrate printer according to claim 6, characterized in that: The third baffle plate is provided with a center of gravity offset pin, so that the solder paste blocking device overlapped on the two vertical plates can be deflected.

10. The solder paste blocking device for a substrate printer according to claim 9, characterized in that: A screen frame is arranged between the two vertical plates; after the solder paste blocking device is deflected, the center of gravity offset pin can contact the top wall of the screen frame.

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