Electroplating clamp and electroplating equipment
By setting insulated conductive blocks on the conductive frame of the electroplating fixture, independent current control of the electroplating grips on both sides is achieved, the problem of uneven electroplating layer in the prior art is solved, and the uniformity of the plating layer during the electroplating process is achieved.
Patent Information
- Application Number
- CN202420927299.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-29
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-29
AI Technical Summary
In the prior art, when the electroplating tool fixture clamps clamp the silicon wafer, the same current is passed on both sides, resulting in significant differences in the thickness of the plating layer, and uniform electroplating cannot be achieved.
An electroplating fixture is designed, by providing a first conductive block and a second conductive block that are insulated from each other on the conductive frame, so that it can flow through different currents, and is connected to the fixed conductive plate and the movable conductive plate through the conductive frame. It realizes that different currents are passed through the grip points on both sides, thereby achieving uniformity of the plating.
Through this design, the uniformity of the electroplating layer is achieved when both sides are plating simultaneously, avoiding the difference in the thickness of the plating due to the same current, and improving the uniformity of the electroplating process.
Smart Images
Figure CN222313369U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of battery and semiconductor manufacturing, and specifically relates to an electroplating fixture and electroplating equipment. Background Art
[0002] With the rapid development of the photovoltaic industry, the industrial preparation technology of solar cells is becoming more and more diversified.
[0003] At present, the photovoltaic electrode manufacturing process uses the screen printing silver electrode process, which consumes a large amount of silver paste, and the cost of silver paste is relatively expensive. Electroplating copper technology has the advantages of low cost and better conductivity than silver paste, and is considered to be the most promising photovoltaic electrode manufacturing process to achieve silver-free photovoltaics.
[0004] In the relevant existing technology, the electroplating fixture basically uses a cathode connector after clamping the silicon wafer. Due to the inconsistency in the number and patterning of the grid lines on both sides of the battery, there are certain differences in the area to be plated on each side. If the same current is passed through both sides, there will be obvious differences in the thickness of the coating on both sides of the battery cell. Utility Model Content
[0005] In view of this, the utility model provides an electroplating fixture and an electroplating device to solve the problem in the prior art that the same current is passed through the clamping points on both sides, resulting in uneven electroplating layers.
[0006] On the one hand, the utility model provides an electroplating fixture, including a fixed conductive plate and a movable conductive plate, the electroplating fixture also includes: a conductive frame connected to the fixed conductive plate; a first conductive block arranged on the conductive frame, the first conductive block is electrically connected to the fixed conductive plate through the conductive frame; a second conductive block is arranged on the conductive frame, the second conductive block is insulated from the first conductive block, and the second conductive block is electrically connected to the movable conductive plate.
[0007] The beneficial effect is that by arranging the first conductive block and the second conductive block insulated from each other on the conductive frame, different currents can flow through the first conductive block and the second conductive block. All the clamping points on the same side use the same current contact point, and by passing different currents through the clamping points on both sides, the uniformity of the electroplating layer is achieved when electroplating on both sides at the same time.
[0008] As an optional implementation, the conductive frame is arranged on the outer side of the fixed conductive plate.
[0009] As an optional embodiment, the conductive frame includes: a first bracket, electrically connected to the fixed conductive plate, and the first bracket extends in a direction away from the fixed conductive plate; a second bracket, connected to an end of the first bracket away from the fixed conductive plate, and an angle is formed between the second bracket and the first bracket; wherein the movable conductive plate and the first conductive block are respectively arranged on the second bracket.
[0010] The beneficial effect is that the first bracket extends away from the fixed conductive plate, so that a gap is formed between the second bracket and the fixed conductive plate, thereby accommodating the upwardly extending part of the movable conductive plate and forming an installation space for the first conductive block and the second conductive block.
[0011] As an optional implementation manner, the movable conductive plate is provided with a first through hole, and the first bracket passes through the first through hole, so that the movable conductive plate is located between the fixed conductive plate and the second bracket.
[0012] As an optional implementation, the conductive frame further includes an insulating member, and the insulating member is disposed between the first conductive block and the movable conductive plate.
[0013] The beneficial effect is that the first conductive block and the movable conductive plate are insulated by the insulating member, so that the currents flowing into the first guide block and the second guide block can be independent of each other.
[0014] As an optional implementation, the insulating member includes: a first insulating portion, disposed between the first conductive block and the movable conductive plate; and a second insulating portion, disposed between the first conductive block and the second conductive block.
[0015] The beneficial effect is that the first conductive block and the second conductive block are insulated by the second insulating part, and the insulation effect is better.
[0016] As an optional implementation, the conductive frame further includes a conductive member, the conductive member is electrically connected to the movable conductive plate, the first conductive block is insulatedly connected to the conductive member, and the second conductive block is electrically connected to the conductive member.
[0017] The beneficial effect is that the movable guide plate and the second conductive block are connected by a conductive member, and the conductive member can be a copper plate, so the conductive effect between the second conductive block and the movable conductive plate is better.
[0018] As an optional implementation manner, the first conductive block and / or the second conductive block has a structure that is wide at the top and narrow at the bottom.
[0019] The beneficial effect is that by providing the first conductive block and the second conductive block with a structure that is wide at the top and narrow at the bottom, it is convenient to input current to the first conductive block and the second conductive block.
[0020] On the other hand, the utility model further provides an electroplating device, which includes the electroplating fixture described in any one of the items.
[0021] The beneficial effect is that, since the above-mentioned electroplating equipment includes any one of the electroplating fixtures, the electroplating equipment has all the beneficial effects of the electroplating fixture, which will not be repeated here.
[0022] The electroplating equipment further includes a conductive seat having a groove, the shape of the groove being adapted to the shapes of the first conductive block and the second conductive block of the electroplating fixture so as to support the first conductive block and the second conductive block.
[0023] The beneficial effect is that such an arrangement makes the tower body structure of the electroplating fixture simple, the force is clear, and the structure of the electroplating fixture is more stable. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0025] Figure 1 It is a three-dimensional structural schematic diagram of the electroplating fixture of an embodiment of the utility model;
[0026] Figure 2 for Figure 1 A is an enlarged structural diagram;
[0027] Figure 3 It is a three-dimensional structural schematic diagram of the conductive frame of the electroplating fixture according to an embodiment of the utility model;
[0028] Figure 4 for Figure 3 The enlarged structural diagram at B in FIG.
[0029] Figure 5 A schematic diagram of the front structure of an electroplating fixture according to an embodiment of the utility model.
[0030] Description of reference numerals:
[0031] 100. Electroplating fixture;
[0032] 110. Fix the conductive plate;
[0033] 120. Movable conductive plate;
[0034] 1201, first via hole;
[0035] 130. Conductive frame;
[0036] 131, first bracket;
[0037] 132, second bracket;
[0038] 133. Insulation parts;
[0039] 1331, a first insulating portion;
[0040] 1332, second insulating portion;
[0041] 134. Conductive parts;
[0042] 140. a first conductive block;
[0043] 150, a second conductive block;
[0044] 160. A first metal fastener;
[0045] 170. A second metal fastener. DETAILED DESCRIPTION
[0046] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0047] Combine the following Figures 1 to 5 , describing an embodiment of the utility model.
[0048] like Figure 1 and Figure 2 As shown, according to an embodiment of the utility model, a plating fixture 100 is provided, the plating fixture 100 includes a fixed conductive plate 110 and a movable conductive plate 120, the plating fixture 100 also includes a conductive frame 130, a first conductive block 140 and a second conductive block 150, the conductive frame 130 is connected to the fixed conductive plate 110, the first conductive block 140 is arranged on the conductive frame 130, the first conductive block 140 is electrically connected to the fixed conductive plate 110 through the conductive frame 130, the second conductive block 150 is arranged on the conductive frame 130, the second conductive block 150 is insulated from the first conductive block 140, and the second conductive block 150 is electrically connected to the movable conductive plate 120.
[0049] It can be understood that the electroplating fixture 100 also includes a fixed conductive shaft and a movable conductive shaft, and the fixed conductive plate 110, the fixed conductive shaft and the movable conductive shaft are constructed into a frame structure. Among them, the two fixed conductive plates 110 are arranged opposite to each other and parallel to each other, one end of the fixed conductive shaft is connected to one of the fixed conductive plates 110, and the other end of the fixed conductive shaft is connected to the other fixed conductive plate 110. One of the fixed conductive plates 110 is suitable for being electrically connected to an external power supply, and a movable conductive plate 120 is provided on the outer side wall of the fixed conductive plate 110 electrically connected to the external power supply, and the movable conductive plate 120 is connected to the movable conductive shaft. The movable conductive plate 120 is suitable for being electrically connected to an external power supply.
[0050] The movable conductive plate 120 is electrically connected to all movable conductive shafts, which can avoid unstable contact and improve conductive stability.
[0051] A plurality of fixed conductive shafts are arranged in parallel between two fixed conductive plates 110, the fixed conductive shafts are electrically connected to the inside of the fixed conductive plates 110, a plurality of first conductive clamping sheets are arranged on the fixed conductive shafts along the length direction, and the first conductive clamping sheets are electrically connected to the fixed conductive shafts. A plurality of movable conductive shafts are arranged in parallel, the movable conductive shafts are arranged one-to-one in parallel with the fixed conductive shafts, the movable conductive shafts are electrically connected to the movable conductive plates 120, a plurality of second conductive clamping sheets are arranged on the movable conductive shafts along the length direction, and the second conductive clamping sheets are electrically connected to the movable conductive shafts, and the movable conductive shafts are arranged so that the second conductive clamping sheets and the first conductive clamping sheets clamp the workpiece to be electroplated from both sides in a natural state, and slide relative to the fixed conductive shafts under the action of external force to form a clamping space for the workpiece to be electroplated between the second conductive clamping sheets and the first conductive clamping sheets. A plurality of first conductive clamping sheets and a plurality of second conductive clamping sheets are arranged one-to-one in correspondence, and the sliding of the movable conductive shaft relative to the fixed conductive shaft is used to realize the opening and closing of the first conductive clamping sheets and the second conductive clamping sheets to load the workpiece to be electroplated. When the electroplating fixture 100 is used to clamp a silicon wafer, the first conductive clamping piece and the corresponding second conductive clamping piece are electrically connected to two side surfaces of the clamped silicon wafer respectively.
[0052] The conductive frame 130 can be detachably connected to the fixed conductive plate 110 through gaskets and fasteners such as bolts or screws.
[0053] The end of the fixed conductive shaft is connected to the fixed conductive plate 110 via a first metal fastener 160 , and the end of the movable conductive shaft is connected to the movable conductive plate 120 via a second metal fastener 170 .
[0054] The material of the movable conductive plate 120 is beryllium copper. The movable conductive plate 120 is provided with a bending portion, and the bending portion can provide a buffer to cooperate with the sliding of the movable conductive shaft relative to the fixed conductive shaft.
[0055] There are two fixed conductive plates 110, and the conductive frame 130 is disposed on one of the fixed conductive plates 110, or both fixed conductive plates 110 are connected to a conductive frame 130. The choice of which scheme can be determined according to actual needs. This embodiment is described with the conductive frame 130 disposed on one of the fixed conductive plates 110.
[0056] The conductive frame 130 is provided with a first conductive block 140 and a second conductive block 150 which are insulated from each other, so that different currents can flow through the first conductive block 140 and the second conductive block 150. All the clamping points on the same surface use the same current contact point, and by passing different currents through the clamping points on both surfaces, the uniformity of the electroplating layer is achieved when electroplating on both surfaces simultaneously.
[0057] Furthermore, the conductive frame 130 is arranged outside the fixed conductive plate 110, which can prevent the first conductive block 140, the second conductive block 150, etc. arranged on the conductive frame 130 from interfering with other components, and when in use, the positioning of the first conductive block 140 and the second conductive block 150 can be simplified. It is understandable that the conductive frame 130 can also be arranged inside the fixed conductive plate 110 or at other locations, which will not be described in detail here. The first conductive block 140 and the second conductive block 150 arranged on the conductive frame 130 will not affect the access current.
[0058] Specifically, Figure 3 As shown, the conductive frame 130 includes a first bracket 131 and a second bracket 132, the first bracket 131 is electrically connected to the fixed conductive plate 110, and the first bracket 131 extends in a direction away from the fixed conductive plate 110, the second bracket 132 is connected to an end of the first bracket 131 away from the fixed conductive plate 110, and an angle is formed between the second bracket 132 and the first bracket 131, wherein the movable conductive plate 120 and the first conductive block 140 are respectively arranged on the second bracket 132.
[0059] It can be understood that the first bracket 131 is detachably connected to the fixed conductive plate 110, the first bracket 131 and the second bracket 132 can be integrally arranged, and the first bracket 131 and the second bracket 132 can be L-shaped. The first bracket 131 can be plate-shaped or block-shaped, the direction of the first bracket 131 away from the fixed conductive plate 110 is a direction perpendicular to the fixed conductive plate 110, and the second bracket 132 is bent upward, so that there is a gap between the second bracket 132 and the fixed conductive plate 110. The first conductive block 140 and the second conductive block 150 can be arranged at the end of the second bracket 132 extending upward.
[0060] Furthermore, if Figure 2 and Figure 5As shown, the movable conductive plate 120 is provided with a first through hole 1201, and the first bracket 131 passes through the first through hole 1201, so that there is a gap between the movable conductive plate 120 and the fixed conductive plate 110, and the movable conductive plate 120 is located between the fixed conductive plate 110 and the second bracket 132, and the upper end of the movable conductive plate 120 can be connected to the upper end of the conductive frame 130.
[0061] The fixed conductive plate 110 is provided with a second through hole, the axial end of the movable conductive shaft is inserted into and passes out of the second through hole, and the movable conductive plate 120 is electrically connected to the end of the movable conductive shaft passing through the second through hole. The movable conductive shaft can freely move along its axial direction by passing through the second through hole, and is supported on the fixed conductive plate 110 as a whole.
[0062] In another embodiment, the conductive frame 130 further includes an insulating member 133, which is disposed between the conductive frame 130 and the movable conductive plate 120, so that the insulating member 133 electrically connected to the conductive frame 130 insulates the first conductive block 140 and the movable conductive plate 120, thereby ensuring that when different currents are passed through, the currents of the first conductive block 140 and the second conductive block 150 are independent of each other, thereby achieving different electroplating currents on both sides of the battery, so that the thickness of the electroplating layer is different.
[0063] In another embodiment, if Figure 4 As shown, the insulating member 133 includes a first insulating portion 1331 and a second insulating portion 1332 . The first insulating portion 1331 is disposed between the first conductive block 140 and the movable conductive plate 120 , and the second insulating portion 1332 is disposed between the first conductive block 140 and the second conductive block 150 .
[0064] The first insulating portion 1331 and the second insulating portion 1332 may be plate-shaped structures respectively. The first insulating portion 1331 insulates the first conductive block 140 and the movable conductive plate 120 , and the second insulating portion 1332 may insulate the first conductive block 140 and the second conductive block 150 .
[0065] In another embodiment, the conductive frame 130 further includes a conductive member 134 , the conductive member 134 is electrically connected to the movable conductive plate 120 , the first conductive block 140 is insulatedly connected to the conductive member 134 , and the second conductive block 150 is electrically connected to the conductive member 134 .
[0066] The conductive member 134 is a plate-shaped structure. The conductive member 134 is connected to the movable conductive plate 120, and the conductive member 134 is arranged between the insulating member 133 and the movable conductive plate 120, and the insulating member 133 is arranged before the first conductive block 140 and the conductive member 134. It can also be understood that the first conductive block 140, the second bracket 132, the insulating member 133, the conductive member 134 and the movable conductive plate 120 are arranged in sequence. The movable conductive plate 120, the conductive member 134 and the insulating member 133 are sequentially connected to the side surface of the conductive frame 130 facing the fixed conductive plate 110, and the first conductive block 140 is connected to the side surface of the conductive frame 130 away from the fixed conductive plate 110. The first conductive block 140, the insulating member 133, the conductive member 134 and the movable conductive plate 120 can be connected to the conductive frame 130 by fasteners such as screws or bolts.
[0067] In another embodiment, the first conductive block 140 and / or the second conductive block 150 has a structure that is wide at the top and narrow at the bottom.
[0068] It is understandable that the structures of the first conductive block 140 and the second conductive block 150 can be the same, and the first conductive block 140 and the second conductive block 150 have a V-shaped cross section, which is more convenient for positioning the first conductive block 140 and the second conductive block 150. For example, only a groove that matches the shape of the first conductive block 140 and the second conductive block 150 is required to fix the first conductive block 140 and the second conductive block 150. Of course, the shapes of the first conductive block 140 and the second conductive block 150 are not limited to V-shaped, and can also be other structural forms.
[0069] According to an embodiment of the present invention, an electroplating device is further provided, and the electroplating device includes any one of the electroplating fixtures 100 .
[0070] The electroplating equipment further includes a conductive seat having a groove, the shape of the groove being adapted to the shape of the first conductive block 140 and the second conductive block 150 of the electroplating fixture 100 to support the first conductive block 140 and the second conductive block 150 .
[0071] When the electroplating equipment is performing electroplating, the electroplating fixture 100 is placed in the electroplating tank, the first conductive block 140 and the second conductive block 150 are supported on the conductive seat, and the cathode current is passed through, so that the current of the fixed conductive axis and the movable conductive axis can be independently controlled, thereby achieving the purpose of independently controlling the electroplating rate of the front and back sides of the silicon wafer to be plated.
[0072] The electroplating fixture 100 needs to be connected to the plated battery cell as a cathode during the electroplating process. If the same input current is used, the plated areas on the front and back sides are different, and thus the current density will be different, resulting in poor thickness uniformity on both sides of the battery during the electroplating process.
[0073] The above-mentioned electroplating equipment sets current contact points on each clamping point of the electroplating fixture 100, so that during the electroplating process, appropriate current can be passed according to the plated area and plated pattern on both sides of the cell, so that during the electroplating process, the current density of the areas to be plated on both sides of the cell is kept consistent, thereby achieving good uniformity in the electroplating process of both sides of the cell. This can simply and effectively solve the problem of obvious differences between the front and back sides due to the use of the same input current.
[0074] During electroplating, two conductive lines can be formed, namely:
[0075] First conductive block 140 → conductive frame 130 → fixed conductive plate 110 → fixed conductive shaft → first conductive clamping piece;
[0076] The second conductive block 150 →the conductive member 134 →the movable conductive plate 120 →the movable conductive shaft →the second conductive clamping piece.
[0077] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.
Claims
1. An electroplating fixture, comprising a fixed conductive plate (110) and a movable conductive plate (120), characterized in that: The electroplating fixture (100) further comprises: A conductive frame (130) connected to the fixed conductive plate (110); A first conductive block (140) is disposed on the conductive frame (130), and the first conductive block (140) is electrically connected to the fixed conductive plate (110) through the conductive frame (130); The second conductive block (150) is disposed on the conductive frame (130), the second conductive block (150) is insulated from the first conductive block (140), and the second conductive block (150) is electrically connected to the movable conductive plate (120).
2. The electroplating fixture according to claim 1, characterized in that: The conductive frame (130) is arranged on the outside of the fixed conductive plate (110).
3. The electroplating fixture according to claim 2, characterized in that: The conductive frame (130) comprises: A first bracket (131) is electrically connected to the fixed conductive plate (110), and the first bracket (131) extends in a direction away from the fixed conductive plate (110); a second bracket (132) connected to an end of the first bracket (131) away from the fixed conductive plate (110), and an angle is formed between the second bracket (132) and the first bracket (131); Wherein, the movable conductive plate (120) and the first conductive block (140) are respectively arranged on the second bracket (132).
4. The electroplating fixture according to claim 3, characterized in that: The movable conductive plate (120) is provided with a first through hole (1201), and the first bracket (131) passes through the first through hole (1201), so that the movable conductive plate (120) is located between the fixed conductive plate (110) and the second bracket (132).
5. The electroplating fixture according to any one of claims 1 to 4, characterized in that: The conductive frame (130) further comprises an insulating member (133), wherein the insulating member (133) is arranged between the first conductive block (140) and the movable conductive plate (120).
6. The electroplating fixture according to claim 5, characterized in that: The insulating member (133) comprises: A first insulating portion (1331) is provided between the first conductive block (140) and the movable conductive plate (120); The second insulating portion (1332) is provided between the first conductive block (140) and the second conductive block (150).
7. The electroplating fixture according to any one of claims 1 to 4, characterized in that: The conductive frame (130) also includes a conductive member (134), the conductive member (134) is electrically connected to the movable conductive plate (120), the first conductive block (140) is insulatedly connected to the conductive member (134), and the second conductive block (150) is electrically connected to the conductive member (134).
8. The electroplating fixture according to any one of claims 1 to 4, characterized in that: The first conductive block (140) and / or the second conductive block (150) has a structure that is wide at the top and narrow at the bottom.
9. An electroplating device, characterized in that: The electroplating equipment comprises an electroplating jig (100) according to any one of claims 1 to 8.
10. The electroplating equipment according to claim 9, characterized in that: The electroplating equipment also includes a conductive seat having a groove, the shape of the groove being adapted to the shapes of the first conductive block (140) and the second conductive block (150) of the electroplating fixture (100) so as to support the first conductive block (140) and the second conductive block (150).