Anti-micro-vibration base for photoetching machine

By adopting U-shaped longitudinal ribs and right-angle flanging structures in the anti-micro vibration base of the lithography machine, combined with AB glue to fix it, the problems of insufficient rigidity and unstable installation are solved, and high rigidity and low-cost protection are achieved Micro vibration effect.

CN222319286UActive Publication Date: 2025-01-07大连地拓精密科技股份有限公司
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Patent Information

Application Number
CN202421168165.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-27
Publication Date
2025-01-07
Estimated Expiration
2034-05-27

AI Technical Summary

Technical Problem

The problem of insufficient rigidity, unstable installation, complex production process and high cost.

Method used

A micro-vibration anti-pollution base including IF light source media base, MB-SF main unit base and WH-SF wafer processing unit base is designed, using a U-shaped vertical rib and left and right horizontal rib overlap structure, combined with right angle turn Double fixing mode of edge and AB glue improves the rigidity and stability of the base.

Benefits of technology

It significantly improves the rigidity and installation stability of the base, reduces the production and installation costs, and reaches the VC-C or VC-D level for anti-micro vibration.

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Abstract

The utility model provides an anti-microvibration base for a photoetching machine, which comprises an IF light source medium base, an MB-SF main body unit base and a WH-SF wafer processing unit base, both the MB-SF main body unit base and the WH-SF wafer processing unit base are welded into a frame structure by side plates, a plurality of cavities are arranged in the side plates, and the cavities are arranged in the frame structure. U-shaped longitudinal bars are arranged between the side plates and the cavities and between the cavities, the tops of the longitudinal bars are lower than the tops of the side plates, left-right transverse bars are arranged in the side plates and over the cavities, front-back transverse bars are welded to the outer sides of the longitudinal bars and the lower portions of the left-right transverse bars at equal intervals, and side bars are welded to the periphery of the inner side of the top of each side plate at equal intervals. A right-angle flange is arranged on the periphery of the outer side of the bottom of the side plate, and fixing pieces are installed on the right-angle flange at equal intervals. The base is large in rigidity, high in installation stability and high in micro-vibration prevention capacity, and the micro-vibration prevention level of the base can reach VC-C or VC-D.
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Description

Technical Field

[0001] The utility model relates to the technical field of vibration isolation devices, in particular to an anti-micro-vibration base for a photolithography machine. Background Art

[0002] At present, the semiconductor industry is developing rapidly. The precision requirements of semiconductor production equipment are getting higher and higher. The equipment is also more and more sensitive to the environment such as micro-vibration. A little micro-vibration will reduce the output yield of the equipment, or even make the equipment unable to work normally. Especially for photolithography machines, the micro-vibration caused by external environmental vibration and internal reaction force of the equipment is one of the key factors restricting manufacturing precision. High-performance precision micro-vibration isolation technology has become a core key technology in the fields of precision engineering and ultra-precision manufacturing. At present, the base of the photolithography machine is usually a combination of concrete and steel structure. The requirements for the manufacturing accuracy and rigidity of the base are very high, and the requirements for the flatness and stability of the base after installation are also very strict. The traditional anti-micro-vibration base of the photolithography machine has unreasonable arrangement of concrete single steel bars, insufficient rigidity, and weak anti-micro-vibration ability. It is usually installed and fixed with AB glue, which has the problem of instability. There are also grooves at the bottom of the base for installation and fixing, but the position of the groove is fixed, and it cannot be applied when the installation position is changed. The production process is complicated and the cost is high. Utility Model Content

[0003] The purpose of the utility model is to provide an anti-micro-vibration base for a photolithography machine to solve the problems existing in the above-mentioned background technology.

[0004] The technical solution of the utility model is achieved in this way:

[0005] An anti-micro-vibration base for a photolithography machine comprises an IF light source medium base, an MB-SF main unit base and a WH-SF wafer processing unit base, wherein the MB-SF main unit base and the WH-SF wafer processing unit base are both welded into a frame structure by side panels, a plurality of cavities are arranged inside the side panels, U-shaped longitudinal ribs are arranged between the side panels and the cavities and between the cavities, the top of the longitudinal ribs is lower than the top of the side panels, left and right transverse ribs are arranged inside the side panels and directly above the cavities, front and rear transverse ribs are welded at equal intervals on the outside of the longitudinal ribs and below the left and right transverse ribs, side ribs are welded at equal intervals around the inner side of the top of the side panel, the top of the side ribs is welded and fixed to the nearest longitudinal ribs, the gap between the side panel and the cavity is poured with concrete, a right-angle flange is arranged around the outer side of the bottom of the side panel, fixings are installed at equal intervals on the right-angle flange, and an L-shaped lap platform is also provided on the top of the side panel on one side of the MB-SF main unit base, The IF light source medium base is connected to the L-shaped overlap platform, and the fixing part includes a pressure plate, which is in a horizontal L-shape. A pad is arranged at the bottom of one end of the pressure plate, a bolt is installed through the middle of the top of the pressure plate, and a locking nut is installed above the pressure plate and on the bolt.

[0006] Furthermore, the IF light source medium base includes a top beam, a plurality of movable panels are installed on the top of the top beam, the movable panels are provided with openings, a plurality of legs are installed on the bottom of the top beam, a bottom plate is vertically welded to the bottom of the legs, and the bottom plate is provided with threaded holes.

[0007] Furthermore, the top beam of the IF light source medium base is connected to the L-shaped lap joint of the MB-SF main unit base.

[0008] Furthermore, the cavity is in the shape of an isosceles trapezoidal pyramid.

[0009] Furthermore, stainless steel fittings A are respectively installed at the four corners of the top of the MB-SF main unit base, and the stainless steel fittings A are welded and fixed to the side ribs.

[0010] Furthermore, four lifting accessories are installed in a rectangular arrangement on the top of the MB-SF main unit base, and the lifting accessories are provided with lifting threaded holes.

[0011] Furthermore, stainless steel accessories B are installed at the front and back of the top of the WH-SF wafer processing unit base respectively.

[0012] The beneficial effects of the utility model are:

[0013] The utility model designs a U-shaped longitudinal rib structure, overlaps the left and right transverse ribs and the front and rear transverse ribs, and arranges side ribs on the top of the base, thereby improving the rigidity of the MB-SF main unit base and the WH-SF wafer processing unit base.

[0014] The MB-SF main unit base and the WH-SF wafer processing unit base of the utility model are designed with a right-angle flange structure, and an overlapping fixing piece combined with an AB glue double fixing mode is adopted to bolt and glue the base to the ground. The stability of the base is significantly improved after installation, and the installation is convenient, the manufacturing process is simple, and the manufacturing and installation costs are reduced.

[0015] The utility model has a base with large rigidity, high installation stability and strong anti-micro-vibration capability, and its anti-micro-vibration level can reach VC-C or VC-D. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model.

[0017] Figure 2 This is a schematic diagram of the structure of the medium base of the IF light source of the utility model.

[0018] Figure 3 This is a schematic diagram of the base structure of the MB-SF main unit of the utility model.

[0019] Figure 4 This is a schematic diagram of the base structure of the 4WH-SF wafer processing unit of the utility model.

[0020] Figure 5 It is a cross-sectional view of the utility model taken along line AA.

[0021] Figure 6 It is a schematic diagram of the side reinforcement arrangement of the utility model.

[0022] Figure 7 This is a schematic diagram of the structure of the fixing member of the utility model.

[0023] In the figure, 1-IF light source medium base, 101-top beam, 102-movable panel, 103-opening, 104-leg, 105-bottom plate, 106-threaded hole, 2-MB-SF main unit base, 201-side plate, 202-cavity, 203-longitudinal ribs, 204-left and right transverse ribs, 205-front and rear transverse ribs, 206-side ribs, 207-concrete, 208-right angle flange, 209-L-shaped lap platform, 210-stainless steel accessories A, 211-lifting accessories, 212-lifting threaded holes, 3-WH-SF wafer processing unit base, 301 stainless steel accessories B, 4-fixing parts, 401-pressing plate, 402-pad, 403-bolts, 404-locking nuts. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solution of the utility model in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] like Figure 1-7 As shown, an anti-micro-vibration base for a photolithography machine includes an IF light source medium base 1, an MB-SF main unit base 2 and a WH-SF wafer processing unit base 3. The MB-SF main unit base 2 and the WH-SF wafer processing unit base 3 are welded into a frame structure by side plates 201. A plurality of cavities 202 are arranged inside the side plates 201. U-shaped longitudinal ribs 203 are arranged between the side plates 201 and the cavities 202 and between the cavities 202. The top of the longitudinal ribs 203 is lower than the top of the side plates 201. The inside of the side plates 201 and the upper part of the cavities 202 are arranged with longitudinal ribs 203 in a U shape. Left and right transverse ribs 204 are arranged, front and rear transverse ribs 205 are welded at equal intervals on the outside of the longitudinal ribs 203 and below the left and right transverse ribs 204, side ribs 206 are welded at equal intervals around the inner side of the top of the side panel 201, and the top of the side ribs 206 is welded and fixed to the nearest longitudinal ribs 203, concrete 207 is poured in the gap between the side panel 201 and the cavity 202, right-angle flanges 208 are arranged around the outer side of the bottom of the side panel 201, and fixing parts 4 are installed at equal intervals on the right-angle flanges 208, and an L-shaped overlap platform 209 is also provided on the top of the side panel 201 on one side of the base 1 of the MB-SF main unit, The IF light source medium base 1 is connected to the L-shaped lap platform 209, and the fixing part 4 includes a pressure plate 104. The pressure plate 401 is in a horizontal L-shape, and a pad 402 is arranged at the bottom of one end of the pressure plate 401. A through bolt 403 is installed in the middle of the top of the pressure plate 401, and a locking nut 404 is installed above the pressure plate 404 and on the bolt 403.

[0026] The IF light source medium base 1 includes a top beam 101, a plurality of movable panels 102 are installed on the top of the top beam 101, and openings 103 are provided on the movable panels 102. A plurality of legs 104 are installed on the bottom of the top beam 101, and a bottom plate 105 is vertically welded to the bottom of the legs 104, and threaded holes 106 are provided on the bottom plate 105.

[0027] The top beam 101 of the IF light source medium base 1 is connected to the L-shaped bridge 209 of the MB-SF main unit base 2 .

[0028] The cavity 202 is in the shape of an isosceles trapezoidal pyramid.

[0029] Stainless steel fittings A210 are respectively installed at the four corners of the top of the MB-SF main unit base 2, and the stainless steel fittings A210 are welded and fixed to the side ribs 206.

[0030] The top of the MB-SF main unit base 2 is provided with four hanging accessories 211 arranged in a rectangular shape, and the hanging accessories 211 are provided with hanging threaded holes 212 .

[0031] Stainless steel accessories B301 are installed on the front and back of the top of the WH-SF wafer processing unit base 3 respectively.

[0032] When installing the utility model, the MB-SF main unit base 2 and the WH-SF wafer processing unit base 3 are closely fitted, and the height difference is controlled to be less than 1mm. The bottom of the base is filled with AB glue to fix the base to the ground, and then the fixing part 4 is used to compact the right-angle flange 208 of the base. When the fixing part 4 is installed, it is installed along the right-angle flange 208 at equal intervals. One end of the pressure plate 401 of the fixing part 4 compacts the right-angle flange 208 and the other end compacts the pad 402. The bottom of the pad 402 is filled with AB glue and fixed to the ground, and then the bolt 403 is tightened by the locking nut 404 to fix the bolt 403 to the ground, so that the fixing part 4 is fixed to the ground and the right-angle flange 208 is compacted to fix the base; then the top beam 101 of the IF light source medium base 1 is connected to the L-shaped lap platform 209 of the MB-SF main unit base 2, and the bottom plate 105 is fixed to the ground by bolts passing through the threaded holes 106.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An anti-micro-vibration base for a photolithography machine, comprising an IF light source medium base, an MB-SF main unit base and a WH-SF wafer processing unit base, characterized in that: The MB-SF main unit base and the WH-SF wafer processing unit base are both welded into a frame structure by side panels, a number of cavities are arranged inside the side panels, U-shaped longitudinal ribs are arranged between the side panels and the cavities, and between the cavities, the top of the longitudinal ribs is lower than the top of the side panels, left and right transverse ribs are arranged inside the side panels and just above the cavities, front and rear transverse ribs are welded at equal intervals on the outside of the longitudinal ribs and below the left and right transverse ribs, side ribs are welded at equal intervals around the inner side of the top of the side panel, the top of the side ribs is welded and fixed to the nearest longitudinal ribs, the gap between the side panel and the cavity is poured with concrete, a right-angle flange is arranged around the outer side of the bottom of the side panel, and fixings are installed at equal intervals on the right-angle flange, and an L-shaped lap platform is also provided on the top of the side panel on one side of the MB-SF main unit base, The IF light source medium base is connected to the L-shaped overlap platform, and the fixing part includes a pressure plate, which is in a horizontal L-shape. A pad is arranged at the bottom of one end of the pressure plate, a bolt is installed through the middle of the top of the pressure plate, and a locking nut is installed above the pressure plate and on the bolt.

2. The anti-micro-vibration base for a photolithography machine according to claim 1, characterized in that: The IF light source medium base includes a top beam, a plurality of movable panels are installed on the top of the top beam, the movable panels are provided with openings, a plurality of legs are installed at the bottom of the top beam, a bottom plate is vertically welded to the bottom of the legs, and threaded holes are opened on the bottom plate.

3. The anti-microvibration base for a photolithography machine according to claim 1, characterized in that: The top beam of the IF light source medium base is connected to the L-shaped lap platform of the MB-SF main unit base.

4. The anti-microvibration base for a photolithography machine according to claim 1, characterized in that: The cavity is in the shape of an isosceles trapezoidal pyramid.

5. The anti-microvibration base for a photolithography machine according to claim 1, characterized in that: Stainless steel fittings A are respectively installed at the four corners of the top of the MB-SF main unit base, and the stainless steel fittings A are welded and fixed to the side ribs.

6. The anti-microvibration base for a photolithography machine according to claim 1, characterized in that: The top of the MB-SF main unit base is provided with four lifting accessories arranged in a rectangular shape, and the lifting accessories are provided with lifting threaded holes.

7. The anti-microvibration base for a photolithography machine according to claim 1, characterized in that: Stainless steel accessories B are installed on the front and back of the top of the WH-SF wafer processing unit base respectively.