Small-size packaging device of three-pin TVS and ESD electrostatic protection tube
By using a combination of insulated base islands, wafers and connecting lines in tripod TVS and ESD electrostatic protection tubes, a small volume packaging structure is formed, which solves the problem that the existing technology cannot meet the small volume requirements, and realizes installation and updates in limited space Multi-component and cost-reducing effects.
Patent Information
- Application Number
- CN202420800505.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-17
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-04-17
AI Technical Summary
The packaging structure of the existing three-pin TVS and ESD electrostatic protection tubes cannot meet the needs of small-volume electronic products, cannot install more components in a limited board-level space, and has many production processes and high costs.
By setting up the insulated base island, ESD electrostatic protection wafer, pins and connecting wires, a three-pin small-volume package DFN0603-3 size electrostatic protection device is formed, and the insulating glue is bonded and connected to the connecting wires to form a small-volume package structure.
The ability to install more components in a limited space is realized, the production process and usage costs are reduced, and the demand for small-volume components of new electronic products is adapted to the needs of new electronic products.
Smart Images

Figure CN222320242U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a small-volume packaging device for a three-pin TVS and an ESD electrostatic protection tube. Background Art
[0002] The packaging of three-pin TVS and ESD electrostatic protection tubes provides efficient electrostatic and surge protection. In the prior art, during the packaging process of three-pin TVS and ESD electrostatic protection tubes, with the demand for the development of smaller and smaller electronic products, the packaging structure in the prior art can no longer meet the small-volume usage requirements. For this reason, we propose a small-volume packaging device for three-pin TVS and ESD electrostatic protection tubes. Utility Model Content
[0003] Therefore, the purpose of the utility model is to provide a small-volume packaging device for a three-pin TVS and ESD electrostatic protection tube. Through the cooperation of the set insulating base island, ESD electrostatic protection wafer, pins and connecting wires, a three-pin small-volume package DFN0603-3 size electrostatic protection device is formed to form a small-volume packaging structure to meet the needs of new electronic products for small-volume components. The small-volume packaging allows more components to be installed in a limited board-level space, and the distribution of a single wafer reduces the production process and reduces the cost of use.
[0004] To solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical solution: a small-volume packaging device of a three-pin TVS and an ESD electrostatic protection tube, comprising an insulating base island, on the surface of which a first ESD electrostatic protection wafer, a second ESD electrostatic protection wafer and a third ESD electrostatic protection wafer are sequentially distributed, and the first ESD electrostatic protection wafer, the second ESD electrostatic protection wafer and the third ESD electrostatic protection wafer are respectively connected to a first pin, a second pin and a third pin.
[0005] As a preferred solution for the small-volume packaging device of the three-pin TVS and ESD electrostatic protection tube described in the utility model, the first ESD electrostatic protection wafer, the second ESD electrostatic protection wafer and the third ESD electrostatic protection wafer are respectively adhered to the insulating base island by insulating glue.
[0006] As a preferred solution for the small-volume packaging device of the three-pin TVS and ESD electrostatic protection tube described in the utility model, one side of the first ESD electrostatic protection wafer, the second ESD electrostatic protection wafer and the third ESD electrostatic protection wafer are respectively connected with the first connecting line, the second connecting line and the third connecting line.
[0007] As a preferred solution for the small-volume packaging device of the three-pin TVS and ESD electrostatic protection tube described in the utility model, the first connecting wire, the second connecting wire and the third connecting wire are respectively connected to the first pin, the second pin and the third pin.
[0008] As an optimal solution for the small-volume packaging device of the three-pin TVS and ESD electrostatic protection tube described in the utility model, the insulating base island, the first ESD electrostatic protection wafer, the second ESD electrostatic protection wafer, the third ESD electrostatic protection wafer, the first pin, the second pin and the third pin constitute a three-pin small-volume package DFN0603-3 size electrostatic protector device.
[0009] As a preferred solution of the small-volume packaging device of the three-pin TVS and ESD electrostatic protection tube described in the utility model, the first pin, the second pin and the third pin are marked as P1, P2 and P3 respectively.
[0010] Compared with the prior art, the utility model has the advantages that: through the cooperation of the set insulating base island, ESD electrostatic protection wafer, pins and connecting wires, a three-pin small-volume package DFN0603-3 size electrostatic protection device is formed, forming a small-volume packaging structure, which meets the needs of new electronic products for small-volume components. The small-volume package allows more components to be installed in a limited board-level space, and the distribution of a single wafer reduces the production process and reduces the cost of use. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solution of the implementation of the utility model, the utility model will be described in detail below in combination with the drawings and detailed implementation. Obviously, the drawings described below are only some implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:
[0012] Figure 1 It is a structural diagram of the utility model;
[0013] Figure 2 This is the electrical principle structure diagram of the utility model.
[0014] In the figure: 1. Insulating base island; 2. First ESD electrostatic protection wafer; 3. Second ESD electrostatic protection wafer; 4. Third ESD electrostatic protection wafer; 5. First pin; 6. Second pin; 7. Third pin; 8. First connecting line; 9. Second connecting line; 10. Third connecting line. DETAILED DESCRIPTION
[0015] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.
[0016] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific implementation methods disclosed below.
[0017] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.
[0018] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.
[0019] The utility model provides a small-volume packaging device for a three-pin TVS and ESD electrostatic protection tube. Through the cooperation of an insulating base island, an ESD electrostatic protection wafer, pins and connecting wires, a three-pin small-volume package DFN0603-3 size electrostatic protection device is formed, forming a small-volume packaging structure to meet the needs of new electronic products for small-volume components. The small-volume packaging allows more components to be installed in a limited board-level space, and the distribution of a single wafer reduces the production process and reduces the use cost.
[0020] Figure 1 , Figure 2 The figure shows the overall structure of a small volume packaging device for a three-pin TVS and ESD electrostatic protection tube of the utility model, see Figure 1 , Figure 2 The main structure of this embodiment is an insulating base island 1, and the surface of the insulating base island 1 is sequentially distributed with a first ESD electrostatic protection wafer 2, a second ESD electrostatic protection wafer 3 and a third ESD electrostatic protection wafer 4, and the first ESD electrostatic protection wafer 2, the second ESD electrostatic protection wafer 3 and the third ESD electrostatic protection wafer 4 are respectively connected with a first pin 5, a second pin 6 and a third pin 7;
[0021] During specific use, the first ESD electrostatic protection wafer 2, the second ESD electrostatic protection wafer 3 and the third ESD electrostatic protection wafer 4 are adhered to the top surface of the insulating base island 1 by glue, so that they are fitted and pressed. At this time, the first ESD electrostatic protection wafer 2, the second ESD electrostatic protection wafer 3 and the third ESD electrostatic protection wafer 4 are respectively connected to the first pin 5, the second pin 6 and the third pin 7 through the first connecting line 8, the second connecting line 9 and the third connecting line 10, forming a three-pin small-volume package DFN0603-3 size electrostatic protection device, forming a small-volume packaging structure to meet the needs of new electronic products for small-volume components. The small-volume package allows more components to be installed in a limited board-level space, and the distribution of a single wafer reduces the production process and reduces the cost of use.
[0022] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A small-volume packaging device for a three-pin TVS and ESD electrostatic protection tube, comprising an insulating base island (1), characterized in that: A first ESD electrostatic protection wafer (2), a second ESD electrostatic protection wafer (3) and a third ESD electrostatic protection wafer (4) are sequentially distributed on the surface of the insulating base island (1), and the first ESD electrostatic protection wafer (2), the second ESD electrostatic protection wafer (3) and the third ESD electrostatic protection wafer (4) are respectively connected to a first pin (5), a second pin (6) and a third pin (7).
2. The small volume packaging device of the three-pin TVS and ESD electrostatic protection tube according to claim 1 is characterized in that: The first ESD electrostatic protection wafer (2), the second ESD electrostatic protection wafer (3) and the third ESD electrostatic protection wafer (4) are respectively adhered to the insulating base island (1) by insulating glue.
3. The small volume packaging device of the three-pin TVS and ESD electrostatic protection tube according to claim 2 is characterized in that: One side of the first ESD electrostatic protection wafer (2), the second ESD electrostatic protection wafer (3) and the third ESD electrostatic protection wafer (4) is respectively connected to a first connecting line (8), a second connecting line (9) and a third connecting line (10).
4. The small volume packaging device of the three-pin TVS and ESD electrostatic protection tube according to claim 3 is characterized in that: The first connecting wire (8), the second connecting wire (9) and the third connecting wire (10) are respectively connected to the first pin (5), the second pin (6) and the third pin (7).
5. The small volume packaging device of the three-pin TVS and ESD electrostatic protection tube according to claim 4 is characterized in that: The insulating base island (1), the first ESD electrostatic protection wafer (2), the second ESD electrostatic protection wafer (3), the third ESD electrostatic protection wafer (4), the first pin (5), the second pin (6) and the third pin (7) form a three-pin small-volume package DFN0603-3 size electrostatic protector device.
6. The small volume packaging device of the three-pin TVS and ESD electrostatic protection tube according to claim 5 is characterized in that: The first pin (5), the second pin (6) and the third pin (7) are labeled P1, P2 and P3 respectively.