Flexible electrical connection structure

Abstract

The utility model discloses a flexible electric connection structure, which comprises a first thin film layer, a base material layer and a second thin film layer which are stacked in sequence, one surface of the base material layer is bonded with a first conducting layer formed by a first metal wire through a first adhesive layer, and the other surface of the base material layer is bonded with a second conducting layer formed by a second metal wire through a second adhesive layer. The other surface of the base material layer is bonded with a second conductive layer composed of a second metal wire through a second adhesive layer, a base material through hole is formed in the area, located between the first winding area and the second winding area, of the base material layer, and a first through hole and a second through hole are formed in the positions, corresponding to the base material through hole, of the first thin film layer and the second thin film layer respectively. A pin terminal is embedded into the first through hole, the first winding area, the base material through hole, the second winding area and the second through hole. A conductive solder paste column is located between the pin terminal and the first through hole, the first winding area, the base material through hole, the second winding area and the second through hole. According to the utility model, electrical signal transmission with the periphery is realized through the contact pin, the application scene is expanded, and the contact resistance is reduced at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a flexible electrical connection structure. Background Art

[0002] The main power source of electric vehicles is the power battery pack, which generally includes battery modules and sampling circuits. In order to regularize and simplify the wiring harness of the sampling circuit, flexible circuit boards with a large number of integrated wiring harnesses are often used as sampling circuits. However, the current flexible circuit boards are mainly made by etching process, which has many and complex processes, high processing costs, single connection methods, and poor reliability of signal transmission. Utility Model Content

[0003] The purpose of the utility model is to provide a flexible electrical connection structure, which can transmit signals in the upper and lower layers simultaneously, thereby improving the reliability of signal transmission and realizing the transmission of electrical signals with the periphery through pins, thereby expanding the application scenarios and reducing the contact resistance.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a flexible electrical connection structure, comprising a first film layer, a substrate layer, and a second film layer stacked in sequence, a first conductive layer composed of a first metal wire bonded to one surface of the substrate layer through a first adhesive layer, a second conductive layer composed of a second metal wire bonded to the other surface of the substrate layer through a second adhesive layer, the first conductive layer having a plurality of first winding areas formed by winding a plurality of turns of the first metal wire, and the second conductive layer having a plurality of second winding areas formed by winding a plurality of turns of the second metal wire;

[0005] The first winding area is located directly above the second winding area, a substrate through hole is opened in the area of ​​the substrate layer located between the first winding area and the second winding area, the first film layer and the second film layer are respectively opened with a first through hole and a second through hole at positions corresponding to the substrate through hole, a pin terminal is embedded in the first through hole, the first winding area, the substrate through hole, the second winding area and the second through hole, and a conductive solder paste column is located between the pin terminal and the first through hole, the first winding area, the substrate through hole, the second winding area and the second through hole.

[0006] The further improved scheme in the above technical scheme is as follows:

[0007] 1. In the above scheme, the substrate through hole is located between the center of the first winding area and the center of the second winding area.

[0008] 2. In the above solution, the diameter of the substrate through hole is smaller than the diameters of the first through hole and the second through hole.

[0009] 3. In the above scheme, the number of turns of the first winding area is 3 to 8 turns.

[0010] 4. In the above solution, the number of turns of the second winding area is 3 to 8.

[0011] 5. In the above solution, the first film layer, the substrate layer, and the second film layer are PET film, PBT film or PI film.

[0012] 6. In the above solution, the first metal wire and the second metal wire are copper wires, aluminum wires or aluminum alloy wires.

[0013] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0014] 1. The utility model has a flexible electrical connection structure, wherein the first conductive layer has a plurality of first winding areas formed by winding a plurality of turns of a first metal wire, the second conductive layer has a plurality of second winding areas formed by winding a plurality of turns of a second metal wire, the pin terminal is embedded in the first through hole, the first winding area, the substrate through hole, the second winding area and the second through hole, a conductive solder paste column is located between the pin terminal and the first through hole, the first winding area, the substrate through hole, the second winding area and the second through hole, and the signal is transmitted simultaneously in the upper and lower layers of the circuit board, thereby improving the reliability of signal transmission of the flexible electrical connection structure, and also realizing the transmission of electrical signals between the flexible electrical connection structure and the peripheral through the pin, thereby expanding the application scenarios and reducing the contact resistance.

[0015] 2. In the flexible electrical connection structure of the utility model, a first conductive layer composed of a first metal wire is bonded to one surface of the substrate layer through a first adhesive layer, and a second conductive layer composed of a second metal wire is bonded to the other surface of the substrate layer through a second adhesive layer, which effectively avoids the degradation of signal transmission quality caused by the detachment of the metal wire and the substrate layer, and the conductive layer composed of the metal wire improves the bending performance, thereby further improving the bending resistance of the flexible electrical connection structure and the stability of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 It is a schematic diagram of the structural decomposition of the flexible electrical connection structure of the utility model;

[0017] Attached Figure 2 It is a schematic front view of the structure of the flexible electrical connection structure of the utility model;

[0018] Attached Figure 3 The utility model is a flexible electrical connection structure along Figure 2 Schematic diagram of the cross section along the AA direction;

[0019] Attached Figure 4 The utility model is a flexible electrical connection structure along Figure 2 Schematic diagram of the cross section along the BB direction.

[0020] In the above figures: 1. substrate layer; 2. first film layer; 3. second film layer; 4. first adhesive layer; 5. second adhesive layer; 6. first metal wire; 7. second metal wire; 8. first conductive layer; 9. second conductive layer; 10. first winding area; 11. second winding area; 12. substrate through hole; 13. first through hole; 14. second through hole; 15. conductive solder paste column; 16. pin terminal. DETAILED DESCRIPTION

[0021] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0022] Embodiment 1: A flexible electrical connection structure, comprising a first film layer 2, a substrate layer 1, and a second film layer 3 stacked in sequence, wherein a first conductive layer 8 composed of a first metal wire 6 is bonded to one surface of the substrate layer 1 through a first adhesive layer 4, and a second conductive layer 9 composed of a second metal wire 7 is bonded to the other surface of the substrate layer 1 through a second adhesive layer 5, wherein the first conductive layer 8 has a plurality of first winding areas 10 formed by winding a plurality of turns of the first metal wire 6, and the second conductive layer 9 has a plurality of second winding areas 11 formed by winding a plurality of turns of the second metal wire 7;

[0023] The first winding area 10 is located directly above the second winding area 11, and a substrate through hole 12 is opened in the area of ​​the substrate layer 1 located between the first winding area 10 and the second winding area 11. The first film layer 2 and the second film layer 3 are respectively opened with a first through hole 13 and a second through hole 14 at positions corresponding to the substrate through hole 12. A pin terminal 16 is embedded in the first through hole 13, the first winding area 10, the substrate through hole 12, the second winding area 11 and the second through hole 14. A conductive solder paste column 15 is located between the pin terminal 16 and the first through hole 13, the first winding area 10, the substrate through hole 12, the second winding area 11 and the second through hole 14.

[0024] The substrate through hole 12 is located between the center of the first winding area 10 and the center of the second winding area 11;

[0025] like Figure 1 As shown, the diameter of the substrate through hole 12 is smaller than the diameters of the first through hole 13 and the second through hole 14;

[0026] The number of turns of the first winding area 10 is 4; the number of turns of the second winding area 11 is 4;

[0027] The first film layer 2, the substrate layer 1, and the second film layer 3 are PET films; the first metal wires 6 and the second metal wires 7 are copper wires.

[0028] Embodiment 2: A flexible electrical connection structure, comprising a first film layer 2, a substrate layer 1, and a second film layer 3 stacked in sequence, wherein a first conductive layer 8 composed of a first metal wire 6 is bonded to one surface of the substrate layer 1 through a first adhesive layer 4, and a second conductive layer 9 composed of a second metal wire 7 is bonded to the other surface of the substrate layer 1 through a second adhesive layer 5, wherein the first conductive layer 8 has a plurality of first winding areas 10 formed by winding a plurality of turns of the first metal wire 6, and the second conductive layer 9 has a plurality of second winding areas 11 formed by winding a plurality of turns of the second metal wire 7;

[0029] The first winding area 10 is located directly above the second winding area 11, and a substrate through hole 12 is opened in the area of ​​the substrate layer 1 located between the first winding area 10 and the second winding area 11. The first film layer 2 and the second film layer 3 are respectively opened with a first through hole 13 and a second through hole 14 at positions corresponding to the substrate through hole 12. A pin terminal 16 is embedded in the first through hole 13, the first winding area 10, the substrate through hole 12, the second winding area 11 and the second through hole 14. A conductive solder paste column 15 is located between the pin terminal 16 and the first through hole 13, the first winding area 10, the substrate through hole 12, the second winding area 11 and the second through hole 14.

[0030] The number of turns of the first winding area 10 is 7; the number of turns of the second winding area 11 is 7;

[0031] The first film layer 2, the substrate layer 1, and the second film layer 3 are PI films; the first metal wire 6 and the second metal wire 7 are aluminum alloy wires.

[0032] When the above-mentioned flexible electrical connection structure is used, the signal is transmitted simultaneously in the upper and lower layers of the circuit board, which improves the reliability of signal transmission of the flexible electrical connection structure, and also realizes the transmission of electrical signals between the flexible electrical connection structure and the peripheral through the pins, which expands the application scenarios and reduces the contact resistance.

[0033] In addition, it effectively avoids the degradation of signal transmission quality caused by the detachment of the metal wire and the substrate layer, and the conductive layer composed of the metal wire improves the bending performance, thereby further improving the bending resistance of the flexible electrical connection structure and the stability of signal transmission.

[0034] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with the technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A flexible electrical connection structure, characterized in that: The invention comprises a first film layer (2), a substrate layer (1), and a second film layer (3) stacked in sequence, wherein a first conductive layer (8) composed of a first metal wire (6) is bonded to one surface of the substrate layer (1) via a first adhesive layer (4), and a second conductive layer (9) composed of a second metal wire (7) is bonded to the other surface of the substrate layer (1) via a second adhesive layer (5), the first conductive layer (8) has a plurality of first winding areas (10) formed by winding the first metal wire (6) a plurality of turns, and the second conductive layer (9) has a plurality of second winding areas (11) formed by winding the second metal wire (7) a plurality of turns; The first winding area (10) is located directly above the second winding area (11); a substrate through hole (12) is formed in the area of ​​the substrate layer (1) between the first winding area (10) and the second winding area (11); a first through hole (13) and a second through hole (14) are formed in the first film layer (2) and the second film layer (3) at positions corresponding to the substrate through hole (12); a pin terminal (16) is embedded in the first through hole (13), the first winding area (10), the substrate through hole (12), the second winding area (11) and the second through hole (14); and a conductive solder paste column (15) is located between the pin terminal (16) and the first through hole (13), the first winding area (10), the substrate through hole (12), the second winding area (11) and the second through hole (14).

2. The flexible electrical connection structure according to claim 1, characterized in that: The substrate through hole (12) is located between the center of the first winding area (10) and the center of the second winding area (11).

3. The flexible electrical connection structure according to claim 1, characterized in that: The diameter of the substrate through hole (12) is smaller than the diameters of the first through hole (13) and the second through hole (14).

4. The flexible electrical connection structure according to claim 1, characterized in that: The number of turns of the first winding area (10) is 3 to 8.

5. The flexible electrical connection structure according to claim 1, characterized in that: The number of turns of the second winding area (11) is 3 to 8 turns.

6. The flexible electrical connection structure according to claim 1, characterized in that: The first film layer (2), the substrate layer (1), and the second film layer (3) are PET films, PBT films, or PI films.

7. The flexible electrical connection structure according to claim 1, characterized in that: The first metal wire (6) and the second metal wire (7) are copper wires, aluminum wires or aluminum alloy wires.

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