Heat dissipation structure with long service life and high heat conduction efficiency

Abstract

In the embodiment of the invention, compared with the prior art that heat-conducting silica gel is low in efficiency and easy to damage, the heat dissipation effect is affected, the energy efficiency and the service life of an inverter are reduced, and the wiring and connection modes of devices of an existing heat dissipation device are complicated, the heat dissipation structure with the long service life and the high heat conduction efficiency is provided. The heat dissipation structure is used for dissipating heat of a heating device in a PCB (printed circuit board) of the inverter, and specifically comprises a heat dissipation shell, a fixed frame and a heat conduction gasket, the fixing frames are arranged on the surface of the inner wall of the heat dissipation shell in a protruding mode and correspond to the heating devices in a one-to-one mode, and the heat conduction gaskets are arranged in the fixing frames and attached to the heating devices. The protruding fixing frame is designed on the inner wall of the inverter shell, the heat conduction gasket is placed in the fixing frame, the heating device makes full contact with the heat conduction gasket, the heat dissipation efficiency of the device is improved, the energy efficiency of the inverter is improved, and the service life of the inverter is prolonged. The structural design is simple, influences on other devices are avoided, and practicability is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of inverters, in particular to a heat dissipation structure with long service life and high thermal conductivity efficiency. Background Art

[0002] With the country's vigorous promotion of clean energy, the widespread application of distributed power stations has put forward more stringent requirements on the performance of power station equipment. The inverter, as the core component of the power station, is also a semiconductor product. Its operating efficiency and service life are restricted by the operating temperature. In view of this, reducing the operating temperature is crucial to improving the energy efficiency and service life of the inverter.

[0003] Traditional inverter heat dissipation design usually uses a thermally conductive silicone pad placed at the bottom of the metal shell, and then presses the power tube of the PCB circuit board onto the metal shell to transfer the heat to the shell, and then dissipates the heat through air convection. Due to the low thermal conductivity of rubber materials, the local temperature is high, and it is easy to age, crack and dry out during long-term use, affecting the heat dissipation effect, causing the power tube to be damaged due to overheating. Although air-cooled heat dissipation mechanisms have been introduced in the prior art, such as adding cooling fans and other heat dissipation devices to deal with high-heat-generating devices, it also increases the volume of the inverter box and makes the wiring and connection of the devices in the inverter box complicated, which brings inconvenience to the replacement and maintenance of the devices. Utility Model Content

[0004] In view of the above problems, embodiments of the present utility model are proposed to provide a heat dissipation structure with long life and high thermal conductivity efficiency, which overcomes the above problems or at least partially solves the above problems.

[0005] A heat dissipation structure with long service life and high thermal conductivity is used to dissipate heat from a heat generating device in a PCB circuit board of an inverter. The heat dissipation structure comprises a heat dissipation housing, a fixing frame and a thermally conductive pad;

[0006] The fixing frame is protrudingly arranged on the inner wall surface of the heat dissipation shell and corresponds to the heating device one by one. The thermal conductive pad is arranged in the fixing frame and fits the heating device.

[0007] Preferably, the thermally conductive gasket is a thermally conductive ceramic gasket.

[0008] Preferably, the fixing frame is integrally formed on the inner wall surface of the heat dissipation housing.

[0009] Preferably, the fixing frame is detachably mounted on the inner wall surface of the heat dissipation housing.

[0010] Preferably, the shape and size of the fixing frame are compatible with the shape and size of the heating device and the thermally conductive pad.

[0011] Preferably, a fixing mechanism is provided on the inner wall of the heat dissipation housing, and the PCB circuit board is fixedly mounted on the heat dissipation housing through the fixing mechanism.

[0012] Preferably, the fixing mechanism comprises a fixing column arranged on the inner wall surface of the heat dissipation housing, and a positioning edge arranged on the side surface of the inner wall of the heat dissipation housing.

[0013] Preferably, the outer wall of the heat dissipation housing is provided with heat dissipation fins.

[0014] Preferably, mounting holes are arranged on the top of four sides of the heat dissipation housing.

[0015] Preferably, thermal conductive silicone grease is also included, and the thermal conductive silicone grease is evenly covered on the surface of the thermal conductive gasket.

[0016] This application has the following advantages:

[0017] In the embodiments of the present application, relative to the problem in the prior art that "the inefficiency and fragility of thermal conductive silicone affect heat dissipation, resulting in reduced energy efficiency and life of the inverter, and the existing heat dissipation device complicates the wiring and connection of the device", the present application provides a heat dissipation structure with a long life and high thermal conductivity efficiency having a fixed frame, specifically: the heat dissipation structure includes a heat dissipation shell, a fixed frame and a thermal conductive gasket; the fixed frame is protrudingly arranged on the inner wall surface of the heat dissipation shell, and corresponds to the heating device one by one, and the thermal conductive gasket is arranged in the fixed frame and fits with the heating device. By designing a protruding fixed frame on the inner wall surface of the inverter shell and placing a thermal conductive gasket in the fixed frame, the heating device of the PCB circuit board is fully contacted with the thermal conductive gasket, so that heat is conducted in a timely and effective manner, the heat dissipation efficiency of the device is improved, and the energy efficiency of the inverter is enhanced and its service life is extended. In addition, the heat dissipation structure of the present application is simple in design, occupies a small volume, avoids the influence on the wiring and connection of other devices, and has certain practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the description of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1 It is a structural schematic diagram of a heat dissipation structure with long service life and high thermal conductivity efficiency of the utility model;

[0020] Figure 2 It is a structural schematic diagram of an internally protruding fixing frame of a heat dissipation structure with a long service life and high thermal conductivity efficiency of the utility model;

[0021] Figure 3 It is a schematic diagram of a top view of a heat dissipation structure with a long service life and high thermal conductivity of the utility model;

[0022] 1. Heat dissipation shell; 2. Fixed frame; 3. Thermal conductive pad; 4. Fixed column; 5. Positioning edge; 6. Positioning hole; 7. Heat dissipation fin. DETAILED DESCRIPTION

[0023] In order to make the objects, features and advantages of the present application more obvious and understandable, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0024] The inventors analyzed the prior art and found that the traditional inverter heat dissipation design uses a thermally conductive silicone pad placed at the bottom of the metal shell to conduct heat, but its thermal conductivity is low and it is prone to aging, cracking and drying up under long-term operation, which reduces the heat dissipation effect and thus reduces the energy efficiency and service life of the inverter. The prior art introduces an air-cooled heat dissipation mechanism, and the additional heat dissipation device added to the inverter reduces the temperature inside the box, but it also increases the volume of the inverter box and complicates the wiring and connection methods of the components inside the box.

[0025] Reference Figure 1-3 , showing a schematic structural diagram of a long-life, high-thermal-conductivity heat dissipation structure of the utility model, which may specifically include the following structures: a heat dissipation shell 1, a fixing frame 2 and a thermally conductive gasket 3; the fixing frame 2 is protrudingly arranged on the inner wall surface of the heat dissipation shell 1, and corresponds one-to-one with the heat-generating device, and the thermally conductive gasket 3 is arranged in the fixing frame 2 and fits with the heat-generating device.

[0026] In the embodiment of the present application, relative to the problem in the prior art that "the heat-conducting silica gel is inefficient and easy to damage, which affects the heat dissipation effect, resulting in reduced energy efficiency and life of the inverter, and the existing heat dissipation device complicates the wiring and connection of the device", the present application provides a heat dissipation structure with a long life and high heat conductivity efficiency having a fixed frame, which is used to dissipate heat from the heating device in the PCB circuit board of the inverter, specifically: the heat dissipation structure includes a heat dissipation shell 1, a fixed frame 2 and a heat-conducting pad 3; the fixed frame 2 is protrudingly arranged on the inner wall surface of the heat dissipation shell 1, and corresponds to the heating device one by one, and the heat-conducting pad 3 is arranged in the fixed frame 2 and fits with the heating device. By designing a protruding fixed frame on the inner wall surface of the inverter shell, and placing a heat-conducting pad in the fixed frame, the heating device of the PCB circuit board is fully contacted with the heat-conducting pad, so as to conduct heat in a timely and effective manner, improve the heat dissipation efficiency of the device, and enhance the energy efficiency of the inverter and extend its service life. In addition, the heat dissipation structure of the present application is simple in design, occupies a small volume, avoids the influence on the wiring and connection of other devices, and is practical.

[0027] Next, a heat dissipation structure with long life and high thermal conductivity in this exemplary embodiment will be further described.

[0028] In one embodiment of the present application, the heat dissipation structure includes a heat dissipation shell 1, a fixed frame 2 and a thermally conductive gasket 3; the fixed frame 2 is protrudingly arranged on the inner wall surface of the heat dissipation shell 1 and corresponds one-to-one with the heat generating device, and the thermally conductive gasket 3 is arranged in the fixed frame 2 and fits with the heat generating device.

[0029] As an example, the heat dissipation shell 1 is made of metal material, such as iron, copper, aluminum, etc., preferably aluminum; the fixed frame 2 can be set in multiples according to the layout of the heating devices on the PCB circuit board, and the thermal conductive gasket 3 is placed in the fixed frame 2, so that the position of the thermal conductive gasket 3 is relatively fixed; preferably, the thickness of the thermal conductive gasket 3 can be lower than the height of the fixed frame 2, so that some heating devices are placed in the fixed frame 2, the heat dissipation effect is better, and the structure is more stable.

[0030] In a specific embodiment, the heat dissipation housing 1 is a metal shell with an open side, and a cavity structure is formed inside. The PCB circuit board is placed in the cavity structure, and the position of the fixed frame 2 on the heat dissipation housing 1 is determined according to the layout of the heating device on the PCB circuit board, so that the position of the fixed frame 2 corresponds to the position of the heating device, and a thermal pad 3 lower than its height is placed in the fixed frame 2 to limit the placement position, and the thermal pad 3 fits tightly with the heat dissipation housing 1 on one side and the heating device on the other side. During the operation of the inverter, the heating device conducts the heat generated during operation to the thermal pad 3, and the heat is further conducted to the heat dissipation housing 1 through the efficient thermal conductivity of the thermal pad 3. The heat dissipation housing 1 dissipates the absorbed heat to the external environment, so that the inverter can operate stably within a suitable operating temperature range.

[0031] It should be noted that the inverter is a converter that converts DC power into constant frequency and voltage or frequency and voltage regulated AC power. The heating device of the inverter can be a MOS tube or an IGBT tube. In this embodiment, the main function of the MOS tube in the AC inverter is to control the switching of the current to realize the conversion of electrical energy. It can realize precise control of the current and improve the working efficiency of the AC inverter.

[0032] In an embodiment of the present application, the thermally conductive gasket 3 is a thermally conductive ceramic gasket.

[0033] It should be noted that the thermally conductive gasket 3 is made of a material with high thermal conductivity. In this embodiment, the thermally conductive gasket 3 is preferably a thermally conductive ceramic gasket. Compared with traditional thermally conductive silicone materials, ceramics are made of alumina as the main raw material, supplemented by rare metal oxides as fluxing agents, and are special corundum ceramic materials prepared through a high-temperature sintering process at 1,700 degrees Celsius. They have high thermal conductivity, high temperature resistance, corrosion resistance, high hardness and excellent wear resistance. Therefore, they have stronger heat dissipation and higher structural strength, which makes the inverter have a longer service life.

[0034] In an embodiment of the present application, the fixing frame 2 is integrally formed on the inner wall surface of the heat dissipation housing 1 .

[0035] It should be noted that the fixing frame 2 is integrally formed on the inner wall surface of the heat dissipation housing 1 , has a simple structure, occupies a small volume, simplifies the manufacturing process of the heat dissipation structure, and facilitates processing and forming.

[0036] In an embodiment of the present application, the fixing frame 2 is detachably mounted on the inner wall surface of the heat dissipation housing 1 .

[0037] As an example, the fixing frame 2 is detachably mounted on the inner wall surface of the heat dissipation housing 1 by a fastening device, and the fastening device can be a screw nut structure and a snap-fit ​​structure.

[0038] In a specific embodiment, the fastening device is a screw-nut structure, the fixing frame is penetrated with round holes on all sides, and the corresponding position of the shell also has round holes, and the fixing frame and the heat dissipation shell are fastened and installed by screws and nuts. When the number, position and shape of the inverter need to be adjusted, any one of the fixing frames 2 can be disassembled and assembled separately, which is low in cost and practical. While saving materials and reducing processing time, it can also be customized according to specific application requirements to meet the heat dissipation requirements of inverters of different specifications.

[0039] In an embodiment of the present application, the shape and size of the fixing frame 2 are adapted to the size of the heating device and the thermally conductive pad 3 .

[0040] As an example, the size of the fixing frame 2 is determined according to the shape and size of the heating device, and the size of the thermal pad 3 is determined according to the size of the fixing frame 2. Each fixing frame 2 corresponds to a heating device, and each fixing frame 2 corresponds to a thermal pad 3.

[0041] In a specific embodiment, the shape and size of the fixing frame 2 are the same as the shape and size of the heating device. Correspondingly, the shape and size of the thermally conductive gasket 3 are the same as the heating device. After all structures are installed, the projection of the heating device on the heat dissipation housing 1 coincides with the position of the thermally conductive gasket 3, so that the heat dissipation is only directed to the main heating device without affecting other devices on the PCB circuit board. While ensuring the heat dissipation effect, there is no damage to the device, and the material used for the thermally conductive gasket 3 can also be saved to reduce costs.

[0042] In one embodiment of the present application, a fixing mechanism is provided on the inner wall of the heat dissipation housing 1 , and the PCB circuit board is positioned, installed and fixed to the heat dissipation housing 1 through the fixing mechanism.

[0043] In an embodiment of the present application, the fixing mechanism includes a fixing column 4 arranged on the inner wall surface of the heat dissipation housing 1 , and a positioning edge 5 arranged on the side surface of the inner wall of the heat dissipation housing 1 .

[0044] As an example, the inner wall surface of the heat dissipation housing 1 has a plurality of fixing columns 4, the inner wall side of the heat dissipation housing 1 has a plurality of positioning edges 5, and the positions of the fixing columns 4 and the positioning edges 5 correspond to the corresponding positions of the PCB circuit board.

[0045] In a specific embodiment, the fixing column 4 is integrally formed on the inner wall surface of the heat dissipation shell 1, and the PCB circuit board is connected and fixed to the heat dissipation shell 1 through the fixing column 4. The positioning edge 5 is integrally formed on the inner wall side of the heat dissipation shell 1 to prevent the position of the PCB circuit board from shifting, thereby further improving the reliability of the overall structure.

[0046] In an embodiment of the present application, the outer wall of the heat dissipation housing 1 is provided with heat dissipation fins 7 .

[0047] In a specific embodiment, after the heat of the thermally conductive gasket 3 is transferred to the heat dissipation housing 1, the heat dissipation is performed by the heat dissipation fins 7 to improve the heat dissipation efficiency. The heat dissipation fins 7 are arranged perpendicular to the outer wall of the heat dissipation housing 1 to further increase the contact area between the heat dissipation housing 1 and the air, so that the heat can be better dissipated from the housing into the air.

[0048] In an embodiment of the present application, mounting holes are provided on the top of four sides of the heat dissipation housing 1 .

[0049] It should be noted that the top of the heat dissipation housing 1 is also provided with mounting holes, which can improve the sealing and stability of the inverter as a whole while dissipating heat efficiently.

[0050] In one embodiment of the present application, thermal conductive silicone grease is also included, and the thermal conductive silicone grease is evenly covered on the surface of the thermal conductive gasket 3.

[0051] It should be noted that, in order to further improve the heat dissipation efficiency, the surface of the thermal conductive gasket 3 close to the heat dissipation housing 1 and the surface close to the heating device may be evenly covered with thermal conductive silicone grease.

[0052] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present application.

[0053] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0054] The above is a detailed introduction to a heat dissipation structure with a long life and high thermal conductivity provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technicians in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A heat dissipation structure with long service life and high thermal conductivity, used for dissipating heat from a heating device in a PCB circuit board of an inverter, characterized in that: The heat dissipation structure comprises a heat dissipation shell, a fixing frame and a heat conductive pad; The fixing frame is protrudingly arranged on the inner wall surface of the heat dissipation shell and corresponds to the heating device one by one. The thermal conductive pad is arranged in the fixing frame and fits the heating device.

2. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: The thermally conductive gasket is a thermally conductive ceramic gasket.

3. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: The fixing frame is integrally formed on the inner wall surface of the heat dissipation shell.

4. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: The fixing frame is detachably mounted on the inner wall surface of the heat dissipation housing.

5. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: The shape and size of the fixing frame are compatible with the shape and size of the heating device and the thermal conductive pad.

6. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: The inner wall of the heat dissipation shell is provided with a fixing mechanism, and the PCB circuit board is fixedly installed with the heat dissipation shell through the fixing mechanism.

7. The heat dissipation structure with long service life and high thermal conductivity according to claim 6, characterized in that: The fixing mechanism comprises a fixing column arranged on the inner wall surface of the heat dissipation shell, and a positioning edge arranged on the side surface of the inner wall of the heat dissipation shell.

8. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: The outer wall of the heat dissipation shell is provided with heat dissipation fins.

9. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: The top of the four sides of the heat dissipation shell is provided with mounting holes.

10. The heat dissipation structure with long service life and high thermal conductivity according to claim 1, characterized in that: It also includes thermal conductive silicone grease, which is evenly covered on the surface of the thermal conductive gasket.

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