Chemical vapor deposition equipment

Abstract

The utility model discloses chemical vapor deposition equipment, which comprises a carrying platform, a chemical vapor deposition device and a chemical vapor deposition device, wherein the carrying platform can horizontally move in at least one direction; the substrate positioning device is arranged below the carrying table, the substrate positioning device is used for positioning a substrate, and the surface of the substrate is used for depositing atmosphere; the deposition chamber is arranged below the substrate positioning device, the deposition chamber is connected with a control valve, and the control valve can control the vacuum degree in the deposition chamber; the spray header is at least partially arranged in the deposition chamber, the spray header is arranged in a manner that when the spray header works, gas sprayed out of an outlet of the spray header is sprayed to a substrate, and the spray header is communicated with a process gas source through a gas pipe. According to the chemical vapor deposition equipment disclosed by the utility model, the spray header is arranged below the substrate, so that impurities generated in the deposition process fall down under the action of gravity and cannot be attached to the substrate, and the coating impurities are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic, semiconductor liquid crystal and lithium battery new energy manufacturing, and specifically relates to a chemical vapor deposition device. Background Art

[0002] Chemical vapor deposition is a process in which gaseous or vaporous substances react in the gas phase or at the gas-solid interface to generate solid deposits on the substrate surface. Due to its advantages of multiple deposition types and good deposition uniformity, it is widely used in the deposition of various dielectric films and metal films, such as tungsten metal films. Two important factors affecting the uniformity of chemical vapor deposition are substrate temperature and the distribution of the reaction gas. In addition, impurities on the substrate during deposition will also affect the deposition uniformity of the generated film.

[0003] Commonly used chemical vapor deposition equipment adopts a structure in which the substrate is under the shower head. Impurities generated during deposition or impurities brought into the deposition chamber by the airflow will adhere to the substrate due to gravity, thereby affecting the deposition uniformity of the generated film and the quality of the film-forming particles. Utility Model Content

[0004] In order to overcome the defects in the prior art, the utility model provides a chemical vapor deposition device, which places a shower head under a substrate so that impurities generated during the deposition process fall due to gravity and cannot adhere to the substrate, thereby reducing coating impurities.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a chemical vapor deposition device, comprising:

[0006] A carrier, the carrier being movable horizontally in at least one direction;

[0007] A substrate positioning device, the substrate positioning device is arranged below the stage, the substrate positioning device is used to position the substrate, and the substrate surface is used to deposit the atmosphere;

[0008] A deposition chamber, the deposition chamber is arranged below the substrate positioning device, the deposition chamber is connected to a control valve, and the control valve can control the vacuum degree in the deposition chamber;

[0009] A shower head is at least partially disposed in the deposition chamber, and the shower head is configured such that, when in operation, the gas ejected from its outlet is sprayed toward the substrate.

[0010] Through the above technical solution, the special gas shower head is placed under the substrate, so that impurities generated during the deposition process fall due to gravity and cannot adhere to the substrate, thereby reducing coating impurities.

[0011] Furthermore, the substrate positioning device includes a suction cup connected to the carrier, the suction cup includes a shell, the shell has an inner cavity, and the lower side of the shell is provided with a plurality of annular grooves connected to the inner cavity, and the annular grooves are used to absorb the substrate.

[0012] Furthermore, the vacuum pipe is connected to a vacuum detection device, and whether the suction cup adsorbs the substrate can be determined according to the vacuum degree detected by the vacuum detection device.

[0013] Furthermore, the suction cup is connected to the carrier through a connecting piece, the carrier is provided with a connecting groove, the suction cup is provided with a card slot, the connecting piece is provided with a connecting buckle matched with the connecting groove, and a card buckle matched with the card slot, the card buckle is abutted with the card slot, and the connecting buckle is connected to the connecting groove, so as to connect the silicon carbide substrate positioning device and the carrier. That is, the silicon carbide sensor is detachable, which is convenient for later maintenance.

[0014] Furthermore, the bottom surface of the carrier is concave to form a receiving cavity, a heating device is arranged in the receiving cavity, and the substrate positioning device is connected to the side of the heating device away from the carrier. The substrate temperature can be adjusted according to actual needs, the deposition speed can be accelerated, and the deposition uniformity can be improved.

[0015] Furthermore, the shower head includes a plurality of shower heads arranged in parallel, and a shower area of ​​the shower head is greater than or equal to an area of ​​the substrate.

[0016] Furthermore, the chemical vapor deposition equipment includes a frame, and the carrier is slidably arranged on the frame.

[0017] Furthermore, the frame is provided with a slide rail device, which includes a slide rail and a slider sliding on the slide rail, the slider is connected to a bracket, the bracket is connected to the carrier, and the slider is connected to a motor to drive the carrier to reciprocate in a horizontal direction.

[0018] Furthermore, the control valve comprises an APC control valve, the bottom of the deposition chamber extends outward to form the exhaust pipe, and the APC control valve is arranged in the exhaust pipe.

[0019] By means of the above technical solution, the beneficial effects of the utility model are as follows:

[0020] 1. In this application, by placing the shower head below the substrate, impurities generated during the deposition process fall due to gravity and cannot adhere to the substrate, thereby reducing coating impurities;

[0021] 2. The carrier in this application is movable, which is convenient for staff to install or take the substrate.

[0022] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a schematic diagram of the overall device structure of the chemical vapor deposition equipment in the embodiment of the utility model;

[0025] Figure 2 It is a structural schematic diagram of a frame and a slide rail device in an embodiment of the utility model;

[0026] Figure 3 yes Figure 1 Enlarged view of point A in the middle.

[0027] The figure markings of the above drawings are: 1. carrier; 101. connecting groove; 2. infrared light heater; 3. suction cup; 31. slot; 32. vacuum pipe; 33. vacuum pump; 34. vacuum gauge; 4. connector; 41. connector buckle; 42. buckle; 5. substrate; 6. shower head; 61. shower head; 7. deposition chamber; 8. exhaust pipe; 9. APC control valve; 10. air pipe; 11. motor module; 111. slide rail; 112. bracket; 12. rack. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] It should be noted that in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects. There is no order of precedence between the two, and they cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0030] Example: Combination Figure 1-3 As shown, this embodiment discloses a chemical vapor deposition device, including:

[0031] The frame 12 is provided with a slide rail device, the slide rail device includes a slide rail 111, and a slider sliding on the slide rail 111, the slider is connected to a bracket 112, the slider is connected to the lower end of the bracket 112, and the bracket 112 slides on the slide rail through the slider. The slider is connected to the motor module 11, and the slider is driven by the motor module 11 to slide on the slide rail 111. The frame 12 is also provided with a motor module 11, the driving direction of the motor module 11 is the same as the extension direction of the slide rail 111, and the driving end of the motor module 11 is also connected to the bracket 112.

[0032] The bracket 112 is used to support the carrier 1, so as to control the carrier 1 to move back and forth in the horizontal direction. It should be noted that the slide rail 111 and the motor module 11 are respectively located on two opposite sides of the carrier 1.

[0033] Optionally, the slide rail device and the motor module 11 can be replaced by any driving device such as a robotic arm that can drive the carrier 1 to move.

[0034] like Figure 1 As shown, the bottom surface of the carrier 1 is concave to form a receiving cavity, and an infrared light heater 2 is arranged in the receiving cavity. Through the above technical solution, the infrared light heater 2 can be used to control the temperature of the substrate 5 according to the needs, and the characteristics of the infrared light heater 2 are used to ensure the surface temperature of the substrate 5 is balanced, which helps to improve the uniformity of chemical vapor deposition. It should be noted that the heating range of the infrared light heater 2 is larger than the area of ​​the substrate 5.

[0035] The present application adopts an infrared light heater 2 as a heater because the infrared light heater has the advantages of strong penetration, can heat both inside and outside at the same time, does not require heat transfer medium, has good thermal efficiency, can heat locally to save energy, is simple and easy to assemble, install and maintain, has a clean heating process without the need for hot air and no secondary pollution, is easy to control temperature, heats up quickly and is highly safe, and can therefore provide high-efficiency and high-uniform heating.

[0036] Optionally, the infrared heater 2 may also be replaced by any one of a resistance heater, a laser heater, an electromagnetic heater, a ceramic heater, and a heat pipe heater, or a combination of two or more thereof.

[0037] The side of the heating device 2 facing away from the carrier 1 is connected to a substrate positioning device, and the substrate positioning device includes a suction cup 3. The suction cup 3 is made of a square shell made of silicon carbide with few impurities and good mechanical properties. The shell has an inner cavity, and the upper side of the shell is provided with an exhaust hole connected to the inner cavity. The lower side of the shell is provided with a plurality of annular grooves connected to the inner cavity. The exhaust hole is connected to the first end of a vacuum pipe 32, and the second end of the vacuum pipe 32 passes through the upper side of the carrier 1 and is connected to a vacuum pump 33. When working, the vacuum pump 33 evacuates the inner cavity of the suction cup 3, so that the side of the suction cup 3 with the annular groove generates suction, thereby adsorbing the substrate 5. By adsorbing the substrate 5 by air pressure, it can be ensured that the side of the substrate 5 used for the deposition atmosphere is unobstructed, so as to ensure the uniformity of the deposited coating.

[0038] Among them combined Figure 1 , 3 As shown, the suction cup 3 is connected to the carrier 1 through a connecting member 4. The bottom surface of the carrier 1 and the two opposite sides are symmetrically provided with connecting grooves 101. The suction cup 3 is provided with card slots 31 on both sides of the connecting groove 101. The connecting member 4 is a right-angle plate. The two extension plates of the right-angle plate are respectively provided with a connecting member 41 that matches the connecting groove 101 and a buckle 42 that matches the card slot 31. During installation, the suction cup 3 is placed on the side of the infrared heater 2 away from the carrier 1, and the buckle 42 of the connecting member 4 is abutted against the card slot 31 of the suction cup 3, and the connecting member 41 is connected to the connecting groove 101, so as to connect the suction cup 3 and the carrier 1. Through the above technical solution, the suction cup 3 is detachable, which is convenient for later maintenance.

[0039] Optionally, the substrate positioning device may also be a gripping and fixing device such as a mechanical claw or two positioning cylinders disposed opposite to each other.

[0040] The vacuum pipe 32 is connected to a vacuum gauge 34, which is used to measure the air pressure value in the vacuum pipe 32, and judge whether the suction cup 3 adsorbs the substrate 5 according to the air pressure detected by the vacuum gauge 34. If the air pressure detected by the vacuum gauge is similar to one atmospheric pressure, the suction cup 3 does not adsorb the substrate 5, and if the vacuum gauge detects that the air pressure becomes lower until it is balanced, the suction cup 3 adsorbs the substrate 5.

[0041] like Figure 1As shown, a deposition chamber 7 is arranged below the suction cup 3, and the distance between the upper edge of the deposition chamber 7 and the stage 1 is between 1 mm and 11 mm. In this embodiment, the distance between the upper edge of the deposition chamber 7 and the stage 1 is 6 mm. A gas extraction port is arranged at the bottom of the deposition chamber 7, and the wall surface of the deposition chamber 7 located at the gas extraction port extends outward to form a gas extraction pipeline 8, and the gas extraction pipeline 8 is connected to an APC control valve 9. The APC control valve 9 has the advantages of small pressure drop loss, large flow rate, and wide adjustable range. The vacuum degree in the deposition chamber 7 can be controlled by exhausting gas through the APC control valve 9, so that the vacuum degree in the deposition chamber 7 can be adjusted in real time according to the optimal pressure required by the atmosphere. It should be noted that when the APC control valve 9 uses a negative pressure airflow to exhaust gas in the exhaust pipeline 8, the residual gas in the deposition chamber 7 can be extracted, and the air outside the deposition chamber 7 can be extracted to block the cavity, forming an airflow barrier to prevent the leakage of process gas.

[0042] A shower head 6 is arranged in the deposition chamber 7, and the shower head 6 is composed of a plurality of shower heads 61 arranged in parallel, and the plurality of shower heads 61 are arranged vertically, and in the working water, the outlet of the shower head 6 faces the substrate 5. The spraying area of ​​the shower head 6 is slightly larger than the substrate 5, so that the entire surface of the substrate 5 can receive the airflow sprayed by the shower head 6, so as to make the coating deposited on the surface of the substrate 5 as uniform as possible. The inlet of the shower head 6 is connected to an air pipe 10, and the air pipe 10 passes through the wall of the deposition chamber 7 and is connected to the process gas source. The special gas enters the shower head 6 through the air pipe 10, and is distributed to each of the shower heads 61 through the shower head 6, and the shower head 61 directly sprays the special gas to the substrate 5. It should be noted that a sealing ring is provided between the air pipe 10 and the deposition chamber 7 to prevent the process gas from leaking out from the gap between the air pipe 10 and the deposition chamber 7.

[0043] Through the above technical solution, before the atmosphere is deposited, the motor module 11 is used to drive the carrier 1 to move out from above the deposition chamber 7, and the staff adsorbs the substrate 5 on the substrate positioning device. The motor module 11 drives the carrier 1 to move to above the deposition chamber 7 for atmosphere deposition.

[0044] In this embodiment, the shower head 6 is placed below the substrate 5 so that impurities generated during the deposition process fall due to gravity and cannot adhere to the substrate 5, thereby reducing impurities in the coating.

[0045] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A chemical vapor deposition device, characterized in that: include: A carrier, the carrier being movable horizontally in at least one direction; A substrate positioning device, the substrate positioning device is arranged below the stage, the substrate positioning device is used to position the substrate, and the substrate surface is used to deposit the atmosphere; A deposition chamber, the deposition chamber is arranged below the substrate positioning device, the deposition chamber is connected to a control valve, and the control valve can control the vacuum degree in the deposition chamber; A shower head is at least partially disposed in the deposition chamber, and the shower head is configured such that, when in operation, the gas ejected from its outlet is sprayed toward the substrate.

2. The chemical vapor deposition apparatus according to claim 1, characterized in that: The substrate positioning device comprises a suction cup connected to the stage, the suction cup comprises a shell, the shell has an inner cavity, a plurality of annular grooves communicating with the inner cavity are arranged on the lower side of the shell, and the annular grooves are used for adsorbing the substrate.

3. The chemical vapor deposition apparatus according to claim 2, characterized in that: The upper side of the shell is connected to a vacuum pipe, and the vacuum pipe is connected to a vacuum detection device. According to the vacuum degree detected by the vacuum detection device, it can be judged whether the suction cup adsorbs the substrate.

4. The chemical vapor deposition apparatus according to claim 2, characterized in that: The suction cup is connected to the carrier through a connecting piece, the carrier is provided with a connecting groove, the suction cup is provided with a clamping slot, the connecting piece is provided with a connecting buckle that cooperates with the connecting groove, and a clamping buckle that cooperates with the clamping slot. During installation, the clamping buckle and the clamping slot are abutted, and the connecting buckle is connected to the connecting groove, thereby connecting the substrate positioning device and the carrier.

5. The chemical vapor deposition apparatus according to claim 1, characterized in that: The bottom surface of the carrier is concave to form a receiving cavity, a heating device is arranged in the receiving cavity, and the substrate positioning device is connected to a side of the heating device away from the carrier.

6. The chemical vapor deposition apparatus according to claim 1, characterized in that: The shower head comprises a plurality of shower heads arranged in parallel, and a shower area of ​​the shower head is greater than or equal to an area of ​​the substrate.

7. The chemical vapor deposition apparatus according to claim 1, characterized in that: The chemical vapor deposition equipment comprises a frame, and the carrier is slidably arranged on the frame.

8. The chemical vapor deposition apparatus according to claim 7, characterized in that: The frame is provided with a slide rail device, which includes a slide rail and a slider sliding on the slide rail, the slider is connected to a bracket, the bracket is connected to the platform, and the slider is connected to a motor to drive the platform to reciprocate in a horizontal direction.

9. The chemical vapor deposition apparatus according to claim 1, characterized in that: The control valve comprises an APC control valve. The bottom of the deposition chamber extends outward to form an exhaust pipeline, and the APC control valve is arranged in the exhaust pipeline.

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