Serial port server convenient for heat dissipation

Abstract

The utility model relates to a serial port server convenient for heat dissipation, which comprises a serial port server body, an auxiliary heat dissipation structure is arranged at the bottom of the serial port server body, and the auxiliary heat dissipation structure comprises a heat dissipation equipment box, a heat dissipation fan, a liquid storage tank, a semiconductor refrigerator, a micro delivery pump, a copper heat conduction plate and an S-shaped coil pipe. According to the serial port server facilitating heat dissipation, a heat dissipation fan is responsible for air cooling and heat dissipation of the serial port server body at the top of a heat dissipation equipment box, liquid in a liquid storage box can be cooled through a semiconductor refrigerator, and a micro conveying pump conveys cooling liquid into an S-shaped coil pipe; the copper heat conduction plate conducts heat generated by the serial server body to the S-shaped coil pipe, cooling liquid in the S-shaped coil pipe returns to the liquid storage tank through the liquid return pipe after absorbing the heat, and a closed-loop cooling system is formed, so that even under the condition that the internal space of a cabinet is limited, the temperature of the serial server can be effectively reduced, and normal operation of the serial server is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of serial port servers, in particular to a serial port server which is convenient for heat dissipation. Background Art

[0002] A serial device server is a networking device used to connect two or more serial devices through a network to achieve remote management and control. The role of a serial device server is that it can enable traditional serial devices to immediately have networking capabilities, thereby broadening the application scenarios and functions of these devices. According to the number of serial ports, serial device servers can be divided into different models such as single serial port, dual serial ports, quad serial ports, eight serial ports, and sixteen serial ports to meet network environments of different sizes and needs.

[0003] In the existing serial port server design, a plastic shell or alloy sealed packaging design is generally adopted, and heat is dissipated by relying on the heat dissipation holes opened on the shell. However, this design still needs to be improved. At present, a large part of the serial port servers are fixed inside the cabinet through the hanging ears on the front or back, which makes the distance between the serial port server and other devices small. Even with the auxiliary heat dissipation effect of the heat dissipation fan inside the cabinet, the heat dissipation effect of the serial port server is still limited. The high body temperature will seriously affect the normal operation of the serial port server. Therefore, a serial port server that is easy to dissipate heat is proposed to solve the above problem. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the utility model provides a serial port server that is easy to dissipate heat and has the advantage of good heat dissipation effect. It solves the problem that a large number of serial port servers are currently fixed inside the cabinet through the hanging ears on the front or back, which makes the distance between the serial port server and other devices smaller. Even with the auxiliary heat dissipation effect of the heat dissipation fan inside the cabinet, the heat dissipation effect of the serial port server is still limited, and the high body temperature will seriously affect the normal operation of the serial port server.

[0006] (II) Technical solution

[0007] To achieve the above object, the utility model provides the following technical solutions: a serial port server that is convenient for heat dissipation, comprising a serial port server body, a fixing structure is provided at the bottom of the serial port server body, and an auxiliary heat dissipation structure is provided at the bottom of the serial port server body;

[0008] The auxiliary heat dissipation structure includes a heat dissipation device box, a heat dissipation fan, a liquid storage tank, a semiconductor refrigerator, a micro-transfer pump, a copper heat conductive plate and an S-shaped coil. The heat dissipation device box is arranged at the bottom of the serial port server body, the heat dissipation device box is fixedly installed with a heat dissipation fan, the heat dissipation device box is fixedly installed with a liquid storage tank, the liquid storage tank is fixedly installed with a semiconductor refrigerator, the heat dissipation device box is fixedly installed with a micro-transfer pump, the heat dissipation device box is fixedly installed with a copper heat conductive plate on the top, and the copper heat conductive plate is fixedly installed with an S-shaped coil.

[0009] Furthermore, the fixed structure includes a fixed block, a tension spring limiting rod and a connecting plate. Two fixed blocks are fixedly installed on the bottom of the serial port server body, and tension spring limiting rods are fixedly installed on the outside of the two fixed blocks. Connecting plates are movably installed on the outside of the two fixed blocks.

[0010] Furthermore, the two connecting plates are respectively fixedly installed on the left and right sides of the heat dissipation device box, and the two tension spring limiting plug rods respectively penetrate the two fixing blocks and are respectively plugged with the two connecting plates.

[0011] Furthermore, two dustproof nets are fixedly installed on the top and bottom of the heat dissipation device box, respectively, and two heat dissipation fans are fixedly installed inside the heat dissipation device box.

[0012] Furthermore, a liquid extraction tube connected to the liquid storage tank is fixedly installed on the right side of the micro-delivery pump, and a liquid injection tube is fixedly installed on the top of the micro-delivery pump. The top of the liquid injection tube passes through the inner top wall of the heat dissipation device box and the bottom of the copper heat conductive plate and is fixedly connected to one end of the S-shaped coil.

[0013] Furthermore, a return pipe is fixedly installed at the other end of the S-shaped coil, the bottom of which passes through the inner bottom wall of the copper heat conductive plate and the top of the heat dissipation device box and extends to the interior of the liquid storage tank, and the top of the copper heat conductive plate is fitted with the bottom of the serial port server body.

[0014] Furthermore, the semiconductor refrigerator includes a heat sink, a first electrically insulating heat-conducting layer, a connecting piece, a semiconductor, a second electrically insulating heat-conducting layer and a cold plate.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0017] The serial port server with easy heat dissipation has an auxiliary heat dissipation structure, wherein a heat dissipation fan is responsible for air-cooling and cooling the serial port server body on the top of the heat dissipation device box, and the liquid in the liquid storage tank can be cooled by a semiconductor refrigerator. The micro-transfer pump draws the coolant from the liquid storage tank and delivers it to the S-shaped coil through the liquid injection pipe. The copper heat conduction plate conducts the heat generated by the serial port server body to the S-shaped coil due to its good thermal conductivity. After the coolant in the S-shaped coil absorbs the heat, it returns to the liquid storage tank through the liquid return pipe, forming a closed-loop cooling system. This design greatly improves the heat dissipation efficiency, so that even when the internal space of the cabinet is limited, the temperature of the serial port server can be effectively reduced to ensure its normal operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the cross-sectional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the auxiliary heat dissipation structure of the utility model;

[0020] Figure 3 It is a three-dimensional schematic diagram of the auxiliary heat dissipation structure of the utility model;

[0021] Figure 4 This is a schematic cross-sectional view of the copper heat conducting plate of the utility model;

[0022] Figure 5 For this utility model Figure 1 A is an enlarged schematic diagram;

[0023] Figure 6 For this utility model Figure 1 The enlarged schematic diagram of point B in FIG.

[0024] In the figure: 1. serial port server body; 2. fixed structure; 201. fixed block; 202. tension spring limit rod; 203. connecting plate; 3. auxiliary heat dissipation structure; 301. heat dissipation device box; 302. heat dissipation fan; 303. liquid storage tank; 304. semiconductor refrigerator; 305. micro delivery pump; 306. copper heat conduction plate; 307. S-type coil. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-6In this embodiment, a serial device server that is easy to dissipate heat includes a serial device server body 1, a fixing structure 2 is provided at the bottom of the serial device server body 1, and an auxiliary heat dissipation structure 3 is provided at the bottom of the serial device server body 1;

[0027] The auxiliary heat dissipation structure 3 includes a heat dissipation device box 301, a heat dissipation fan 302, a liquid storage tank 303, a semiconductor refrigerator 304, a micro-transfer pump 305, a copper heat conductive plate 306 and an S-shaped coil 307. The heat dissipation device box 301 is arranged at the bottom of the serial port server body 1, the heat dissipation device box 301 is fixedly installed with a heat dissipation fan 302, the heat dissipation device box 301 is fixedly installed with a liquid storage tank 303, the liquid storage tank 303 is fixedly installed with a semiconductor refrigerator 304, the heat dissipation device box 301 is fixedly installed with a micro-transfer pump 305, the heat dissipation device box 301 is fixedly installed with a copper heat conductive plate 306 on the top, and the S-shaped coil 307 is fixedly installed with the copper heat conductive plate 306.

[0028] Specifically, by pulling the tension spring limit rod 202 toward the side away from the fixed block 201 so that the other end of the tension spring limit rod 202 is disengaged from the connecting plate 203, the entire auxiliary heat dissipation structure 3 can be removed from the bottom of the serial port server body 1. This is convenient for maintenance of the auxiliary heat dissipation structure 3 and is also quick and convenient when installing and fixing the serial port server body 1 inside the cabinet.

[0029] Specifically, the semiconductor refrigerator 304 includes a heat sink, a first electrically insulating thermally conductive layer, a connecting plate, a semiconductor, a second electrically insulating thermally conductive layer and a cold plate, wherein the first electrically insulating thermally conductive layer and the second electrically insulating thermally conductive layer are both insulating and thermally conductive, and their function is to prevent current from flowing directly between the heat sink and the semiconductor, and at the same time transfer the heat on one side of the semiconductor to the heat sink. The connecting plate is usually made of metal and is used to fix the semiconductor in an appropriate position and ensure good thermal contact. The semiconductor is the core component of the semiconductor refrigerator 304, and is composed of two or more semiconductor materials with different conductive properties to form multiple galvanic couples. When current passes through these galvanic couples, an endothermic effect will be generated on one side (the cooling side) and an exothermic effect (the heating side) will be generated on the other side. The cold plate is the cooling side of the refrigerator, which contacts the object or medium to be cooled, absorbs heat, and thus achieves a cooling effect.

[0030] In summary, the serial port server with easy heat dissipation is provided with an auxiliary heat dissipation structure 3, wherein the heat dissipation fan 302 is responsible for cooling and cooling the serial port server body 1 on the top of the heat dissipation device box 301, and the liquid in the liquid storage tank 303 can be cooled by the semiconductor refrigerator 304, and the micro-transfer pump 305 draws the coolant from the liquid storage tank 303 and delivers it to the S-shaped coil 307 through the injection pipe. The copper heat conducting plate 306, due to its good thermal conductivity, conducts the heat generated by the serial port server body 1 to the S-shaped coil 307. After the coolant in the S-shaped coil 307 absorbs the heat, it is The liquid return pipe returns to the liquid storage tank 303 to form a closed-loop cooling system. This design greatly improves the heat dissipation efficiency, so that even when the internal space of the cabinet is limited, the temperature of the serial port server can be effectively reduced to ensure its normal operation. This solves the problem that a large part of the serial port servers are currently fixed inside the cabinet through the mounting ears on the front or back, which makes the distance between the serial port server and other devices smaller. Even with the auxiliary heat dissipation effect of the cooling fan inside the cabinet, the heat dissipation effect of the serial port server is still limited, and the higher body temperature will seriously affect the normal operation of the serial port server.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A serial device server that is easy to dissipate heat, comprising a serial device server body (1), characterized in that: A fixing structure (2) is provided at the bottom of the serial port server body (1), and an auxiliary heat dissipation structure (3) is provided at the bottom of the serial port server body (1); The auxiliary heat dissipation structure (3) comprises a heat dissipation device box (301), a heat dissipation fan (302), a liquid storage tank (303), a semiconductor refrigerator (304), a micro-transfer pump (305), a copper heat conduction plate (306) and an S-shaped coil (307). The heat dissipation device box (301) is arranged at the bottom of the serial port server body (1), the heat dissipation device box (301) is fixedly installed with a heat dissipation fan (302), the liquid storage tank (303) is fixedly installed inside the heat dissipation device box (301), the semiconductor refrigerator (304) is fixedly installed inside the liquid storage tank (303), the micro-transfer pump (305) is fixedly installed inside the heat dissipation device box (301), the copper heat conduction plate (306) is fixedly installed on the top of the heat dissipation device box (301), and the S-shaped coil (307) is fixedly installed inside the copper heat conduction plate (306).

2. A serial port server for facilitating heat dissipation according to claim 1, characterized in that: The fixing structure (2) comprises a fixing block (201), a tension spring limiting rod (202) and a connecting plate (203); two fixing blocks (201) are fixedly installed at the bottom of the serial port server body (1); the outsides of the two fixing blocks (201) are fixedly installed with tension spring limiting rods (202); and the outsides of the two fixing blocks (201) are movably installed with connecting plates (203).

3. A serial port server for facilitating heat dissipation according to claim 2, characterized in that: The two connecting plates (203) are respectively fixedly mounted on the left and right sides of the heat dissipation device box (301), and the two tension spring limiting plug rods (202) respectively penetrate the two fixing blocks (201) and are respectively plugged into the two connecting plates (203).

4. A serial port server for facilitating heat dissipation according to claim 1, characterized in that: Two dustproof nets are fixedly installed on the top and bottom of the heat dissipation device box (301), respectively, and two heat dissipation fans (302) are fixedly installed inside the heat dissipation device box (301).

5. A serial port server for facilitating heat dissipation according to claim 1, characterized in that: A liquid extraction pipe connected to the liquid storage tank (303) is fixedly installed on the right side of the micro-delivery pump (305), and a liquid injection pipe is fixedly installed on the top of the micro-delivery pump (305). The top of the liquid injection pipe passes through the inner top wall of the heat dissipation device box (301) and the bottom of the copper heat conduction plate (306) and is fixedly connected to one end of the S-shaped coil (307).

6. A serial port server for heat dissipation according to claim 1, characterized in that: A liquid return pipe is fixedly installed at the other end of the S-shaped coil (307), the bottom of which passes through the inner bottom wall of the copper heat conducting plate (306) and the top of the heat dissipation device box (301) and extends to the interior of the liquid storage tank (303), and the top of the copper heat conducting plate (306) is in contact with the bottom of the serial port server body (1).

7. A serial port server for facilitating heat dissipation according to claim 1, characterized in that: The semiconductor refrigerator (304) comprises a heat sink, a first electrically insulating heat-conducting layer, a connecting sheet, a semiconductor, a second electrically insulating heat-conducting layer and a cold plate.

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