High-temperature-resistant and high-toughness RFID electronic tag

Abstract

The utility model discloses a high-temperature-resistant high-toughness RFID electronic tag, which comprises an RFID embedded part, a first high-temperature-resistant layer arranged at the top of the RFID embedded part, a second high-temperature-resistant layer arranged at the bottom of the first high-temperature-resistant layer and located at the bottom of the RFID embedded part, and a base material double-faced adhesive tape arranged at the bottom of the second high-temperature-resistant layer. Fasteners used for reinforcing connection between the second high-temperature-resistant layer and the base material double-faced adhesive tape are symmetrically arranged at the joint of the base material double-faced adhesive tape and the second high-temperature-resistant layer, the fasteners comprise fastening blocks symmetrically arranged at the bottom of the second high-temperature-resistant layer, and the bottom ends of the fastening blocks are connected to the top of the base material double-faced adhesive tape in a penetrating mode. According to the utility model, the fastener is arranged at the joint of the second high-temperature-resistant layer and the base material double-faced adhesive tape, the fastening block in the fastener is inserted into the top of the base material double-faced adhesive tape, and the insertion part is filled and fixed by adopting the adhesive, so that the contact area of the second high-temperature-resistant layer and the base material double-faced adhesive tape is increased by adopting the arrangement mode; mechanical interlocking can be formed at the interpenetrating position, and the connecting strength of the base material double-faced adhesive tape and the second high-temperature-resistant layer is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic tags, in particular to a high-temperature-resistant and high-toughness RFID electronic tag. Background Art

[0002] RFID electronic tags are a type of wireless radio frequency identification technology that automatically identifies and tracks objects with electronic tags through radio waves. This technology can improve the efficiency and accuracy of logistics, inventory management, product tracking and other fields. RFID electronic tags generally use high-temperature resistant and high-toughness polyimide sealing materials to wrap RFID embedded parts. Double-sided tape is attached to the bottom of the polyimide. After long-term use, the polyimide sealing material of existing RFID electronic tags will separate from the double-sided tape, affecting the use of RFID electronic tags. In order to strengthen the strength of the connection between the polyimide sealing material and the double-sided tape, a new type of high-temperature resistant and high-toughness RFID electronic tag is needed. Summary of the invention

[0003] The purpose of the utility model is to provide a high-temperature resistant and high-toughness RFID electronic tag to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned objectives, the utility model provides the following technical solutions: a high-temperature resistant and high-toughness RFID electronic tag, comprising an RFID embedded component, a first high-temperature resistant layer is arranged on the top of the RFID embedded component, a second high-temperature resistant layer is arranged at the bottom of the first high-temperature resistant layer and located at the bottom of the RFID embedded component, a substrate double-sided adhesive is arranged at the bottom of the second high-temperature resistant layer, and fasteners for strengthening the connection between the second high-temperature resistant layer and the substrate double-sided adhesive are symmetrically arranged at the connection between the substrate double-sided adhesive and the second high-temperature resistant layer, and the fasteners include fastening blocks symmetrically arranged at the bottom of the second high-temperature resistant layer, the bottom end of the fastening block is inserted and connected to the top of the substrate double-sided adhesive, and an adhesive is arranged at the insertion of the substrate double-sided adhesive and the fastening block.

[0005] Preferably, a fastening groove for inserting a fastening block is provided on the top of the base double-sided adhesive.

[0006] Preferably, a threaded groove for enhancing the friction force of the fastening block is provided on the outer side of the fastening block.

[0007] Preferably, a plurality of reinforcement grooves are provided on the top of the base double-sided adhesive and on the opposite side of the fastening block.

[0008] Preferably, a release paper is provided at the bottom of the double-sided adhesive substrate.

[0009] Preferably, a tear notch is provided on the bottom side of the double-sided adhesive substrate.

[0010] Technical effects and advantages of the utility model:

[0011] The utility model provides a fastener at the connection between the second high temperature resistant layer and the base material double-sided adhesive. The fastening block in the fastener is inserted into the top of the base material double-sided adhesive. The insertion portion is filled and fixed with an adhesive. This arrangement increases the contact area between the second high temperature resistant layer and the base material double-sided adhesive. After the adhesive is cured, the insertion portion can form a mechanical interlock, thereby enhancing the connection strength between the base material double-sided adhesive and the second high temperature resistant layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a top view of the utility model as a whole.

[0013] Figure 2 It is a cross-sectional view of the utility model as a whole.

[0014] Figure 3 For this utility model Figure 2 A magnified view of the structure at center.

[0015] In the figure: 1. RFID embedded part; 2. First high temperature resistant layer; 3. Second high temperature resistant layer; 301. Fastening block; 3011. Thread groove; 4. Double-sided adhesive of base material; 401. Fastening groove; 402. Reinforcement groove; 403. Tear-off notch; 5. Adhesive; 6. Release paper. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] The utility model provides Figure 1-3 A high-temperature-resistant and high-toughness RFID electronic tag shown includes an RFID inlay 1, a first high-temperature-resistant layer 2 is arranged on the top of the RFID inlay 1, a second high-temperature-resistant layer 3 is arranged at the bottom of the first high-temperature-resistant layer 2 and located at the bottom of the RFID inlay 1, and a substrate double-sided adhesive 4 is arranged at the bottom of the second high-temperature-resistant layer 3;

[0018] It should be noted that the first high temperature resistant layer 2 and the second high temperature resistant layer 3 are both made of polyimide. The RFID embedded part 1 includes an antenna and a chip. Polyimide is used as the substrate of the antenna, and etched aluminum is used as the antenna. The first high temperature resistant layer 2 and the second high temperature resistant layer 3 are bonded with glue. The polyimide material is resistant to high temperatures and has high toughness, which can ensure that the label function is not affected during high temperature assembly line operation, and can make the label have sufficient toughness and can be attached to the curved product surface. The substrate double-sided adhesive 4 is a high temperature resistant PET substrate. The wrapping of the first high temperature resistant layer 2 and the second high temperature resistant layer 3 on the RFID embedded part 1 and the setting of the high temperature resistant substrate double-sided adhesive 4 increase the overall high temperature resistance of the product.

[0019] The connection between the substrate double-sided adhesive tape 4 and the second high temperature resistant layer 3 is symmetrically provided with fasteners for strengthening the connection between the second high temperature resistant layer 3 and the substrate double-sided adhesive tape 4;

[0020] Specifically, the fastener includes a fastening block 301 symmetrically arranged at the bottom of the second high temperature resistant layer 3, the bottom end of the fastening block 301 is inserted and connected to the top of the substrate double-sided adhesive 4, and a thread groove 3011 is provided on the outer side of the fastening block 301 for enhancing the friction force of the fastening block 301;

[0021] It should be noted that the second high temperature resistant layer 3 and the fastening block 301 are integrally injection molded, a fastening groove 401 for inserting the fastening block 301 is provided on the top of the base double-sided adhesive 4, an adhesive 5 is provided on the inner wall of the fastening groove 401, and the material of the adhesive 5 is organic silicone adhesive, and the adhesive 5 is filled in the opposite sides of the thread groove 3011 and the fastening groove 401 to bond and fix the fastening block 301;

[0022] Specifically, a plurality of reinforcement grooves 402 are provided on the top of the substrate double-sided adhesive 4 and on the opposite side of the fastening block 301. The provision of the reinforcement grooves 402 is conducive to the bonding and fixing of the glue on the surface of the substrate double-sided adhesive 4 and the second high temperature resistant layer 3.

[0023] A release paper 6 is provided at the bottom of the substrate double-sided adhesive 4, and a tearing notch 403 is provided at the bottom side of the substrate double-sided adhesive 4;

[0024] It should be noted that the release paper 6 is used to protect the adhesive on the surface of the substrate double-sided adhesive 4 from being contaminated, so that the double-sided adhesive can be conveniently stored and used until it is needed to be pasted, and the tearing opening 403 is provided to facilitate the user to peel off the release paper 6;

[0025] During actual use, a fastener is provided at the connection between the second high temperature resistant layer 3 and the base double-sided adhesive 4. The fastening block 301 in the fastener is inserted into the top of the base double-sided adhesive 4, and the insertion portion is filled and fixed with an adhesive 5. This arrangement increases the contact area between the second high temperature resistant layer 3 and the base double-sided adhesive 4. After the adhesive 5 is cured, the insertion portion can form a mechanical interlock, thereby enhancing the connection strength between the base double-sided adhesive 4 and the second high temperature resistant layer 3.

[0026] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high temperature resistant and high toughness RFID electronic tag, comprising an RFID inlay (1), characterized in that: The top of the RFID inlay (1) is provided with a first high temperature resistant layer (2), the bottom of the first high temperature resistant layer (2) and located at the bottom of the RFID inlay (1) is provided with a second high temperature resistant layer (3), the bottom of the second high temperature resistant layer (3) is provided with a base material double-sided adhesive tape (4), and a fastener for strengthening the connection between the second high temperature resistant layer (3) and the base material double-sided adhesive tape (4) is symmetrically provided at the connection between the base material double-sided adhesive tape (4) and the second high temperature resistant layer (3), the fastener comprising a fastening block (301) symmetrically provided at the bottom of the second high temperature resistant layer (3), the bottom end of the fastening block (301) is connected to the top of the base material double-sided adhesive tape (4), and an adhesive (5) is provided at the connection between the base material double-sided adhesive tape (4) and the fastening block (301).

2. The high temperature resistant and high toughness RFID electronic tag according to claim 1, characterized in that: A fastening groove (401) for inserting a fastening block (301) is provided on the top of the base double-sided adhesive tape (4).

3. The high temperature resistant and high toughness RFID electronic tag according to claim 2, characterized in that: A thread groove (3011) for enhancing the friction force of the fastening block (301) is provided on the outer side of the fastening block (301).

4. The high temperature resistant and high toughness RFID electronic tag according to claim 3, characterized in that: A plurality of reinforcement grooves (402) are provided on the top of the base material double-sided adhesive tape (4) and on the opposite side of the fastening block (301).

5. The high temperature resistant and high toughness RFID electronic tag according to claim 4, characterized in that: A release paper (6) is provided at the bottom of the double-sided adhesive substrate (4).

6. The high temperature resistant and high toughness RFID electronic tag according to claim 5, characterized in that: A tear-off notch (403) is provided on the bottom side of the double-sided adhesive tape (4).

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