Rigid-flex circuit board and electronic equipment

Abstract

The utility model discloses a rigid-flex circuit board and an electronic device, the rigid-flex circuit board comprises a plurality of rigid boards, the rigid boards are arranged at intervals, and each rigid board is composed of a plurality of layer boards; the two rigid plates are arranged on the substrate, the two flexible plates are arranged on the two sides of the rigid plates, the rigid plates are arranged at the non-edge positions of the flexible plates, bonding pads are arranged on the flexible plates, and the bonding pads correspond to the rigid plates and are connected with the rigid plates. Through the mutual pressing between the two flexible boards and the rigid board, the use of a reinforcing sheet can be avoided, and the flexible board formed at the non-rigid board area of the rigid-flexible circuit board can meet the bending requirement and the space compression requirement. Namely, the rigid-flexible circuit board has the characteristics of compact structure, small occupied space, bending function and high reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of rigid-flexible circuit boards, in particular to a rigid-flexible circuit board and an electronic device. Background Art

[0002] Flexible circuit boards, also known as "soft boards", are printed circuits made of flexible insulating substrates. Flexible circuits provide excellent electrical properties, can be bent, wound, and folded freely, can withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to spatial layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, thereby achieving the integration of component assembly and wire connection.

[0003] In the prior art, flexible circuit boards have good flexibility and can bend to a certain extent, but their hardness is relatively low. For some circuit boards that need to ensure flexibility so that they can bend, and at the same time ensure that the circuit board has sufficient hardness and a relatively thin thickness, the processing is generally more complicated and will occupy a large space. In addition, the existing PCB pressing process cannot meet the requirements of increasingly dense wiring and reduced space for products. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a rigid-flexible circuit board, which can avoid the use of a reinforcing sheet by pressing two flexible boards and a rigid board together, and the soft board formed in the non-rigid board area of ​​the rigid-flexible circuit board can meet the bending requirements and the compression space requirements.

[0005] The utility model also provides an electronic device.

[0006] According to the first aspect of the present invention, the rigid-flexible circuit board includes: a plurality of rigid boards, which are spaced apart from each other and are composed of a plurality of layer boards; two flexible boards, which are arranged on both sides of the plurality of rigid boards and are arranged at non-edges of the flexible boards, and solder pads are arranged on the flexible boards, which correspond to and are connected to the rigid boards.

[0007] According to the rigid-flexible circuit board of the embodiment of the utility model, the use of a reinforcing sheet can be avoided by pressing the two flexible boards and the rigid board together, and the soft board formed in the non-rigid board area of ​​the rigid-flexible circuit board can meet the bending requirements and the compression space requirements. That is, the rigid-flexible circuit board has the characteristics of compact structure, small space occupation, bending function, and high reliability.

[0008] According to some embodiments of the present invention, a plug-in portion is provided at an edge of the flexible board; and / or a first through hole is provided at an edge of the flexible board.

[0009] According to some embodiments of the present invention, at least one of the rigid boards is provided with at least one second through hole, so that the rigid board is divided into at least two sub-boards, and at least two of the sub-boards are disconnected from each other.

[0010] According to some embodiments of the present invention, at least one of the rigid boards is provided with at least one second through hole, so that the rigid board is divided into at least two sub-boards, and at least two of the sub-boards are disconnected from each other.

[0011] According to some embodiments of the utility model, in a first direction, two adjacent rigid boards are spaced apart so that the thickness of the area between the two adjacent rigid boards is smaller than the thickness of the rigid-flexible circuit board at the rigid boards.

[0012] According to some embodiments of the present invention, the thickness of the rigid plate is h1, and h1 satisfies the relationship: 0.15mm≤h1≤0.2mm.

[0013] According to some embodiments of the present invention, the thickness of the flexible board is h2, and h2 satisfies the relationship: 0.03mm≤h2≤0.04mm.

[0014] According to some embodiments of the utility model, the rigid board includes: two first conductive layers, a first insulating layer and two second insulating layers, the two first conductive layers are arranged on both sides of the first insulating layer, and the two second insulating layers are respectively arranged on the side of the two first conductive layers away from the first insulating layer.

[0015] According to some embodiments of the present invention, the flexible layer includes: a second conductive layer and a third insulating layer, the third insulating layer is in contact with the rigid layer, and the second conductive layer is arranged on a side of the third insulating layer away from the rigid layer.

[0016] According to some embodiments of the present invention, the first insulating layer and the second insulating layer are respectively an epoxy resin layer and a glass cloth layer; and / or the third insulating layer is a polyimide layer.

[0017] An electronic device according to an embodiment of the second aspect of the utility model includes: the rigid-flex circuit board.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 It is a schematic diagram of the structure in which a flexible board and a rigid board are superimposed on each other according to the utility model;

[0021] Figure 2 It is a structural schematic diagram of a rigid-flex circuit board according to the utility model.

[0022] Reference numerals:

[0023] 100. Rigid-flex circuit board;

[0024] 10. flexible board; 11. second conductive layer; 12. third insulating layer; 13. soldering pad;

[0025] 20. Rigid board; 21. First insulating layer; 22. First conductive layer; 23. Second insulating layer; 24. Second through hole 13. DETAILED DESCRIPTION

[0026] The embodiments of the present utility model are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present utility model are described in detail below.

[0027] Reference below Figure 1-Figure 2 A rigid-flex circuit board 100 according to an embodiment of the present invention is described. The present invention also proposes an electronic device having the rigid-flex circuit board 100 .

[0028] Reference Figure 1 and Figure 2 As shown, the rigid-flexible circuit board 100 of the embodiment of the utility model comprises: a plurality of rigid boards 20 and two flexible boards 10, the plurality of rigid boards 20 are arranged at intervals with each other, the rigid boards 20 are composed of a plurality of layer boards, and the two flexible boards 10 are arranged on both sides of the plurality of rigid boards 20. Among them, the rigid board 20 can be a FR4 core board, and the flexible board 10 can be a FRCC.

[0029] The rigid board 20 is arranged at the non-edge of the flexible board 10, so that the thickness of the rigid-flexible circuit board 100 at the edge is less than the thickness of the rigid-flexible circuit board 100 at the rigid board 20. By superimposing and pressing two flexible boards 10 and multiple rigid boards 20, the rigid-flexible circuit board 100 becomes a soft board in the area of ​​the non-rigid board 20, reducing the layers, thereby forming a portion that needs to be bent on the rigid-flexible circuit board 100, that is, the rigid-flexible circuit board 100 can be bent through the soft board; the hard board part, that is, the rigid board 20 can ensure the required hardness of the rigid-flexible circuit board 100, without the need to design a reinforcing sheet, meeting the customer's requirements for thinness and hardness at this location.

[0030] In addition, a pad 13 is provided on the flexible board 10, and the pad 13 corresponds to and is connected to the rigid board 20. That is, the pad 13 is provided at a position where the flexible board 10 and the rigid board 20 are relative to each other, and the electrical connection point between the rigid board 20 and the flexible board 10 is improved by the pad 13, so as to facilitate the function of the rigid-flexible circuit board 100.

[0031] Thus, by pressing the two flexible boards 10 and the rigid board 20 together, the use of a reinforcing sheet can be avoided, and the soft board formed by the rigid-flexible circuit board 100 in the area of ​​the non-rigid board 20 can meet the bending requirements and the compression space requirements. That is, the rigid-flexible circuit board 100 has the characteristics of compact structure, small space occupation, bending function, and high reliability.

[0032] A plug-in portion is provided at the edge of the flexible board 10. The plug-in portion may be a gold finger, that is, the gold finger may be plugged and matched with other circuit boards and electrically connected, which may improve the application scenario of the rigid-flex circuit board 100.

[0033] A first through hole is provided at the edge of the flexible board 10. That is, a pad 13 is provided at the edge of the flexible board 10, and the component is fixed on the pad 13 by soldering through the first through hole on the rigid-flexible circuit board 100, and the printed wire connects the components to realize the electrical connection of the components in the circuit. Specifically, the form of the pad 13 is not limited to one of a square pad 13, a circular pad 13, an island pad 13 and an elliptical pad 13.

[0034] Reference Figure 2 As shown, at least one second through hole is provided on at least one rigid board 20, so that the rigid board 20 is divided into at least two sub-boards, and at least two sub-boards are disconnected from each other. That is, by providing a second through hole on the rigid board 20 and providing an electrical connector in the second through hole, the electrical connection between the flexible boards 10 at both ends of the rigid board is achieved through the electrical connector, thereby realizing the functional application of the rigid-flexible circuit board 100.

[0035] In the first direction, two adjacent rigid boards 20 are spaced apart so that the thickness of the region between the two adjacent rigid boards 20 is smaller than the thickness of the rigid-flexible circuit board 100 at the rigid boards 20. That is, by spacing the two adjacent rigid boards 20 apart from each other, a thinning region can be formed between the two adjacent rigid boards 20 while the two rigid boards 20 are spaced apart from each other, that is, the thickness of the region between the two adjacent rigid boards 20 is smaller than the thickness at the rigid boards 20, which is conducive to thinning the thickness of the rigid-flexible circuit board 100.

[0036] Reference Figure 1As shown, the thickness of the rigid board 20 is h1, and h1 satisfies the relationship: 0.15mm≤h1≤0.2mm. In this way, the thickness of the rigid board 20 is set between 0.15mm-0.2mm, which can prevent the rigid board 20 from being too thick, causing the thickness of the rigid-flexible circuit board 100 to be too large, and prevent the rigid board 20 from being too thin, so as not to affect subsequent punching and use. Specifically, if the thickness of the rigid board 20 is greater than 0.2mm, the rigid board 20 will be too thick, and the thickness of the rigid-flexible circuit board 100 will be too large. And, if the thickness of the rigid board 20 is less than 0.15mm, it will break or break down when it is stuck in the hole or used.

[0037] Reference Figure 1 As shown, the thickness of the flexible board 10 is h2, and h2 satisfies the relationship: 0.03mm≤h2≤0.04mm. In this way, when the thickness of the flexible board 10 is set to 0.03mm-0.04mm, on the one hand, the problem of the flexible board 10 being broken during lamination due to the flexible board 10 being too thin can be avoided, and on the other hand, the problem of the rigid-flexible circuit board 100 being too thick due to the rigid board 20 being too thick can be avoided.

[0038] Reference Figure 1 and Figure 2 As shown, the rigid board 20 includes: two first conductive layers 22, a first insulating layer 21 and two second insulating layers 23, the two first conductive layers 22 are arranged on both sides of the first insulating layer 21, and the two second insulating layers 23 are respectively arranged on the side of the two first conductive layers 22 away from the first insulating layer 21. That is, the first insulating layer 21 is sandwiched between the two first conductive layers 22, and the first insulating layer 21 can separate the two first conductive layers 22 and achieve insulation between the two first conductive layers 22, and the two first conductive layers 22 can also be connected through vias. In addition, a second insulating layer 23 is also arranged between the first conductive layer 22 and the flexible board 10, and the first conductive layer 22 and the flexible layer can be separated by the second insulating layer 23, and the insulation strength between the first conductive layer 22 and the flexible layer can be improved, thereby avoiding conduction between the first conductive layer 22 and the flexible layer.

[0039] Reference Figure 1 and Figure 2 As shown, the flexible layer includes: a second conductive layer 11 and a third insulating layer 12, the third insulating layer 12 is in contact with the rigid layer, and the second conductive layer 11 is arranged on the side of the third insulating layer 12 away from the rigid layer. Among them, the third insulating layer 12 is an electrical insulating layer, and its function is to isolate the current leakage between the circuit in the rigid-flexible circuit board 100 and the external circuit. In addition, the second conductive layer 11 is a copper layer, that is, copper layers are arranged on both sides of the circuit board, so that electrical conduction can be achieved through both sides of the circuit board.

[0040] The first insulating layer 21 and the second insulating layer 23 can be an epoxy resin layer and a glass cloth layer, respectively. Among them, epoxy resin has good electrical insulation, moisture resistance, thermal shock resistance, heat resistance, low corrosion and other properties, so epoxy resin can be used as the first insulating layer 21 or the second insulating layer 23. Among them, glass cloth (glass-fibre fabric) is a fabric woven with glass fibers, which has the properties of insulation, heat insulation, corrosion resistance, non-combustion, high temperature resistance, high strength and other properties, so glass cloth can be used as the first insulating layer 21 or the second insulating layer 23.

[0041] The third insulating layer 12 may be a polyimide layer, which has high insulation performance, so the polyimide layer can effectively isolate the current leakage between the circuit in the rigid-flex circuit board 100 and the external circuit.

[0042] The electronic device according to the second embodiment of the utility model includes: a rigid-flex circuit board 100. In this way, the rigid-flex circuit board 100 on the electronic device has the characteristics of compact structure, small space occupation, bending function, and high reliability.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0045] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A rigid-flex circuit board, characterized in that: include: A plurality of rigid plates, wherein the plurality of rigid plates are arranged at intervals from each other, and the rigid plates are composed of a plurality of layer plates; Two flexible boards are arranged on both sides of the plurality of rigid boards and the rigid boards are arranged at non-edges of the flexible boards. The flexible boards are provided with pads, and the pads correspond to and are connected to the rigid boards.

2. The rigid-flex circuit board according to claim 1, characterized in that: An inserting portion is provided at an edge of the flexible board; and / or a first through hole is provided at an edge of the flexible board.

3. The rigid-flex circuit board according to claim 1, characterized in that: At least one of the rigid boards is provided with at least one second through hole, so that the rigid board is divided into at least two sub-boards, and at least two of the sub-boards are disconnected from each other.

4. The rigid-flex circuit board according to claim 1, characterized in that: In the first direction, two adjacent rigid boards are spaced apart so that the thickness of the area between the two adjacent rigid boards is smaller than the thickness of the rigid-flexible circuit board at the rigid boards.

5. The rigid-flex circuit board according to claim 4, characterized in that: The thickness of the rigid plate is h1, and h1 satisfies the relationship: 0.15 mm ≤ h1 ≤ 0.2 mm.

6. The rigid-flex circuit board according to claim 5, characterized in that: The thickness of the flexible board is h2, and h2 satisfies the relationship: 0.03mm≤h2≤0.04mm.

7. The rigid-flex circuit board according to claim 4, characterized in that: The rigid board includes: two first conductive layers, a first insulating layer and two second insulating layers, the two first conductive layers are arranged on both sides of the first insulating layer, and the two second insulating layers are respectively arranged on one side of the two first conductive layers away from the first insulating layer.

8. The rigid-flex circuit board according to claim 7, characterized in that: The flexible board includes: a second conductive layer and a third insulating layer, the third insulating layer is in contact with the rigid board, and the second conductive layer is arranged on a side of the third insulating layer away from the rigid board.

9. The rigid-flex circuit board according to claim 8, characterized in that: The first insulating layer and the second insulating layer are respectively an epoxy resin layer and a glass cloth layer; and / or, The third insulating layer is a polyimide layer.

10. An electronic device, characterized in that: include: The rigid-flex circuit board according to any one of claims 1 to 9.

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