Electronic device

Abstract

The utility model relates to the technical field of electronic products, and discloses electronic equipment, which comprises a first shell and a second shell, the first shell and the second shell are both made of non-metal materials, and the first shell and the second shell jointly enclose to form an accommodating cavity; the first shell and / or the second shell are / is partially provided with a heat dissipation opening; the main radiating fin is detachably mounted at the radiating opening, and the main radiating fin is made of a metal material; the main board is fixedly mounted in the accommodating cavity; and at least partial area of the mainboard is communicated with the main radiating fin through the main heat conduction part. According to the electronic equipment provided by the utility model, heat generated by the main board can be dissipated through the main cooling fins, so that the heat dissipation efficiency is improved. According to the electronic equipment, the plastic shell is matched with the local metal shell, so that the cost can be reduced on the basis of ensuring heat dissipation, meanwhile, more heat dissipation holes do not need to be formed in the shell, and the situation that dust easily falls into the electronic equipment is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, in particular to an electronic device. Background Art

[0002] Electronic devices all have heat dissipation requirements when working. Take audio and video all-in-one machines as an example. In some scenarios, in order to meet sufficient heat dissipation requirements, the entire casing is often made of metal, but a pure metal casing will result in higher costs. If plastic materials are used, it is usually necessary to open more heat dissipation holes on the casing, which makes it easy for dust to accumulate inside the electronic device. Utility Model Content

[0003] In view of this, the utility model provides an electronic device to solve the problem that when the electronic device faces the heat dissipation demand, the pure metal shell has a high cost, and the plastic shell has too many openings and is easy to be dusty.

[0004] The utility model provides an electronic device, comprising:

[0005] The first shell and the second shell are both made of non-metallic materials, and the first shell and the second shell together enclose a receiving cavity; the first shell and / or the second shell are partially provided with a heat dissipation opening;

[0006] The main heat sink is detachably mounted at the heat dissipation opening, and the main heat sink is made of metal;

[0007] A mainboard is fixedly installed in the accommodating cavity;

[0008] At least a partial area of ​​the mainboard is connected to the main heat sink via the main heat sink.

[0009] Beneficial effect: The electronic device provided by the embodiment of the utility model has a heat dissipation opening partially opened in the first shell and / or the second shell, and the main heat sink is disassembled and installed at the heat dissipation opening. Since the first shell and the second shell are both made of non-metallic materials, and the main heat sink is made of metal materials, by connecting at least a part of the mainboard area with the main heat sink through the main heat sink, the heat generated by the mainboard can be dissipated through the main heat sink, thereby accelerating the heat dissipation efficiency. By matching the plastic shell with the partially metal shell, the cost can be reduced while ensuring the heat dissipation, and at the same time, there is no need to open more heat dissipation holes in the shell, thereby avoiding the situation where dust easily falls inside the electronic device.

[0010] In an optional embodiment, the main heat sink includes a buckle, and the second shell is formed with a buckle fixing portion corresponding to the buckle, and the buckle is plug-connected with the buckle fixing portion.

[0011] In an optional embodiment, a buckle is provided on the main heat sink, and a buckle fixing portion is formed on the second shell corresponding to the buckle, and the buckle is buckled with the buckle fixing portion.

[0012] Beneficial effect: By inserting the buckle into the buckle fixing part, and then flipping and pressing the main heat sink, the buckle of the main heat sink is buckled into the buckle fixing part to achieve structural fixation. After the main heat sink is installed, full contact between the main heat sink and the thermal conductive silicone is achieved.

[0013] In an optional embodiment, the buckle is separately provided with the main heat sink, and the buckle is fixed to a side of the main heat sink facing the accommodating cavity via a fixing member.

[0014] In an optional embodiment, the electronic device further includes a bracket, which is arranged in the accommodating cavity; the bracket includes:

[0015] A main body portion, adapted to support a mainboard;

[0016] A first flange portion and a second flange portion are respectively arranged on both sides of the main body portion along the assembly direction of the first shell and the second shell, and are arranged at an angle with the main body portion;

[0017] The first flange portion is suitable for being fixedly connected to the first shell, and the second flange portion is suitable for being fixedly connected to the second shell.

[0018] In an optional embodiment, at least a partial area of ​​the bracket is formed with an overlap portion, the overlap portion is located between the mainboard and the main heat sink, and the overlap portion and the main heat sink are connected via a conductive filler.

[0019] Beneficial effect: By forming an overlapped portion in at least part of the bracket, and connecting the overlapped portion to the main heat sink via a conductive filler, the board chip is effectively protected from static electricity. When external high-voltage static electricity hits the main heat sink, the current will be preferentially transferred to the metal bracket through the conductive filler, and will not break through the thermal conductive silicone, thereby ensuring the safety of the motherboard.

[0020] In an optional implementation, the mainboard is installed with a terminal port shell, the terminal port shell is made of metal material, and the terminal port shell is in direct contact with the bracket, or is in indirect contact with the bracket via a conductive filler.

[0021] Beneficial effect: The terminal port shell is made of metal material. By making the terminal port shell directly contact with the bracket, or indirectly contact with it through a conductive filler, when external high-voltage static electricity hits the terminal port, the current will first be transferred to the metal bracket through the conductive filler, and will not directly damage the internal components of the motherboard, thereby playing a safety protection role.

[0022] In an optional embodiment, the bracket is made of a conductive material.

[0023] In an optional embodiment, at least one heat conducting fin is formed on a side of the main heat sink extending away from the mainboard.

[0024] Beneficial effect: By providing the heat-conducting fins, the heat dissipation area of ​​the main heat sink can be increased and the heat dissipation efficiency can be improved.

[0025] In an optional implementation, the electronic device further includes: a microphone component and / or a camera component; and

[0026] The auxiliary heat sink is made of metal material, and the microphone assembly and / or the camera assembly is connected to the auxiliary heat sink via the auxiliary heat conducting part.

[0027] Beneficial effect: By connecting the microphone assembly and / or the camera assembly to the auxiliary heat sink via the auxiliary heat conduction portion, the heat dissipation efficiency of the microphone assembly and / or the camera assembly can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a schematic diagram of the electronic device of the utility model in a disassembled state;

[0030] Figure 2 It is a cross-sectional schematic diagram of the electronic device of the utility model;

[0031] Figure 3 It is a cross-sectional schematic diagram of the electronic device of the utility model in an exploded state;

[0032] Figure 4 It is a schematic diagram of the main heat sink of the utility model in an open state relative to the second housing;

[0033] Figure 5 It is a schematic diagram of the main heat sink of the utility model;

[0034] Figure 6 A schematic diagram of the internal structure of the electronic device of the utility model;

[0035] Figure 7 It is a schematic diagram of the exploded state of the internal structure of the electronic device of the utility model;

[0036] Figure 8 It is a schematic diagram of the heat-conducting filler between the mainboard and the main heat sink of the utility model;

[0037] Fig. 9 It is a schematic diagram of the main heat sink, mainboard and bracket of the utility model.

[0038] Description of reference numerals:

[0039] 1. first housing; 100. accommodating chamber;

[0040] 2. Second housing; 21. Heat dissipation opening; 22. Buckle fixing portion; 23. Clip fixing portion; 24. Housing fixing hole;

[0041] 3. Bracket; 31. Overlapping portion; 32. Conductive filler; 33. Bracket fixing hole; 34. First flange portion; 35. Main body portion; 36. Second flange portion;

[0042] 4. Main board; 41. Main heating part; 42. Terminal port housing;

[0043] 5. Main heat sink; 51. Thermal fin; 52. Buckle; 53. Buckle;

[0044] 6. Microphone assembly; 7. Camera assembly; 8. Auxiliary heat sink; 9. Auxiliary heat conduction unit. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0046] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0047] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0049] Combine the following Figures 1 to 9 , describing an embodiment of the utility model.

[0050] According to an embodiment of the present utility model, there is provided an electronic device, comprising:

[0051] The first shell 1 and the second shell 2 are both made of non-metallic materials, and the first shell 1 and the second shell 2 together enclose a receiving cavity 100; a heat dissipation opening 21 is partially opened in the first shell 1 and / or the second shell 2;

[0052] The main heat sink 5 is detachably mounted at the heat dissipation opening 21, and the main heat sink 5 is made of metal;

[0053] The main board 4 is fixedly installed in the accommodating cavity 100;

[0054] At least a part of the main board 4 is connected to the main heat sink 5 via the main heat sink 41 .

[0055] Combination Figure 1 , Figure 2 It can be known that the first shell 1 can be a front shell, the second shell 2 can be a rear shell, and the first shell 1 is constructed in an inclined shape.

[0056] The first shell 1 and the second shell 2 are together enclosed to form a receiving cavity 100 , and the receiving cavity 100 is suitable for placing components such as a mainboard 4 , a microphone assembly 6 , and a camera assembly 7 .

[0057] Since the first shell 1 and the second shell 2 are jointly enclosed to form the accommodating cavity 100, and the first shell 1 and the second shell 2 are both made of non-metallic materials, after the mainboard 4 and other components are placed in the accommodating cavity 100, due to the poor heat dissipation effect, this embodiment opens a heat dissipation opening 21 in a part of the second shell 2, and removes and installs the main heat sink 5 at the heat dissipation opening 21. By connecting at least a partial area of ​​the mainboard 4 with the main heat sink 5 via the main heat dissipation portion 41, the heat generated by the mainboard 4 can be dissipated through the main heat sink 5, thereby accelerating the heat dissipation efficiency.

[0058] The main heat-conducting portion 41 may be thermally conductive silica gel.

[0059] The first housing 1 and the second housing 2 can be made of low-cost plastic material. The main heat sink 5 is preferably made of aluminum alloy, and the specific grade is preferably AL6063.

[0060] The electronic device provided by the embodiment of the utility model has a heat dissipation opening 21 partially opened in the first shell 1 and / or the second shell 2, and the main heat sink 5 is disassembled and installed at the heat dissipation opening 21. Since the first shell 1 and the second shell 2 are both made of non-metallic materials, and the main heat sink 5 is made of metal materials, by connecting at least a part of the mainboard 4 with the main heat sink 5 via the main heat dissipation part 41, the heat generated by the mainboard 4 can be dissipated through the main heat sink 5, thereby accelerating the heat dissipation efficiency. By matching the plastic shell with the partially metal shell, the cost can be reduced while ensuring the heat dissipation, and at the same time, there is no need to open more heat dissipation holes in the shell, thereby avoiding the situation where dust easily falls inside the electronic device.

[0061] The main heat sink 5 can be detachably installed at the heat dissipation opening 21, which can not only meet the heat dissipation requirements, but also in the subsequent maintenance stage, the main heat sink 5 can be disassembled to conveniently expose the motherboard 4 inside the shell, thereby realizing rapid maintenance of the electronic device.

[0062] In some embodiments, in combination Figures 2 to 5 As shown, the main heat sink 5 includes a buckle 52 , and the second housing 2 is formed with a buckle fixing portion 22 corresponding to the buckle 52 , and the buckle 52 is plug-connected with the buckle fixing portion 22 .

[0063] In some embodiments, a buckle 53 is provided on the main heat sink 5 , and a buckle fixing portion 23 is formed on the second housing 2 corresponding to the buckle 53 , and the buckle 53 is buckled with the buckle fixing portion 23 .

[0064] The buckle fixing portion 22 is formed on the second shell 2 and is specifically located at the edge position surrounding the heat dissipation opening 21. The main heat sink 5 includes a buckle 52, and the buckle 52 is arranged on a side of the main heat sink 5 corresponding to the buckle fixing portion 22. Taking the main heat sink 5 as a quadrilateral plate as an example, the buckle 52 is arranged at the position of one of the side edges of the main heat sink 5.

[0065] Taking the main heat sink 5 as a quadrilateral plate as an example, the buckle 53 is arranged on the side of the main heat sink 5 opposite to the plug buckle 52. In addition, the buckle 53 can also be arranged on the side of the main heat sink 5 adjacent to the plug buckle 52.

[0066] During the specific installation, the buckle 52 is inserted into the position of the buckle fixing part 22, and then the main heat sink 5 is turned over and pressed down, so that the buckle 53 of the main heat sink 5 is buckled into the buckle fixing part 23, so as to achieve structural fixation. After the main heat sink 5 is installed, the main heat sink 5 and the thermal conductive silicone are fully in contact.

[0067] In addition, the main heat sink 5 of this embodiment adopts the installation form of the plug buckle 52 and the buckle 53. After being installed to the second shell 2, it can be effectively fixed without screws, ensuring the appearance without screws and improving the overall appearance effect.

[0068] In some embodiments, in combination Figure 5 As shown, the buckle 53 is separately provided with the main heat sink 5 , and the buckle 53 is fixed to the side of the main heat sink 5 facing the accommodating cavity 100 via a fixing member.

[0069] The main heat sink 5 is made of metal, and the buckle 53 can be made of plastic. The buckle 53 and the main heat sink 5 are set separately, for example, by bonding or screwing, to fix the buckle 53 and the main heat sink 5. Since the buckle 53 is fixed to the side of the main heat sink 5 facing the accommodating cavity 100, the main heat sink 5 can be installed in the second shell 2 without screws.

[0070] In some embodiments, in combination Figure 2 , Figure 3 As shown, the electronic device further includes a bracket 3, which is arranged in the accommodating cavity 100; the bracket 3 includes:

[0071] The main body 35 is adapted to support the main board 4;

[0072] The first flange portion 34 and the second flange portion 36 are respectively disposed on both sides of the main body portion 35 along the assembly direction of the first shell 1 and the second shell 2, and are disposed at an angle with the main body portion 35;

[0073] The first flange portion 34 is suitable for being fixedly connected to the first shell 1 , and the second flange portion 36 is suitable for being fixedly connected to the second shell 2 .

[0074] Since the first housing 1 is tilted and has a large inclination angle, it is difficult to make a plastic buckle mold, resulting in a small number of buckles on the first housing 1. In this embodiment, by providing a bracket 3 and the bracket 3 is configured in a Z shape, the first housing 1 and the second housing 2 can be assembled on the bracket 3 respectively to achieve the fixation of the overall structure.

[0075] The second flange portion 36 is provided with a bracket fixing hole 33, and the second shell 2 is provided with a shell fixing hole 24. Figure 2As shown, the second flange portion 36 is arranged to fit the inner surface of the second shell 2 , and the second flange portion 36 can be fixedly connected to the second shell 2 by screws passing through the shell fixing hole 24 and the bracket fixing hole 33 .

[0076] Additionally, plastic buckles are correspondingly disposed between the first shell 1 and the second shell 2 to perform alignment, positioning and preliminary fixation.

[0077] The bracket 3 simultaneously connects the first shell 1 and the second shell 2, which can ensure a strong connection of the entire electronic device and ensure the structural strength of the overall product.

[0078] In some embodiments, in combination Figure 7 , Figure 8 As shown, at least a portion of the bracket 3 is formed with a lap portion 31 , the lap portion 31 is located between the mainboard 4 and the main heat sink 5 , and the lap portion 31 and the main heat sink 5 are connected via a conductive filler 32 .

[0079] The overlapping portion 31 is disposed on a side of the first flange portion 34 away from the main body portion 35 .

[0080] By forming a lap joint 31 in at least part of the bracket 3, and connecting the lap joint 31 to the main heat sink 5 via the conductive filler 32, the board chip is effectively protected from static electricity. When external high-voltage static electricity hits the main heat sink 5, the current will be preferentially transferred to the metal bracket 3 through the conductive filler 32, and will not break through the thermal conductive silicone, thereby ensuring the safety of the motherboard 4.

[0081] The conductive filler 32 may specifically be conductive foam.

[0082] In some embodiments, in combination Fig. 9 As shown, the mainboard 4 is installed with a terminal port shell 42 , which is made of metal material. The terminal port shell 42 is in direct contact with the bracket 3 , or is in indirect contact with the bracket 3 via a conductive filler 32 .

[0083] The terminal port shell 42 is made of metal material. By making the terminal port shell 42 directly contact with the bracket 3, or indirectly contact with it through the conductive filler 32, when external high-voltage static electricity hits the terminal port, the current will preferentially pass through the conductive filler 32 to the metal bracket 3, and will not directly damage the internal components of the mainboard 4, thereby playing a safety protection role.

[0084] In some embodiments, the bracket 3 is made of a conductive material.

[0085] Specifically, the bracket 3 is made of metal material, which can meet the conductive grounding requirements.

[0086] In some embodiments, in combination Figure 3As shown, at least one heat conducting fin 51 is formed on a side of the main heat sink 5 extending away from the mainboard 4 .

[0087] By providing the heat-conducting fins 51 , the heat dissipation area of ​​the main heat sink 5 can be increased, thereby improving the heat dissipation efficiency.

[0088] In some embodiments, in combination Figure 6 , Figure 7 As shown, the electronic device further includes: a microphone component 6 and / or a camera component 7; and

[0089] The auxiliary heat sink 8 is made of metal material, and the microphone assembly 6 and / or the camera assembly 7 is connected to the auxiliary heat sink 8 via the auxiliary heat conducting portion 9 .

[0090] By connecting the microphone assembly 6 and / or the camera assembly 7 to the auxiliary heat sink 8 via the auxiliary heat conducting portion 9, the heat dissipation efficiency of the microphone assembly 6 and / or the camera assembly 7 can be increased.

[0091] Obviously, the above embodiments are only examples for clear explanation, and are not intended to limit the implementation methods. Although the embodiments of the present utility model are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present utility model, and such modifications and variations are all within the scope defined by the present utility model.

Claims

1. An electronic device, characterized in that: include: A first shell (1) and a second shell (2), wherein the first shell (1) and the second shell (2) are both made of non-metallic material, and the first shell (1) and the second shell (2) together enclose a receiving cavity (100); a heat dissipation opening (21) is partially provided on the first shell (1) and / or the second shell (2); A main heat sink (5) is detachably mounted on the heat dissipation opening (21), and the main heat sink (5) is made of a metal material; A main board (4) is fixedly mounted in the accommodating cavity (100); At least a partial area of ​​the main board (4) is connected to the main heat sink (5) via the main heat-dissipating portion (41).

2. The electronic device according to claim 1, characterized in that: The main heat sink (5) comprises a buckle (52), and the second housing (2) is formed with a buckle fixing portion (22) corresponding to the buckle (52), and the buckle (52) is plug-connected with the buckle fixing portion (22).

3. The electronic device according to claim 2, characterized in that: A buckle (53) is provided on the main heat sink (5), and a buckle fixing portion (23) is formed on the second housing (2) corresponding to the buckle (53), and the buckle (53) is buckled with the buckle fixing portion (23).

4. The electronic device according to claim 3, characterized in that: The buckle (53) and the main heat sink (5) are arranged separately, and the buckle (53) is fixed to a side of the main heat sink (5) facing the accommodating cavity (100) via a fixing member.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further comprises a bracket (3) which is arranged in the accommodating cavity (100); the bracket (3) comprises: A main body (35) adapted to support the main board (4); A first flange portion (34) and a second flange portion (36), along the assembly direction of the first shell (1) and the second shell (2), the first flange portion (34) and the second flange portion (36) are respectively arranged on both sides of the main body portion (35), and are arranged at an angle with the main body portion (35); The first flange portion (34) is suitable for being fixedly connected to the first shell (1), and the second flange portion (36) is suitable for being fixedly connected to the second shell (2).

6. The electronic device according to claim 5, characterized in that: At least a partial area of ​​the bracket (3) is formed with an overlap portion (31), the overlap portion (31) is located between the main board (4) and the main heat sink (5), and the overlap portion (31) and the main heat sink (5) are connected via a conductive filler (32).

7. The electronic device according to claim 5, characterized in that: The mainboard (4) is installed with a terminal port shell (42), the terminal port shell (42) is made of a metal material, and the terminal port shell (42) is in direct contact with the bracket (3) or in indirect contact via a conductive filler (32).

8. The electronic device according to claim 5, characterized in that: The bracket (3) is made of a conductive material.

9. The electronic device according to any one of claims 1 to 4, characterized in that: At least one heat-conducting fin (51) is formed extending from a side of the main heat sink (5) away from the main board (4).

10. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further comprises: a microphone component (6) and / or a camera component (7); and The auxiliary heat sink (8) is made of a metal material, and the microphone assembly (6) and / or the camera assembly (7) is connected to the auxiliary heat sink (8) via an auxiliary heat conducting portion (9).

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