Power distribution switch mainboard with long service life
By using a combination structure of polytetrafluoroethylene, epoxy resin, aluminum alloy and polyimide on the power distribution switch motherboard, the problem of untimely heat dissipation and dust accumulation of the power distribution switch motherboard is solved, and a higher level is achieved The reliability and anti-interference ability extend the service life.
Patent Information
- Application Number
- CN202420686132.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-07
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-07
AI Technical Summary
During long-term operation, the existing distribution switch motherboards have caused untimely heat dissipation and pollutants to accumulate due to temperature changes and dust accumulation, resulting in corrosion, short circuits or poor contact problems, shortening their service life.
The structure adopts a circuit board layer, signal layer, insulating layer, sealing layer, heat dissipation component, protective layer and coating, where the insulating layer is polytetrafluoroethylene, sealing layer is epoxy resin, protective layer is aluminum alloy, coating For polyimide, the heat dissipation components are aluminum alloy thermal management layers and copper heat dissipation plates, which achieve good sealing, thermal conductivity and isolation through these materials and structures.
Effectively prevent dust and pollutants from entering, improve the reliability and anti-interference ability of the power distribution switch motherboard, enhance the heat dissipation effect, and extend the service life.
Smart Images
Figure CN222339831U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power distribution switch mainboards, in particular to a power distribution switch mainboard with a long service life. Background Art
[0002] The power distribution switch motherboard is usually one of the key components used to control power distribution and protect circuits. It usually contains multiple circuit breakers and other electrical devices for monitoring power supply and distributing current. There are also some connectors on the motherboard for connecting external power supplies and load devices.
[0003] During the long-term operation of the existing distribution switch mainboard, the heat generated cannot be dissipated in time due to temperature changes, thermal expansion and contraction, etc., and the distribution switch mainboard is used in a dusty environment, and dust and pollutants may accumulate on the mainboard, causing corrosion, short circuit or poor contact problems, thereby causing damage to the distribution switch mainboard. Therefore, the present application proposes a distribution switch mainboard with a long service life. Utility Model Content
[0004] The purpose of the utility model is to solve the shortcomings existing in the prior art and to propose a distribution switch mainboard with a long service life, aiming to improve the problem that the heat generated by the distribution switch mainboard during long-term operation cannot be dissipated in time, and dust and pollutants may accumulate on the mainboard.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a distribution switch mainboard with a long service life, comprising a circuit board layer, the outer wall of the circuit board layer is fixedly connected to a signal layer, the outer wall of the signal layer is fixedly connected to an insulating layer, the outer wall of the insulating layer is fixedly connected to a sealing layer, the outer wall of the sealing layer is provided with a heat dissipation component, the outer wall of the circuit board layer is provided with a protective layer, and the outer wall of the protective layer is fixedly connected to a coating.
[0006] As a further description of the above technical solution:
[0007] The material of the insulating layer is set to polytetrafluoroethylene, and the material of the sealing layer is set to epoxy resin.
[0008] As a further description of the above technical solution:
[0009] The material of the protective layer is set to aluminum alloy, and the material of the coating is set to polyimide.
[0010] As a further description of the above technical solution:
[0011] The heat dissipation component comprises a heat management layer, an outer wall of an inner end of the heat management layer is fixedly connected to the outer wall of the sealing layer, and the material of the heat management layer is set to be aluminum alloy.
[0012] As a further description of the above technical solution:
[0013] The upper and lower ends of the thermal management layer are both fixedly connected to the outer walls with heat dissipation plates, the heat dissipation plates on both sides are made of copper, and the inner walls of the heat dissipation plates on both sides are provided with a plurality of heat dissipation holes.
[0014] The utility model has the following beneficial effects:
[0015] In the utility model, firstly, when the power distribution switch mainboard is used in an environment with dust and pollutants, the coating can provide waterproof, dustproof and chemical-resistant properties, thereby improving the reliability and durability of the power distribution switch mainboard. The protective layer has good sealing performance, which can prevent dust, moisture and pollutants from entering the power distribution switch mainboard. Then, the heat dissipation plate has good thermal conductivity, which can quickly conduct the heat generated by the power distribution switch mainboard to the heat dissipation plate, and then further disperse it into the surrounding air. The heat dissipation surface area can be increased through the heat dissipation holes, providing more heat dissipation channels. Subsequently, the heat management layer can effectively conduct and disperse the heat. The heat generated by the distribution switch mainboard can be dissipated to improve the heat dissipation effect. At the same time, the sealing layer can prevent external factors such as dust, pollutants and moisture from entering the distribution switch mainboard, protecting the electronic components and circuits of the distribution switch mainboard from pollution and oxidation. The insulating layer can isolate external radio waves, static electricity, magnetic fields and other interferences to ensure the signal transmission and processing capabilities of the distribution switch mainboard, improve the anti-interference ability and reliability of the distribution switch mainboard, avoid the distribution switch mainboard from being damaged due to untimely heat dissipation and dust accumulation, improve the protection of the distribution switch mainboard, and achieve the effect of increasing the service life of the distribution switch mainboard. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A three-dimensional diagram of a mainboard of a power distribution switch with a long service life proposed by the utility model;
[0017] Figure 2 This is a schematic diagram of a heat sink for a power distribution switch mainboard with a long service life proposed by the utility model;
[0018] Figure 3 This is a schematic diagram of a heat dissipation hole of a power distribution switch mainboard with a long service life proposed by the utility model.
[0019] Legend:
[0020] 1. Circuit board layer; 2. Signal layer; 3. Insulation layer; 4. Sealing layer; 5. Thermal management layer; 6. Heat sink; 7. Heat dissipation holes; 8. Protective layer; 9. Coating. DETAILED DESCRIPTION
[0021] The following will refer to the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] In order to further understand the content of the utility model, the utility model is described in detail with reference to the accompanying drawings.
[0023] Reference Figure 1-3 The utility model provides an embodiment: a power distribution switch mainboard with a long service life, including a circuit board layer 1, the outer wall of the circuit board layer 1 is fixedly connected with a signal layer 2, the outer wall of the signal layer 2 is fixedly connected with an insulating layer 3, the outer wall of the insulating layer 3 is fixedly connected with a sealing layer 4, the outer wall of the sealing layer 4 is provided with a heat dissipation component, the outer wall of the circuit board layer 1 is provided with a protective layer 8, and the outer wall of the protective layer 8 is fixedly connected with a coating 9.
[0024] Furthermore, various components are connected through the circuit board layer 1 to connect and transmit circuits, signals and control signals are transmitted through the signal layer 2, and the sealing layer 4 can prevent external factors such as dust, pollutants and moisture from entering the distribution switch mainboard, thereby protecting the electronic components and circuits of the distribution switch mainboard from pollution and oxidation. The insulating layer 3 can isolate external radio waves, static electricity, magnetic fields and other interferences, thereby ensuring the signal transmission and processing capabilities of the distribution switch mainboard.
[0025] The material of the insulating layer 3 is set to polytetrafluoroethylene, the material of the sealing layer 4 is set to epoxy resin, the material of the protective layer 8 is set to aluminum alloy, and the material of the coating layer 9 is set to polyimide.
[0026] Furthermore, the coating 9 can provide waterproof, dustproof and chemical-resistant properties, thereby improving the reliability and durability of the distribution switch mainboard. The protective layer 8 has good sealing properties, thereby preventing dust, moisture and pollutants from entering the distribution switch mainboard.
[0027] The heat dissipation component includes a heat management layer 5, an inner end outer wall of the heat management layer 5 is fixedly connected to the outer wall of the sealing layer 4, the material of the heat management layer 5 is set to aluminum alloy, and the upper and lower ends of the heat management layer 5 are fixedly connected to the outer walls with heat dissipation plates 6, the material of the heat dissipation plates 6 on both sides is set to copper, and the inner walls of the heat dissipation plates 6 on both sides are opened with a plurality of heat dissipation holes 7.
[0028] Furthermore, the heat sink 6 has good thermal conductivity, so the heat generated by the distribution switch mainboard can be quickly conducted to the heat sink 6, and then further dispersed into the surrounding air. The heat dissipation surface area can be increased through the heat dissipation holes 7, providing more heat dissipation channels. Subsequently, the heat generated by the distribution switch mainboard can be effectively conducted and dispersed through the thermal management layer 5, thereby improving the heat dissipation effect.
[0029] Working principle: First, the circuit board layer 1 is responsible for the signals and power supply between the various components on the distribution switch mainboard, and the signal layer 2 is responsible for the transmission of signals. When the distribution switch mainboard is used in an environment with dust and pollutants, the coating 9 can provide waterproof, dustproof and chemical resistance properties to improve the reliability and durability of the distribution switch mainboard. The protective layer 8 has good sealing performance to prevent dust, moisture and pollutants from entering the distribution switch mainboard. Then, the heat sink 6 has good thermal conductivity, which can quickly transfer the heat generated by the distribution switch mainboard to the heat sink 6, and then further disperse it into the surrounding air. The heat dissipation holes 7 can increase The heat dissipation surface area is increased to provide more heat dissipation channels. Subsequently, the heat generated by the distribution switch mainboard can be effectively conducted and dispersed through the thermal management layer 5 to improve the heat dissipation effect. At the same time, the sealing layer 4 can prevent external factors such as dust, pollutants and moisture from entering the distribution switch mainboard, protecting the electronic components and circuits of the distribution switch mainboard from pollution and oxidation. The insulating layer 3 can isolate external radio waves, static electricity, magnetic fields and other interferences, ensure the signal transmission and processing capabilities of the distribution switch mainboard, improve the anti-interference ability and reliability of the distribution switch mainboard, improve the protection of the distribution switch mainboard, and achieve the effect of increasing the service life of the distribution switch mainboard.
[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A power distribution switch mainboard with a long service life, comprising a circuit board layer (1), characterized in that: The outer wall of the circuit board layer (1) is fixedly connected to a signal layer (2), the outer wall of the signal layer (2) is fixedly connected to an insulating layer (3), the outer wall of the insulating layer (3) is fixedly connected to a sealing layer (4), the outer wall of the sealing layer (4) is provided with a heat dissipation component, the outer wall of the circuit board layer (1) is provided with a protective layer (8), and the outer wall of the protective layer (8) is fixedly connected to a coating (9).
2. A power distribution switch mainboard with a long service life according to claim 1, characterized in that: The material of the insulating layer (3) is set to polytetrafluoroethylene, and the material of the sealing layer (4) is set to epoxy resin.
3. A power distribution switch mainboard with a long service life according to claim 1, characterized in that: The material of the protective layer (8) is set to be aluminum alloy, and the material of the coating (9) is set to be polyimide.
4. A power distribution switch mainboard with a long service life according to claim 1, characterized in that: The heat dissipation component comprises a heat management layer (5), the outer wall of an inner end of the heat management layer (5) is fixedly connected to the outer wall of the sealing layer (4), and the material of the heat management layer (5) is set to be aluminum alloy.
5. A power distribution switch mainboard with a long service life according to claim 4, characterized in that: The upper and lower ends of the thermal management layer (5) are both fixedly connected to the outer walls with heat dissipation plates (6), the heat dissipation plates (6) on both sides are made of copper, and the inner walls of the heat dissipation plates (6) on both sides are provided with a plurality of heat dissipation holes (7).