High-heat-dissipation power supply module

Abstract

The utility model discloses a high heat dissipation power supply module, which comprises an installation shell, an air inlet, a connecting wire, an air outlet, a circuit board, a heat dissipation fan module, a buckle and a heat dissipation alloy plate, the rear end of the installation shell is provided with the air inlet and the connecting wire, the front end of the installation shell is provided with the air outlet, and the circuit board is installed in the installation shell. According to the high-heat-dissipation power supply module, the design is suitable for efficient heat dissipation of the circuit board, the heat dissipation alloy plate is installed at the bottom of the circuit board in an attached mode through the buckles, heat of a plate body is rapidly conducted out through the heat dissipation alloy plate, the heat dissipation effect is good, and the heat dissipation effect is good. An alloy heat dissipation ring is installed in front of the heat dissipation fan module to absorb heat in a concentrated mode and then dissipate heat, and a fan is installed in an arc-shaped inner sound insulation bin to reduce working noise.

Description

Technical Field

[0001] The utility model relates to a high heat dissipation power supply module, belonging to the technical field of power supply modules. Background Art

[0002] With the development of the electronics industry, the power supply is required to be smaller and more reliable. With the advancement of high-frequency soft switching technology, semiconductor process and packaging technology, the power density of power modules is getting higher and higher, the conversion efficiency is getting higher and higher, and the application is simpler. High integration and large heat dissipation require high heat dissipation performance. Utility Model Content

[0003] The purpose of the utility model is to provide a high heat dissipation power supply module to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high heat dissipation power supply module, including an installation shell, an air inlet, wiring, an air outlet, a circuit board, a heat dissipation fan module, a clip, and a heat dissipation alloy plate. The rear end of the installation shell is provided with an air inlet and wiring, the front end of the installation shell is provided with an air outlet, the installation shell is internally installed with a circuit board, a heat dissipation fan module is vertically installed on one side of the circuit board, and the heat dissipation alloy plate is fixed to the bottom of the circuit board by a clip.

[0005] Preferably, the heat dissipation fan module consists of a mounting frame, an arc-shaped inner sound insulation chamber, a fan and an alloy heat dissipation ring. The arc-shaped inner sound insulation chamber is fixedly installed on the inner frame of the mounting frame, the fan is arranged at the center of the arc-shaped inner sound insulation chamber, and the alloy heat dissipation ring is fixedly installed on the outer side of the mounting frame.

[0006] Preferably, the heat dissipation alloy plate is composed of thermal conductive silicone grease and an alloy plate, and the thermal conductive silicone grease is spread on the upper end of the alloy plate.

[0007] Preferably, a non-slip rubber pad is attached to the bottom of the buckle.

[0008] Compared with the prior art, the beneficial effects of the utility model are: a heat dissipation alloy plate is installed at the bottom of the circuit board through a snap-fit, the heat dissipation alloy plate quickly conducts the heat of the board body, an alloy heat dissipation ring is installed in front of the heat dissipation fan module to absorb the heat and then dissipate the heat, and the fan is installed inside the arc-shaped sound insulation compartment to reduce working noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of the structure of the high heat dissipation power supply module of the utility model;

[0010] Figure 2 This is a schematic diagram of the installation structure of the circuit board of the utility model;

[0011] Figure 3 This is a schematic diagram of the structure of the heat dissipation fan module of the utility model;

[0012] Figure 4 This is a schematic diagram of the structure of the heat dissipation alloy plate of the utility model;

[0013] In the figure: 1. Installation shell, 2. Air inlet, 3. Wiring, 4. Air outlet, 5. Circuit board, 6. Cooling fan module, 7. Buckle, 8. Cooling alloy plate, 9. Installation frame, 10. Arc-shaped inner sound insulation compartment, 11. Fan, 12. Alloy heat dissipation ring, 13. Thermal grease, 14. Alloy plate, 15. Anti-slip rubber pad. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0015] like Figure 1-Figure 4 As shown, a high heat dissipation power supply module includes an installation shell 1, an air inlet 2, a wiring 3, an air outlet 4, a circuit board 5, a heat dissipation fan module 6, a buckle 7, and a heat dissipation alloy plate 8. The installation shell 1 is provided with an air inlet 2 and a wiring 3 at the rear end, and the installation shell 1 is provided with an air outlet 4 at the front end. The installation shell 1 is internally installed with a circuit board 5, a heat dissipation fan module 6 is vertically installed on one side of the circuit board 5, and the heat dissipation alloy plate 8 is fixedly installed on the bottom of the circuit board 5 by a buckle 7.

[0016] The heat dissipation fan module 6 is composed of a mounting frame 9, an arc-shaped inner sound insulation chamber 10, a fan 11 and an alloy heat dissipation ring 12. The inner frame of the mounting frame 9 is fixedly installed with the arc-shaped inner sound insulation chamber 10, and the fan 11 is installed at the center of the arc-shaped inner sound insulation chamber 10. An alloy heat dissipation ring 12 is fixedly installed on the outer side of the mounting frame 9. The alloy heat dissipation ring 12 absorbs heat and then dissipates it. The fan 11 is installed inside the arc-shaped inner sound insulation chamber 10 to reduce working noise.

[0017] The heat dissipation alloy plate 8 is composed of a thermal grease 13 and an alloy plate 14 . The thermal grease 13 is spread on the upper end of the alloy plate 14 . The thermal grease 13 dissipates the heat of the circuit board through the alloy plate 14 .

[0018] A non-slip rubber pad 15 is attached to the bottom of the buckle 7 to ensure installation stability.

[0019] Specific usage: A high heat dissipation power module. This device is designed for efficient heat dissipation of circuit boards. A heat dissipation alloy plate is installed at the bottom of the circuit board through snap fit. The heat dissipation alloy plate quickly conducts the heat of the board body. An alloy heat dissipation ring is installed in front of the heat dissipation fan module to absorb the heat and then dissipate it. The fan is installed inside the arc-shaped soundproof compartment to reduce working noise.

[0020] The above is a preferred embodiment of the present invention. For ordinary technicians in this field, according to the teachings of the present invention, without departing from the principles and spirit of the present invention, changes, modifications, substitutions and variations made to the implementation methods are still within the scope of protection of the present invention.

Claims

1. A high heat dissipation power module, characterized in that: The invention comprises an installation shell (1), an air inlet (2), a wiring (3), an air outlet (4), a circuit board (5), a heat dissipation fan module (6), a buckle (7), and a heat dissipation alloy plate (8). The installation shell (1) is provided with an air inlet (2) and a wiring (3) at the rear end, and an air outlet (4) at the front end. The installation shell (1) is provided with a circuit board (5) installed inside. The heat dissipation fan module (6) is vertically installed on one side of the circuit board (5). The heat dissipation alloy plate (8) is fixedly installed on the bottom of the circuit board (5) by means of a buckle (7).

2. A high heat dissipation power module according to claim 1, characterized in that: The heat dissipation fan module (6) is composed of a mounting frame (9), an arc-shaped inner sound insulation chamber (10), a fan (11) and an alloy heat dissipation ring (12); the arc-shaped inner sound insulation chamber (10) is fixedly mounted on the inner frame of the mounting frame (9); the fan (11) is arranged at the center of the arc-shaped inner sound insulation chamber (10); and the alloy heat dissipation ring (12) is fixedly mounted on the outer side of the mounting frame (9).

3. The high heat dissipation power module according to claim 1, characterized in that: The heat dissipation alloy plate (8) is composed of thermal conductive silicone grease (13) and an alloy plate (14), and the thermal conductive silicone grease (13) is paved on the upper end of the alloy plate (14).

4. The high heat dissipation power module according to claim 1, characterized in that: An anti-slip rubber pad (15) is adhered to the bottom of the buckle (7).

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