Anti-collision chip mounter conveying device
By using damping springs and buffer plates in the conveyor device of the patch machine for shock absorption, combined with the design of the conveyor belt and telescopic rod, the vibration problem when the device is hit is solved, the patch accuracy and production efficiency are improved, and the product damage is reduced Rate.
Patent Information
- Application Number
- CN202420731559.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2034-04-10
AI Technical Summary
The existing chip machine conveying device is prone to vibration when impacted, causing the electronic components and the raw material plate to break away from their original position during the bonding process, affecting the accuracy of pasting and production quality.
An anti-collision-proof patch machine conveyor device is designed, using damping springs and buffer plates for shock absorption, combined with a combination of conveyor belts, telescopic rods and clamps to ensure accurate alignment and stability of electronic components and raw material plates when bonding.
It effectively reduces the probability of product defective products, improves patch accuracy and production efficiency, and reduces labor costs.
Smart Images

Figure CN222339874U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of conveying devices, in particular to a collision-proof conveying device for a chip mounter. Background Art
[0002] During the production process of integrated circuit boards, the raw board needs to be printed with solder paste on a solder paste printer, and then the raw board printed with solder paste is transferred to a placement machine. The placement machine places electronic components on the raw board printed with solder paste, and finally the raw board is transported to a reflow soldering furnace to melt the solder paste into liquid and then cool and solidify it to fix the electronic components to the raw board.
[0003] In the existing SMT conveying device, the raw material board may be skewed during the conveying process, which affects the accuracy of the SMT main body in pasting electronic components on the raw material board, and there is a defect of low accuracy in pasting electronic components on the raw material board. For example, a SMT conveying device with adjustable spacing is recorded in the patent with patent announcement number CN 214826910 U, which uses a positioning plate and abutment plate to limit the raw material board, reduces the degree of skewness of the raw material board, and improves the accuracy of pasting electronic components on the raw material board. However, in the process of pasting electronic components on the raw material board, if the device is hit and vibrates to a certain extent, it is easy for the electronic components and the raw material board to be separated from the original position during the pasting process, resulting in inaccurate pasting position of the electronic components, which greatly reduces the production quality of the product.
[0004] Based on this, a collision-proof placement machine conveying device is now provided, which can eliminate the disadvantages of the existing device. Utility Model Content
[0005] The utility model aims to provide a collision-proof chip placement machine conveying device to solve the problem in the background technology that the device is prone to vibration due to collision.
[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0007] An anti-collision chip placement machine conveying device includes a base;
[0008] A rotating groove is provided on the base, a transmission component is provided inside the rotating groove, a supporting frame is provided at the upper end of the base, a fixing component is provided inside the supporting frame, a loading component is provided inside the supporting frame, a feeding component is provided inside the supporting frame, and a buffer component is provided at the lower end of the feeding component.
[0009] On the basis of the above technical solutions, the present invention also provides the following optional technical solutions:
[0010] In an optional solution: the conveying component includes a rotating shaft, which is rotatably arranged on the inner walls on both sides of the rotating groove, a driving motor is provided on the surface of the base, the output end of the driving motor is connected to the rotating shaft, rotating rollers are provided on the outside of the rotating shaft, and a conveyor belt is provided on the outside of the rotating rollers.
[0011] In an optional solution: the fixing assembly includes a support rod, there are multiple support rods, and they are arranged on the inner wall of one side of the support frame, a first telescopic rod is arranged on the inside of the other side of the support frame, the output end of the first telescopic rod and the end of the support rod are both provided with a fixing plate, a guide plate is provided at the left end of the fixing plate, and a rubber pad is provided on the surface of the fixing plate.
[0012] In an optional solution: the loading assembly includes a support block, the support block is arranged on the inner wall of the support frame, a movable groove is provided on the support block, a placement box is provided at the upper end of the support block, an entrance is provided on the surface of the support frame, the entrance is connected to the placement box, a second telescopic rod is provided inside the movable groove, and a push plate is provided at the output end of the second telescopic rod.
[0013] In an optional scheme: the feeding assembly includes a connecting rod, the connecting rod is arranged between the inner walls on both sides of the supporting frame, the connecting rod is provided with a slide groove, a slider is provided inside the slide groove for sliding, a third telescopic rod is provided at the lower end of the slider, a connecting block is provided at the output end of the third telescopic rod, a two-way telescopic rod is provided at the upper end of the connecting block, splints are provided at the output ends of both sides of the two-way telescopic rod, a motor is provided at the upper end of the slider, a driving wheel is provided at the output end of the motor, a rack is provided at the upper end of the connecting rod, and the driving wheel is meshed with the rack.
[0014] In an optional solution: the buffer assembly includes a damping spring, a plurality of damping springs are provided and evenly distributed at the lower end of the connecting block, and a buffer pad is provided at the lower end of the damping spring.
[0015] In an optional solution: an anti-slip plate is provided on the inner wall of the splint.
[0016] In an optional solution: a detector is provided at the top of the support frame, and an observation window is provided on the surface of the support frame.
[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0018] 1. The utility model uses the damping spring and the buffer plate to reduce shock and prevent collision when the electronic components and the raw material plate are bonded, thereby greatly reducing the probability of defective products when the products are bonded.
[0019] 2. The utility model places the electronic components in the placement box, and then starts the second telescopic rod so that the push plate pushes the electronic components out. At this time, the motor is started to move the slider, and then the third telescopic rod and the two-way telescopic rod are used to clamp the electronic components with the clamping plate, and then they are fitted with the raw material plate, which reduces labor costs and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a structural schematic diagram of the utility model.
[0021] Figure 2 It is a structural schematic diagram of the conveyor belt of the utility model.
[0022] Figure 3 It is a structural schematic diagram of the fixing plate of the utility model.
[0023] Figure 4 It is a schematic diagram of the structure inside the support frame of the utility model.
[0024] Figure 5 It is a schematic diagram of the structural section of the support frame of the utility model.
[0025] Figure 6 It is a structural schematic diagram of the connecting rod of the utility model.
[0026] Figure 7 This is a schematic diagram of the structure of the bidirectional telescopic rod of the utility model.
[0027] Notes on figure numbers: 100, base; 200, rotating groove; 201, rotating shaft; 202, driving motor; 203, rotating roller; 204, conveyor belt; 300, supporting frame; 301, supporting rod; 302, first telescopic rod; 303, fixing plate; 304, guide plate; 305, rubber pad; 400, supporting block; 401, moving groove; 402, placing box; 403, second telescopic rod; 404, pushing plate; 405, entrance; 500, connecting rod; 501, sliding groove; 502, sliding block; 503, third telescopic rod; 504, connecting block; 505, two-way telescopic rod; 506, splint; 507, anti-slip pad; 508, motor; 509, driving wheel; 510, rack; 511, damping spring; 512, buffer plate; 600, detector; 601, observation window. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.
[0029] Example 1
[0030] In one embodiment, Figure 1-Figure 7As shown, a collision-proof placement machine conveying device includes a base 100 and a rotating groove 200. The base 100 is provided with a rotating groove 200, and a conveying component is provided inside the rotating groove 200. A support frame 300 is provided at the upper end of the base 100, and a fixing component is provided inside the support frame 300. A loading component is provided inside the support frame 300, and a feeding component is provided inside the support frame 300. A buffer component is provided at the lower end of the feeding component. A detector 600 is provided at the top end of the support frame 300 for detecting the raw material plate moving on the conveyor belt 204 to facilitate the subsequent bonding of electronic components. An observation window 601 is provided on the surface of the support frame 300 for observing the bonding of electronic components inside the support frame 300.
[0031] The conveying assembly includes a rotating shaft 201, which is rotatably arranged on the inner walls of both sides of the rotating groove 200. A driving motor 202 is provided on the surface of the base 100, and the output end of the driving motor 202 is connected to the rotating shaft 201. A rotating roller 203 is provided on the outer side of the rotating shaft 201, and a conveyor belt 204 is provided on the outer side of the rotating roller 203. When the driving motor 202 is started, the rotating shaft 201 drives the rotating roller 203 to rotate, so that the raw material plate moves following the conveyor belt 204.
[0032] The fixing assembly includes a support rod 301, and a plurality of support rods 301 are provided and arranged on the inner wall of one side of the support frame 300. A first telescopic rod 302 is provided inside the other side of the support frame 300. A fixing plate 303 is provided at the output end of the first telescopic rod 302 and the end of the support rod 301. A guide plate 304 is provided at the left end of the fixing plate 303. A rubber pad 305 is provided on the surface of the fixing plate 303. When the raw material board moves to an appropriate position, the first telescopic rod 302 is started to move the fixing plate 303 toward the raw material board, so that the raw material board is fixed between the two fixing plates 303, which is convenient for subsequent patching.
[0033] The loading assembly includes a support block 400, which is arranged on the inner wall of the support frame 300. A moving groove 401 is provided on the support block 400. A placement box 402 is provided on the upper end of the support block 400. An entrance 405 is provided on the surface of the support frame 300. The entrance 405 is communicated with the placement box 402. A second telescopic rod 403 is provided inside the moving groove 401. A push plate 404 is provided at the output end of the second telescopic rod 403. When in use, the required electronic components are first placed into the placement box 402 from the entrance 405. When it is needed, the second telescopic rod 403 is started to make the push plate 404 move forward. When passing under the placement box 402, the electronic components inside are pushed to the end of the moving groove 401 for easy use.
[0034] The feeding assembly includes a connecting rod 500, which is arranged between the inner walls on both sides of the supporting frame 300, and a slide groove 501 is provided on the connecting rod 500, and a slider 502 is slidably provided inside the slide groove 501, and a third telescopic rod 503 is provided at the lower end of the slider 502, and a connecting block 504 is provided at the output end of the third telescopic rod 503, and a two-way telescopic rod 505 is provided at the upper end of the connecting block 504, and a clamping plate 506 is provided at the output end of both sides of the two-way telescopic rod 505, and an anti-skid plate 507 is provided on the inner wall of the clamping plate 506, and a motor 508 is provided at the upper end of the slider 502, and a driving wheel 509 is provided at the output end of the motor 508, A rack 510 is provided at the upper end of the rod 500, and the driving wheel 509 is meshed with the rack 510. The motor 508 is started to rotate the driving wheel 509. Due to the action of the rack 510, the slider 502 moves inside the slide groove 501. At this time, the slider 502 can be moved to above the moving groove 401, and then the third telescopic rod 503 is started to make the connecting block 504 descend, and then the two-way telescopic rod 505 is started, and the clamping plate 506 is used to clamp the electronic components, and then the motor 508 is used to move the electronic components to above the raw material board, and then the third telescopic rod 503 is started to make the electronic components contact with the raw material board.
[0035] Example 2
[0036] The buffer assembly includes a damping spring 511. There are multiple damping springs 511 and they are evenly distributed at the lower end of the connecting block 504. A buffer pad 512 is provided at the lower end of the damping spring 511. During the bonding process of the electronic components and the raw material board, due to the lack of good shock absorption and anti-collision effect, a part of the bonded product is damaged, causing losses. At this time, due to the effects of the damping spring 511 and the buffer pad 512, the shock absorption and anti-collision effect are played, which greatly reduces the probability of defective products.
[0037] The above embodiment discloses an anti-collision placement machine conveying device. When the device is used, the driving motor 202 is started, so that the rotating shaft 201 drives the rotating roller 203 to rotate, so that the raw material plate moves with the conveyor belt 204. At this time, the detector 600 installed at the top of the supporting frame 300 can detect the raw material plate moving on the conveyor belt 204, which is convenient for the subsequent bonding of electronic components. When the raw material plate moves to an appropriate position, the first telescopic rod 302 is started to move the fixed plate 303 toward the raw material plate, so that the raw material plate is fixed between the two fixed plates 303, and then the required electronic components are placed into the placement box 402 from the entrance 405. When it is needed, the second telescopic rod 403 is started to move the push plate 404 forward. When passing under the placement box 402, the electronic components inside are pushed to the end of the moving slot 401. It is convenient to use. Start the motor 508 to rotate the driving wheel 509. Due to the action of the rack 510, the slider 502 moves inside the slide groove 501. At this time, the slider 502 can be moved to the top of the moving groove 401, and then the third telescopic rod 503 is started to make the connecting block 504 drop, and then the two-way telescopic rod 505 is started, and the clamping plate 506 is used to clamp the electronic components, and then the motor 508 is used to move the electronic components to the top of the raw material board, and then the third telescopic rod 503 is started to make the electronic components contact with the raw material board. In the process of bonding the electronic components to the raw material board, due to the lack of good shock absorption and anti-collision effect, part of the bonded product is damaged, causing losses. At this time, due to the action of the damping spring 511 and the buffer pad 512, the shock absorption and anti-collision effect are played, which greatly reduces the probability of defective products.
[0038] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.
Claims
1. A collision-proof chip placement machine conveying device, comprising a base (100); It is characterized in that The base (100) is provided with a rotating groove (200), a conveying assembly is provided inside the rotating groove (200), a supporting frame (300) is provided at the upper end of the base (100), a fixing assembly is provided inside the supporting frame (300), a loading assembly is provided inside the supporting frame (300), a feeding assembly is provided inside the supporting frame (300), and a buffer assembly is provided at the lower end of the feeding assembly.
2. The anti-collision chip placement machine conveying device according to claim 1, characterized in that: The transmission assembly comprises a rotating shaft (201), the rotating shaft (201) being rotatably arranged on the inner walls on both sides of the rotating groove (200), a driving motor (202) being arranged on the surface of the base (100), an output end of the driving motor (202) being connected to the rotating shaft (201), a rotating roller (203) being arranged on the outer side of the rotating shaft (201), and a conveyor belt (204) being arranged on the outer side of the rotating roller (203).
3. The anti-collision chip placement machine conveying device according to claim 1, characterized in that: The fixing assembly comprises a support rod (301), a plurality of the support rods (301) are provided and are arranged on an inner wall of one side of a support frame (300), a first telescopic rod (302) is provided inside the other side of the support frame (300), a fixing plate (303) is provided at the output end of the first telescopic rod (302) and the end of the support rod (301), a guide plate (304) is provided at the left end of the fixing plate (303), and a rubber pad (305) is provided on the surface of the fixing plate (303).
4. The anti-collision chip placement machine conveying device according to claim 1, characterized in that: The loading assembly comprises a support block (400), wherein the support block (400) is arranged on the inner wall of the support frame (300), a movable groove (401) is provided on the support block (400), a placement box (402) is provided at the upper end of the support block (400), an entrance (405) is provided on the surface of the support frame (300), and the entrance (405) is connected to the placement box (402), a second telescopic rod (403) is provided inside the movable groove (401), and a push plate (404) is provided at the output end of the second telescopic rod (403).
5. The anti-collision chip placement machine conveying device according to claim 1, characterized in that: The feeding assembly comprises a connecting rod (500), wherein the connecting rod (500) is arranged between the inner walls on both sides of the supporting frame (300), a slide groove (501) is provided on the connecting rod (500), a slider (502) is slidably provided inside the slide groove (501), a third telescopic rod (503) is provided at the lower end of the slider (502), a connecting block (504) is provided at the output end of the third telescopic rod (503), a bidirectional telescopic rod (505) is provided at the upper end of the connecting block (504), and clamps (506) are provided at both output ends of the bidirectional telescopic rod (505), a motor (508) is provided at the upper end of the slider (502), a driving wheel (509) is provided at the output end of the motor (508), a rack (510) is provided at the upper end of the connecting rod (500), and the driving wheel (509) is meshed with the rack (510).
6. The anti-collision chip placement machine conveying device according to claim 5, characterized in that: The buffer assembly comprises a damping spring (511), a plurality of the damping springs (511) are provided and are evenly distributed at the lower end of the connecting block (504), and a buffer pad (512) is provided at the lower end of the damping spring (511).
7. The anti-collision chip placement machine conveying device according to claim 5, characterized in that: An anti-slip plate (507) is provided on the inner wall of the clamping plate (506).
8. The anti-collision chip placement machine conveying device according to claim 1, characterized in that: A detector (600) is provided at the top end of the support frame (300), and an observation window (601) is provided on the surface of the support frame (300).
Citation Information
Patent Citations
Chip mounter conveying device with adjustable spacing
CN214826910U