Mobile phone integrated circuit board batch surface mounting device

By using a linear motor-driven slide rail system and air pump in the patch device, combined with the design of hydraulic rod, bearing seat and linkage gear, the problems of circuit board movement and physical damage in traditional patch devices are solved, achieving high accuracy and stability Improves production efficiency and product quality.

CN222339877UActive Publication Date: 2025-01-10中贸区块链(深圳)有限公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421653814.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-12
Publication Date
2025-01-10
Estimated Expiration
2034-07-12

AI Technical Summary

Technical Problem

Traditional patch devices can easily cause the circuit board to move during patching, reduce the patch accuracy, and may cause physical damage to the circuit board, affecting its integrity and functionality.

Method used

A batch patch device for mobile phone integrated circuit board including patch mechanism and support mechanism is designed. The linear motor-driven slide rail system and air pump are used to cooperate with hydraulic rods, bearing seats and linkage gears to achieve high-precision positioning and stable support, ensuring high-precision positioning and stable support. Accuracy and stability of the patching process.

Benefits of technology

It improves the accuracy and stability of patch operations, reduces labor costs, improves production efficiency, and ensures product quality, and is suitable for automated production.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222339877U_ABST
    Figure CN222339877U_ABST
Patent Text Reader

Abstract

The utility model provides a mobile phone integrated circuit board batch chip mounting device, which belongs to the technical field of electronic manufacturing equipment and comprises a chip mounting mechanism and a supporting mechanism, the chip mounting mechanism comprises a chip mounting shell, a first sliding rail is fixedly mounted on the inner side wall of the chip mounting shell, a first linear motor is sleeved on the outer side wall of the first sliding rail, and a second linear motor is sleeved on the outer side wall of the first sliding rail. And a second sliding rail is fixedly mounted on the outer side wall of the first linear motor. According to the utility model, through the arrangement of the chip mounting mechanism and the supporting mechanism, the high-precision chip mounting operation of the electronic component is realized, the chip mounting mechanism can quickly and accurately complete the placement of the electronic component through the sliding rail system driven by the linear motor, and the supporting mechanism provides a stable mechanical supporting and adjusting system, so that the chip mounting efficiency is improved. The stability and reliability of the whole chip mounting process are ensured, and the flexibility and adjustability of the mechanism are further improved through the application of mechanisms such as a hydraulic rod, a bearing seat and a linkage gear.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic manufacturing equipment, and in particular relates to a batch patch device for mobile phone integrated circuit boards. Background Art

[0002] With the rapid development of electronic technology, the speed of updating and replacing electronic products such as mobile phones is accelerating, and the requirements for circuit board assembly efficiency and quality are becoming higher and higher. Especially in the field of mobile phone manufacturing, the patch process of integrated circuit boards has an important impact on the performance and reliability of the whole machine.

[0003] When using a traditional patch device, the circuit board may move during the patch process, which may cause a decrease in patch accuracy or even damage to components. In addition, when the device performs large-scale movements, it may also cause physical damage to the circuit board, affecting the integrity and functionality of the circuit board. Therefore, in order to avoid these problems, improve the stability of the patch operation and protect the safety of the circuit board, the utility model proposes a new type of mobile phone integrated circuit board batch patch device. Utility Model Content

[0004] The utility model aims to provide a batch patch device for mobile phone integrated circuit boards, aiming to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A mobile phone integrated circuit board batch mounting device, comprising:

[0007] The patch mechanism and the supporting mechanism, the patch mechanism comprises a patch shell, a first slide is fixedly mounted on the inner wall of the patch shell, a first linear motor is sleeved on the outer wall of the first slide rail, and a second slide rail is fixedly mounted on the outer wall of the first linear motor.

[0008] As a preferred solution of the utility model, a second linear motor is sleeved on the outer wall of the second slide rail, a patch head is fixedly installed on the outer wall of the second linear motor, a first motor is fixedly installed on the inner wall of the patch housing, a first air pump is fixedly installed on the output end of the first motor, and a push plate is fixedly installed on the outer wall of the first air pump.

[0009] As a preferred solution of the utility model, the supporting mechanism includes a supporting shell, a fixing groove is opened on the inner side wall of the supporting shell, a supporting base plate is fixedly installed on the outer side wall of the supporting shell, a fixing column is fixedly installed on the outer side wall of the supporting base plate, a connecting shaft is fixedly installed on the outer side wall of the fixing column, a supporting box is fixedly installed on the outer side wall of the connecting shaft, a second motor is fixedly installed on the outer side wall of the supporting base plate, and a second air pump is fixedly installed on the output end of the second motor.

[0010] As a preferred solution of the utility model, a support plate is fixedly installed on the outer wall of the second air pump, a fixed shaft is fixedly installed on the outer wall of the support base plate, a first bearing seat is fixedly installed on the outer wall of the fixed shaft, a second bearing seat is fixedly installed on the outer wall of the fixed shaft, a telescopic arm is fixedly connected to the outer wall of the second bearing seat, a connecting rod is fixedly connected to the outer wall of the telescopic arm, and a telescopic small arm is fixedly installed on the outer wall of the connecting rod.

[0011] As a preferred solution of the utility model, a third bearing seat is fixedly installed on the outer wall of the telescopic arm, a fourth bearing seat is fixedly installed on the outer wall of the telescopic arm, a fifth bearing seat is fixedly installed on the outer wall of the telescopic arm, and a first hydraulic rod is fixedly installed on the outer wall of the first bearing seat.

[0012] As a preferred solution of the utility model, a third bearing seat is fixedly installed on the outer wall of the first hydraulic rod, a second hydraulic rod is fixedly installed on the outer wall of the fourth bearing seat, and a fifth bearing seat is fixedly connected to the outer wall of the second hydraulic rod.

[0013] As a preferred solution of the utility model, a third hydraulic rod is fixedly mounted on the outer side wall of the telescopic arm, a rack is fixedly mounted on the outer side wall of the third hydraulic rod, a linkage gear meshing therewith is movably connected to the outer side wall of the rack, and a clamping head is fixedly mounted on the outer side wall of the linkage gear.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: the setting of the patch mechanism and the support mechanism realizes high-precision patch operation of electronic components. The patch mechanism can quickly and accurately complete the placement of electronic components through the slide rail system driven by the linear motor and the high-precision positioning of the patch head. At the same time, the support mechanism provides a stable mechanical support and adjustment system to ensure the stability and reliability of the entire patch process. In addition, through the application of mechanisms such as hydraulic rods, bearing seats and linkage gears, the flexibility and adjustability of the mechanism are further improved, so that the integrated circuit board can be quickly placed in a suitable position. On the whole, these designs improve production efficiency, ensure product quality, and reduce labor costs. They are indispensable key components in automated production. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is an overall schematic diagram of the patch mechanism of the utility model;

[0018] Figure 3 It is an enlarged schematic diagram of the support mechanism of the utility model;

[0019] Figure 4 It is an enlarged schematic diagram of the telescopic boom of the utility model.

[0020] In the figure: 100, patch mechanism; 101, patch housing; 102, first motor; 103, first air pump; 104, push plate; 105, first slide rail; 106, first linear motor; 107, second linear motor; 108, patch head; 109, second slide rail; 200, support mechanism; 201, support housing; 202, support bottom plate; 203, fixing groove; 204, second motor; 205, second air pump; 206, support plate; 207 , fixed shaft; 208, fixed column; 209, connecting shaft; 210, supporting box; 211, first bearing seat; 212, second bearing seat; 213, first hydraulic rod; 214, third bearing seat; 215, fourth bearing seat; 216, fifth bearing seat; 217, second hydraulic rod; 218, telescopic arm; 219, telescopic arm; 220, third hydraulic rod; 221, linkage gear; 222, rack; 223, clamping head; 224, connecting rod. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0024] Example 1

[0025] Reference Figure 1 and Figure 2 , which is the first embodiment of the utility model, and provides a mobile phone integrated circuit board batch mounting device, comprising:

[0026] The patch mechanism 100 and the support mechanism 200, the patch mechanism 100 includes a patch shell 101, a first slide rail 105 is fixedly installed on the inner wall of the patch shell 101, a first linear motor 106 is sleeved on the outer wall of the first slide rail 105, and a second slide rail 109 is fixedly installed on the outer wall of the first linear motor 106.

[0027] Specifically, a second linear motor 107 is sleeved on the outer wall of the second slide rail 109, a patch head 108 is fixedly installed on the outer wall of the second linear motor 107, a first motor 102 is fixedly installed on the inner wall of the patch housing 101, a first air pump 103 is fixedly installed on the output end of the first motor 102, and a push plate 104 is fixedly installed on the outer wall of the first air pump 103.

[0028] When in use, after the support mechanism 200 places the integrated circuit board in a suitable position, the linear motor drives the patch head 108 to place the patch component in a specified position. After the patch is completed, the second air pump 205 pushes the circuit board out, and the first motor 102 drives the first air pump 103 to push the circuit board to the next process.

[0029] In summary, the support mechanism 200 and the patch mechanism 100 realize efficient and accurate patch operations of the integrated circuit board through precise mechanical design and control. After the integrated circuit board is placed in a suitable position, the patch head 108 driven by the linear motor can quickly and accurately place the patch components in the specified position, thereby improving the patch efficiency and accuracy. After the patch is completed, the second air pump 205 pushes the circuit board out so that the patch head 108 can continue to the next round of patch operations. At the same time, the first motor 102 drives the first air pump 103 to push the circuit board to the next process, thereby ensuring the continuity and efficiency of the production process, which not only improves production efficiency, but also ensures product quality and reduces labor costs.

[0030] Example 2

[0031] Reference Figure 3, which is the second embodiment of the utility model. Different from the previous embodiment, this embodiment provides a supporting mechanism 200 for supporting a circuit board.

[0032] Specifically, the support mechanism 200 includes a support shell 201, a fixing groove 203 is opened on the inner wall of the support shell 201, a support base plate 202 is fixedly installed on the outer wall of the support shell 201, a fixing column 208 is fixedly installed on the outer wall of the support base plate 202, a connecting shaft 209 is fixedly installed on the outer wall of the fixing column 208, a support box 210 is fixedly installed on the outer wall of the connecting shaft 209, a second motor 204 is fixedly installed on the outer wall of the support base plate 202, and a second air pump 205 is fixedly installed on the output end of the second motor 204.

[0033] Furthermore, a support plate 206 is fixedly installed on the outer wall of the second air pump 205, a fixed shaft 207 is fixedly installed on the outer wall of the support base plate 202, a first bearing seat 211 is fixedly installed on the outer wall of the fixed shaft 207, a second bearing seat 212 is fixedly installed on the outer wall of the fixed shaft 207, a telescopic arm 218 is fixedly connected to the outer wall of the second bearing seat 212, a connecting rod 224 is fixedly connected to the outer wall of the arm, and a telescopic small arm 219 is fixedly installed on the outer wall of the connecting rod 224.

[0034] When in use, the circuit board is transported to the supporting mechanism 200, and the connecting shaft 209 drives the supporting box 210 to transport the circuit board downward. After the circuit board reaches the specified position, the second motor 204 drives the second air pump 205 to push the supporting plate 206 to the specified position, and cooperates with the fixing groove 203 to clamp the circuit board. After the patch is completed, the circuit board is ejected.

[0035] In summary, the connecting shaft 209 cooperates with the support box 210 to transport the circuit board downward to the specified position. When the circuit board reaches the predetermined position, the second motor 204 starts to drive the second air pump 205 to push the support plate 206 to the specified position and precisely cooperate with the fixing groove 203 to clamp the circuit board to keep it stable. After the patch operation is completed, the mechanism can eject the circuit board smoothly and prepare for the circuit board to move to the next production process. The design of this process improves the positioning accuracy and stability of the circuit board during the patch process, while also ensuring the continuity and efficiency of the production process.

[0036] Example 3

[0037] Reference Figure 4 , which is the third embodiment of the present utility model. Different from the previous embodiment, this embodiment provides another function of the supporting mechanism 200.

[0038] Specifically, a third bearing seat 214 is fixedly installed on the outer wall of the telescopic arm 218, a fourth bearing seat 215 is fixedly installed on the outer wall of the telescopic arm 218, a fifth bearing seat 216 is fixedly installed on the outer wall of the telescopic arm 219, a first hydraulic rod 213 is fixedly installed on the outer wall of the first bearing seat 211, a third bearing seat 214 is fixedly installed on the outer wall of the first hydraulic rod 213, a second hydraulic rod 217 is fixedly installed on the outer wall of the fourth bearing seat 215, and a fifth bearing seat 216 is fixedly connected to the outer wall of the second hydraulic rod 217.

[0039] Furthermore, a third hydraulic rod 220 is fixedly mounted on the outer wall of the telescopic arm 219, a rack 222 is fixedly mounted on the outer wall of the third hydraulic rod 220, a linkage gear 221 meshing therewith is movably connected to the outer wall of the rack 222, and a clamping head 223 is fixedly mounted on the outer wall of the linkage gear 221.

[0040] When in use, the first air pump 103 drives the telescopic arm 218 to move forward and backward, the second air pump 205 drives the telescopic arm 219 to move forward and backward, and the third air pump drives the clamping head 223 to clamp the circuit board, clamping the circuit board from the support box 210 to the support plate 206.

[0041] In summary, the third air pump is used to drive the clamping head 223 so that it can clamp the circuit board. This function is crucial because it not only ensures the stability and safety of the circuit board during transportation, but also enables the circuit board to be smoothly transferred from the support box 210 to the support plate 206, preparing for subsequent patch operations. Overall, the coordinated work of the three air pumps greatly improves the operational flexibility and efficiency of the patch mechanism 100.

[0042] Importantly, it should be noted that the construction and arrangement of the present application shown in a plurality of different exemplary embodiments are only exemplary. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and ratio of various elements, and parameter values ​​(e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, directional changes, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in the application. For example, the element shown as integrally formed can be composed of multiple parts or elements, the position of the element can be inverted or otherwise changed, and the nature or number or position of the discrete element can be changed or changed. Therefore, all such modifications are intended to be included in the scope of the present utility model. The order or sequence of any process or method steps can be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to a specific embodiment, but extends to various modifications that still fall within the scope of the appended claims.

[0043] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0044] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0045] It should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A batch mounting device for mobile phone integrated circuit boards, characterized in that: include, A patch mechanism (100) and a support mechanism (200), wherein the patch mechanism (100) comprises a patch housing (101), a first slide rail (105) is fixedly mounted on the inner side wall of the patch housing (101), a first linear motor (106) is sleeved on the outer side wall of the first slide rail (105), and a second slide rail (109) is fixedly mounted on the outer side wall of the first linear motor (106).

2. A mobile phone integrated circuit board batch mounting device according to claim 1, characterized in that: A second linear motor (107) is sleeved on the outer wall of the second slide rail (109), a patch head (108) is fixedly mounted on the outer wall of the second linear motor (107), a first motor (102) is fixedly mounted on the inner wall of the patch housing (101), a first air pump (103) is fixedly mounted on the output end of the first motor (102), and a push plate (104) is fixedly mounted on the outer wall of the first air pump (103).

3. A mobile phone integrated circuit board batch mounting device according to claim 2, characterized in that: The support mechanism (200) comprises a support shell (201), a fixing groove (203) is provided on the inner side wall of the support shell (201), a support base plate (202) is fixedly mounted on the outer side wall of the support shell (201), a fixing column (208) is fixedly mounted on the outer side wall of the support base plate (202), a connecting shaft (209) is fixedly mounted on the outer side wall of the fixing column (208), a support box (210) is fixedly mounted on the outer side wall of the connecting shaft (209), a second motor (204) is fixedly mounted on the outer side wall of the support base plate (202), and a second air pump (205) is fixedly mounted on the output end of the second motor (204).

4. A mobile phone integrated circuit board batch mounting device according to claim 3, characterized in that: A support plate (206) is fixedly mounted on the outer wall of the second air pump (205), a fixed shaft (207) is fixedly mounted on the outer wall of the support base plate (202), a first bearing seat (211) is fixedly mounted on the outer wall of the fixed shaft (207), a second bearing seat (212) is fixedly mounted on the outer wall of the fixed shaft (207), a telescopic arm (218) is fixedly connected to the outer wall of the second bearing seat (212), a connecting rod (224) is fixedly connected to the outer wall of the telescopic arm (218), and a telescopic small arm (219) is fixedly mounted on the outer wall of the connecting rod (224).

5. A mobile phone integrated circuit board batch mounting device according to claim 4, characterized in that: A third bearing seat (214) is fixedly mounted on the outer wall of the telescopic arm (218), a fourth bearing seat (215) is fixedly mounted on the outer wall of the telescopic arm (218), a fifth bearing seat (216) is fixedly mounted on the outer wall of the telescopic arm (219), and a first hydraulic rod (213) is fixedly mounted on the outer wall of the first bearing seat (211).

6. A mobile phone integrated circuit board batch mounting device according to claim 5, characterized in that: A third bearing seat (214) is fixedly mounted on the outer wall of the first hydraulic rod (213), a second hydraulic rod (217) is fixedly mounted on the outer wall of the fourth bearing seat (215), and a fifth bearing seat (216) is fixedly connected to the outer wall of the second hydraulic rod (217).

7. A mobile phone integrated circuit board batch mounting device according to claim 6, characterized in that: A third hydraulic rod (220) is fixedly mounted on the outer wall of the telescopic arm (219), a rack (222) is fixedly mounted on the outer wall of the third hydraulic rod (220), a linkage gear (221) meshing with the rack (222) is movably connected on the outer wall of the rack (222), and a clamping head (223) is fixedly mounted on the outer wall of the linkage gear (221).