Heating piece of electronic atomization device and electronic atomization device
By applying an enamel layer on the outer peripheral surface of the heating member and setting a heat resistance section, the problem of high temperature failure of the sealing parts of the heating assembly is solved, and the sealing and reliability of the electronic atomization device are improved.
Patent Information
- Application Number
- CN202420812012.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-04-18
AI Technical Summary
The seals of the heating assembly are susceptible to high temperatures and fail, resulting in a reduction in the sealing properties of the electronic atomization device.
The enamel layer is coated on the outer peripheral surface of the heating member. The enamel layer includes a heat resistance section. The thickness of the heat resistance section is greater than that of the adjacent part. It is used to reduce the transfer of heat to the radial outer side and a heat resistance section is provided at the sealing end to reduce the temperature. The temperature of the seal.
It effectively reduces the temperature of the seal, avoids the failure of the seal due to high temperature, and improves the working reliability and service life of the electronic atomization device.
Smart Images

Figure CN222340560U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electronic atomization devices, in particular to a heating element of an electronic atomization device and the electronic atomization device. Background Art
[0002] The heating component is an important part of the electronic atomization device. The heating component can heat the aerosol-forming matrix at a certain temperature to generate an aerosol. The heating component is located on the airflow path of the electronic atomization device. In order to ensure the sealing requirements of the airflow path, the corresponding ends of the heating component need to be provided with sealing members, which can form a seal between the heating component and the adjacent components.
[0003] Since the sealing member is generally made of elastic rubber material and the operating temperature of the heating component is relatively high, the sealing member may fail due to the long-term effect of high temperature during use. Utility Model Content
[0004] The utility model mainly solves the technical problem that the sealing part on the heating component is easily affected by high temperature and becomes ineffective.
[0005] In a first aspect, the utility model provides a heating element of an electronic atomization device.
[0006] A heating element of an electronic atomization device, comprising:
[0007] a main body portion for generating heat to heat the aerosol-forming substrate;
[0008] An enamel layer is attached to the outer peripheral surface of the main body part, the enamel layer includes a heat-resistant section, the enamel thickness of the heat-resistant section is greater than the enamel thickness of the adjacent part, at least one end of the main body part is a sealing end for sealing with a sealing member, the sealing end is provided with the heat-resistant section, and the heat-resistant section is used to reduce heat transfer from the main body part to the radial outside.
[0009] Optionally, the main body portion has a first end and a second end along its own axial direction, and the first end is provided with an opening for inserting an aerosol-forming matrix; the main body portion includes a substrate and a heating element, and the heating element is arranged on the main body portion close to the second end, and at least a portion of the heat-resistant section is located on the outside of the heating element along the radial direction of the main body portion.
[0010] Optionally, the substrate is provided with isolation holes distributed around the axis of the substrate, the isolation holes are arranged on a side of the heating element close to the first end, and the isolation holes are used to reduce heat transfer from the heating element to the first end.
[0011] Optionally, the enamel layer is at least one of glass glaze and ceramic glaze, and the enamel thickness of the heat-resistant section is not less than 100 μm.
[0012] In a second aspect, the utility model provides an electronic atomization device.
[0013] An electronic atomization device, comprising:
[0014] Device housing;
[0015] A heating component, wherein the heating component is arranged in the device shell, the heating component comprises a heating element, a heating element support and a sealing element, the heating element support is connected to the end of the heating element, the sealing element is sealed between the heating element support and the heating element, the heating element is the heating element described in any of the above embodiments, and the heat-resistant section is arranged corresponding to the sealing element.
[0016] Optionally, the heating assembly includes a heat exchange core, which is provided with a heat exchange air duct, and the heat exchange core is used to heat the airflow passing through the heat exchange air duct; the heat exchange core is arranged at the end of the main body part and is located inside the main body part, and at least a part of the heat resistance section corresponds to the heat exchange core on the inner and outer sides of the main body part.
[0017] Optionally, the heat exchange core includes a flange portion, and the corresponding end surface of the heating element is supported on the flange.
[0018] Optionally, the heating element support includes a first support and a second support, two ends of the heating element are respectively connected to the first support and the second support, the second support includes a heat-resistant ring, and the heat-resistant ring is provided with a support platform for supporting the heating element.
[0019] Optionally, the second support includes a resin base, the heat-resistant ring is arranged between the resin base and the heating element, and the heat-resistant ring is used to reduce heat transfer from the heating element to the resin base.
[0020] Optionally, the heat-resistant ring includes a protruding portion protruding from the table surface of the support platform, the protruding portion forms a positioning groove on the top of the support platform, the main body is arranged in the positioning groove, and at least a portion of the seal is arranged between the groove side wall of the positioning groove and the main body.
[0021] Beneficial effects of the utility model:
[0022] According to the heating element of the above-mentioned electronic atomization device, the enamel layer on the outer peripheral surface of the main part includes a heat-resistant section. The thickness of the heat-resistant section is greater than that of the adjacent part, which can isolate heat transfer and reduce the heat transfer from the sealing end to the radial outside. When working, the heat-resistant section corresponds to the corresponding sealing part setting on the heating component, which is beneficial to reduce the temperature of the sealing part outside the sealing end, thereby avoiding the situation where the sealing part on the heating component is easily affected by high temperature and fails. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a structural schematic diagram of an embodiment of the electronic atomization device in the utility model;
[0024] Figure 2 It is a schematic diagram of the coordination state between the heating component and the aerosol forming matrix in the electronic atomization device;
[0025] Figure 3 yes Figure 2 Isometric section view of
[0026] Figure 4 yes Figure 2 An orthographic cross-sectional view of the heating assembly;
[0027] Figure 5 yes Figure 1 Exploded diagram of
[0028] Figure 6 It is a schematic diagram of the structure when the heating element is not provided with an enamel layer.
[0029] List of feature names corresponding to the reference numerals in the figure:
[0030] 1000, device housing; 1100, insertion port;
[0031] 2000, heating assembly; 2100, heating element; 2110, main body; 2111, substrate; 2112, heating element; 2113, first end; 2114, second end; 2120, enamel layer; 2121, heat-resisting section; 2130, isolation hole;
[0032] 2200, heating element support; 2210, first support; 2211, insertion channel; 2220, second support; 2221, air inlet;
[0033] 2300, sealing member; 2310, inner portion; 2320, outer portion; 2330, connecting portion;
[0034] 2400, heat exchange core; 2410, heat exchange air duct; 2420, flange part;
[0035] 2500, heat-resistant ring; 2510, support platform; 2520, protruding portion;
[0036] 3000. Aerosol forming matrix. DETAILED DESCRIPTION
[0037] The present invention is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.
[0038] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.
[0039] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).
[0040] In order to more clearly illustrate the specific implementation of the present invention, Figure 2 Of course, the positional limitation in the embodiment is only an example to more clearly illustrate the positional relationship between the various components, and does not limit the specific implementation of the utility model to be arranged in this way.
[0041] In an embodiment of the utility model, a heat-resistant section 2121 formed of enamel is provided on the outer peripheral surface of the main part 2110 of the heating element 2100 in the electronic atomization device. The enamel thickness of the heat-resistant section 2121 is greater than the enamel thickness of the adjacent part, which can reduce the heat transfer of the main part 2110 to the radial outside, thereby reducing the heat received by the seal 2300 located outside the heat-resistant section 2121, which is beneficial to avoiding failure of the seal 2300 due to high temperature.
[0042] An embodiment of an electronic atomization device in the utility model:
[0043] In one embodiment, please refer to Figure 1 The electronic atomization device includes a device housing 1000 and a heating component 2000 .
[0044] The shape of the device housing 1000 is not limited, and the device housing 1000 is provided with an insertion port 1100, which can allow the rod-shaped aerosol-forming matrix 3000 to pass through and be inserted into the heating component 2000. Those skilled in the art should know that the electronic atomization device also includes a power module, electrical components, etc. The power module and electrical components are arranged in the device housing 1000 and can control the power supply of the heating component 2000. The improvement requested for protection by the utility model lies in the heating component 2000. Other structures in the electronic atomization device except the heating component 2000 can adopt existing structures, so they are not described in detail here.
[0045] Please refer to Figures 2 to 5 The heating assembly 2000 is disposed in the device housing 1000, and the heating assembly 2000 includes a heating element 2100, a heating element support 2200 and a sealing element 2300. The heating element support 2200 is connected to the end of the heating element 2100, and the sealing element 2300 is sealed and connected between the heating element support 2200 and the heating element 2100.
[0046] The heating element 2100 can be used as part of the airflow channel of the electronic atomization device. In a specific embodiment, the heating element support 2200 includes a first support 2210 and a second support 2220, and the two ends of the main body 2110 are respectively connected to the first support 2210 and the second support 2220, and the first support 2210 is provided with an insertion channel 2211 for inserting the rod-shaped aerosol-forming matrix 3000, and the second support 2220 is provided with an air inlet 2221, and the axial ends of the heating element 2100 are respectively connected to the insertion channel 2211 and the air inlet 2221, and can form an airflow channel together with the insertion channel 2211 and the air inlet 2221. Those skilled in the art will appreciate that, in some other embodiments, the air flow channel may have different structural forms. For example, the second support 2220 may be a closed structure, and there may be a gap between the outer peripheral surface of the aerosol-forming substrate 3000 and the insertion channel 2211 and the heating element 2100. The gap may serve as an air inlet channel for air to enter the lower end of the aerosol-forming substrate 3000, and the aerosol may be discharged from the rod-shaped aerosol-forming substrate 3000 during inhalation. For example, in some embodiments, an air inlet may be provided on the outer peripheral surface of the heating element 2100 to form a side air intake structure.
[0047] The heating element 2100 includes a main body portion 2110 and an enamel layer 2120. The main body portion 2110 is used to generate heat to heat the aerosol-forming substrate 3000. In one embodiment, please refer to Figure 6 The main body 2110 includes a substrate 2111 and a heating element 2112. The substrate 2111 may be made of metal, such as stainless steel, and can transfer heat to the aerosol-forming matrix 3000 well; and the heating element 2112 may be a heating circuit disposed on the outer surface of the substrate 2111. Those skilled in the art will appreciate that in some embodiments, the specific structural form of the heating element 2100 is not limited, for example, it may be a heating sheet with a cylindrical structure, or a cylindrical body with a heating wire or a heating film wound around the periphery, or a cylindrical body with a heating needle or a heating wire embedded inside, or an electromagnetic induction heating tube, etc.
[0048] In one embodiment, please refer to Figure 6 The main body 2110 has a first end 2113 and a second end 2114 along its own axial direction. The first end 2113 is provided with an opening for inserting the aerosol-forming matrix 3000. The second end 2114 is provided with a heat exchange core 2400. The heat exchange core 2400 is provided with a heat exchange air passage 2410. The heat exchange air passage 2410 penetrates the heat exchange core 2400 along the axial direction of the heating element 2100. The heat exchange air passage 2410 is connected with the air inlet on the heating component 2000 and is used to heat the airflow passing through the heat exchange air passage 2410. The heat exchange core 2400 can be made of a material with good thermal conductivity, such as aluminum, so that the heat generated by the heating element 2100 can be quickly transferred to itself, so that the air passing through the heat exchange air passage 2410 can be heated more effectively, and the hot air can heat the aerosol-forming matrix 3000.
[0049] At least one end of the main body 2110 is a sealing end for sealing with the sealing member 2300. For example, in the illustrated embodiment, the lower end of the main body 2110 is a sealing end that can be sealed with the heating element support 2200 through the sealing member 2300. Of course, in some other embodiments, the upper end of the main body 2110 can also be a sealing end that can be sealed with the heating element support 2200 through the sealing member 2300.
[0050] Through the above-mentioned heating element 2100 and heat exchange core 2400, when the electronic atomization device is working, the airflow passing through the side wall of the heating element 2100 and the heat exchange core 2400 at the bottom of the heating element 2100 can heat the aerosol-forming matrix 3000 at the same time to form atomized matter. The user inhales the top of the aerosol-forming matrix 3000 to discharge the aerosol, and the seal 2300 can prevent air leakage in the airflow path. It should be noted that in some other embodiments, the heat source for heating the aerosol-forming matrix 3000 can also rely solely on the heating element 2100.
[0051] The outer peripheral surface of the heating element 2100 is attached with an enamel layer 2120, which can play an insulating role. The enamel layer 2120 can be glass enamel, ceramic enamel, etc. These enamels can be applied to the surface of the main part 2110 by brushing, spraying or dipping during the manufacturing process of the heating element 2100, and can be formed into a dense enamel by high-temperature sintering. It can be understood by those skilled in the art that the enamel layer 2120 of the utility model can adopt any enamel forming method in the relevant technology, which will not be described in detail here.
[0052] The enamel layer 2120 includes a heat-resistant section 2121, the enamel thickness of the heat-resistant section 2121 is greater than the enamel thickness of the adjacent part, the sealing end of the main part 2110 is provided with a heat-resistant section 2121, and the heat-resistant section 2121 is arranged corresponding to the seal 2300, and at least a part of the heat-resistant section 2121 is located on the outside of the heating element 2112 along the radial direction of the main part 2110, and the heat-resistant section 2121 is used to reduce the heat transfer of the main part 2110 to the radial outside. In a specific embodiment, the enamel thickness of the heat-resistant section 2121 is not less than 100μm. In some other embodiments, the heat-resistant section 2121 may include more than two enamels, for example, the inner layer is glass enamel and the outer layer is ceramic enamel. The length and thickness of the heat-resistant section 2121 can meet the protection requirements of the seal 2300, which is conducive to saving costs and reducing weight.
[0053] Those skilled in the art can understand that the axial dimension of the heat-resistant section 2121 can be greater than the axial dimension of the heating element 2112, or can be equal to or smaller than the axial dimension of the heating element 2112. In addition, along the axial direction of the heating element 2100, the two ends of the heat-resistant section 2121 can be flush with the heating element 2112, or at least one end can extend beyond the heating element 2112, or at least one end can have an indentation relative to the corresponding end of the heating element 2112.
[0054] In a specific embodiment, please refer to Figure 4 and Figure 5 The upper end of the heat-resisting segment 2121 is flush with the upper end of the heat exchange core 2400, and the lower end of the heat-resisting segment 2121 is flush with the lower end of the main body 2110, so that heat can be more effectively transferred to the heat exchange core 2400. Of course, in other embodiments, at least one end of the heat-resisting segment 2121 may extend beyond the heat exchange core 2400, or at least one end may be indented relative to the corresponding end of the heat exchange core 2400.
[0055] The heating element support 2200 is generally made of resin material, such as PEEK (Polyetheretherketone). In order to prevent the heating element support from failing under the influence of high temperature, in one embodiment, the base 2111 is provided with isolation holes 2130 distributed around the axis of the base 2111. The isolation holes 2130 are arranged on the side of the heating element 2112 close to the first end 2113. The isolation holes 2130 are used to reduce the heat transfer from the heating element 2112 to the first end 2113. Please refer to Figure 6 In a specific embodiment, the isolation holes 2130 are formed by slits, and the portion of the substrate 2111 between adjacent isolation holes 2130 can connect the substrates 2111 located on both sides of the isolation holes 2130. It should be noted that in some other embodiments, the isolation holes 2130 can also be other shapes, such as round holes, elliptical holes, square holes, oblong holes, etc. In order to better ensure the stability of the airflow, the isolation holes 2130 can be blocked with enamel.
[0056] The heating element 2100 is axially positioned on the heating element support 2200. In one embodiment, please refer to Figures 3 to 5 The heat exchange core 2400 includes a flange portion 2420, which is exposed at the end opening of the heating element 2100. The lower end surface of the heating element 2100 is supported on the flange, and the flange portion 2420 at the bottom of the heat exchange core 2400 is supported on a support platform 2510 arranged on the second support 2220, which can facilitate the assembly and positioning of the heating element 2100 and the heat exchange core 2400.
[0057] Considering the influence of the heat of the heating element 2100 on the second support 2220, in one embodiment, the second support 2220 includes a heat-resistant ring 2500, and an annular boss is provided on the inner wall of the heat-resistant ring 2500, and the annular boss forms the above-mentioned support platform 2510, which is used to support the lower end surface of the flange part 2420 of the heat exchange core 2400, thereby supporting the main body 2110 and reducing the heat transfer from the heating element 2100 to the resin base. The heat-resistant ring 2500 is made of a material with a low thermal conductivity, such as zirconium oxide, quartz glass, etc. It should be noted that in some other embodiments, the heat exchange core 2400 can be completely set inside the heating element 2100, and the support platform 2510 can be in contact with the lower end surface of the heating element 2100, directly supporting the heating element 2100.
[0058] In one embodiment, the heat-resistant ring 2500 further includes a protruding portion 2520 protruding from the surface of the support platform 2510, the protruding portion 2520 forms a positioning groove on the top of the support platform 2510, the main body 2110 is disposed in the positioning groove, and at least a portion of the sealing member 2300 is disposed between the groove side wall of the positioning groove and the main body 2110. Please refer to Figure 3 and Figure 4 In a specific embodiment, the cross section of the seal 2300 is a "U"-shaped structure, including an inner portion 2310, an outer portion 2320 and a connecting portion 2330 connected between the inner portion 2310 and the outer portion 2320 arranged at intervals along the radial direction. The protruding portion 2520 on the heat-resistant ring 2500 is embedded in the annular interval between the inner portion 2310 and the outer portion 2320, which can ensure good fixation of the seal 2300. The seal 2300 can be made of silicone material, which can better adapt to high temperature environments.
[0059] When the electronic atomization device is working, the heat-resisting section 2121 formed by the enamel layer 2120 on the heating element 2100 can prevent the heat on the heating element 2100 from diffusing radially outward, reduce the temperature of the corresponding part of the heating element 2100, thereby controlling the temperature at the sealing element 2300, which is beneficial to prevent the sealing element 2300 from being affected by high temperature and failing. At the same time, by providing the heat-resisting ring 2500, the temperature transfer from the heating element 2100 and the heat exchange core 2400 to the heating element support 2200 can be reduced, which is beneficial to prevent the second support 2220 from being affected by high temperature and failing, thereby improving the working reliability and service life of the electronic atomization device.
[0060] An embodiment of a heating element of an electronic atomization device in the utility model:
[0061] The heating element of the electronic atomization device includes a main body 2110 and an enamel layer 2120. The enamel layer 2120 includes a heat-resistant section 2121. The specific structure of the heating element 2100 is the same as the structure of the heating element 2100 in any embodiment of the above-mentioned electronic atomization device, and will not be repeated here.
[0062] The above specific examples are used to illustrate the present invention, which are only used to help understand the present invention and are not intended to limit the present invention. For those skilled in the art of the present invention, some simple deductions, deformations or substitutions can be made based on the idea of the present invention.
Claims
1. A heating element of an electronic atomization device, characterized in that: include: a main body portion for generating heat to heat the aerosol-forming substrate; An enamel layer is attached to the outer peripheral surface of the main body part, the enamel layer includes a heat-resistant section, the enamel thickness of the heat-resistant section is greater than the enamel thickness of the adjacent part, at least one end of the main body part is a sealing end for sealing with a sealing member, the sealing end is provided with the heat-resistant section, and the heat-resistant section is used to reduce heat transfer from the main body part to the radial outside.
2. The heating element according to claim 1, characterized in that The main body portion has a first end and a second end along its own axial direction, and the first end is provided with an opening for inserting an aerosol-forming matrix; the main body portion includes a substrate and a heating element, and the heating element is arranged on the main body portion near the second end, and at least a portion of the heat-resistant section is located on the outside of the heating element along the radial direction of the main body portion.
3. The heating element according to claim 2, characterized in that The base is provided with isolation holes distributed around the axis of the base, the isolation holes are arranged on a side of the heating element close to the first end, and the isolation holes are used to reduce heat transfer from the heating element to the first end.
4. The heating element according to claim 1, 2 or 3, characterized in that: The enamel layer is at least one of glass glaze and ceramic glaze, and the enamel thickness of the heat-resistant section is not less than 100 μm.
5. An electronic atomization device, characterized in that: include: Device housing; A heating component, wherein the heating component is arranged in the device shell, the heating component comprises a heating element, a heating element support and a sealing element, the heating element support is connected to the end of the heating element, the sealing element is sealingly connected between the heating element support and the heating element, the heating element is the heating element described in any one of claims 1 to 4, and the heat-resistant section is arranged corresponding to the sealing element.
6. The electronic atomization device according to claim 5, characterized in that: The heating assembly includes a heat exchange core, on which a heat exchange air duct is provided, and the heat exchange core is used to heat the airflow passing through the heat exchange air duct; the heat exchange core is arranged at the end of the main body part and is located inside the main body part, and at least a part of the heat resistance section corresponds to the heat exchange core on the inner and outer sides of the main body part.
7. The electronic atomization device according to claim 6, characterized in that: The heat exchange core comprises a flange portion, and the corresponding end surface of the heating element is supported on the flange.
8. The electronic atomization device according to claim 5, characterized in that: The heating element support includes a first support and a second support, two ends of the heating element are connected to the first support and the second support respectively, the second support includes a heat-resistant ring, and the heat-resistant ring is provided with a support platform for supporting the heating element.
9. The electronic atomization device according to claim 8, characterized in that: The second support includes a resin base, the heat-resistant ring is arranged between the resin base and the heating element, and the heat-resistant ring is used to reduce heat transfer from the heating element to the resin base.
10. The electronic atomization device according to claim 9, characterized in that: The heat-resistant ring includes a protruding portion protruding from the table surface of the support table, the protruding portion forms a positioning groove on the top of the support table, the main body is arranged in the positioning groove, and at least a part of the seal is arranged between the groove side wall of the positioning groove and the main body.