Silicon wafer spraying system

Abstract

The utility model provides a silicon wafer spraying system, and aims to solve the technical problem that a silicon wafer is easily crushed by a roller when the silicon wafer is subjected to roller coating in the prior art. The system comprises a transmission mechanism; the spray head is arranged above the transmission mechanism; the liquid supply device is communicated with the spray head; wherein the transmission mechanism drives the silicon wafers to enter the spraying range of the spray head, and the spray head sprays the silicon wafers in the spraying range. According to the utility model, the spray head is arranged above the transmission mechanism, when the transmission mechanism drives the silicon wafer to the spraying range of the spray head, the spray head sprays the silicon wafer, a coating mode is changed into a spraying mode, and non-contact coating is adopted, so that silicon wafer fragments are basically avoided. Meanwhile, the liquid supply device is matched with the spray head, high-precision constant-flow liquid supply is achieved, precision and controllability are achieved, and waste of the stock solution can be effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafers, in particular to a silicon wafer spraying system. Background Art

[0002] In the process of gettering of solar raw silicon wafers, a liquid needs to be coated on the surface to activate the trace elements in the silicon wafer. Currently, the most commonly used method is to roll-coat directly on the silicon wafer, such as Figure 1 As shown, the rolling coating structure includes a liquid dripping device 101, an upper sponge roller 102, a lower sponge roller 103 and a driving device. The liquid dripping device 101 is controlled by a micro pump, and the stock liquid is dripped onto the upper sponge roller 102. The stock liquid on the upper sponge roller 102 flows onto the lower sponge roller 103. The sponges of the upper and lower rollers are soaked with the stock liquid. The upper and lower rollers are moved toward each other by the driving device. During the transmission of the silicon wafer 1, the upper and lower surfaces of the silicon wafer 1 are coated with the stock liquid through the upper and lower rollers. In the above-mentioned rolling coating method, the sponge roller is easy to crush the silicon wafer (because the silicon wafer is only 90-110μm, it is very easy to be damaged. Once the broken silicon wafer or other hard objects are stuck on the sponge roller, a large amount of fragments will be caused), resulting in a greatly increased fragmentation rate in production. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the utility model is to provide a silicon wafer spraying system, which solves the technical problem that the roller is easy to crush the silicon wafer during the existing silicon wafer rolling coating.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] The silicon wafer spraying system comprises: a transmission mechanism; a nozzle arranged above the transmission mechanism; and a liquid supply device connected to the nozzle. The transmission mechanism drives the silicon wafer into the spraying range of the nozzle, and the nozzle sprays the silicon wafer within the spraying range.

[0006] The utility model arranges a nozzle above the transmission mechanism. When the transmission mechanism drives the silicon wafer to the spraying range of the nozzle, the nozzle sprays the silicon wafer, changes the coating mode to spraying, adopts non-contact coating, and basically does not cause silicon wafer fragments. At the same time, through the liquid supply device and the nozzle, high-precision constant flow liquid supply is achieved, which is precisely controllable and can effectively reduce the waste of raw liquid.

[0007] Optionally, the silicon wafer spraying system further comprises a moving module disposed above the transmission mechanism, wherein the moving module is drivingly connected to the nozzle to drive the nozzle to move in a preset direction.

[0008] Optionally, the mobile module includes a mounting frame and a first moving mechanism disposed on the mounting frame, the first moving mechanism is connected to the nozzle drive, and the nozzle can reciprocate along the width direction of the transmission mechanism under the drive of the first moving mechanism. The nozzle of the utility model can move along the Y-axis direction for continuous spraying, and can realize spraying of multiple silicon wafers with high spraying efficiency.

[0009] Optionally, the mobile module includes a mounting frame and a first moving mechanism and a second moving mechanism disposed on the mounting frame; the second moving mechanism is drivingly connected to the first moving mechanism, the first moving mechanism is drivingly connected to the nozzle, the nozzle can reciprocate along the width direction of the transmission mechanism under the drive of the first moving mechanism, and the first moving mechanism can move along the transmission direction of the transmission mechanism under the drive of the second moving mechanism. The nozzle moves at the same speed as the silicon wafer transmission direction in the X direction, and the nozzle moves continuously along the Y axis direction to spray, so that multiple silicon wafers can be sprayed while the uniformity and consistency of the spraying can be guaranteed.

[0010] Optionally, the second moving mechanism includes a screw assembly and a sliding assembly arranged on the mounting frame; the bottom of the first moving mechanism is transmission-connected to the screw assembly, and the screw assembly drives the first moving mechanism to reciprocate along the sliding assembly.

[0011] Optionally, the mounting frame includes a first mounting plate and a second mounting plate arranged at intervals; the sliding assembly includes a first slide rail and a second slide rail arranged on the first mounting plate and the second mounting plate; the screw assembly is installed on one side of the second slide rail; the screw assembly includes a screw and a driving motor for driving the screw to rotate, and a moving seat is mounted on the screw; wherein, the bottom of one end of the first moving mechanism is slidably connected to the first slide rail; a slide plate is connected to the bottom of the other end, the bottom of the slide plate is slidably connected to the second slide rail, and the slide plate is connected to the moving seat; the driving motor drives the screw to rotate, and the moving seat drives the first moving mechanism to move along the slide rail through the slide plate.

[0012] Optionally, the nozzle is connected to the first moving mechanism via a connecting frame, the upper portion of the connecting frame is connected to the first moving mechanism, and the nozzle is connected to the lower portion of the connecting frame.

[0013] Optionally, the connecting frame includes a cross bar and a vertical bar, the cross bar is arranged along the width of the transmission mechanism, and one end of the vertical bar is connected to the cross bar; there are multiple nozzles, and the multiple nozzles are arranged on the cross bar at intervals.

[0014] Optionally, a carrying plate is provided on the top of the first moving mechanism, the liquid supply device is provided on the carrying plate, the bottom of the carrying plate is slidably connected to the first moving mechanism, the upper end of the connecting frame is connected to the carrying plate, and the first moving mechanism drives the carrying plate and the connecting frame to move along the width direction of the transmission mechanism.

[0015] Optionally, the silicon wafer spraying system further comprises a sensor, wherein the sensor is used to sense the position of the silicon wafer, and the spray head can start the spraying operation based on the sensing result of the sensor.

[0016] Optionally, the nozzle is an ultrasonic nozzle. By setting the ultrasonic nozzle, the raw liquid sprayed out is atomized and fan-shaped, which can provide efficient thin film spraying, uniform coating, and controllable spraying.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] 1. The utility model arranges a nozzle above the transmission mechanism. When the transmission mechanism drives the silicon wafer to the spraying range of the nozzle, the nozzle sprays the silicon wafer. The utility model changes the rolling coating method to spraying and adopts non-contact coating, which basically does not cause silicon wafer fragments.

[0019] 2. The existing coating method uses a large amount of raw liquid, and the raw liquid flows out through the sponge roller, which is easy to cause waste; the utility model realizes high-precision constant-flow liquid supply through the liquid supply device in conjunction with the nozzle, realizes uninterrupted liquid supply, is precisely controllable, and reduces the waste of raw liquid.

[0020] 3. The existing coating method drips onto the sponge roller, and the original liquid in the sponge roller is not evenly distributed, resulting in uneven original liquid on the surface of the silicon wafer. The utility model provides an ultrasonic nozzle, and the original liquid sprayed is atomized and fan-shaped, which can provide efficient thin film spraying, uniform coating, and controllable spraying.

[0021] 4. The nozzle of the utility model can move along the Y-axis direction to spray continuously, and can realize spraying on multiple silicon wafers, with high spraying efficiency and good uniformity and consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 It is a structural schematic diagram of the prior art.

[0024] Figure 2 It is a structural schematic diagram of the utility model.

[0025] : 101, dripping device; 102, upper sponge roller; 103, lower sponge roller; 1, silicon wafer; 2, transmission mechanism; 3, nozzle; 4, liquid supply device; 41, pipeline; 5, mounting frame; 51, first mounting plate; 52, second mounting plate; 521, mounting groove; 53, connecting plate; 6, first moving mechanism; 61, slide plate; 7, second moving mechanism; 71, lead screw assembly; 711, lead screw seat; 712, lead screw; 713, driving motor; 714, stopper; 721, first slide rail; 722, second slide rail; 723, slider; 8, connecting frame; 81, cross bar; 82, vertical bar; 9, bearing plate. DETAILED DESCRIPTION

[0026] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0027] In the description of the embodiments of the present utility model application, it needs to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "end", "side", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present utility model application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present utility model application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0029] In the embodiments of the present utility model application, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model application can be understood according to the specific circumstances.

[0030] In the embodiments of the utility model application, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] The disclosure below provides many different embodiments or examples for realizing different structures of the embodiments of the utility model application. In order to simplify the disclosure of the embodiments of the utility model application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the utility model application. In addition, the embodiments of the utility model application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0032] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings. Example

[0033] like Figure 2 As shown, the embodiment of the utility model application provides a silicon wafer spraying system, including: a transmission mechanism 2, a nozzle 3 and a liquid supply device 4.

[0034] The conveying mechanism 2 is used to convey the silicon wafer 1; the nozzle 3 is arranged above the conveying mechanism 2 and is used to spray the stock solution to spray the surface of the silicon wafer 1; the liquid supply device 4 is connected to the nozzle 3 and is used to supply liquid to the nozzle 3. When in use, when the silicon wafer 1 runs to the spraying range of the nozzle 3 through the conveying mechanism 2, the nozzle 3 is turned on to spray the stock solution onto the upper surface of the silicon wafer.

[0035] Optionally, the stock liquid sprayed from the nozzle 3 is in atomized form and fan-shaped.

[0036] Optionally, the nozzle 3 is an ultrasonic nozzle. The ultrasonic spraying technology can provide efficient thin film spraying. The coating is uniform and the spraying is controllable.

[0037] Optionally, the liquid supply device 4 adopts a constant-current liquid supply system, and adopts a high-precision constant-current liquid supply system to achieve uninterrupted liquid supply, precise control, and reduce the waste of original liquid.

[0038] For example, the transmission mechanism 2 may include, but is not limited to, a conveyor belt transmission mechanism and a conveyor roller transmission mechanism. Optionally, the transmission mechanism 2 uses a sponge transmission roller. Of course, other types of transmission mechanisms are also possible, and those skilled in the art can set them according to actual needs, and the embodiments of the present application do not limit this.

[0039] As an implementation scenario, in this scenario, the spraying range of the nozzle 3 is the spraying area set on the transmission mechanism 2. The transmission mechanism 2 can drive the silicon wafer 1 through the spraying area. The nozzle 3 is located above the spraying area. The nozzle 3 can spray the silicon wafer in the spraying area. When the transmission mechanism 2 drives the silicon wafer 1 through the spraying area, the nozzle 3 sprays the silicon wafer 1 passing through the spraying area. The spraying area is an area preset on the transmission mechanism 2 for performing the spraying operation. For example, the area corresponding to the nozzle on the transmission mechanism 2 can be set as the spraying area. The position, size and shape of the spraying area can be set according to actual needs, and the embodiment of the present application does not limit this. The nozzle 3 can spray statically or during movement. The movement can be along the transmission direction of the transmission mechanism 2 and / or the width direction of the transmission mechanism 2, that is, the nozzle 3 can move in one or more dimensions. During static spraying, the silicon wafers sprayed by one or more nozzles are the spraying range. The position and size of the spraying area of ​​the nozzle 3 can be set according to the size of the silicon wafer 1. By setting, the stock liquid is sprayed from the nozzle 3 and is sprayed on the upper surface of the silicon wafer, avoiding the stock liquid from being sprayed on the area outside the silicon wafer 1. During dynamic spraying, the silicon wafers sprayed by one or more nozzles after one movement are the spraying range of the nozzles. Example

[0040] On the basis of the embodiment 1, it further comprises a moving module arranged above the transmission mechanism 2, and the moving module is drivingly connected to the nozzle 3, and is used for driving the nozzle 3 to move in a preset direction.

[0041] As an implementation scenario, in this scenario, the mobile module includes a mounting frame 5 and a first moving mechanism 6 disposed on the mounting frame 5. The first moving mechanism 6 is connected to the nozzle 3 by driving, and the first moving mechanism 6 can drive the nozzle 3 to move back and forth along the width direction of the transmission mechanism 2, that is, the first moving mechanism 6 can drive the nozzle 3 to move along the Y-axis direction. The nozzle 3 is driven to move along the Y-axis direction by the first moving mechanism 6, so that the nozzle 3 can spray multiple silicon wafers 1. When in use, multiple silicon wafers are placed on the transmission mechanism 2. When the transmission mechanism 2 drives the multiple silicon wafers 1 into the preset spraying area, the transmission mechanism 2 stops running, and the system starts spraying, that is, the nozzle 3 moves along the Y-axis direction to continuously spray the stock solution on the upper surface of the multiple silicon wafers.

[0042] In this embodiment, the spraying area is an area on the transmission mechanism 2 that is preset for performing the spraying operation. For example, the area corresponding to the transmission mechanism 2 and the nozzle 3 is set as the spraying area. Figure 2 As shown, the spraying area can be the area where eight silicon wafers are arranged. Of course, other areas on the transmission mechanism 2 can also be set as spraying areas, and the position, size and shape of the spraying area set on the transmission mechanism 2 can be set according to actual needs, and the embodiment of the present application does not limit this.

[0043] Optionally, the number of the nozzles 3 may be one or more. When there is one nozzle 3, the nozzle 3 continuously sprays multiple silicon wafers when it moves from one end to the other end, and the nozzle 3 returns to the initial position after the spraying is completed. When there are multiple nozzles 3, the multiple nozzles 3 are arranged at intervals, for example: two nozzles 3 are used, such as Figure 2 As shown, two nozzles spray four silicon wafers respectively along the Y-axis direction. After the four wafers are sprayed, the nozzle 3 returns to the initial position. The number of nozzles 3 can be flexibly configured according to needs, and the distance between two adjacent nozzles 3 can also be flexibly set according to the number of silicon wafers to be sprayed. In this embodiment, two nozzles spray eight silicon wafers as an example.

[0044] Optionally, the first moving mechanism 6 may include but is not limited to: a slideway sliding block moving mechanism, a guide rail moving mechanism, a gear rack moving mechanism, a linear moving mechanism, etc. Of course, it can also be other types of moving modules, and those skilled in the art can set it according to actual needs, and the embodiment of the present application does not limit this. Example

[0045] On the basis of the embodiment 1, it further comprises a moving module arranged above the transmission mechanism 2, and the moving module is drivingly connected to the nozzle 3, and is used for driving the nozzle 3 to move in a preset direction.

[0046] As an implementation scenario, in this scenario, the mobile module includes a mounting frame 5 and a first mobile mechanism 6 and a second mobile mechanism 7 arranged on the mounting frame 5. The first mobile mechanism 6 is connected to the nozzle 3 by driving, and the second mobile mechanism 7 is connected to the first mobile mechanism 6 by driving. The second mobile mechanism 7 can drive the first mobile mechanism 6 to move along the transmission direction of the transmission mechanism 2, that is, the second mobile mechanism 7 can drive the first mobile mechanism 6 and the nozzle 3 to move along the X-axis direction. In this embodiment, the mobile module can realize multi-dimensional movement, so that the nozzle 3 can be driven to move in different directions, which can not only realize the spraying of multiple silicon wafers, but also ensure the uniformity and consistency of the spraying.

[0047] When in use, when the silicon wafer 1 moves to the spraying range of the nozzle 3, the nozzle 3 starts spraying, and the nozzle 3 moves at the same speed in the X-axis direction and the transmission direction of the silicon wafer 1, and at the same time, the nozzle 3 moves along the Y-axis direction to spray continuously, completing the spraying of multiple silicon wafers 1. After the spraying is completed, the nozzle returns to the initial position (retreats a certain distance along the X-axis direction and returns along the Y-axis direction) to start the next working cycle.

[0048] Optionally, the number of nozzles 3 can be one or more. When there is one nozzle 3, the nozzle 3 moves at the same speed in the X-axis direction and the transmission direction of the silicon wafer 1, and moves along the Y-axis direction at the same time, that is, it continuously sprays multiple silicon wafers when moving from one end to the other end of the spraying area. After the spraying is completed, the nozzle 3 returns to the initial position. When there are multiple nozzles 3, the multiple nozzles 3 are arranged at intervals. For example, two nozzles 3 are used, such as Figure 2 As shown, two nozzles 3 spray four silicon wafers respectively along the Y-axis direction. The number of nozzles 3 can be flexibly configured according to needs, and the distance between two adjacent nozzles 3 can also be flexibly set according to the number of silicon wafers to be sprayed. In this embodiment, two nozzles are mainly used to spray eight silicon wafers as an example.

[0049] Optionally, the first moving mechanism 6 may include but is not limited to: a slideway sliding block moving mechanism, a guide rail moving mechanism, a gear rack moving mechanism, a linear moving mechanism, etc. Of course, it can also be other types of moving modules, and those skilled in the art can set it according to actual needs, and the embodiment of the present application does not limit this.

[0050] Optionally, the second moving mechanism 7 includes a screw assembly 71 and a sliding assembly installed on the mounting frame 5, and the bottom of the first moving mechanism 6 is transmission-connected to the screw assembly 71, and the screw assembly 71 drives the first moving mechanism 6 to reciprocate along the sliding assembly.

[0051] Optionally, the mounting frame 5 includes a first mounting plate 51 and a second mounting plate 52 that are spaced apart, and the sliding assembly includes a first slide rail 721 and a second slide rail 722 that are disposed on the first mounting plate 51 and the second mounting plate 52, and sliders 723 are disposed on the first slide rail 721 and the second slide rail 722, respectively. The lead screw assembly 71 is mounted on one side of the first slide rail 721 or the second slide rail 722, and the bottom of one end of the first moving mechanism 6 is connected to the first slide rail 721 through a slider, and the bottom of the other end is connected to a slide plate 61, and the bottom of the slide plate 61 is connected to the second slide rail 722 through a slider, and the bottom of the slide plate 61 located on one side of the slider is also drivingly connected to the lead screw assembly 71, and the lead screw assembly 71 drives the first moving mechanism 6 to move along the first slide rail 721 and the second slide rail 722 through the slider 61.

[0052] Optionally, the second mounting plate 52 has an extension portion, on which a mounting groove 521 is formed, and the mounting groove 521 is arranged along the length direction of the second mounting plate 52. The screw assembly 71 includes a screw 712 installed on the mounting groove 521 through a screw seat 711, and a driving motor 713 for driving the screw 712 to rotate. A moving seat is provided on the screw 712, and the lower surface of the slide plate 61 located on one side of the slider is connected to the moving seat. When the driving motor 713 is started, the driving motor 713 drives the screw 712 to rotate, and the moving seat drives the slide plate 61 and the first moving mechanism 6 to move along the slide rail.

[0053] Optionally, a stopper 714 is further provided on the second mounting plate 52 located on one side of the screw seat 711 .

[0054] Optionally, a connecting plate 53 is further provided at one end of the first mounting plate 51 and the second mounting plate 52 , and a U-shaped structure is formed among the first mounting plate 51 , the second mounting plate 52 and the connecting plate 53 . Example

[0055] On the basis of Embodiment 2 or Embodiment 3, in this embodiment, the nozzle 3 is connected to the first moving mechanism 6 via a connecting frame 8. The upper portion of the connecting frame 8 is connected to the first moving mechanism 6, and the nozzle 3 is connected to the lower portion of the connecting frame 8.

[0056] Optionally, the connecting frame 8 includes a crossbar 81 and a vertical bar 82, the crossbar 81 is horizontally arranged above the transmission mechanism 2 along the width of the transmission mechanism 2, the vertical bar 82 is connected to the middle of the crossbar 81, and the vertical bar 82 is perpendicular to the crossbar 81, and reinforcing ribs can be respectively arranged between the two sides of the vertical bar 82 and the crossbar 81. As an implementation scenario, in this scenario, nozzles 3 are respectively arranged at both ends of the crossbar 81, and the nozzles 3 can be fixed to the bottom or side of the crossbar 81 through a connecting plate, and the distance between the two nozzles 3 is set to a distance that the nozzles can just complete the spraying of four silicon wafers.

[0057] In one embodiment, a carrying plate 9 is disposed on the top of the first moving mechanism 6, the liquid supply device 4 is disposed on the upper surface of the carrying plate 9, the bottom of the carrying plate 9 is slidably connected to the first moving mechanism 6, and the first moving mechanism 6 drives the carrying plate 9 to move along the Y-axis direction. The top of the vertical rod 82 at the upper end of the connecting frame 8 is connected to the bottom of the carrying plate 9, so that when the carrying plate 9 moves, it can drive the liquid supply device 4 and the nozzle 3 installed on the connecting frame 8 to move synchronously.

[0058] Optionally, baffles are provided on both sides of the carrying plate 9 .

[0059] Optionally, the liquid supply device 4 is a barrel-shaped structure.

[0060] Optionally, the liquid supply device 4 can be fixed on the supporting plate 9 by a fixing device, which is helpful to ensure the stability of its use.

[0061] Optionally, the liquid supply device 4 is connected to the corresponding nozzle 3 through a pipeline 41. When in use, the original liquid in the liquid supply device 4 is transported to the nozzle 3 through the pipeline 41 and sprayed out by the nozzle 3.

[0062] Optionally, a liquid pump is provided on the liquid supply device 4 or the pipeline 41 , the input end of the liquid pump is connected to the liquid supply device 4 , and the output end is connected to the nozzle. The liquid pump draws the original liquid in the liquid supply device 4 into the nozzle 3 , and sprays it out from the nozzle 3 .

[0063] In one embodiment, the silicon wafer spraying system further includes a sensor, which is used to sense the position of the silicon wafer 1 , and the spray head 3 can start the spraying operation based on the sensing result of the sensor.

[0064] A method for using a silicon wafer spraying system: a sensor is arranged on a nozzle 3, and the position of the silicon wafer can be sensed by the sensor. The transmission mechanism 2, the first moving mechanism 6, the second moving mechanism 7, the sensor, and the nozzle 3 are all electrically connected to the controller. When the transmission mechanism 2 drives the silicon wafer 1 to enter the spraying range (preset spraying area) of the nozzle 3, the sensor transmits the sensing result to the controller, and the controller regulates the transmission mechanism 2 and the nozzle 3. The transmission mechanism 2 stops the silicon wafer transmission based on the sensing result, and the nozzle starts the spraying operation based on the sensing result to spray the stock solution onto the surface of the silicon wafer. The size of the spraying range can be set according to demand, that is, the nozzle 3 can spray only one silicon wafer or multiple silicon wafers. When spraying multiple silicon wafers, the nozzle 3 continuously sprays the multiple silicon wafers along the Y-axis direction under the drive of the first moving mechanism 6. After the silicon wafer spraying is completed, the nozzle 3 stops the spraying operation.

[0065] Another method of using the silicon wafer spraying system: the sensor is set on the nozzle 3, and the transmission mechanism 2, the first moving mechanism 6, the second moving mechanism 7, the sensor, and the nozzle 3 are all controlled by the controller. When the transmission mechanism 2 drives multiple neatly arranged silicon wafers 1 to enter the spraying range (preset spraying area) of the nozzle 3, the sensor transmits the sensing result to the controller, and the controller controls the nozzle 3 to start the spraying operation, and simultaneously starts the first moving mechanism 6 and the second moving mechanism 7. The nozzle 3 moves at the same speed in the X-axis direction and the silicon wafer transmission direction through the second moving mechanism 7, and at the same time moves along the Y-axis direction through the first moving mechanism 6 for continuous spraying. In this implementation scenario, after spraying is completed, the nozzle 3 can directly return to the initial position and start the next working cycle; when the nozzle 3 returns along the Y-axis direction, the silicon wafer can be sprayed again as needed; after the first group of silicon wafers (multiple silicon wafers arranged in the same row) are sprayed, the nozzle 3 can retreat a certain distance along the X-axis direction and return along the Y-axis direction. When the nozzle 3 returns along the Y-axis direction, it can move at the same speed in the X-axis direction and the silicon wafer transmission direction to spray the second group of silicon wafers, which is conducive to improving the efficiency of spraying.

[0066] Parts not described in detail in this embodiment are well-known techniques in the art.

[0067] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. Silicon wafer spraying system, characterized in that: include: Transmission mechanism (2); A nozzle (3) is arranged above the transmission mechanism (2); A liquid supply device (4) connected to the spray head (3); A moving module is arranged above the transmission mechanism (2), and the moving module is drivingly connected to the nozzle (3) to drive the nozzle (3) to move in a preset direction; The movable module comprises a mounting frame (5) and a first movable mechanism (6) and a second movable mechanism (7) arranged on the mounting frame (5); the second movable mechanism (7) is drivingly connected to the first movable mechanism (6), the first movable mechanism (6) is drivingly connected to the nozzle (3), the nozzle (3) can reciprocate along the width direction of the transmission mechanism (2) under the drive of the first movable mechanism (6), and the first movable mechanism (6) can move along the transmission direction of the transmission mechanism (2) under the drive of the second movable mechanism (7); the transmission mechanism (2) drives the silicon wafer (1) to enter the spraying range of the nozzle (3), and the nozzle (3) sprays the silicon wafer (1) within the spraying range.

2. The silicon wafer spraying system according to claim 1, characterized in that: The movable module comprises a mounting frame (5) and a first movable mechanism (6) arranged on the mounting frame (5); the first movable mechanism (6) is drivingly connected to the nozzle (3); the nozzle (3) can reciprocate along the width direction of the transmission mechanism (2) under the drive of the first movable mechanism (6).

3. The silicon wafer spraying system according to claim 1, characterized in that: The mounting frame (5) comprises a first mounting plate (51) and a second mounting plate (52) which are arranged at an interval; The second moving mechanism (7) comprises a lead screw assembly (71) and a sliding assembly which are arranged on the mounting frame (5); The sliding assembly comprises a first sliding rail (721) and a second sliding rail (722) which are arranged on the first mounting plate (51) and the second mounting plate (52); The lead screw assembly (71) is installed on one side of the second slide rail (722); The lead screw assembly (71) comprises a lead screw (712) and a drive motor (713) for driving the lead screw (712) to rotate, and a movable seat is sleeved on the lead screw (712); The bottom of one end of the first moving mechanism (6) is slidably connected to the first slide rail (721); the bottom of the other end is connected to a slide plate (61); the bottom of the slide plate (61) is slidably connected to the second slide rail (722), and the slide plate (61) is connected to the moving seat; the driving motor (713) drives the lead screw (712) to rotate, and the moving seat drives the first moving mechanism (6) to move along the slide rail through the slide plate (61).

4. The silicon wafer spraying system according to any one of claims 1 to 3, characterized in that: The nozzle (3) is connected to the first moving mechanism (6) via a connecting frame (8); the upper part of the connecting frame (8) is connected to the first moving mechanism (6); and the nozzle (3) is connected to the lower part of the connecting frame (8).

5. The silicon wafer spraying system according to claim 4, characterized in that: The connecting frame (8) comprises a cross bar (81) and a vertical bar (82); the cross bar (81) is arranged along the width of the transmission mechanism (2); one end of the vertical bar (82) is connected to the cross bar (81); and there are a plurality of nozzles (3), which are arranged at intervals on the cross bar (81).

6. The silicon wafer spraying system according to claim 4, characterized in that: A carrying plate (9) is arranged on the top of the first moving mechanism (6), the liquid supply device (4) is arranged on the carrying plate (9), the bottom of the carrying plate (9) is slidably connected to the first moving mechanism (6), the upper end of the connecting frame (8) is connected to the carrying plate (9), and the first moving mechanism (6) drives the carrying plate (9) and the connecting frame (8) to move along the width direction of the transmission mechanism (2).

7. The silicon wafer spraying system according to claim 1, characterized in that: The silicon wafer spraying system further comprises a sensor, wherein the sensor is used to sense the position of the silicon wafer, and the spray head (3) can start the spraying operation based on the sensing result of the sensor.

8. The silicon wafer spraying system according to claim 1, characterized in that: The nozzle (3) is an ultrasonic nozzle.

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