Experimental silicon wafer separating device

Abstract

The utility model provides an experimental silicon wafer slicing device, which comprises a silicon wafer basket feeding mechanism, a silicon wafer transfer mechanism, a visual inspection mechanism and a slicing mechanism, and is characterized in that the silicon wafer basket feeding mechanism comprises a feeding lifting assembly and a feeding belt assembly, and the feeding lifting assembly drives the feeding belt assembly to move in the vertical direction; the silicon wafer transfer mechanism comprises a transfer belt assembly and a transfer moving assembly; the visual detection mechanism comprises a detection belt assembly and a visual assembly; the wafer separating mechanism comprises a plurality of wafer separating belt assemblies arranged side by side and a movable suction cup assembly, the movable suction cup assembly is used for transferring silicon wafers among the wafer separating belt assemblies, and the detection belt assembly is in butt joint with one wafer separating belt assembly. According to the arrangement, the silicon wafer slicing efficiency and quality are greatly improved, the labor cost and the time cost of laboratory slicing are reduced, and the practical value is high.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to an experimental silicon wafer slicing device. Background Art

[0002] During the R&D experiment of the screen printing process of crystalline silicon solar cells, the R&D personnel need to consider the refined grouping, quantity and quality of silicon wafers when designing the experiment. Therefore, before the R&D experiment, the R&D personnel need to carry out refined card-dealing-style grouping of experimental silicon wafers to minimize the quality and quantity differences of each group of experimental samples to ensure the accuracy of the experimental data and its conclusions.

[0003] The existing technology usually involves manual chip distribution by R&D personnel. During this process, R&D personnel use tweezers to pinch the sample, which can easily cause scratches or even cracks on the silicon wafer when grouping. It is also easy for the surface of the sample to become dirty when the R&D personnel wear gloves to take the sample. In addition, in order to ensure the reliability of experimental data, the sample size of the experimental grouping sample must be large enough, which requires a lot of manpower and time for chip grouping, and the chip grouping efficiency and quality are low.

[0004] Therefore, it is necessary to design an experimental silicon wafer slicing device to solve the above problems. Utility Model Content

[0005] The utility model aims to provide an experimental silicon wafer slicing device which can effectively solve the problems of low efficiency, easy scratching, easy pollution and hidden cracking caused by manual slicing of samples required for experiments.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme: an experimental silicon wafer slicing device, which includes

[0007] The silicon wafer basket feeding mechanism comprises a feeding lifting assembly and a feeding belt assembly arranged on the feeding lifting assembly, wherein the feeding lifting assembly drives the feeding belt assembly to move in a vertical direction;

[0008] A silicon wafer transfer mechanism, comprising a transfer belt assembly and a transfer moving assembly for driving the transfer belt assembly to move in the X-axis direction and the Z-axis direction;

[0009] The visual inspection mechanism comprises a detection belt assembly and a visual assembly located above the detection belt assembly; the transfer belt assembly can be moved between the feeding belt assembly and the detection belt assembly, one end of the transfer belt assembly is connected to the silicon wafer basket, and the other end is connected to the detection belt assembly, so as to transfer the silicon wafers in the silicon wafer basket to the detection belt assembly one by one;

[0010] The slicing mechanism comprises a plurality of slicing belt assemblies and a movable suction cup assembly arranged side by side. The movable suction cup assembly is used to transfer the silicon wafers between the plurality of slicing belt assemblies, and the detection belt assembly is docked with one of the slicing belt assemblies.

[0011] As a further improved technical solution of the utility model, the feeding lifting assembly includes a motor and a screw rod connected to the output end power of the motor, and the feeding belt assembly is arranged on the screw rod.

[0012] As a further improved technical solution of the utility model, the silicon wafer basket feeding mechanism also includes a full-loaded belt assembly and an empty-loaded basket belt assembly arranged below the full-loaded belt assembly, and the full-loaded belt assembly and the empty-loaded basket belt assembly are connected to the feeding belt assembly.

[0013] As a further improved technical solution of the utility model, the transfer moving component includes an X-linear module and a lifting module arranged on the X-linear module, the transfer belt assembly is arranged at the top of the lifting module, and the transfer belt assembly can be moved to the bottom of the detection belt assembly.

[0014] As a further improved technical solution of the utility model, the transfer belt assembly includes a transfer belt and a motor, and the width of the transfer belt is smaller than the width of the silicon wafer basket so that one end of the transfer belt can extend into the interior of the silicon wafer basket.

[0015] As a further improved technical solution of the utility model, the number of the slice belt assemblies is 3, and the detection belt assembly is connected to the slice belt assembly located in the middle position.

[0016] As a further improved technical solution of the utility model, it also includes a foreign piece rejection mechanism arranged on one side of the visual inspection mechanism, and the foreign piece rejection mechanism includes a slide rail drive assembly, a vacuum suction cup assembly and a material receiving box. The slide rail drive assembly drives the vacuum suction cup assembly to move above the material receiving box and the inspection belt assembly.

[0017] As a further improved technical solution of the utility model, it also includes a unloading mechanism, which includes a plurality of unloading lifting components, a unloading belt component arranged on the unloading lifting component and connected to the slice mechanism, an empty flower basket belt component and a fully loaded belt component connected to the unloading belt component.

[0018] It can be seen from the above technical scheme that the experimental silicon wafer slicing device of the utility model realizes batch and automatic loading of silicon wafers by setting up a silicon wafer basket feeding mechanism, and by setting up a silicon wafer transfer mechanism to connect with the silicon wafer basket feeding mechanism, it is convenient to transfer the silicon wafers one by one from the silicon wafer basket and transmit them to the detection mechanism for piece-by-piece detection; further, a slicing mechanism is set at the rear end of the detection mechanism to realize automatic slicing of silicon wafers, avoiding the inefficiency and hidden crack problems caused by manual slicing; by setting up a foreign wafer rejection mechanism, unqualified silicon wafers can be automatically rejected, further improving the uniformity of experimental samples and reducing experimental errors; the experimental silicon wafer slicing device of the utility model greatly improves the efficiency and quality of silicon wafer slicing, reduces the manpower and time costs of laboratory slicing, and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The present invention is an experimental silicon wafer slicing device according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 Diagram of the docking relationship between the silicon wafer transfer mechanism, the silicon wafer basket feeding mechanism and the detection belt assembly. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] Please refer to Figure 1 As shown, the utility model provides an experimental silicon wafer slicing device, which includes a silicon wafer basket loading mechanism 10, a silicon wafer transfer mechanism 20, a visual inspection mechanism 30, a slicing mechanism 40, a feeding mechanism 50 and a foreign wafer rejecting mechanism 60.

[0023] The silicon wafer basket feeding mechanism 10 includes a fully loaded belt assembly 11, a feeding lifting assembly 12, a feeding belt assembly 13 arranged on the feeding lifting assembly 12, and an empty basket belt assembly 14 arranged below the fully loaded belt assembly 11. The fully loaded belt assembly 11 is docked with the feeding belt assembly 13 to transfer the fully loaded basket to the feeding belt assembly 13. The empty basket belt assembly 14 is used to transfer the empty basket on the feeding belt assembly 13. The feeding lifting assembly 12 is used to drive the feeding belt assembly 13 to move back and forth between the fully loaded belt assembly 11 and the empty basket belt assembly 14 in the vertical direction, so that the feeding belt assembly 13 is docked with the fully loaded belt assembly 11 and the empty basket belt assembly 14 respectively. The feeding lifting assembly 12 includes a motor, a screw rod connected to the output end power of the motor, and a position sensor, and the feeding belt assembly 13 is arranged on the screw rod.

[0024] Please also refer to Figure 2As shown, the wafer transfer mechanism 20 is used to transfer the wafers in the wafer basket 1 on the feeding belt assembly 13 to the visual inspection mechanism 30 one by one. The wafer transfer mechanism 20 includes a transfer belt assembly 23 and a transfer moving assembly that drives the transfer belt assembly 23 to move in the X-axis direction and the Z-axis direction; the transfer moving assembly includes an X-linear module 21 and a lifting module 22 arranged on the X-linear module 21, and the transfer belt assembly 23 is arranged at the top of the lifting module 22.

[0025] The transfer belt assembly 23 includes a transfer belt and a motor driving the transfer belt. The width of the transfer belt is smaller than the width of the silicon wafer basket so that one end of the transfer belt can extend into the interior of the silicon wafer basket. When the transfer belt assembly 23 is docked with the silicon wafer basket, the transfer belt is located below the bottommost silicon wafer to transfer the silicon wafers in the silicon wafer basket one by one from bottom to top.

[0026] The visual inspection mechanism 30 is used to detect whether there are defects such as hidden cracks, broken edges, and fragments on the silicon wafers. The visual inspection mechanism 30 includes a detection belt assembly 31 and a visual assembly 32 located above the detection belt assembly 31. The transfer belt assembly 23 can be moved between the feeding belt assembly 13 and the detection belt assembly 31. One end of the transfer belt assembly 23 is connected to the silicon wafer basket, and the other end is connected to the detection belt assembly 31 to transfer the silicon wafers in the silicon wafer basket to the detection belt assembly 31 one by one. The transfer belt assembly 23 can be moved to the bottom of the detection belt assembly 31 by the X-linear module 21 and the lifting module 22.

[0027] The slicing mechanism 40 includes a plurality of slicing belt assemblies 41 and a movable suction cup assembly 42 arranged side by side. The movable suction cup assembly 42 is used to transfer the silicon wafer between the plurality of slicing belt assemblies 41. The detection belt assembly 31 docks with one of the slicing belt assemblies 41. In this embodiment, the number of slicing belt assemblies 41 is 3, and the detection belt assembly 31 docks with the slicing belt assembly 41 located in the middle.

[0028] The unloading mechanism 50 is used to unload the silicon wafers that have been unsliced ​​from the slicing mechanism 40. The unloading mechanism 50 specifically includes a plurality of unloading lifting components 51, an unloading belt component 52 provided on the unloading lifting component 51 and docked with the slicing mechanism 40, an empty basket belt component 53 and a full belt component 54 docked with the unloading belt component 52. Corresponding to the slicing mechanism 40, there are three unloading lifting components 51, three unloading belt components 52, three empty basket belt components 53 and three full belt components 54 in this embodiment.

[0029] The foreign wafer rejection mechanism 60 is used to collect defective silicon wafers to prevent defective silicon wafers from flowing into the slicing mechanism 40. The foreign wafer rejection mechanism 60 is arranged on one side of the visual inspection mechanism 30, specifically on one side of the inspection belt assembly 31. The foreign wafer rejection mechanism 60 includes a slide rail driving assembly 61, a vacuum suction cup assembly 62 and a receiving box 63. The slide rail driving assembly 61 drives the vacuum suction cup assembly 62 to move above the receiving box 63 and the inspection belt assembly 31.

[0030] The working process of the experimental silicon wafer slicing device in this embodiment is as follows: first, a basket full of silicon wafers is manually placed on the loading belt assembly 11, and the opening of the basket is facing the transmission direction. The full basket is transported to the loading belt assembly 13 under the drive of the loading belt assembly 11; at the same time, the transfer belt is docked with the full basket to transfer the bottom layer of silicon wafers. Further, the loading belt assembly 11 is driven by the loading lifting assembly 12 to move downward a certain distance so that the second layer of silicon wafers contacts the transfer belt. In this way, the silicon wafers are transferred one by one; when the silicon wafers in the basket are transferred, the loading belt assembly 11 drives the empty basket to descend to the height of the empty basket belt assembly 14, and the two are docked to transfer the empty basket to the empty basket belt assembly 14. At the same time, the silicon wafers transferred to the transfer belt are transmitted to the detection belt assembly 31 for visual inspection. If they are judged to be defective silicon wafers, they are removed by the foreign wafer removal mechanism 60. The qualified silicon wafers are further transported to the slicing belt assembly 41 through the detection belt assembly 31 and sliced ​​by the mobile suction cup assembly 42. Specifically, the silicon wafers transported to the slicing belt assembly 41 are sliced ​​according to the following periodic rules: the first and second silicon wafers are successively transferred to the slicing belt assemblies 41 on both sides through the mobile suction cup assembly 42, and the third silicon wafer is transported by the slicing belt assembly 41 in the middle position, that is, it is set to transport three silicon wafers as a cycle, and the cyclical reciprocating transport is carried out. Finally, each slicing belt assembly 41 is docked with its corresponding unloading belt assembly 52 for unloading. The unloading process is opposite to the loading process, which will not be described here.

[0031] Terms such as "upper" and "lower" used herein to indicate spatial relative positions are used for the purpose of convenience to describe the relationship of one feature relative to another feature as shown in the drawings. It is understood that, depending on the placement of the product, the terms of spatial relative positions may be intended to include different orientations other than those shown in the drawings, and should not be construed as limitations on the claims.

[0032] In addition, the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of this specification should be based on the technical personnel in the relevant technical field. Although this specification has described the present invention in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or make equivalent substitutions to the present invention, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. An experimental silicon wafer slicing device, characterized in that: include The silicon wafer basket feeding mechanism comprises a feeding lifting assembly and a feeding belt assembly arranged on the feeding lifting assembly, wherein the feeding lifting assembly drives the feeding belt assembly to move in a vertical direction; A silicon wafer transfer mechanism, comprising a transfer belt assembly and a transfer moving assembly for driving the transfer belt assembly to move in the X-axis direction and the Z-axis direction; The visual inspection mechanism comprises a detection belt assembly and a visual assembly located above the detection belt assembly; the transfer belt assembly can be moved between the feeding belt assembly and the detection belt assembly, one end of the transfer belt assembly is connected to the silicon wafer basket, and the other end is connected to the detection belt assembly, so as to transfer the silicon wafers in the silicon wafer basket to the detection belt assembly one by one; The slicing mechanism comprises a plurality of slicing belt assemblies and a movable suction cup assembly arranged side by side. The movable suction cup assembly is used to transfer the silicon wafers between the plurality of slicing belt assemblies, and the detection belt assembly is docked with one of the slicing belt assemblies.

2. The experimental silicon wafer slicing device as claimed in claim 1, characterized in that: The feeding lifting assembly comprises a motor and a screw rod which is connected to the output end of the motor, and the feeding belt assembly is arranged on the screw rod.

3. The experimental silicon wafer slicing device as claimed in claim 1, characterized in that: The silicon wafer basket feeding mechanism also includes a fully loaded belt assembly and an empty basket belt assembly arranged below the fully loaded belt assembly, and the fully loaded belt assembly and the empty basket belt assembly are connected to the feeding belt assembly.

4. The experimental silicon wafer slicing device as claimed in claim 1, characterized in that: The transfer moving component includes an X-linear module and a lifting module arranged on the X-linear module. The transfer belt component is arranged at the top of the lifting module. The transfer belt component can be moved to the bottom of the detection belt component.

5. The experimental silicon wafer slicing device as claimed in claim 4, characterized in that: The transfer belt assembly includes a transfer belt and a motor. The width of the transfer belt is smaller than the width of the silicon wafer basket, so that one end of the transfer belt can extend into the interior of the silicon wafer basket.

6. The experimental silicon wafer slicing device as claimed in claim 1, characterized in that: The number of the slice belt assemblies is 3, and the detection belt assembly is docked with the slice belt assembly located in the middle position.

7. The experimental silicon wafer separation device as claimed in claim 1, characterized in that: It also includes a foreign piece rejection mechanism arranged on one side of the visual inspection mechanism, and the foreign piece rejection mechanism includes a slide rail drive assembly, a vacuum suction cup assembly and a material receiving box. The slide rail drive assembly drives the vacuum suction cup assembly to move above the material receiving box and the inspection belt assembly.

8. The experimental silicon wafer slicing device as claimed in claim 1, characterized in that: It also includes a material unloading mechanism, which includes a plurality of material unloading lifting components, a material unloading belt component arranged on the material unloading lifting component and connected to the slicer mechanism, an empty flower basket belt component connected to the material unloading belt component, and a fully loaded belt component.

Images