Circuit board pin bending mechanism

Abstract

The utility model relates to the field of circuit board processing, in particular to a circuit board pin bending mechanism which comprises two supporting plates which are oppositely arranged, step portions are arranged on the tops of the opposite side faces of the supporting plates, and the two ends of a circuit board are placed on the step portions. A two-way air cylinder is fixed between the supporting plates, the driving ends on the two sides of the two-way air cylinder face the two supporting plates respectively and are in driving connection with bending blocks, the two-way air cylinder drives the bending blocks on the two sides to face or be away from the supporting plates, and the step parts support and guide the circuit board. The circuit board can be conveniently placed between the two supporting plates and can move back and forth; when the circuit board moves to the position above the bidirectional air cylinder, the pins are located between the bending block and the supporting plate, the bidirectional air cylinder drives the bending block to move towards the supporting plate, and the bending block drives the pins to be bent by 90 degrees, so that the pins of the component are tightly attached to the circuit board, the contact area of welding spots is increased, and the situation that the welding spots fall off is avoided.

Description

Technical Field

[0001] The utility model relates to the field of circuit board processing, in particular to a circuit board pin bending mechanism. Background Art

[0002] PCB, the full name of which is Printed Circuit Board, is a support for electronic components and a provider of circuit connections for electronic components. It is made using electronic printing technology, so it is called a "printed" circuit board. The main functions include providing connections between electronic components: by printing wires on the board, PCB can connect various components to form a complete working circuit. Support components: As a support for components, PCB can ensure the stability and reliability of components in the equipment. Components are fixed on the PCB by welding or plugging, forming a compact and solid whole. Optimize space layout: The design of the PCB can flexibly adjust the layout of components to achieve optimal use of space. This helps to reduce the size and weight of the equipment and improve the portability and reliability of the product. Simplify the production process: Through automated production lines, PCBs can be produced in large quantities and quickly, thereby reducing production costs and improving production efficiency.

[0003] The assembly process of PCB includes patch, welding, assembly, functional testing, etc., among which patch is the process of placing electronic components (such as chips, resistors, capacitors, etc.) on the PCB board accurately according to the position on the design drawing. Welding is the process of connecting the electronic components placed on the PCB board with the copper foil on the circuit board. However, when the terminal is welded, the PCB board is heated and there is a possibility of deformation. If the PCB board is deformed, the terminal cannot be attached to the bottom, and there is a gap between the terminal and the PCB board. Then the reliability of the solder joint is reduced, and there is a risk of the solder joint falling off. Utility Model Content

[0004] The utility model aims to provide a circuit board pin bending mechanism, which aims to improve the problem that a gap exists between a terminal and a PCB board during welding, thereby reducing the reliability of the solder joint and posing the risk of the solder joint falling off.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A circuit board pin bending mechanism is used to bend the pins of components on the circuit board, the components are located at both ends of the circuit board, the pins extend downward through the circuit board, and include two oppositely arranged support plates, the tops of the opposite sides of the support plates are provided with step portions, and the two ends of the circuit board are placed on the step portions;

[0007] A bidirectional cylinder is fixed between the support plates, and the driving ends on both sides of the bidirectional cylinder are respectively facing the two support plates and drivingly connected to the bending blocks, and the bidirectional cylinder drives the bending blocks on both sides toward or away from the support plates;

[0008] The pins extend between the bending block and the supporting plate.

[0009] Furthermore, a mounting plate is fixed on the outer side of the support plate, the top of the mounting plate protrudes from the support plate, and a horizontally extending limiting plate is fixed thereto, the limiting plate extends above the bending block, and the end of the circuit board is located between the limiting plate and the bending block.

[0010] Furthermore, a side plate is fixed between the two ends of the support plate, and the height of the side plate is lower than or equal to the height of the step portion;

[0011] A bottom plate is fixed to the bottom of the support plate and the side plate, and the bidirectional cylinder is fixed on the bottom plate.

[0012] Furthermore, a discharge area and a bending area are provided in the extension direction of the support plate, the bidirectional cylinder is located in the bending area, an air pump is fixed on the bottom plate, an air pipe is connected between the air pump and the bidirectional cylinder, the air pump is located in the discharge area, and the height of the air pump is lower than the height of the step portion.

[0013] Furthermore, a transparent baffle is fixed between the tops of the side panels, and the transparent baffle is located above the bidirectional cylinder and the air pump.

[0014] Furthermore, two side surfaces of the transparent baffle are spaced apart from the two support plates respectively.

[0015] Furthermore, a buffer pad is fixed on the opposite side of the support plate, the end of the buffer pad protrudes from the step portion, and the buffer pad is located in the discharge area.

[0016] Furthermore, the ratio of the width of the bending block to the width of the circuit board is 1:1-3:2.

[0017] After adopting the above technical solution, the utility model has the following advantages compared with the background technology:

[0018] In this solution, the step portion supports and guides the circuit board, making it easier for the circuit board to be placed between the two support plates and to move back and forth. When the circuit board moves to the top of the two-way cylinder, the pins are located between the bending block and the support plate. The two-way cylinder drives the bending block to move toward the support plate, and the bending block drives the pins to bend 90°, so that the pins of the components and the circuit board are in close contact with each other, increasing the contact area of ​​the solder joints and avoiding the solder joints from falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a top view of the circuit board pin bending mechanism of the utility model;

[0020] Figure 2 A schematic diagram of the circuit board movement path of the circuit board pin bending mechanism of the utility model;

[0021] Figure 3 It is a side view of the circuit board pin bending mechanism of the utility model.

[0022] Description of reference numerals:

[0023] 1. Support plate; 101. Step portion; 1011. Horizontal surface; 1012. Vertical surface; 102. Mounting plate; 103. Limiting plate; 104. Material discharge area; 105. Bending area;

[0024] 2. Bidirectional cylinder; 201. Bending block;

[0025] 3. Side panel; 301. Wiring channel;

[0026] 4. Bottom plate;

[0027] 5. Air pump; 501. Air pipe;

[0028] 6. Transparent baffle; 7. Buffer pad;

[0029] 8. Circuit board; 801. Pins; 802. Components. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0031] In addition, it should be noted that the terms "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element of the present invention must have a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] When an element is referred to as being “fixed to” or “disposed on” or “provided on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0033] Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0034] Example

[0035] Please refer to Figure 1-3 As shown, this embodiment provides a circuit board pin bending mechanism, which is used to bend the pins 801 of the components 802 on the circuit board 8, the components 802 are located at both ends of the circuit board 8, and the pins 801 extend downward through the circuit board 8. Specifically, the circuit board pin bending mechanism includes two support plates 1 arranged opposite to each other, and the tops of the opposite sides of the support plates 1 are provided with step portions 101, and the two ends of the circuit board 8 are placed on the step portions 101. A bidirectional cylinder 2 is fixed between the support plates 1, and the driving ends of the bidirectional cylinder 2 on both sides are respectively facing the two support plates 1, and the driving ends are connected with bending blocks 201, and the bidirectional cylinder 2 drives the bending blocks 201 on both sides toward or away from the support plates 1. The pins 801 extend between the bending blocks 201 and the support plates 1. The step portion 101 supports and guides the circuit board 8, making it convenient for the circuit board 8 to be placed between the two support plates 1 and to move back and forth; when the circuit board 8 moves to the top of the two-way cylinder 2, the pin 801 is located between the bending block 201 and the support plate 1, and the two-way cylinder 2 drives the bending block 201 to move toward the support plate 1, and the bending block 201 drives the pin 801 to bend 90°, so that the pin 801 of the component 802 is in close contact with the circuit board 8, thereby increasing the contact area of ​​the solder joint and avoiding the solder joint from falling off.

[0036] A mounting plate 102 is fixed on the outer surface of the support plate 1. The top of the mounting plate 102 protrudes from the support plate 1 and is fixed with a horizontally extending limiting plate 103. The limiting plate 103 extends above the bending block 201. The end of the circuit board 8 is located between the limiting plate 103 and the bending block 201. The limiting plate 103 limits the components 802 of the circuit board 8 at the top to prevent the components 802 from rotating during the bending process of the pins 801, which affects the degree of fit between the components 802 and the circuit board 8 and affects the bending and subsequent soldering effects.

[0037] In this embodiment, a side plate 3 is fixed between the two ends of the support plate 1, and the height of the side plate 3 is lower than or equal to the height of the step portion 101. In this embodiment, the height of the side plate 3 is equal to the height of the step portion 101. The side plate 3 makes way for the circuit board 8, so that the two ends of the step portion 101 are connected to the outside. During use, the circuit board 8 can directly leave the support plate 1 from one end of the step portion 101, thereby improving the discharging efficiency after bending. A bottom plate 4 is fixed to the bottom of the support plate 1 and the side plate 3, and the two-way cylinder 2 is fixed on the bottom plate 4. The side plate 3 and the bottom plate 4 support and fix the support plate 1, thereby improving the overall structural strength. At the same time, the side plate 3, the support plate 1 and the bottom plate 4 form a box-like structure, which accommodates the two-way cylinder 2 and protects the two-way cylinder 2. In this embodiment, a wiring channel 301 is provided on the side plate 3, and the air pipe and power cord of the two-way air pump 2 can be connected to the outside through the wiring channel 301, thereby improving the neatness of the overall structure.

[0038] The support plate 1 is provided with a discharge area 104 and a bending area 105 in the extending direction. The bidirectional cylinder 2 is located in the bending area 105. An air pump 5 is fixed on the bottom plate 4. An air pipe 501 is connected between the air pump 5 and the bidirectional cylinder 2. The air pump 5 is located in the discharge area 104, making full use of the internal space and reducing the volume of the overall structure. The height of the air pump 5 is lower than the height of the step 101. The air pump 5 drives the bidirectional cylinder 2. At the same time, the height of the air pump 5 is set lower than the height of the step 101. During the bending process, the circuit board 8 is given way, providing a larger feeding space for the circuit board 8, reducing the difficulty of placing the circuit board 8, and thus improving the overall bending efficiency.

[0039] A transparent baffle 6 is fixed between the tops of the side panels 3, and the transparent baffle 6 is located above the bidirectional cylinder 2 and the air pump 5. The transparent baffle 6, the side panels 3, the support plate 1 and the bottom plate 4 surround the bidirectional cylinder 2 and the air pump 5, further protecting the bidirectional cylinder 2 and the air pump 5, and ensuring that the bidirectional cylinder 2 and the air pump 5 have a stable working environment when working. In this embodiment, the two sides of the transparent baffle 6 are spaced between the two support plates 1, and the side of the transparent baffle 6 gives way to the pins 801 to prevent the pins 801 from interfering with the transparent baffle 6 during the movement, affecting the bending efficiency of the pins 801. The transparent baffle 6 is located below the circuit board 8, and plays a certain supporting role on the circuit board 8; at the same time, during use, the working status of the bidirectional cylinder 2 and the air pump 5 can be directly observed through the transparent baffle 6, and the working status problems of the bidirectional cylinder 2 and the air pump 5 can be quickly discovered, which is convenient for maintenance. In this embodiment, the height of the top surface of the transparent baffle 6 is the same as the height of the step portion 101. During the bending process, the transparent baffle 6 and the step portion 101 jointly support the circuit board 8, further ensuring the stability of the circuit board 8 during the bending process. Specifically, the step portion 101 includes a horizontal surface and vertical surfaces connected to both ends of the horizontal surface, and the horizontal surface supports the circuit board 8. In this embodiment, the top surface of the transparent baffle 6 and the top surface of the side panel 3 are both located on the same horizontal extension plane as the horizontal surface, that is, the above-mentioned heights are the same.

[0040] In this embodiment, a buffer pad 7 is fixed on the opposite side of the support plate 1, the end of the buffer pad 7 protrudes from the step portion 101, and the buffer pad 7 is located in the material discharge area 104. The buffer pad 7 buffers the circuit board 8 to prevent the circuit board 8 from colliding with the support plate 1 during the placement process, thereby affecting the position accuracy of the pins 801 of the components 802.

[0041] The ratio of the width of the bending block 201 to the width of the circuit board 8 is 1:1-3:2. In this embodiment, the ratio of the width of the bending block 201 to the width of the circuit board 8 is 3:2. A larger bending block 201 is provided. During the bending process of the pins 801, it is possible to quickly determine whether all the pins 801 have entered one side of the bending block 201, thereby ensuring that all the pins 801 on the circuit board 8 are bent, reducing the rework frequency and improving the bending efficiency. Similarly, the ratio of the width of the bending block 201 to the width of the circuit board 8 can also be 1:1, which satisfies the requirement of bending all the pins 801 on the circuit board 8 in one bending process, and has good bending efficiency.

[0042] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A circuit board pin bending mechanism, used for bending pins of components on a circuit board, wherein the components are located at both ends of the circuit board, and the pins extend downward through the circuit board, characterized in that: It comprises two supporting plates arranged opposite to each other, the tops of the opposite sides of the supporting plates are provided with step portions, and the two ends of the circuit board are placed on the step portions; A bidirectional cylinder is fixed between the support plates, and the driving ends on both sides of the bidirectional cylinder are respectively facing the two support plates and drivingly connected to the bending blocks, and the bidirectional cylinder drives the bending blocks on both sides toward or away from the support plates; The pins extend between the bending block and the supporting plate.

2. The circuit board pin bending mechanism according to claim 1, characterized in that: A mounting plate is fixed on the outer side of the support plate, the top of the mounting plate protrudes from the support plate, and a horizontally extending limiting plate is fixed thereto, the limiting plate extends above the bending block, and the end of the circuit board is located between the limiting plate and the bending block.

3. The circuit board pin bending mechanism according to claim 1, characterized in that: A side plate is fixed between the two ends of the support plate, and the height of the side plate is lower than or equal to the height of the step portion; A bottom plate is fixed to the bottom of the support plate and the side plate, and the bidirectional cylinder is fixed on the bottom plate.

4. The circuit board pin bending mechanism according to claim 3, characterized in that: A discharge area and a bending area are provided in the extension direction of the support plate, the two-way cylinder is located in the bending area, an air pump is fixed on the bottom plate, an air pipe is connected between the air pump and the two-way cylinder, the air pump is located in the discharge area, and the height of the air pump is lower than the height of the step portion.

5. The circuit board pin bending mechanism according to claim 4, characterized in that: A transparent baffle is fixed between the tops of the side plates, and the transparent baffle is located above the bidirectional cylinder and the air pump.

6. The circuit board pin bending mechanism according to claim 5, characterized in that: The two side surfaces of the transparent baffle are respectively arranged between the two support plates.

7. The circuit board pin bending mechanism according to claim 4, characterized in that: Buffer pads are fixed on the opposite sides of the support plate, the ends of the buffer pads protrude from the step portion, and the buffer pads are located in the material discharge area.

8. The circuit board pin bending mechanism according to claim 1, characterized in that: The ratio of the width of the bending block to the width of the circuit board is 1:1-3:2.

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