Lateral positioning mechanism

Abstract

The utility model provides a lateral positioning mechanism, and belongs to the technical field of semiconductor processing equipment. A positioning shaft; and the guide wheel is mounted at the end part of the positioning shaft, the guide wheel is provided with a working position and a non-working position which slide up and down along with the positioning shaft, and the guide wheel and the positioning wheel are matched to position the wafer bearing disc placed on the grinding disc at the working position. After the mechanical arm places the bearing disc with the wafer on the grinding disc, the grinding disc drives the bearing disc to rotate and move together in the rotating process, the bearing disc abuts against the guide wheel and the positioning wheel, the guide wheel and the positioning wheel can prevent the bearing disc from continuously rotating along with the grinding disc, and the bearing disc can be limited to the guide wheel and the positioning wheel. Therefore, positioning of the bearing disc is achieved, the grinding head can move to the position where the bearing disc is limited by the guide wheel and the positioning wheel every time, the grinding head is rapidly aligned with the bearing disc and grinds the wafer, the alignment time of the grinding head and the wafer is shortened, and the grinding efficiency of the wafer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a lateral positioning mechanism. Background Art

[0002] Grinding a wafer (silicon wafer, etc.) is one of the processes for manufacturing semiconductor devices, etc. In the related art, when grinding a wafer, the wafer is usually placed on a carrier plate (such as a ceramic plate), and then the carrier plate is placed on a grinding plate, and the wafer is ground and polished by a grinding head. However, when placing the carrier plate with the wafer on the grinding plate, the ceramic plate often fails to align with the grinding head, resulting in low grinding efficiency and poor grinding effect. Utility Model Content

[0003] The purpose of the present application is to provide a lateral positioning mechanism, which aims to solve the problem in the related art that when the ceramic disk with a wafer is placed on the grinding disk, the ceramic disk is not aligned with the grinding head, resulting in low grinding efficiency and poor grinding effect.

[0004] Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

[0005] According to a first aspect of the present application, a lateral positioning mechanism is provided, comprising:

[0006] Pedestal;

[0007] A positioning shaft is slidably mounted on the base;

[0008] A guide wheel is installed at the end of the positioning shaft away from the base. The guide wheel can slide downward with the positioning shaft to move to a working position on the grinding disk and slide upward with the positioning shaft to move upward away from a non-working position of the grinding disk. In the working position, the guide wheel cooperates with the positioning wheel arranged on the grinding disk to position the wafer carrier placed on the grinding disk.

[0009] In an exemplary embodiment of the present application, the positioning wheel is located at the center of the grinding disk, and the guide wheel is located at the circumferential edge of the grinding disk when in the working position. In the working position, the horizontal distance between the guide wheel and the positioning wheel is smaller than the outer diameter of the supporting disk.

[0010] In an exemplary embodiment of the present application, the installation position of the guide wheel at the end of the positioning shaft is arranged to be horizontally adjustable.

[0011] In an exemplary embodiment of the present application, the guide wheel is installed on the end of the positioning shaft through a sliding assembly, and the sliding assembly includes a first positioning support plate and a second positioning support plate, the first positioning support plate is fixedly installed on the end of the positioning shaft, the second positioning support plate can be horizontally slidably installed on the first positioning support plate, and the guide wheel is fixedly installed on the second positioning support plate.

[0012] In an exemplary embodiment of the present application, a locking structure is further included, which is arranged on the first positioning support plate and / or the second support plate, and the locking structure is configured to fix the relative position between the first positioning support plate and the second fixed support plate.

[0013] In an exemplary embodiment of the present application, a positioning shield is further included, and the positioning shield is arranged on the outside of the sliding assembly.

[0014] In an exemplary embodiment of the present application, the base includes a pedestal and a positioning shaft seat, the positioning shaft seat is installed on the pedestal, and the positioning shaft is installed in the positioning shaft seat so as to be slidable up and down.

[0015] In an exemplary embodiment of the present application, a driving device is further included, wherein a driving end of the driving device extends into the positioning shaft seat and is connected to the bottom end of the positioning shaft, and the driving device is configured to drive the positioning shaft to slide up and down in the positioning shaft seat;

[0016] A vertically extending guide groove is provided on the side of the positioning shaft seat;

[0017] A guide portion extends out from the side of the positioning shaft, and the guide portion is slidably arranged in the guide groove. The bottom end of the positioning shaft is connected to the driving end of the driving device.

[0018] In an exemplary embodiment of the present application, the guide groove includes a vertical section and an inclined section connected above the vertical section, and the inclined section is inclined in a direction away from the grinding disk; the bottom end of the positioning shaft is connected to the driving end of the driving device through a floating joint, so that when the guide portion cooperates with the inclined section, the positioning shaft and the guide wheel can swing relative to the driving end of the driving device in a direction close to or away from the grinding disk.

[0019] In an exemplary embodiment of the present application, the driving device is a cylinder; and / or the guide portion is a roller, and the roller is rollingly arranged in the guide groove.

[0020] The exemplary embodiments of the present application may have some or all of the following beneficial effects:

[0021] In the lateral positioning mechanism provided in the example implementation mode of the present application, the positioning shaft can be slidably installed on the base up and down, and a guide wheel is installed at the end of the positioning shaft. The guide wheel is located at the circumferential position of the grinding disk, and the guide wheel can cooperate with the positioning wheel at the center position of the grinding disk to position the wafer on the grinding disk. After the robot places the wafer carrier on the grinding disk, the grinding disk drives the carrier to rotate and move together during the rotation of the grinding disk. The carrier is respectively abutted against the guide wheel and the positioning wheel. The guide wheel and the positioning wheel will prevent the carrier from continuing to rotate with the grinding disk, and the carrier will be restricted at the guide wheel and the positioning wheel, thereby realizing the positioning of the wafer, so that the grinding head can move to the position where the guide wheel and the positioning wheel restrict the carrier each time, quickly align with the wafer, and grind the wafer, thereby shortening the alignment time between the grinding head and the wafer, improving the grinding efficiency of the wafer, and because the grinding head and the wafer are accurately aligned, the grinding effect can also be improved.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic structural diagram of a lateral positioning mechanism in an embodiment of the present application is shown;

[0025] Figure 2 A cross-sectional view of a lateral positioning mechanism in an embodiment of the present application is shown;

[0026] Figure 3 A schematic diagram of the structure of the sliding assembly in an embodiment of the present application is shown;

[0027] Figure 4 A schematic diagram of the coordination between the guide wheel and the positioning wheel in an embodiment of the present application is shown.

[0028] Description of reference numerals:

[0029] 1. Base; 2. Driving device; 3. Positioning shaft seat; 4. Guide groove; 5. Positioning shaft; 6. Sliding assembly; 7. Guide wheel; 8. First positioning support plate; 9. Second positioning support plate; 10. Positioning shield; 11. Floating joint; 12. Guide part; 13. Positioning wheel; 14. Grinding disc; 15. Carrying disc. DETAILED DESCRIPTION

[0030] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present application will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic illustrations of the present application and are not necessarily drawn to scale.

[0031] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the diagram to another component, these terms are used in this specification only for convenience, such as according to the direction of the examples in the drawings. It is understood that if the device of the diagram is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0032] The terms "a", "an", "the" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first" and "second" are used merely as labels and are not intended to limit the quantity of their objects.

[0033] Example

[0034] This embodiment provides a specific implementation of the lateral positioning mechanism, such as Figure 1 and Figure 4As shown, it includes a base, a positioning shaft 5 and a guide wheel 7, wherein the base is arranged on one side of the grinding disc 14 device, the positioning shaft seat 3 is installed on the base, the positioning shaft 5 is installed on the positioning shaft seat 3 so as to slide up and down, and the guide wheel 7 is installed at the end of the positioning shaft 5 away from the base. When the guide wheel 7 slides up and down on the positioning shaft seat 3, it has a working position and a non-working position. When the guide wheel 7 slides to the working position, the guide wheel 7 is attached to the surface of the grinding disc 14, and the guide wheel 7 can cooperate with the positioning wheel 13 at the center position of the grinding disc 14 to limit the bearing disc 15. Specifically, the guide wheel 7 Arranged side by side with the positioning wheel 13, the carrier plate 15 abuts against the guide wheel 7 and the positioning wheel 13 respectively during the process of following the rotation of the grinding disc 14. Under the obstruction of the guide wheel 7 and the positioning wheel 13, the carrier plate 15 no longer moves following the rotation of the grinding disc 14. At this time, the position of the carrier plate 15 is fixed, and the wafer on the carrier plate 15 can be quickly identified by the grinding head, which shortens the time for the grinding head to align with the wafer and improves the grinding efficiency. When the guide wheel 7 slides to the non-working position, the guide wheel 7 is away from the grinding disc 14, so that the carrier plate 15 can pass through, and at the same time, it is also convenient to replace the polishing pad. Figure 4 As shown, the dotted circle is the initial position of the carrier plate 15. When the carrier plate 15 moves following the grinding disc 14, it is stuck in the position where the guide wheel 7 and the positioning wheel 13 cooperate, and the carrier plate 15 is limited at this position, thereby limiting the carrier plate 15. When the guide wheel 7 is away from the grinding disc 14, the carrier plate 15 can pass by, and the polishing pad on the grinding disc 14 can also be easily replaced.

[0035] As a specific embodiment of the lateral positioning mechanism of the present application, the base in this embodiment includes a base 1 and a positioning shaft seat 3 fixedly installed on the base 1, and the positioning shaft seat 3 is provided with an installation cavity for the positioning shaft to slide up and down, but the present application is not limited to this. In other embodiments, the base can also be an integrated structure.

[0036] Furthermore, the positioning wheel 13 is located at the center of the grinding disk 14, and the guide wheel 7 is located at the circumferential edge of the grinding disk 14 when it is in the working position. When the supporting disk 15 is limited, the guide wheel 7 slides to the working position, and the horizontal distance between the guide wheel 7 and the positioning wheel 13 is smaller than the outer diameter of the supporting disk 15, so that the supporting disk 15 can abut against the guide wheel 7 and the positioning wheel 13 respectively.

[0037] In this embodiment, the installation position of the guide wheel 7 at the end of the positioning shaft 5 can be adjusted horizontally. By adjusting the position of the guide wheel 7, the distance between the guide wheel 7 and the positioning wheel 13 can be adjusted, so that the cooperation between the guide wheel 7 and the positioning wheel 13 can adapt to the supporting plates 15 of different specifications and sizes, which is convenient for limiting different supporting plates 15.

[0038] Furthermore, if Figure 2 and Figure 3As shown, the guide wheel 7 can be horizontally slidably installed on the end of the positioning shaft 5 through the sliding component 6, the sliding component 6 includes a first positioning support plate 8 and a second positioning support plate 9, the first positioning support plate 8 is fixedly installed on the end of the positioning shaft 5, the second positioning support plate 9 can be horizontally slidably installed on the first positioning support plate 8, the guide wheel 7 is fixedly installed on the second positioning support plate 9, when the position of the guide wheel 7 needs to be adjusted, the second positioning support plate 9 is controlled to slide on the first positioning support plate 8, the installation direction of the first positioning support plate 8 is perpendicular to the axial direction of the positioning shaft 5, the extension direction of the first positioning support plate 8 and the second positioning support plate 9 is the radial direction of the positioning shaft 5, by setting the sliding component 6, not only the distance between the base 1 and the grinding disc 14 device can be adjusted, but also the spacing between the guide wheel 7 and the positioning wheel 13 can be adjusted.

[0039] In some other embodiments, the sliding assembly 6 may not be provided, and the guide wheel 7 may be directly installed at the end of the positioning shaft 5. The diameter of the guide wheel 7 may be set to be larger so that the guide wheel 7 can cooperate with the positioning wheel 13 to limit the carrying plate 15; the guide wheel 7 may also be eccentrically installed on the positioning shaft 5 so that the guide wheel 7 can cooperate with the positioning wheel 13 to limit the carrying plate 15; or some side-by-side mounting holes may be provided at the end of the positioning shaft 5, and the guide wheel 7 can be installed in different mounting holes to adjust the horizontal position.

[0040] In this embodiment, a locking structure is provided between the first positioning support plate 8 and the second positioning support plate 9 for fixing the relative position of the second positioning support plate 9 and the first positioning support plate 8. When adjusting the position of the guide wheel 7, it is necessary to control the second positioning support plate 9 to slide on the first positioning support plate 8. After the adjustment is completed, the position of the second positioning support plate 9 is fixed by the locking structure to prevent the second positioning support plate 9 from sliding on the first positioning support plate 8 with the guide wheel 7 during the process of limiting the carrying plate 15, thereby affecting the limiting of the carrying plate 15.

[0041] Furthermore, the locking structure is a locking screw, which is passed through the second positioning support plate 9 and is located at the overlapping position of the second positioning support plate 9 and the first positioning support plate 8. The locking screw is connected to the second positioning support plate 9 by a thread. When the locking screw moves axially by rotation, the end of the locking screw can abut against the first positioning support plate 8. When the end of the locking screw is tightened to the first positioning support plate 8, the second positioning support plate 9 and the first positioning support plate 8 can be relatively fixed. At this time, the second positioning support plate 9 cannot slide on the first positioning support plate 8.

[0042] In some other embodiments, the locking screw may also be set on the first positioning support plate 8 through threads.

[0043] In some other embodiments, the locking structure can also be a structure such as a latch, a screw slider combination, etc. When the locking structure is a latch, slots for the latch to pass through are opened on the first positioning support plate 8 and the second positioning support plate 9, and multiple slots can be arranged side by side. When the second positioning support plate 9 is adjusted to slide to different positions on the first positioning support plate 8, the latch is inserted into the corresponding hole groove to achieve relative fixation of the second positioning support plate 9 and the first positioning support plate 8; when the locking structure is a screw slider assembly, the screw can be installed on the first positioning support plate 8, and the slider is sleeved on the screw. The slider is fixedly connected to the second positioning support plate 9. When the screw is driven to rotate, the slider drives the second positioning support plate 9 to slide on the first positioning support plate 8. After the second support plate moves to the specified position, the slider and the screw form a self-locking structure.

[0044] In this embodiment, a positioning shield 10 is provided on the outer side cover of the sliding component 6 , and the positioning shield 10 can prevent dust and the like from falling into the sliding component 6 and affecting the sliding effect of the sliding component 6 .

[0045] In this embodiment, a driving device 2 is also included. The driving end of the driving device 2 extends into the positioning shaft seat 3 and is connected to the bottom end of the positioning shaft 5. The driving device 2 can drive the positioning shaft 5 to slide up and down in the positioning shaft seat 3. Specifically, the driving device 2 is a cylinder, and the bottom end of the positioning shaft 5 is connected to the piston of the cylinder. A vertically extending guide groove 4 is provided on the side of the positioning shaft seat 3. A guide portion 12 extends from the side of the positioning shaft 5. The guide portion 12 is installed in cooperation with the guide groove 4. The guide portion 12 is slidably arranged in the guide groove 4. When the positioning shaft 5 slides up and down in the positioning shaft seat 3, the guide portion 12 slides in the guide groove 4. The guide groove 4 restricts the guide portion 12 so that it slides up and down along the guide groove 4, thereby ensuring the direction and sliding stability of the positioning shaft 5 during the up and down sliding process.

[0046] In some other embodiments, the driving device 2 may also be an electric cylinder, a telescopic rod or other components, as long as it can drive the positioning shaft 5 to slide up and down.

[0047] In some other embodiments, the driving device 2 may not be provided, and the positioning shaft 5 may be slid up and down by manual operation of an operator.

[0048] In this embodiment, the guide groove 4 includes a vertical section extending vertically and an inclined section inclined upward at an angle to the vertical section. The inclined section is located above the vertical section, and the inclined direction of the inclined section is away from the grinding disk 14. The top end of the positioning shaft 5 is connected to the driving end of the driving device 2 through a floating joint 11, so that when the guide part 12 cooperates with the inclined section and the driving device 2 drives the positioning shaft 5 to slide up and down, the guide part 12 slides along the guide groove 4. When the guide part 12 slides in the vertical section, the positioning shaft 5 slides in the vertical direction. When the guide part 12 slides to the inclined section, the positioning shaft 5 will move left and right while sliding up and down to further away from the grinding disk 14, so that the positioning wheel 13 moves to the outside of the circumference of the grinding disk 14 to facilitate the replacement of the polishing pad. Furthermore, the bottom end of the positioning shaft 5 is hinged to the driving end of the driving device 2 through a floating joint 11, so that when the guide portion 12 slides from the vertical section to the inclined section, a certain misalignment is generated between the bottom end of the positioning shaft 5 and the driving end of the driving device 2 through the floating device, so that the positioning shaft 5 can slide obliquely upward under the guidance of the guide portion 12 and the guide groove 4.

[0049] Furthermore, when the positioning shaft 5 slides up and down along the guide groove 4 with the guide wheel 7 on the positioning shaft seat 3, there are two non-working positions, namely the first non-working position and the second non-working position, wherein the first non-working position is that the guide part 12 slides in the vertical section, and the second non-working position is that the guide part 12 slides in the inclined section. In the first non-working position, the positioning shaft 5 slides up and down only in the vertical direction with the guide wheel 7, and the carrying plate 15 on the grinding disk 14 can be allowed to pass through at this time. When the guide wheel 7 enters the second non-working position, the positioning shaft 5 not only slides up and down with the guide wheel 7 in the vertical direction, but also swings in the horizontal direction, so that the guide wheel 7 is away from the base. At this time, the guide wheel 7 can avoid the grinding disk 14, making it easy to replace the polishing pad.

[0050] In this embodiment, the guide portion 12 is specifically configured as a roller, which is rotatably installed on the side of the positioning shaft 5, and the roller is rollingly installed in the guide groove 4, so that the guide portion 12 and the guide groove 4 form rolling friction. When moving, the friction force is smaller than the sliding friction force, which facilitates the cooperation between the guide portion 12 and the guide groove 4.

[0051] In some other embodiments, the guide portion 12 can also be a slider extending from the side of the positioning shaft 5, and the slider is slidably set in the guide groove 4. The slider slides in the guide groove 4 to achieve the guiding function of the guide portion 12 and the guide groove 4.

[0052] Those skilled in the art will easily think of other embodiments of the present application after considering the specification and practicing the embodiments of the present application. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that the present application does not apply for. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the appended claims.

Claims

1. A lateral positioning mechanism, characterized in that: include: Pedestal; A positioning shaft is slidably mounted on the base; A guide wheel is installed at the end of the positioning shaft away from the base. The guide wheel can slide downward with the positioning shaft to move to a working position on the grinding disk and slide upward with the positioning shaft to move upward away from a non-working position of the grinding disk. In the working position, the guide wheel cooperates with the positioning wheel arranged on the grinding disk to position the wafer carrier placed on the grinding disk.

2. The lateral positioning mechanism according to claim 1, characterized in that: The positioning wheel is located at the center of the grinding disc, and the guide wheel is located at the circumferential edge of the grinding disc when in the working position. In the working position, the horizontal distance between the guide wheel and the positioning wheel is smaller than the outer diameter of the supporting disc.

3. The lateral positioning mechanism according to claim 1, characterized in that: The installation position of the guide wheel at the end of the positioning shaft is arranged to be horizontally adjustable.

4. The lateral positioning mechanism according to claim 3, characterized in that: The guide wheel is installed on the end of the positioning shaft through a sliding assembly, and the sliding assembly includes a first positioning support plate and a second positioning support plate. The first positioning support plate is fixedly installed on the end of the positioning shaft, and the second positioning support plate can be horizontally slidably installed on the first positioning support plate. The guide wheel is fixedly installed on the second positioning support plate.

5. The lateral positioning mechanism according to claim 4, characterized in that: A locking structure is also included, which is arranged on the first positioning support plate and / or the second support plate, and the locking structure is configured to fix the relative position between the first positioning support plate and the second fixed support plate.

6. The lateral positioning mechanism according to any one of claims 4 to 5, characterized in that: It also includes a positioning shield, which is arranged on the outside of the sliding component.

7. The lateral positioning mechanism according to claim 1, characterized in that: The base comprises a pedestal and a positioning shaft seat, wherein the positioning shaft seat is mounted on the pedestal, and the positioning shaft is mounted in the positioning shaft seat so as to be slidable up and down.

8. The lateral positioning mechanism according to claim 7, characterized in that: It also includes a driving device, the driving end of which extends into the positioning shaft seat and is connected to the bottom end of the positioning shaft, and the driving device is configured to drive the positioning shaft to slide up and down in the positioning shaft seat; A vertically extending guide groove is provided on the side of the positioning shaft seat; A guide portion extends out from the side of the positioning shaft, and the guide portion is slidably arranged in the guide groove. The bottom end of the positioning shaft is connected to the driving end of the driving device.

9. The lateral positioning mechanism according to claim 8, characterized in that: The guide groove includes a vertical section and an inclined section connected above the vertical section, and the inclined section is inclined in a direction away from the grinding disk; the bottom end of the positioning shaft is connected to the driving end of the driving device through a floating joint, so that when the guide portion cooperates with the inclined section, the positioning shaft and the guide wheel can swing relative to the driving end of the driving device in a direction close to or away from the grinding disk.

10. The lateral positioning mechanism according to claim 8, characterized in that: The driving device is a cylinder; and / or the guiding part is a roller, and the roller is rollingly arranged in the guiding groove.

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