Recyclable workpiece bonding base plate for semiconductor wire cutting
By designing ABS plastic pads with curved grooves and pits, the problem of scrapping and insufficient bonding strength in semiconductor wire cutting is solved, and the efficiency of bonding and environmental protection performance is improved, and the pads are recyclable. Utilization reduces environmental pollution.
Patent Information
- Application Number
- CN202421198300.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-05-28
AI Technical Summary
During the semiconductor wire cutting process, the pads between the workpiece and the workpiece plate are scrapped due to over-cutting of the wire bow problem, resulting in high cost and unrecyclable, and the bonding strength of the adhesive is not stable enough, affecting production efficiency and environmental performance.
A recyclable workpiece bonding pad for semiconductor wire cutting is designed, made of ABS plastic material. The main surface of the pad is equipped with arcuate grooves and multiple pits. The pits are distributed in an array to increase the bonding area; the bottom surface is Linear pits are provided to increase contact friction; weight reduction holes and nameplates are provided on the side walls to reduce self-weight and production costs, and facilitate marking.
The workpiece bonding strength and production yield are improved, the secondary recycling of the pad is realized, environmental pollution is reduced, and environmental protection performance and cutting efficiency are improved.
Smart Images
Figure CN222345980U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of workpiece bonding plastic pads for wire cutting, in particular to a recyclable workpiece bonding pad for semiconductor wire cutting. Background Art
[0002] The pad between the workpiece and the workpiece plate in the cutting process of the semiconductor multi-wire machine is a production consumable. After each cutting is completed, the pad is scrapped after cutting due to overcutting due to the wire bow problem. Initially, the semiconductor pad materials were cast iron, glass, ceramic, carbon, etc. These materials were either costly, non-recyclable, or had high recycling costs. Later, with the development of wire cutting technology, the cost issue became a bottleneck in the development of semiconductor wire cutting technology.
[0003] To solve this problem, through research and development, trials, and drawing on materials from architectural decoration and building materials, we launched an artificial marble pad, which has been widely promoted and used, effectively reducing the cost of multi-wire cutting. With the strengthening of national environmental protection control, in order to increase the environmental performance of semiconductor pad materials, we have developed a workpiece bonding plastic pad for semiconductor wire cutting. In addition, all pads have insufficient and unstable bonding strength with the adhesive during use. This is mainly because the roughness of the working surface of the pad is uneven and constant. Therefore, we proposed a recyclable workpiece bonding pad for semiconductor wire cutting to solve the above-mentioned problems. Utility Model Content
[0004] In view of the deficiencies of the prior art, the utility model provides a recyclable workpiece bonding pad for semiconductor wire cutting, which solves the problems of cost and unstable bonding strength of multi-wire cutting.
[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a recyclable workpiece bonding pad for semiconductor wire cutting, including a pad body, an arc-shaped groove is opened in the middle of the upper surface of the pad body, and a plurality of first pits are opened on the upper surface of the pad body and located at the arc-shaped groove, and the plurality of first pits are distributed in an array along the arc-shaped groove.
[0006] Preferably, the main material of the pad body is ABS plastic.
[0007] Preferably, a plurality of second pits are formed on the bottom surface of the pad body, and the plurality of second pits are distributed in a linear array.
[0008] Preferably, the roughness of the top and bottom surfaces of the pad body is 100-150 um, the flatness of the bottom surface of the pad body is less than 0.5 mm, and the straightness of the top surface of the pad body is less than 0.5 mm.
[0009] Preferably, the first pit and the second pit are both 10-20uin deep.
[0010] Preferably, the first pit and the second pit are both 15uin deep, and the curvatures of the first pit and the second pit are both 70° to 180°.
[0011] Preferably, a plurality of weight-reducing holes are provided on the side wall surface of the pad body, and the plurality of weight-reducing holes are distributed in a rectangular array.
[0012] Preferably, a nameplate is provided on the side wall surface of the pad body.
[0013] Beneficial Effects
[0014] The utility model provides a recyclable workpiece bonding pad for semiconductor wire cutting. Compared with the prior art, it has the following beneficial effects:
[0015] The recyclable workpiece bonding pad for semiconductor wire cutting, when the workpiece needs to be installed on the pad body made of ABS plastic as the main material, firstly glue is applied on the arc groove, because the arc groove is provided with a plurality of first pits distributed in an array, and a large number of the first pits are 15uin deep, and the curvature of the first pits is 70° to 180°, so this structure can accumulate glue during bonding, greatly increasing the actual bonding area, stably improving the bonding strength of the workpiece, and improving the yield rate in production, because the roughness of the top and bottom surfaces of the pad body are both 100 to 150um, and the flatness of the bottom surface of the pad body is less than 0.5mm, and the straightness of the top surface of the pad body is less than 0.5mm, so that the friction between the pad body and the workpiece can be improved;
[0016] Since a plurality of second pits distributed in a linear array are provided on the bottom surface of the pad body, and the second pits are all 15uin deep and have an arc of 70° to 180°, the bottom surface of the pad body can be used as the contact surface with the workpiece, thereby ensuring the stability of the connection between the bottom surface and the workpiece. Since the main material of the pad body is ABS plastic, this material can not only make the pad body easy to process and shape, but also can be recycled for secondary use after use. After simple treatment, it can be crushed and used as raw material particles to continue to be put into the processing of the pad body, or sold to other industries to be made into construction and decorative panels, etc., effectively improving the environmental performance of this product and minimizing the harmful pollution of this product to the environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 This is a schematic diagram of the bottom structure of the utility model;
[0019] Figure 3 It is a schematic diagram of the main structure of the utility model.
[0020] In the figure: 1. pad body; 2. arc groove; 3. first pit; 4. second pit; 5. weight reduction hole; 6. nameplate. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] See also Figure 1-3 The utility model provides a technical solution: a recyclable workpiece bonding pad for semiconductor wire cutting, comprising a pad body 1, an arc groove 2 is opened in the middle of the upper surface of the pad body 1, a plurality of first pits 3 are opened on the upper surface of the pad body 1 and located at the arc groove 2, and the plurality of first pits 3 are distributed in an array along the arc groove 2, the main material of the pad body 1 is ABS plastic, a plurality of second pits 4 are opened on the bottom surface of the pad body 1, and the plurality of second pits 4 are distributed in a linear array, the top surface and bottom surface roughness of the pad body 1 are both 100-150um, the flatness of the bottom surface of the pad body 1 is less than 0.5mm, the straightness of the top surface of the pad body 1 is less than 0.5mm, the first pit 3 and the second pit 4 are both 10-20uin deep, the first pit 3 and the second pit 4 are both 15uin deep, and the curvature of the first pit 3 and the second pit 4 are both 70°~180°;
[0023] When the workpiece needs to be installed on the pad body 1 made of ABS plastic as the main material, glue is first applied to the arc groove 2. Since the arc groove 2 is provided with a plurality of first pits 3 distributed in an array, and a large number of the first pits 3 are 15uin deep, and the curvature of the first pits 3 is 70° to 180°, this structure can accumulate glue during bonding, greatly increasing the actual bonding area, stably improving the bonding strength of the workpiece, and improving the yield rate in production. Since the roughness of the top and bottom surfaces of the pad body 1 are both 100 to 150um, and the flatness of the bottom surface of the pad body 1 is less than 0.5mm, and the straightness of the top surface of the pad body 1 is less than 0.5mm, the contact between the pad body 1 and the workpiece can be improved. Friction force, since the bottom surface of the pad body 1 is provided with a plurality of second pits 4 distributed in a linear array, and the second pits 4 are all 15uin deep, and the arc of the second pits 4 are all 70°~180°, the bottom surface of the pad body 1 can also be used as the contact surface with the workpiece, thereby ensuring the stability of the connection between the bottom surface and the workpiece. Since the main material of the pad body 1 is ABS plastic, this material can not only make the pad body 1 easy to process and shape, but also can be recycled for the second time after the use of the discarded pad body 1. After simple treatment, it can be crushed and continued to be put into the processing of the pad body 1 as raw material particles, or sold to other industries to be made into construction, decorative panels, etc., effectively improving the environmental performance of this product and minimizing the harmful pollution of this product to the environment.
[0024] See also Figure 1 , Figure 3 , a plurality of weight-reducing holes 5 are provided on the side wall surface of the pad body 1, and the plurality of weight-reducing holes 5 are distributed in a rectangular array;
[0025] The plurality of weight-reducing holes 5 distributed in a rectangular array can effectively reduce the deadweight of the pad body 1, and can also save production materials and costs of the pad body 1. At the same time, since liquid can flow in, degumming time can be reduced and edge collapse can be reduced.
[0026] See also Figure 1 , Figure 3 A nameplate 6 is provided on the side wall surface of the pad body 1, which can facilitate the staff to mark the specifications and facilitate later use.
[0027] During operation, when the workpiece needs to be installed on the pad body 1 made of ABS plastic as the main material, glue is first applied to the arc groove 2. Since the arc groove 2 is provided with a plurality of first pits 3 distributed in an array, and a large number of the first pits 3 are 15uin deep, and the curvature of the first pits 3 is 70° to 180°, this structure can accumulate glue during bonding, greatly increasing the actual bonding area, stably improving the bonding strength of the workpiece, and improving the yield rate in production. Since the roughness of the top and bottom surfaces of the pad body 1 are both 100 to 150um, and the flatness of the bottom surface of the pad body 1 is less than 0.5mm, and the straightness of the top surface of the pad body 1 is less than 0.5mm, the pad body 1 can improve the connection between the pad body 1 and the workpiece. The friction of contact is reduced because a plurality of second pits 4 distributed in a linear array are provided on the bottom surface of the pad body 1, and the second pits 4 are all 15uin deep, and the arc of the second pits 4 are all 70°~180°, which can also make the bottom surface of the pad body 1 serve as the contact surface with the workpiece, thereby ensuring the stability of the connection between the bottom surface and the workpiece. Since the main material of the pad body 1 is ABS plastic, this material can not only make the pad body 1 easy to process and shape, but also can be recycled for the second time after the use of the discarded pad body 1. After simple treatment, it can be crushed and used as raw material particles to continue to be put into the processing of the pad body 1, or sold to other industries to be made into construction and decorative panels, etc., which effectively improves the environmental performance of this product and minimizes the harmful pollution of this product to the environment.
[0028] The plurality of weight-reducing holes 5 distributed in a rectangular array can effectively reduce the deadweight of the pad body 1 itself, and can also save production materials and costs of the pad body 1. At the same time, since liquid can flow in, degumming time and edge collapse can be reduced. Since a nameplate 6 is provided on the side wall surface of the pad body 1, it is convenient for staff to mark the specifications thereof, which can facilitate later use.
[0029] In summary, the device can not only effectively improve its performance, but also improve the product quality and overall cutting efficiency at the end of the cutting process, and at the same time, the residues after its use can be recycled and reused.
[0030] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.
Claims
1. A recyclable workpiece bonding pad for semiconductor wire cutting, characterized in that: The invention comprises a pad body (1), wherein an arc-shaped groove (2) is provided in the middle of the upper surface of the pad body (1), and a plurality of first pits (3) are provided on the upper surface of the pad body (1) and located at the arc-shaped groove (2), and the plurality of first pits (3) are distributed in an array along the arc-shaped groove (2).
2. The recyclable workpiece bonding pad for semiconductor wire cutting according to claim 1, characterized in that: The main material of the pad body (1) is ABS plastic.
3. The recyclable workpiece bonding pad for semiconductor wire sawing according to claim 1, characterized in that: A plurality of second recesses (4) are provided on the bottom surface of the pad body (1), and the plurality of second recesses (4) are distributed in a linear array.
4. The recyclable workpiece bonding pad for semiconductor wire sawing according to claim 1, characterized in that: The roughness of the top and bottom surfaces of the pad body (1) are both between 100 and 150 um, the flatness of the bottom surface of the pad body (1) is less than 0.5 mm, and the straightness of the top surface of the pad body (1) is less than 0.5 mm.
5. The recyclable workpiece bonding pad for semiconductor wire sawing according to claim 3, characterized in that: The first pit (3) and the second pit (4) are both 10-20uin deep.
6. The recyclable workpiece bonding pad for semiconductor wire cutting according to claim 3, characterized in that: The first pit (3) and the second pit (4) are both 15uin deep, and the arcs of the first pit (3) and the second pit (4) are both 70° to 180°.
7. The recyclable workpiece bonding pad for semiconductor wire cutting according to claim 1, characterized in that: A plurality of weight-reducing holes (5) are provided on the side wall surface of the pad body (1), and the plurality of weight-reducing holes (5) are distributed in a rectangular array.
8. The recyclable workpiece bonding pad for semiconductor wire sawing according to claim 1, characterized in that: A nameplate (6) is provided on the side wall surface of the pad body (1).