Feeding cavity with capacitance coupling discharge cleaning function

Abstract

The utility model discloses a feeding cavity with a capacitive coupling discharge cleaning function. The feeding cavity comprises a feeding cavity body, a supporting transmission assembly and a capacitive coupling discharge assembly, the feeding cavity body is connected with the vacuum assembly and the air inlet assembly, and the supporting and conveying assembly is arranged in the feeding cavity body and used for assisting a substrate carrying frame loaded with substrates to automatically enter and exit from the interior of the feeding cavity body. The capacitive coupling discharge assembly comprises a discharge polar plate, an extraction electrode and a radio frequency power supply, the discharge polar plate and the radio frequency power supply are located inside and outside the feeding cavity body respectively, and the two ends of the extraction electrode are connected with the discharge polar plate and the radio frequency power supply respectively; when the substrate needs to be cleaned, the interior of the feeding cavity body is vacuumized, cleaning gas is input, the radio frequency power supply is turned on, and the discharging polar plate discharges, so that ionization luminance build-up of the cleaning gas is achieved, and automatic cleaning of the surface of the substrate is completed. The cleaning device has the advantages of being compact in structure, high in automation degree, good in cleaning effect, beneficial to improving the coating effect and the like.

Description

Technical Field

[0001] The utility model belongs to the technical field of substrate coating equipment, and in particular relates to a feeding chamber with a capacitive coupled discharge cleaning function. Background Art

[0002] In existing continuous vacuum evaporation, magnetron sputtering and other coating equipment, the feed chamber does not have a plasma cleaning function. If the substrate is contaminated during placement, it can only be taken out of the process vacuum chamber and cleaned with an ultrasonic cleaner, or with chemical reagents such as alcohol and acetone. This operation is troublesome and easily causes secondary contamination of the substrate. The existing cleaning method is also difficult to achieve the expected cleaning effect, and it will also affect the coating effect. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the shortcomings of the prior art such as complex substrate cleaning operation, low cleaning quality and easy secondary pollution, and to provide a feed chamber with capacitive coupled discharge cleaning function which has a compact structure, simple operation, high degree of automation, good cleaning effect and is beneficial to improving the coating effect.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] A feed chamber with a capacitively coupled discharge cleaning function comprises a feed chamber body, a support transmission component and a capacitively coupled discharge component; the feed chamber body is respectively connected to a vacuum component and an air intake component, the support transmission component is arranged inside the feed chamber body, the support transmission component is used to assist a wafer carrier to automatically enter and exit the feed chamber body, the wafer carrier is used to carry a substrate; the capacitively coupled discharge component comprises a discharge electrode plate, an extraction electrode and a radio frequency power supply, the discharge electrode plate is located inside the feed chamber body, the radio frequency power supply is located outside the feed chamber body, one end of the extraction electrode is connected to the discharge electrode plate, and the other end of the extraction electrode is connected to the radio frequency power supply; when the substrate in the feed chamber needs to be cleaned, the vacuum component evacuates the inside of the feed chamber body, and after the air intake component transports the cleaning gas to the inside of the feed chamber body, the radio frequency power supply is turned on, and the discharge electrode plate discharges, so as to realize ionization and ignition of the cleaning gas in the feed chamber, thereby completing automatic cleaning of the substrate surface.

[0006] As a further improvement of the present invention, the capacitively coupled discharge assembly also includes a protective cover and an insulating flange; the insulating flange seal passes through the bottom of the feed chamber body, the protective cover is located inside the feed chamber body and is fixedly connected to the insulating flange, the discharge electrode plate is connected to the protective cover, and the lead-out electrode passes through the protective cover and the insulating flange to realize the connection between the discharge electrode plate and the radio frequency power supply.

[0007] As a further improvement of the utility model, the protective cover is wrapped around the bottom and surrounding of the discharge electrode plate to prevent the discharge electrode plate from sparking and discharging.

[0008] As a further improvement of the present invention, the vacuum assembly includes a vacuum pipe and a vacuum pump, one end of the vacuum pipe is connected to the feed chamber body, and the other end of the vacuum pipe is connected to the vacuum pump.

[0009] As a further improvement of the utility model, the air intake assembly includes an air intake pipe and an air source cabinet, one end of the air intake pipe is connected to the feed chamber body, and the other end of the air intake pipe is connected to the air source cabinet.

[0010] Compared with the prior art, the advantages of the utility model are:

[0011] The feed chamber with capacitive coupled discharge cleaning function of the utility model realizes the plasma cleaning function of the feed chamber by adding a capacitive coupled discharge component in the feed chamber of continuous vacuum evaporation, magnetron sputtering and other coating equipment, that is, the substrate is pre-cleaned in the feed chamber, which can not only avoid the secondary contamination caused by the separate cleaning of the substrate sample, but also improve the cleaning effect, which is beneficial to improve the substrate coating effect. At the same time, the feed chamber is isolated from the process vacuum chamber, and the process vacuum chamber will not be polluted during cleaning, nor will it affect the normal coating work of the substrate. Furthermore, the power of the RF power supply is smaller during cleaning, and the temperature of the substrate is lower, which extends the service life of the RF power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structural principle of the feed chamber with capacitive coupled discharge cleaning function in a specific embodiment of the utility model.

[0013] Legend: 101, feed chamber body; 102, substrate; 103, wafer carrier; 104, support and transmission assembly; 105, discharge electrode plate; 106, protective cover; 107, insulating flange; 108, lead-out electrode; 109, RF power supply; 110, vacuum pipe; 111, vacuum pump; 112, air intake pipe; 113, air source cabinet. DETAILED DESCRIPTION

[0014] The present invention is further described below in conjunction with the accompanying drawings and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0015] Example

[0016] like Figure 1As shown, the feed chamber with capacitive coupled discharge cleaning function of the utility model includes a feed chamber body 101, a support transmission component 104 and a capacitive coupled discharge component. The feed chamber body 101 is connected to the vacuum component and the air intake component respectively. By adopting an air intake system in which the front end of the cavity is air-intaken and the rear end of the cavity is exhausted in the feed chamber, the cleaning gas is distributed from left to right in the feed chamber body 101, thereby achieving a uniform distribution of the cleaning gas in the chamber, thereby achieving a uniform distribution of high-energy plasma in the chamber, which is beneficial to improving the cleaning efficiency and cleaning quality of the substrate 102. The support transmission component 104 is arranged inside the feed chamber body 101, and the support transmission component 104 is used to assist the wafer carrier 103 to automatically enter and exit the feed chamber body 101, and the wafer carrier 103 is used to carry the substrate 102, that is, the support transmission component 104 plays a supporting and transmission role for the wafer carrier 103. The capacitive coupling discharge assembly includes a discharge electrode plate 105, an extraction electrode 108 and a radio frequency power supply 109. The discharge electrode plate 105 is located inside the feed chamber body 101, and the radio frequency power supply 109 is located outside the feed chamber body 101. One end of the extraction electrode 108 is connected to the discharge electrode plate 105, and the other end of the extraction electrode 108 is connected to the radio frequency power supply 109. When the substrate 102 in the feed chamber needs to be cleaned, the vacuum assembly evacuates the inside of the feed chamber body 101, and after the gas intake assembly delivers the cleaning gas to the inside of the feed chamber body 101, the radio frequency power supply 109 is turned on, and the discharge electrode plate 105 discharges to realize the ionization and ignition of the cleaning gas in the feed chamber, and complete the automatic cleaning of the substrate surface. Specifically, the discharge electrode plate 105 is set at the bottom of the support transmission assembly 104, and the power frequency used by the radio frequency power supply 109 is ≤500w. The power of the radio frequency power supply is small during cleaning, and the temperature of the substrate is low, which increases the service life of the radio frequency power supply. The supporting transmission component 104 is a conventional configuration in the art, and its structural composition will not be described in detail here.

[0017] like Figure 1 As shown, in this embodiment, the capacitive coupling discharge assembly also includes a protective cover 106 and an insulating flange 107. The insulating flange 107 seals and penetrates the bottom of the feed chamber body 101. The protective cover 106 is located inside the feed chamber body 101 and is connected and fixed to the insulating flange 107. The discharge electrode plate 105 is connected to the protective cover 106. The lead-out electrode 108 penetrates the protective cover 106 and the insulating flange 107 to achieve the connection between the discharge electrode plate 105 and the radio frequency power supply 109. The functions of the insulating flange 107 mainly include: achieving insulation between the lead-out electrode 108 and the feed chamber body 101, and achieving vacuum sealing of the lead-out electrode 108. In this embodiment, the lead-out electrode 108 and the radio frequency power supply 109 are connected by a copper sheet.

[0018] Furthermore, the protective cover 106 is wrapped around the bottom and surrounding of the discharge electrode plate 105 to prevent the discharge electrode plate 105 from igniting and discharging, so as to improve the safety of the equipment operation.

[0019] like Figure 1 As shown, in this embodiment, the vacuum assembly includes a vacuum pipe 110 and a vacuum pump 111, one end of the vacuum pipe 110 is connected to the feed chamber body 101, and the other end of the vacuum pipe 110 is connected to the vacuum pump 111. Further, a control valve can be provided on the vacuum pipe 110 to flexibly control the on and off of the vacuum pipe 110.

[0020] like Figure 1 As shown, in this embodiment, the air intake assembly includes an air intake pipe 112 and an air source cabinet 113. One end of the air intake pipe 112 is connected to the feed chamber body 101, and the other end of the air intake pipe 112 is connected to the air source cabinet 113. An air intake conduit with a porous structure can be provided on the side of the feed chamber body 101 to improve the uniformity of the air intake.

[0021] In this embodiment, argon gas or argon mixed gas can be introduced as the cleaning gas, and the radio frequency power supply 109 is used to excite the discharge electrode 105 to discharge, so as to ionize the cleaning gas to form plasma, so as to bombard the stains on the surface of the substrate 102 or react with them, and obtain volatile gaseous substances, which are pumped away by the vacuum pump, thereby achieving the cleaning of the surface coating of the substrate 102, with the advantages of fast cleaning speed, large cleaning range, uniform cleaning, low cleaning cost, etc., and the substrate does not need to be placed in a strong acid or strong alkali solution, there is no damage to the substrate 102, and no secondary pollution will be generated.

[0022] In this embodiment, the working principle of the feed chamber is as follows: the substrate 102 is placed on the wafer carrier 103, and under the transmission of the support transmission component 104, the wafer carrier 103 is transmitted from the atmospheric side to the inside of the feed chamber body 101. When the wafer carrier 103 and the substrate 102 reach a predetermined position in the feed chamber, the vacuum pump 111 is turned on to evacuate the chamber. After reaching a preset bottom pressure, a cleaning gas is introduced into the feed chamber through the air intake pipe 112, and the RF power supply 109 is turned on. The cleaning gas is ionized and glows in the feed chamber to start cleaning the surface of the substrate. After cleaning, the support transmission component 104 transmits the wafer carrier 103 and the substrate 102 into the process vacuum chamber for normal coating work.

[0023] Although the utility model is disclosed as above with preferred embodiments, it is not intended to limit the utility model. Any technician familiar with the art can use the above disclosed methods and technical contents to make many possible changes and modifications to the technical solution of the utility model without departing from the spirit and technical solution of the utility model, or modify it into an equivalent embodiment with equivalent changes. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the utility model without departing from the content of the technical solution of the utility model still falls within the scope of protection of the technical solution of the utility model.

Claims

1. A feeding chamber with capacitive coupled discharge cleaning function, characterized in that: The invention comprises a feed chamber body (101), a support transmission component (104) and a capacitive coupling discharge component; the feed chamber body (101) is connected to a vacuum component and an air intake component respectively; the support transmission component (104) is arranged inside the feed chamber body (101); the support transmission component (104) is used to assist a wafer carrier (103) to automatically enter and exit the feed chamber body (101); the wafer carrier (103) is used to carry a substrate (102); the capacitive coupling discharge component comprises a discharge electrode plate (105), an extraction electrode (108) and a radio frequency power supply (109); the discharge electrode plate (105) is located inside the feed chamber body (101); The RF power supply (109) is located inside the cavity body (101) and outside the feed cavity body (101). One end of the lead-out electrode (108) is connected to the discharge electrode plate (105), and the other end of the lead-out electrode (108) is connected to the RF power supply (109). When the substrate (102) in the feed cavity needs to be cleaned, the vacuum component evacuates the inside of the feed cavity body (101), and the gas intake component delivers the cleaning gas to the inside of the feed cavity body (101). Then, the RF power supply (109) is turned on and the discharge electrode plate (105) discharges, so as to realize ionization and ignition of the cleaning gas in the feed cavity, thereby completing automatic cleaning of the substrate surface.

2. The feed chamber with capacitive coupled discharge cleaning function according to claim 1, characterized in that: The capacitive coupling discharge assembly also includes a protective cover (106) and an insulating flange (107); the insulating flange (107) seals and penetrates the bottom of the feed chamber body (101); the protective cover (106) is located inside the feed chamber body (101) and is connected and fixed to the insulating flange (107); the discharge electrode plate (105) is connected to the protective cover (106); and the extraction electrode (108) penetrates the protective cover (106) and the insulating flange (107) to achieve the connection between the discharge electrode plate (105) and the radio frequency power supply (109).

3. The feed chamber with capacitive coupled discharge cleaning function according to claim 2, characterized in that: The protective cover (106) is wrapped around the bottom and surrounding of the discharge electrode plate (105) to prevent the discharge electrode plate (105) from sparking and discharging.

4. The feed chamber with capacitive coupled discharge cleaning function according to claim 2, characterized in that: The vacuum assembly comprises a vacuum pipe (110) and a vacuum pump (111); one end of the vacuum pipe (110) is connected to the feed chamber body (101), and the other end of the vacuum pipe (110) is connected to the vacuum pump (111).

5. The feed chamber with capacitive coupled discharge cleaning function according to claim 2, characterized in that: The air intake assembly comprises an air intake pipeline (112) and an air source cabinet (113); one end of the air intake pipeline (112) is connected to the feed chamber body (101), and the other end of the air intake pipeline (112) is connected to the air source cabinet (113).

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