Fingerprint identification module without semi-cutting of PCB (Printed Circuit Board)
By using the packaging layer to extend to the side of the PCB board and the reinforced steel sheet in the fingerprint recognition module, the problem of half-cut increases costs is solved, and the effect of reducing production costs and improving product competitiveness is achieved. At the same time, the FPC is optimized. Heat dissipation performance.
Patent Information
- Application Number
- CN202323580400.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2033-12-26
AI Technical Summary
The existing fingerprint recognition module needs to be cut half-cut to the PCB board in the structural design to leave room for movement, which increases production costs and process complexity and affects product competitiveness.
Design a fingerprint recognition module that does not require half-cutting, extends to the side of the PCB board using a package layer, combining FPC and reinforced steel sheets to provide sufficient moving space to avoid FPC friction, and improve heat dissipation efficiency by optimizing the structure and materials of the FPC .
It reduces production costs, improves product competitiveness, and reduces the cutting demand for PCB board through the extension of the packaging layer, avoids FPC friction damage, and improves the reliability of the module.
Smart Images
Figure CN222354462U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic equipment, and more specifically to a fingerprint recognition module without half-cutting of PCB. Background Art
[0002] At present, the mainstream fingerprint recognition module usually takes into account the power button to simplify the structural design and reduce costs. At this time, the fingerprint recognition module needs to be pressed as a physical button. This requires the fingerprint recognition module to use FPC soft board so that there is a certain amount of activity space after installation and fixation. Usually, in order to avoid the FPC below the module chip output terminal from being deformed due to frequent pressing and possibly touching the fingerprint chip, resulting in damage to the FPC surface friction, the fingerprint chip will be half-cut near the output terminal to leave space for the FPC to move, so as to avoid the FPC circuit damage caused by FPC friction and then cause the fingerprint recognition module to fail. In this way, it is necessary to add a process to the production and assembly process of the fingerprint recognition module to process the chip substrate area into a half-cut area. This processing method usually uses CNC. The mainstream fingerprint chip is a chip bound to a large PCB, and then packaged on the PCB to add a packaging layer, so the half-cut area is actually processed on the chip substrate PCB. In this way, the addition of CNC cutting technology will increase product costs and reduce product competitiveness. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to design a structure without cutting the PCB board so that enough activity space can be reserved for the FPC to prevent the FPC from rubbing, thereby reducing production costs and improving product competitiveness.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] To solve the above technical problems, the utility model provides a fingerprint recognition module that does not require half-cutting of a PCB, comprising an FPC, a fingerprint chip and a reinforcing steel sheet, wherein the fingerprint chip is arranged on the upper surface of the FPC, the fingerprint chip comprises a PCB board, a wafer and a packaging layer, the wafer is fixed on the upper surface of the PCB board, the packaging layer covers the wafer and the upper surface of the PCB board, and one end of the packaging layer is provided with a side extension portion extending to the PCB board; the reinforcing steel sheet is arranged on the lower surface of the FPC.
[0006] As a preferred implementation of the fingerprint recognition module without half-cutting the PCB provided by the utility model, the width of the extension portion is the inwardly contracted width of the PCB board.
[0007] As a preferred implementation of the fingerprint recognition module without half-cutting the PCB provided by the utility model, the depth of the extension portion is the difference between the thickness of the PCB board and the inward shrinkage depth of the PCB board.
[0008] As a preferred embodiment of the fingerprint recognition module without half-cutting of the PCB provided by the utility model, the FPC includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.
[0009] As a preferred embodiment of the fingerprint recognition module of the PCB without half-cutting provided by the utility model, the FPC also includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.
[0010] As a preferred implementation of the fingerprint recognition module without half-cutting the PCB provided by the utility model, a heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
[0011] As a preferred implementation of the fingerprint recognition module without half-cutting of the PCB provided by the utility model, the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wavy structure or a honeycomb structure.
[0012] As a preferred embodiment of the fingerprint recognition module without half-cutting of the PCB provided by the utility model, a two-dimensional code laser area is provided on the upper surface of the FPC, and a black ink layer and a white ink layer provided on the black ink layer are provided on the upper surface of the FPC located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer by laser.
[0013] As a preferred embodiment of the fingerprint recognition module without half-cutting of the PCB provided by the utility model, the thickness of the black ink layer is 30 μm. ～ 40μm.
[0014] As a preferred embodiment of the fingerprint recognition module without half-cutting of the PCB provided by the utility model, the thickness of the white ink layer is 10 μm. ～ 20μm.
[0015] The utility model has the following beneficial effects:
[0016] In the actual production of PCB boards, the length of the PCB boards is shorter than that of the PCB boards in the existing designs, which is equivalent to a part of the PCB boards being retracted. Then, the packaging layer is extended to the retracted side of the PCB boards, and the packaging layer is used to fill the half-cut area in the existing technology. The PCB boards do not need to be cut, so that sufficient space for the FPC to move can be left to prevent FPC friction, thereby reducing production costs and improving product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 A schematic structural diagram of a fingerprint recognition module without half-cutting of PCB provided by the utility model.
[0019] Figure 2 for Figure 1 Schematic diagram of the structure of the fingerprint chip.
[0020] Figure 3 This is a schematic diagram of the structure of Example 2.
[0021] Figure 4 This is a schematic diagram of the structure of Example 3.
[0022] Description of Figure Numbers:
[0023] FPC1; fingerprint chip 2; reinforcing steel sheet 3; PCB board 21; chip 22; packaging layer 23; extension part 24;
[0024] Base material layer 11; circuit layer 12; metal heat dissipation layer 13; through hole 14;
[0025] Black ink layer 101; white ink layer 102. DETAILED DESCRIPTION
[0026] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0028] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0029] The utility model provides a fingerprint recognition module without half-cutting of PCB, which comprises an FPC, a fingerprint chip and a reinforcing steel sheet, wherein the fingerprint chip is arranged on the upper surface of the FPC, the fingerprint chip comprises a PCB board, a wafer and a packaging layer, the wafer is fixed on the upper surface of the PCB board, the packaging layer covers the wafer and the upper surface of the PCB board, one end of the packaging layer is provided with a side extension portion extending to the PCB board; the reinforcing steel sheet is arranged on the lower surface of the FPC.
[0030] In the actual production of PCB boards, the length of the PCB boards is shorter than that of the PCB boards in the existing designs, which is equivalent to a part of the PCB boards being retracted. Then, the packaging layer is extended to the retracted side of the PCB boards, and the packaging layer is used to fill the half-cut area in the existing technology. The PCB boards do not need to be cut, so that sufficient space for the FPC to move can be left to prevent FPC friction, thereby reducing production costs and improving product competitiveness.
[0031] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0032] Example 1
[0033] See also Figure 1 and Figure 2 , a fingerprint recognition module without half-cutting of PCB provided by the utility model, comprising FPC1, fingerprint chip 2 and reinforcing steel sheet 3, the fingerprint chip 2 is fixed on the upper surface of FPC1, the fingerprint chip 2 comprises a PCB board 21, a chip 22 and a packaging layer 23, the chip 22 is fixed on the upper surface of the PCB board 21, the packaging layer 23 covers the upper part of the chip 22 and covers the upper surface of the PCB board 21, an extension part 24 is provided at one end of the packaging layer 23, and the extension part 24 extends to the side of the PCB board 21; the reinforcing steel sheet 3 is fixed on the lower surface of FPC1.
[0034] Furthermore, the width of the extension portion 24 is the inwardly contracted width of the PCB board 21 , that is, the width of the half-cut region in the conventional design.
[0035] Furthermore, the depth of the extension portion 24 is the difference between the thickness of the PCB board 21 and the retracted depth of the PCB board 21 , that is, the difference between the depth of the PCB board 21 and the depth of the half-cut area in the traditional design.
[0036] Example 2
[0037] See also Figure 3 As a further optimization scheme of Example 1, in this embodiment, the FPC1 includes a substrate layer 11, a circuit layer 12 arranged on the upper surface of the substrate layer 11, and a metal heat dissipation layer 13 arranged on the lower surface of the substrate layer 11. The arrangement method can be that the circuit layer 12 and the metal heat dissipation layer 13 are respectively attached to the substrate layer 11 by double-sided adhesive. Since the thickness of the substrate layer 11 is relatively thin, the heat on the FPC1 can be diffused to the metal heat dissipation layer 13 through the substrate layer 11. The metal heat dissipation layer 13 can effectively increase the heat dissipation area of the FPC1 and play a role in uniform heat dissipation, thereby improving the heat dissipation efficiency of the FPC1. The substrate layer 11 can be any one of polyimide, polyester, polysulfone or polytetrafluoroethylene, the double-sided adhesive is any one of an acrylic adhesive layer or an epoxy resin adhesive layer, and the metal heat dissipation layer 13 can be a copper foil layer.
[0038] Furthermore, the FPC1 further includes at least one through-hole 14 penetrating the substrate layer 11, the circuit layer 12 and the metal heat dissipation layer 13, and the inner wall of the through-hole 14 is provided with a heat-conducting layer in contact with the circuit layer 12 and the metal heat dissipation layer 13. By utilizing the good thermal conductivity of the through-hole 14, the circuit layer 12 and the metal heat dissipation layer 13 on both sides of the substrate layer 11 can be electrically connected to play a good thermal conductivity function, and the thermal conductive layer can provide a thermal conductive function to achieve a good heat dissipation effect. Among them, the thermal conductive layer can be a copper glue conductive ink layer.
[0039] Furthermore, a heat conductor connected to an external heat-conducting structure is disposed in the through hole 14. The heat conductor is connected to the external heat-conducting structure from one side of the circuit layer 12 and is also in contact with the heat-conducting layer in the through hole 14, so that the circuit layer 12 and the metal heat dissipation layer 13 can be connected to the external heat-conducting structure through the through hole 14, so that the heat in the FPC 1 can be diffused to the external heat-conducting structure through the heat conductor in the through hole 14, so as to further improve the heat dissipation efficiency of the FPC 1. Preferably, in order to enable the through hole 14 to be connected to the external heat-conducting structure, the through hole 14 is disposed at the edge of the FPC 1.
[0040] Furthermore, the metal heat dissipation layer 13 is a uniform heat dissipation structure, and its structure can be any one of a mesh structure, a strip structure, a wavy structure or a honeycomb structure. Through the uniform heat dissipation structure, the heat dissipation effect can be better improved.
[0041] Example 3
[0042] See also Figure 4 As a further optimization scheme of Example 1, in this embodiment, a two-dimensional code laser area is further provided on the upper surface of FPC1. A black ink layer 101 and a white ink layer 102 provided on the black ink layer 101 are provided on the upper surface of FPC1 located on the two-dimensional code laser area. The white ink layer 102 is formed with a two-dimensional code by laser. Since two layers of ink are provided, the black ink layer 101 and the white ink layer 102, the surface white ink layer 102 is lasered off by laser to expose the bottom black ink layer 101. The area where the laser is lasered is displayed as black. The two-dimensional code generated in this way has a good contrast effect and is easy to scan. At the same time, the two-dimensional code will not fall off and be damaged, which prevents the two-dimensional code from being invalid, and greatly reduces the labor cost.
[0043] Furthermore, the thickness of the black ink layer 101 is 30 μm. ～ 40 μm. The thickness of the white ink layer 102 is 10 μm ～ 20μm. This thickness is the thickness that the commonly used ultraviolet laser can just penetrate, and there is no dust around after the laser irradiation, which has the advantages of high rhythm and efficiency. The reason why the thickness of the lower black ink layer 101 is thicker than the thickness of the upper white ink layer 102 is to avoid laser power energy fluctuations and prevent the black ink layer 101 from being penetrated by the laser and causing damage to the internal layer of FPC1.
[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0045] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A fingerprint recognition module without half-cutting of PCB, characterized in that: It includes: FPC; A fingerprint chip is arranged on the upper surface of the FPC, the fingerprint chip comprises a PCB board, a chip and a packaging layer, the chip is fixed on the upper surface of the PCB board, the packaging layer covers the chip and the upper surface of the PCB board, and one end of the packaging layer is provided with a side extension portion extending to the PCB board; A reinforcing steel sheet is arranged on the lower surface of the FPC.
2. The fingerprint recognition module without half-cutting of PCB according to claim 1 is characterized in that: The width of the extension portion is the inwardly contracted width of the PCB board.
3. The fingerprint recognition module without half-cutting of PCB according to claim 1, characterized in that: The depth of the extension portion is the difference between the thickness of the PCB board and the retracted depth of the PCB board.
4. The fingerprint recognition module without half-cutting of PCB according to claim 1, characterized in that: The FPC includes a substrate layer, a circuit layer disposed on an upper surface of the substrate layer, and a metal heat dissipation layer disposed on a lower surface of the substrate layer.
5. The fingerprint recognition module without half-cutting of PCB according to claim 4 is characterized in that: The FPC further includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and an inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.
6. The fingerprint recognition module without half-cutting of PCB according to claim 5, characterized in that: A heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
7. The fingerprint recognition module without half-cutting of PCB according to claim 4, characterized in that: The structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.
8. The fingerprint recognition module without half-cutting of PCB according to claim 1, characterized in that: A two-dimensional code laser area is arranged on the upper surface of the FPC, a black ink layer and a white ink layer arranged on the black ink layer are arranged on the upper surface of the FPC located on the two-dimensional code laser area, and a two-dimensional code is formed on the white ink layer by laser.
9. The fingerprint recognition module without half-cutting of PCB according to claim 8, characterized in that: The thickness of the black ink layer is 30 μm ～ 40μm.
10. The fingerprint recognition module without half-cutting of PCB according to claim 8, characterized in that: The thickness of the white ink layer is 10 μm ～ 20μm.