Semiconductor plastic packaging equipment and semiconductor plastic packaging system
By using multiple robots to automate sheet handling and plastic packaging in semiconductor plastic packaging equipment, the limitations of existing equipment for single-size sheet packaging are solved, and an efficient and flexible plastic packaging process is achieved, which improves production efficiency and scope of application.
Patent Information
- Application Number
- CN202323649308.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2033-12-29
AI Technical Summary
Existing semiconductor plastic packaging equipment generally can only package semiconductor sheets of one size, and requires manual loading and unloading, affecting production efficiency and scope of application.
Using semiconductor plastic packaging equipment including the first robot, the second robot and the third robot, these robots realize automatic handling and plastic packaging of the material sheets, and using preheating platforms, pressing devices, transit platforms and other devices to perform standardized plastic packaging process, which can Flexible adjustment of movement paths and production beats to suit different types of pieces.
It improves semiconductor production efficiency and quality, expands the scope of application of plastic packaging equipment, reduces the transition cycle of different types of sheet products, reduces the cost of equipment replacement, and improves the economicality of production.
Smart Images
Figure CN222355076U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor plastic packaging technology, and in particular to a semiconductor plastic packaging device and a semiconductor plastic packaging system. Background Art
[0002] Semiconductor devices are an important component of electronic products. In order to ensure the structural strength and anti-pollution and anti-corrosion properties of semiconductors, semiconductors need to be packaged to ensure the quality and reliability of semiconductors.
[0003] In the prior art, a type of encapsulation equipment generally encapsulates semiconductor sheets of one size type, and before encapsulation, the semiconductor sheets to be encapsulated and the injection molding materials still need to be manually loaded, and after encapsulation, the semiconductor devices encapsulated by the injection molding materials need to be manually unloaded, which affects the production efficiency and application scope of the semiconductor devices. Utility Model Content
[0004] Based on this, it is necessary to provide a semiconductor plastic packaging equipment and a semiconductor plastic packaging system, aiming to improve the production efficiency and production quality of semiconductors and expand the application scope of semiconductor plastic packaging equipment.
[0005] An embodiment of the first aspect of the present application provides a semiconductor molding equipment, which includes: a first robot, a preheating platform, a pressing device, a second robot, a transfer platform and a third robot; the first robot is used to transport multiple sheets to the preheating platform, and the preheating platform has multiple preheating positions for preheating the sheets; the second robot is used to transport the sheets to the pressing device, and the pressing device is used to plasticize the sheets to form plastic sheets, and the second robot is also used to transport the plastic sheets to the transfer platform; the transfer platform is used to temporarily store the plastic sheets, and the third robot transports the plastic sheets on the transfer platform to the next processing position.
[0006] In the embodiment of the present application, the first robot, the second robot and the third robot are used together to realize the transport and plastic sealing of the sheet, and there is no need to manually transport the sheet and the semiconductor after plastic sealing, which can standardize the semiconductor plastic sealing process and improve the production efficiency and production quality of semiconductors. The movement path and production rhythm of the first robot, the second robot and the third robot can be adjusted in real time, and the sheet of different types and sizes can be transported and plastic sealed flexibly and conveniently, expanding the application scope of semiconductor plastic sealing equipment, meeting production requirements, and there is no need to replace the device in the existing semiconductor plastic sealing equipment, which can reduce the transition period of plastic sealing different types of sheet products and improve the economic efficiency of semiconductor plastic sealing equipment application.
[0007] In some embodiments, the semiconductor encapsulation equipment also includes a feeding platform, which is arranged on one side of the second robot. The feeding platform has multiple feeding positions for placing injection molding materials. The second robot is also used to transport the injection molding material to the pressing device, and the pressing device is used to press the sheet and the injection molding material to form a plastic encapsulation sheet.
[0008] In some embodiments, the end of the first robot has a first clamp, the first clamp includes two first clamping parts arranged in parallel, the first clamping parts are used to clamp the sheet, and the first clamping parts include at least one clamping claw.
[0009] In some embodiments, the end of the second robot has a second clamp, and both ends of the second clamp are respectively provided with a second clamping part, one second clamping part is used to clamp the sheet on the preheating platform or the plastic packaging sheet in the pressing device, and the other second clamping part is used to clamp the injection molding material on the feeding position.
[0010] In some embodiments, both of the two second clamping parts include multiple clamping positions; or one of the second clamping parts includes multiple clamping positions, and the other second clamping part includes multiple accommodating cavities for accommodating the injection molding material; at least one clamping claw is provided on the clamping position.
[0011] In some embodiments, the semiconductor encapsulation equipment further includes a loading device, the loading device includes a flow channel, a plurality of material sheets are arranged on the flow channel, and the flow channel can drive the plurality of material sheets to move linearly.
[0012] In some embodiments, the semiconductor packaging equipment also includes an overflow removal device, which is arranged downstream of the transfer platform, and is used to remove overflow on the packaging material sheet. The third robot is used to transport the packaging material sheet on the transfer platform to the overflow removal device, and transport the packaging material sheet after the overflow is removed to the next processing position.
[0013] In some embodiments, the semiconductor packaging equipment also includes a box loading device, which is arranged downstream of the overflow removal device, and the box loading device has at least one storage position for storing finished boxes; the end of the third robot has a third clamp, and the third clamp is provided with a third clamping part, and the third clamping part is used to transport the packaging material sheet after the overflow is removed to the storage position.
[0014] In some embodiments, the box loading device includes two storage positions that are spaced apart from each other, and the third clamp is provided with two third clamping portions that are parallel and spaced apart from each other.
[0015] An embodiment of a second aspect of the present application provides a semiconductor plastic packaging system, including the semiconductor plastic packaging device in any of the above embodiments.
[0016] In the semiconductor encapsulation system provided in the embodiment of the present application, the semiconductor encapsulation system includes a semiconductor encapsulation device, in which the first robot, the second robot and the third robot jointly realize the transport and encapsulation of the sheet, and there is no need to manually transport the sheet and the encapsulated semiconductor, which can standardize the semiconductor encapsulation process and improve the production efficiency and production quality of the semiconductor. The movement paths and production rhythms of the first robot, the second robot and the third robot can be adjusted in real time, and sheets of different types and sizes can be transported and encapsulated flexibly and conveniently, expanding the scope of application of the semiconductor encapsulation device, meeting production requirements, and there is no need to replace the devices in the existing semiconductor encapsulation device, which can reduce the transition period of encapsulating different types of sheet products and improve the economic efficiency of the application of the semiconductor encapsulation device. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a schematic structural diagram of a semiconductor packaging device in an embodiment of the present application;
[0018] Figure 2 It is a front view of a semiconductor packaging device in one embodiment of the present application;
[0019] Figure 3 This is a schematic diagram of the operation of the first robot in one embodiment of the present application;
[0020] Figure 4 This is a schematic diagram of the operation of the second robot in one embodiment of the present application;
[0021] Figure 5 This is a working schematic diagram of the third robot in one embodiment of the present application;
[0022] Figure markings: semiconductor packaging equipment-100, material sheet-200, packaging material sheet-300, frame-400, control device-500, first robot-1, first clamp-11, first clamping part-111, preheating platform-2, preheating position-21, feeding platform-3, feeding position-31, pressing device-4, second robot-5, second clamp-51, second clamping part-511, transfer platform-6, third robot-7, third clamp-71, third clamping part-711, loading device-8, flow channel-81, overflow removal device-9, boxing device-10, storage position-101. DETAILED DESCRIPTION
[0023] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.
[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0025] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there may be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly under or there may be one or more intervening elements. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there may be one or more intervening elements.
[0026] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.
[0027] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.
[0028] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.
[0029] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.
[0030] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.
[0031] Semiconductor devices are an important component of electronic products. In order to ensure the structural strength and anti-pollution and anti-corrosion properties of semiconductors, semiconductors need to be packaged to ensure the quality and reliability of semiconductors.
[0032] In the prior art, a type of encapsulation equipment generally encapsulates semiconductor sheets of one size type, and before encapsulation, the semiconductor sheets to be encapsulated and the injection molding materials still need to be manually loaded, and after encapsulation, the semiconductor devices encapsulated by the injection molding materials need to be manually unloaded, which affects the production efficiency and application scope of the semiconductor devices.
[0033] Based on the above problems, the present application provides a semiconductor plastic packaging equipment and a semiconductor plastic packaging system, aiming to improve the production efficiency and production quality of semiconductors and expand the scope of application of semiconductor plastic packaging equipment.
[0034] The embodiment of the first aspect of the present application provides a semiconductor plastic packaging device 100, such as Figure 1 and Figure 2 As shown, the semiconductor plastic packaging equipment 100 includes: a first robot 1, a preheating platform 2, a pressing device 4, a second robot 5, a transfer platform 6 and a third robot 7; the first robot 1 is used to transport multiple sheets 200 to the preheating platform 2, the preheating platform 2 is arranged between the first robot 1 and the second robot 5, and the preheating platform 2 has multiple preheating positions 21 for preheating the sheets 200; the second robot 5 is used to transport the sheets 200 to the pressing device 4, the pressing device 4 is arranged on one side of the second robot 5, the pressing device 4 is used to plasticize the sheets 200 to form plastic-encapsulated sheets 300, and the second robot 5 is also used to transport the plastic-encapsulated sheets 300 to the transfer platform 6; the transfer platform 6 is arranged between the second robot 5 and the third robot 7, the transfer platform 6 is used to temporarily store the plastic-encapsulated sheets 300, and the third robot 7 transports the plastic-encapsulated sheets 300 on the transfer platform 6 to the next processing position.
[0035] In the embodiment of the present application, the tablet 200 includes but is not limited to the lead frame, the first robot 1, the second robot 5 and the third robot 7 can be six-axis robots, and multiple tablets 200 can be evenly placed on the preheating platform 2. The number of tablets 200 can be set according to actual needs, and the present application does not limit this. The first robot 1, the second robot 5 and the third robot 7 jointly realize the transport, movement and plastic sealing of the tablet 200, without the need to manually transport the tablet 200 and the semiconductor that has been plastic-sealed, which can standardize the semiconductor plastic sealing process and improve the production efficiency and production quality of the semiconductor. The moving path and production rhythm of the first robot 1, the second robot 5 and the third robot 7 can be adjusted in real time, and tablets 200 of different types and sizes can be flexibly and conveniently transported and plastic-sealed, expanding the scope of application of the semiconductor plastic sealing equipment 100, meeting production requirements, and without the need to replace the device in the existing semiconductor plastic sealing equipment 100, it can reduce the transition period of plastic-sealed tablets 200 products of different types, and improve the economic efficiency of the application of the semiconductor plastic sealing equipment 100.
[0036] In some embodiments, Figure 2 and Figure 4 As shown, the semiconductor plastic packaging equipment 100 also includes a feeding platform 3, which is arranged on one side of the second robot 5. The feeding platform 3 has a plurality of feeding positions 31 for placing injection molding materials. The second robot 5 is also used to transport the injection molding materials to the pressing device 4, and the pressing device 4 is used to press the material sheet 200 and the injection molding material to form a plastic packaging material sheet 300. The injection molding material includes but is not limited to resin and plastic.
[0037] In some embodiments, Figure 3 As shown, the semiconductor encapsulation equipment 100 also includes a loading device 8, which is used to provide a material sheet 200. The loading device 8 includes a flow channel 81, and a plurality of material sheets 200 are arranged on the flow channel 81. The flow channel 81 can drive the plurality of material sheets 200 to move in a straight line, thereby improving the loading efficiency of the loading device 8.
[0038] In some embodiments, Figure 3 As shown, the first robot 1 has a first clamp 11 at the end thereof, and the first clamp 11 includes two first clamping parts 111 arranged in parallel, and the first clamping part 111 is used to clamp the sheet 200, and the first clamping part 111 includes at least one clamping claw. The first clamp 11 can grab two sheets 200 from the flow channel 81 in batches, and can first control one of the first clamping parts 111 of the first clamp 11 to move above the flow channel 81 to clamp and fix one sheet 200 on the flow channel 81, and then control the first clamp 11 to rotate 180°, so that the other first clamping part 111 moves above the flow channel 81 to clamp and fix the second sheet 200.
[0039] In the embodiment of the present application, after the first clamp 11 clamps and fixes the two sheets 200, the first robot 1 is controlled to drive the two sheets 200 to move to the preheating platform 2, and the two sheets 200 are placed on the preheating positions 21 accordingly. The first robot 1 continues to perform this step until the preheating platform 2 is filled with sheets 200 as required. For example, the preheating platform 2 may include 12 preheating positions 21. In this case, the first robot 1 needs to perform six operations of clamping and placing the sheets 200 to complete one movement stroke. After the second robot 5 takes away all the sheets 200 on the preheating platform 2, the first robot 1 starts to perform a new movement stroke, and re-transports and arranges the sheets 200 on the flow channel 81 to the preheating platform. The spacing between the two first clamping parts 111 on the first clamp 11 can be determined according to the spacing between adjacent preheating positions 21 on the preheating platform 2, so that the two sheets 200 clamped by the first clamp 11 can be accurately and quickly placed on the preheating position 21, saving the transportation time of the first robot 1 and improving the plastic packaging efficiency.
[0040] In some embodiments, Figure 4 As shown, the second robot 5 has a second clamp 51 at its end, and a second clamping portion 511 is respectively provided at both ends of the second clamp 51, one second clamping portion 511 is used to clamp the material 200 on the preheating platform 2 or the plastic packaging material 300 in the pressing device 4, and the other second clamping portion 511 is used to clamp the injection molding material on the feeding position 31. The two second clamping portions 511 can be arranged in parallel.
[0041] In the embodiment of the present application, the second clamping part 511 on the second robot 5 can first move to the top of the feeding platform 3 to clamp and fix the injection molding materials on the multiple feeding positions 31, and then control another second clamping part 511 to move to the top of the preheating platform 2 to clamp and fix a batch of tablets 200 on the multiple preheating positions 21, and then transport the clamped and fixed tablets 200 and the injection molding materials to the mold of the pressing device 4 for mold closing to form the plastic-encapsulated tablets 300. After the plastic-encapsulated tablets 300 are formed, the mold is opened, and the second robot 5 is controlled to enter the pressing device 4 again to clamp and fix the plastic-encapsulated tablets 300, and transport the plastic-encapsulated tablets 300 to the multiple discharge positions on the transfer platform 6. In this way, one movement stroke of the second robot 5 ends, and it can wait for the tablets 200 on the preheating platform 2 to be full to carry out the next cycle.
[0042] In the embodiment of the present application, the second robot 5 first clamps and fixes the injection molding material. During the process of clamping the injection molding material, the robot can wait for the preheating platform 2 to be filled with the tablets 200 as required and the preheating of the tablets 200 to be completed, which can save the overall plastic packaging time and improve the plastic packaging efficiency. The movement travel of the first robot 1 and the second robot 5 is avoided to avoid appearing above the preheating platform 2 at the same time, to avoid interference between the first robot 1 and the second robot 5 and damage to the device, and to improve the working reliability and safety of the semiconductor plastic packaging device.
[0043] In some embodiments, both second clamping parts 511 include multiple clamping positions; or one second clamping part 511 includes multiple clamping positions, and the other second clamping part 511 includes multiple accommodating cavities for accommodating injection molding materials; at least one clamping claw is provided on the clamping position. The clamping claws on the multiple clamping positions can clamp and fix multiple tablets 200 and multiple injection molding materials at one time, so that the second robot 5 can clamp multiple tablets 200 on the preheating platform 2 and multiple injection molding materials on the feeding platform 3 in one movement stroke, and place multiple tablets 200 and multiple injection molding materials in the pressing mold, which can improve the molding rhythm of the semiconductor molding equipment 100 and further improve the molding efficiency.
[0044] In the embodiment of the present application, the distance between adjacent preheating positions 21 on the preheating platform 2 is set correspondingly to the distance between adjacent feeding positions 31 on the feeding platform 3, the distance between adjacent clamping positions of the second clamping part 511, the distance between adjacent discharge positions in the mold, and the distance between adjacent discharge positions on the transfer platform 6, so that the multiple sheets 200 and multiple injection molding materials clamped by the second clamp 51 can be accurately and quickly placed on the corresponding discharge positions of the mold, and the multiple plastic packaging sheets 300 clamped by the second clamp 51 can be accurately and quickly placed on the corresponding discharge positions of the transfer platform 6, thereby saving the handling time of the second robot 5 and improving the plastic packaging efficiency.
[0045] In some embodiments, Figure 1 and Figure 5 As shown, the semiconductor plastic packaging equipment 100 also includes an overflow removal device 9, which is arranged downstream of the transfer platform 6. The overflow removal device 9 is used to remove the overflow on the plastic packaging material sheet 300 to improve the quality of the semiconductor plastic packaging process. The third robot 7 is used to transport the plastic packaging material sheet 300 on the transfer platform 6 to the overflow removal device 9, and to transport the plastic packaging material sheet 300 after the overflow is removed to the next processing position.
[0046] In some embodiments, Figure 5As shown, the semiconductor packaging equipment 100 also includes a box loading device 10, which is arranged downstream of the overflow removal device 9, and the box loading device 10 has at least one storage position 101 for storing finished product boxes; the end of the third robot 7 has a third clamp 71, and the third clamp 71 is provided with a third clamping part 711, and the third clamping part 711 is used to transport the semiconductor to the storage position 101, so as to facilitate the packaging of the semiconductor, improve the automation degree of the semiconductor packaging equipment 100, save labor, and reduce application costs.
[0047] In the embodiment of the present application, the third clamping part 711 in the third robot 7 can be controlled to move to the top of the transfer platform 6, and a group of plastic encapsulation sheets 300 with overflow materials connected together can be taken from the transfer platform 6, and a group generally includes two plastic encapsulation sheets 300, and then the third robot 7 can be controlled to carry a group of plastic encapsulation sheets 300 to the overflow removal device 9. After the plastic encapsulation sheets 300 complete the overflow removal operation, the third robot 7 clamps the plastic encapsulation sheets 300 after the overflow is removed in the overflow removal device 9, and carries it to the top of the storage position 101 of the box loading device 10. The third clamping part 711 can clamp the plastic encapsulation sheets 300 in the overflow removal device 9 in batches, and place the plastic encapsulation sheets 300 in the finished box. After the third robot 7 is controlled to repeat the above steps, after the overflow removal operation and box loading are performed on all the plastic encapsulation sheets 300 on the transfer platform 6, one movement stroke of the third robot 7 is completed, and after the plastic encapsulation sheets 300 are placed again on the transfer platform 6, a new movement stroke is started.
[0048] In some embodiments, Figure 5 As shown, the box loading device 10 includes two storage positions 101 spaced apart from each other, and the third clamp 71 is provided with two parallel and spaced apart third clamping portions 711 , and the distance between the two third clamping portions 711 corresponds to the distance between the two storage positions 101 .
[0049] In the embodiment of the present application, the two third clamping parts 711 can clamp the two plastic packaging material sheets 300 in the overflow removal device 9 at the same time, and then first control one third clamping part 711 to put one plastic packaging material sheet 300 into the finished product box of the storage position 101, and then control the third clamp 71 to rotate 180°, or control the third robot 7 to drive another third clamping part 711 to move, so as to place another semiconductor in the finished product box of another storage position 101, thereby improving the plastic packaging efficiency of the semiconductor plastic packaging device 100. Optionally, the distance between the two third clamping parts 711 corresponds to the distance between the two storage positions 101, so that the two plastic packaging material sheets 300 clamped by the third clamp 71 can be accurately and quickly placed in the finished product box, saving the handling time of the third robot 7, and further improving the plastic packaging efficiency of the semiconductor plastic packaging device 100.
[0050] In some embodiments, Figure 2 As shown, with the location of the laminating device 4 as the reference location, the second robot 5 is arranged at the side of the material sheet 200 entrance of the laminating device 4, and the preheating platform 2 is respectively arranged on both sides of the second robot 5. The connection between the second robot 5 and the location of the laminating device 4 can extend along the first direction. The locations of the preheating platform 2, the second robot 5 and the transfer platform 6 can be located on the same straight line and extend along the second direction. The first direction and the second direction are perpendicular, so that the second robot 5 can carry the preheated material sheet 200 to the mold, and carry the plastic packaging material sheet 300 fixture to the transfer platform 6. The feeding device 8 is arranged on the side of the preheating platform 2 away from the laminating device 4, and the first robot 1 is arranged between the feeding device 8 and the preheating platform 2, so as to arrange the material sheet 200 on the flow channel 81 to the preheating platform 2.
[0051] In the embodiment of the present application, the overflow removal device 9 is arranged on the side of the transfer platform 6 away from the pressing device 4, and the third robot 7 is located between the overflow removal device 9 and the transfer platform 6, so as to facilitate the transfer of the plastic packaging material sheet 300 on the transfer platform 6 to the overflow removal device 9. The feeding platform 3 is arranged on the side of the feeding device 8 away from the pressing device 4, and is located within the working range of the second robot 5, so as to facilitate the second robot 5 to transport the injection molding material to the mold; the boxing device 10 is arranged on the side of the overflow removal device 9 away from the pressing device 4, and is located within the working range of the third robot 7, so as to facilitate the third robot 7 to transport the plastic packaging material sheet 300 after the overflow is removed to box it.
[0052] In the embodiment of the present application, the placement of the loading device 8, the feeding platform 3, the overflow removing device 9 and the box loading device 10 can allow the second robot 5 to have a larger space on the side away from the pressing device 4, so as to provide the second robot 5 with sufficient moving space, so that it can clamp the multiple tablets 200 on the preheating platform 2 and the multiple injection molding materials on the feeding platform 3 in one movement stroke, place the multiple tablets 200 and the multiple injection molding materials in the pressing mold, and prevent interference between the first robot 1, the second robot 5 and the third robot 7. Secondly, the space on the side of the second robot 5 can also facilitate the staff to maintain and replace each device in the semiconductor plastic packaging equipment 100, avoid the devices blocking each other during the maintenance process, and improve the maintenance efficiency and maintenance safety.
[0053] In the implementation of this application, the arrangement positions of the various devices in the semiconductor molding equipment 100 can make the spatial layout of the entire equipment more reasonable, facilitate the various robots to carry materials in the molding process, and make the operation of the semiconductor molding equipment 100 more stable and reliable; it can also make the entire semiconductor molding equipment 100 have a compact structure and a small footprint, which is conducive to saving the installation space of the semiconductor molding device and improving the applicability of the semiconductor molding device.
[0054] In the semiconductor encapsulation equipment 100 provided in the embodiment of the present application, the feeding device, the loading device 8, the first robot 1, the preheating platform 2, the pressing device 4, the second robot 5, the transfer platform 6, the third robot 7, the overflow removal device 9 and the box loading device 10 can all operate independently to complete their respective functions, with clear division of labor but close cooperation. Through the arrangement of the above-mentioned devices, not only the entire semiconductor encapsulation process is carried out in an orderly manner, but also the production rhythm of the entire encapsulation process is made more compact, thereby making the utilization rate of each device higher and improving the encapsulation effect and efficiency of the semiconductor encapsulation equipment 100.
[0055] The embodiment of the second aspect of the present application provides a semiconductor molding system, including the semiconductor molding equipment 100 in any of the above embodiments. The semiconductor molding system also includes a rack 400 and a control device 500. The rack 400 is arranged outside the semiconductor molding equipment 100 to protect the semiconductor molding equipment 100 and improve the working safety and reliability of the semiconductor molding equipment 100. The control device 500 includes but is not limited to a single-chip microcomputer and an industrial computer, etc. The control device 500 can control and adjust the moving path and production rhythm of the first robot 1, the second robot 5 and the third robot 7 in the semiconductor molding equipment 100, improve the automation and intelligence of the semiconductor molding system, and improve the working effect and work efficiency of the semiconductor molding system.
[0056] In the semiconductor encapsulation system provided in the embodiment of the present application, the semiconductor encapsulation equipment 100 includes a first robot 1, a second robot 5 and a third robot 7, which jointly realize the transport and encapsulation of the tablet 200, and do not need to manually transport the tablet 200 and the encapsulated semiconductor, which can standardize the semiconductor encapsulation process and improve the production efficiency and production quality of semiconductors. The movement paths and production rhythms of the first robot 1, the second robot 5 and the third robot 7 can be adjusted in real time, and tablets 200 of different types and sizes can be transported and encapsulated flexibly and conveniently, expanding the scope of application of the semiconductor encapsulation equipment 100, meeting production requirements, and do not need to replace the devices in the existing semiconductor encapsulation equipment 100, which can reduce the transition period of encapsulating different types of tablets 200 products, and improve the economic efficiency of the application of the semiconductor encapsulation equipment 100.
[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0058] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. A semiconductor plastic packaging device, characterized in that: include: A first robot, a preheating platform, a laminating device, a second robot, a transfer platform and a third robot; the first robot is used to transport a plurality of sheets to the preheating platform, the preheating platform has a plurality of preheating positions for preheating the sheets; the second robot is used to transport the sheets to the laminating device, the laminating device is used to plastic-seal the sheets to form plastic-sealed sheets, the second robot is also used to transport the plastic-sealed sheets to the transfer platform; the transfer platform is used to temporarily store the plastic-sealed sheets, the third robot transports the plastic-sealed sheets on the transfer platform to the next processing position.
2. The semiconductor plastic packaging equipment according to claim 1, characterized in that: The semiconductor encapsulation equipment also includes a feeding platform, which is arranged on one side of the second robot. The feeding platform has multiple feeding positions for placing injection molding materials. The second robot is also used to transport the injection molding material to the pressing device, and the pressing device is used to press the sheet and the injection molding material to form a plastic encapsulation sheet.
3. The semiconductor plastic packaging equipment according to claim 1, characterized in that: The end of the first robot has a first clamp, and the first clamp includes two first clamping parts arranged in parallel. The first clamping parts are used to clamp the sheet, and the first clamping parts include at least one clamping claw.
4. The semiconductor plastic packaging equipment according to claim 2, characterized in that: The end of the second robot has a second clamp, and both ends of the second clamp are respectively provided with a second clamping part, one second clamping part is used to clamp the sheet on the preheating platform or the plastic packaging sheet in the pressing device, and the other second clamping part is used to clamp the injection molding material on the feeding position.
5. The semiconductor plastic packaging equipment according to claim 4, characterized in that: Both of the two second clamping parts include a plurality of clamping positions; or one of the second clamping parts includes a plurality of the clamping positions, and the other second clamping part includes a plurality of accommodating cavities for accommodating the injection molding material; at least one clamping claw is provided on the clamping position.
6. The semiconductor plastic packaging equipment according to claim 1, characterized in that: The semiconductor plastic packaging equipment also includes a loading device, which includes a flow channel, and a plurality of material sheets are arranged on the flow channel. The flow channel can drive the plurality of material sheets to move linearly.
7. The semiconductor plastic packaging equipment according to claim 1, characterized in that: The semiconductor packaging equipment also includes an overflow removal device, which is arranged downstream of the transfer platform. The overflow removal device is used to remove overflow on the packaging material sheet. The third robot is used to transport the packaging material sheet on the transfer platform to the overflow removal device, and transport the packaging material sheet after the overflow is removed to the next processing position.
8. The semiconductor plastic packaging equipment according to claim 7, characterized in that: The semiconductor plastic packaging equipment also includes a box loading device, which is arranged downstream of the overflow removal device, and the box loading device has at least one storage position for storing finished boxes; the end of the third robot has a third clamp, and the third clamp is provided with a third clamping part, and the third clamping part is used to transport the plastic packaging material sheet after the overflow is removed to the storage position.
9. The semiconductor plastic packaging equipment according to claim 8, characterized in that: The box loading device comprises two storage positions which are spaced apart from each other, and the third clamp is provided with two third clamping parts which are parallel and spaced apart from each other.
10. A semiconductor plastic packaging system, characterized in that: The invention comprises the semiconductor plastic packaging device as claimed in any one of claims 1 to 9.