Wafer finger compatible with wafer patch ring
By adding patch ring support plate and adsorption holes to the fingers of semiconductor devices, compatible adsorption of wafers and patch rings is achieved, which solves the problem of frequent finger replacement and improves the flexibility of the equipment and resource utilization.
Patent Information
- Application Number
- CN202421127749.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-05-22
AI Technical Summary
In existing semiconductor devices, fingers need to be frequently replaced to meet the needs of handling wafers and frame rings, resulting in inflexible use and waste of resources.
A wafer finger compatible with wafer patch ring was designed. By setting wafer adsorption holes and patch ring support plates in the adsorption part, compatible adsorption of wafers and patch rings is achieved, avoiding the need to change fingers.
It realizes flexible handling of wafers and patch rings without changing fingers, saving resources and improving the efficiency of equipment usage.
Smart Images
Figure CN222355110U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor equipment, and in particular relates to a wafer finger compatible with a wafer patch ring. Background Art
[0002] In semiconductor equipment, robots are generally used for automatic wafer transfer, that is, the wafers that need to be processed by semiconductor processes are automatically transferred into the process chamber by the robot, or the wafers that have been processed by semiconductor processes are automatically transferred out of the process chamber. In this process, semiconductor fingers play an important role in transporting wafers, but sometimes the industry needs to transport not only wafers but also frame iron rings. Currently, there are basically two types of fingers, one that can only transport wafers and the other that can only transport frame iron rings. When changing the transport object, they need to be constantly replaced. Utility Model Content
[0003] The utility model provides a wafer finger compatible with a wafer patch ring, which aims to enable the wafer finger to carry wafers and be compatible with a wafer patch ring through wafer adsorption holes and patch ring adsorption holes. When the transported object needs to be replaced, there is no need to replace the finger. It is more flexible to use and saves more resources, thereby solving the above-mentioned problem.
[0004] The technical solution of the utility model to solve the above technical problems is as follows:
[0005] The utility model provides a wafer finger compatible with a wafer patch ring, comprising: a mounting portion, and an adsorption portion arranged at the front end of the mounting portion, wherein at least one wafer adsorption hole is provided on the surface of the adsorption portion, a patch ring support plate is extended outwardly from both sides of the adsorption portion, and at least one patch ring adsorption hole is provided on the surface of the patch ring support plate; at least one patch ring adsorption hole is provided on the surface of the adsorption portion away from one end of the mounting portion.
[0006] In some embodiments, the surface of the mounting portion is provided with air holes for connecting the finger connector.
[0007] In some embodiments, the wafer adsorption holes are arranged on the central axis of the adsorption portion, or are symmetrically arranged along the central axis of the adsorption portion.
[0008] In some embodiments, the patch ring support plate is symmetrically arranged on both sides of the adsorption portion along the central axis of the adsorption portion.
[0009] In some embodiments, the patch ring adsorption holes are symmetrically arranged along the central axis of the adsorption portion.
[0010] In some embodiments, the projection of the patch ring adsorption hole on the plane corresponds to the shape of the wafer patch ring.
[0011] The beneficial effects of this application are:
[0012] The present application provides a wafer finger that is compatible with a wafer patch ring. Through the wafer adsorption holes and the patch ring adsorption holes, the wafer finger can not only transport wafers but also be compatible with the wafer patch ring. When the transported objects need to be replaced, there is no need to replace the fingers. It is more flexible to use and saves more resources. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the structure of the wafer finger of this application;
[0014] Figure 2 This is a schematic diagram of the wafer finger of this application when sucking the wafer;
[0015] Figure 3 This is a schematic diagram of the wafer finger of this application when adsorbing the wafer bonding ring.
[0016] Description of reference numerals:
[0017] Mounting part-1; adsorption part-2; wafer adsorption hole-3; patch ring support plate-4; patch ring adsorption hole-5; air hole-6; wafer-7; wafer patch ring-8. DETAILED DESCRIPTION
[0018] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.
[0019] In order to more clearly understand the above-mentioned purpose, features and advantages of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and examples. It is to be understood that the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. The specific embodiments described herein are merely used to explain the present application, rather than to limit the present application. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.
[0020] It should be noted that, in this document, relational terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.
[0021] Figure 1 This is a schematic diagram of the structure of the wafer finger of this application. Figure 2 This is a schematic diagram of the wafer finger of this application when sucking the wafer. Figure 3 This is a schematic diagram of the wafer finger of this application when adsorbing the wafer bonding ring.
[0022] Combination Figure 1-Figure 3 A wafer finger compatible with a wafer patch ring comprises: a mounting portion 1, and an adsorption portion 2 arranged at the front end of the mounting portion 1, wherein at least one wafer adsorption hole 3 is provided on the surface of the adsorption portion 2, and a patch ring support plate 4 is extended outward from both sides of the adsorption portion 2, and at least one patch ring adsorption hole 5 is provided on the surface of the patch ring support plate 4; at least one patch ring adsorption hole 5 is provided on the surface of the adsorption portion 2 away from the mounting portion 1.
[0023] This solution adds a patch ring support plate 4 and a patch ring adsorption hole 5 on the basis of the existing wafer adsorption finger, so that the wafer adsorption finger can not only adsorb the wafer 7, but also adsorb the wafer patch ring 8. The structure of the existing wafer adsorption finger generally includes a mounting portion 1, and an adsorption portion 2 arranged at the front end of the mounting portion 1, and at least one wafer adsorption hole 3 is provided on the surface of the adsorption portion 2, wherein the mounting portion 1 is used to connect the finger connector, and the wafer adsorption hole 3 is used to adsorb the wafer 7. At the same time, an airway is provided inside the adsorption portion 2 and connected to the wafer adsorption hole 3. On this basis, both sides of the adsorption portion 2 of this solution extend outwardly with a patch ring support plate 4, and the patch ring support plate 4 is provided with at least one patch ring adsorption hole 5. At the same time, the surface of the adsorption portion 2 away from the mounting portion 1 is provided with at least one patch ring adsorption hole 5. The patch ring support plate 4 and the patch ring adsorption hole 5 work together to adsorb the wafer patch ring 8, so as to achieve the effect that the wafer adsorption finger can be compatible with the wafer patch ring 8. In addition, the air channel provided inside the adsorption portion 2 is also communicated with the patch ring adsorption hole 5 .
[0024] In some embodiments, the surface of the mounting portion 1 is provided with air holes 6 for connecting to an air source and ventilating the airway inside the wafer finger.
[0025] Specifically, it is a common choice in the art to provide air holes 6 on the surface of the mounting portion 1, and to connect the air source and ventilate the airway inside the wafer finger through the air holes 6. In addition, the mounting portion 1 can be fixed on the finger connector by a cover plate.
[0026] In some embodiments, the wafer adsorption holes 3 are disposed on the central axis of the adsorption portion 2 , or are symmetrically disposed along the central axis of the adsorption portion 2 .
[0027] Specifically, in order to improve the stability of the wafer 7 when being adsorbed by the adsorption portion 2 , the wafer adsorption holes 3 should be arranged on the central axis of the adsorption portion 2 , or symmetrically arranged along the central axis of the adsorption portion 2 .
[0028] In some embodiments, the patch ring support plate 4 is symmetrically arranged on both sides of the adsorption portion 2 along the central axis of the adsorption portion 2 .
[0029] Similarly, in order to improve the stability of the wafer bonding ring 8 when being adsorbed, the bonding ring support plate 4 of this solution is symmetrically arranged on both sides of the adsorption part 2 along the central axis of the adsorption part 2.
[0030] In some embodiments, the patch ring adsorption holes 5 are symmetrically arranged along the central axis of the adsorption portion 2 .
[0031] In some embodiments, the projection of the patch ring adsorption hole 5 on the plane corresponds to the shape of the wafer patch ring 8 .
[0032] Specifically, to improve the stability of the wafer patch ring 8 when being adsorbed by the patch ring adsorption hole 5, the patch ring adsorption hole 5 can be symmetrically arranged along the central axis of the adsorption portion 2, and the projection of the patch ring adsorption hole 5 on the plane corresponds to the shape of the wafer patch ring 8.
[0033] At the same time, it should be understood that in order to adapt to wafer patch rings 8 of different specifications, the patch ring adsorption holes 5 arranged on the patch ring support plate 4 and the front section of the adsorption part 2 can be arranged according to the shapes of wafer patch rings 8 of different specifications, so that when wafer patch rings 8 of different specifications need to be adsorbed, different patch ring adsorption holes 5 can be adaptively selected for adsorption.
[0034] Those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features from different embodiments is meant to be within the scope of the present application and to form different embodiments.
[0035] Those skilled in the art will appreciate that the description of each embodiment has its own emphasis, and for parts not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0036] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations all fall within the scope defined by the attached claims. The above are only specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present utility model, and these modifications or replacements should be included in the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be based on the protection scope of the claims.
[0037] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A wafer finger compatible with a wafer bonding ring, comprising: A mounting portion, and an adsorption portion arranged at the front end of the mounting portion, wherein the surface of the adsorption portion is provided with at least one wafer adsorption hole, and is characterized in that a patch ring support plate is extended outwardly from both sides of the adsorption portion, and the surface of the patch ring support plate is provided with at least one patch ring adsorption hole; and at least one patch ring adsorption hole is provided on the surface of the adsorption portion away from one end of the mounting portion.
2. A wafer finger compatible with a wafer bonding ring according to claim 1, characterized in that: The surface of the mounting portion is provided with air holes for connecting to an air source and ventilating the airway inside the wafer finger.
3. The wafer finger compatible with a wafer bonding ring according to claim 1, characterized in that: The wafer adsorption holes are arranged on the central axis of the adsorption portion, or are symmetrically arranged along the central axis of the adsorption portion.
4. The wafer finger compatible with a wafer bonding ring according to claim 1, characterized in that: The patch ring support plate is symmetrically arranged on both sides of the adsorption portion along the central axis of the adsorption portion.
5. The wafer finger compatible with a wafer bonding ring according to claim 1, characterized in that: The patch ring adsorption holes are symmetrically arranged along the central axis of the adsorption portion.
6. The wafer finger compatible with a wafer bonding ring according to claim 5, characterized in that: The projection of the patch ring adsorption hole on the plane corresponds to the shape of the wafer patch ring.