High density terminal module

Abstract

A high-density terminal module is provided with a bearing substrate unit which is provided with a plurality of open holes, a vacuum suction nozzle action area and a terminal adhesion area; and the group of columnar conductors are adhered to the terminal adhesion area through a layer of debonding adhesive, and the group of columnar conductors are correspondingly erected above the terminal adhesion area and are distributed in the terminal adhesion area in a preset pattern.

Description

Technical Field

[0001] The utility model relates to a terminal module, in particular to a high-density terminal module used for semiconductor packaging. Background Art

[0002] With the evolution of semiconductor technology, the packaging of many chips has involved the installation process of high-density pin terminals on a wafer or a circuit board.

[0003] However, since the conventional lead terminal mounting process generally uses a pick and place method, the mounting efficiency of the lead terminal is poor.

[0004] In addition, the conventional high-density pin chip packaging process uses solder balls as pins. Specifically, the pin formation process includes: forming a plurality of through holes on a substrate by an etching process; performing an electroplating process on the through holes to form a plurality of conductive through holes; and fixing a solder ball on each opening of the conductive through holes to form a pin structure.

[0005] However, the pin forming process still has the following disadvantages: 1. The etching process is not easy to produce high aspect ratio through holes on the substrate; 2. The electroplating process will increase the cost; and 3. The instability of the solder ball fixing process will also cause height differences of the pin joints.

[0006] In order to solve the above problems, a novel high-density terminal module is urgently needed in the art. Utility Model Content

[0007] One purpose of the utility model is to provide a high-density terminal module, which can set multiple groups of terminals on multiple bearing areas of a tooling board through a batch terminal alignment process, and cut the tooling board through a batch cutting process to produce multiple terminal modules, thereby efficiently meeting the pin installation requirements of multiple circuit units on a wafer or a circuit board.

[0008] Another object of the utility model is to provide a high-density terminal module, which can be configured with a plurality of openings on the carrier substrate of each terminal module so that each circuit unit can be subjected to an injection-type resin sealing process through the openings of the carrier substrate in an injection-type mold when a unit of the carrier substrate is adhered thereto, thereby optimizing the resin sealing effect of each circuit unit.

[0009] Another object of the present invention is to provide a high-density terminal module, which can effectively prevent the columnar conductor from being skewed due to lateral impact during the resin sealing process, and can also allow the central area of ​​the terminal module to be fully injected with resin.

[0010] Another object of the present invention is to provide a high-density terminal module, which can remove impurities between each circuit unit and the carrier substrate through the openings before performing the top-injection resin sealing process.

[0011] To achieve the above object, a high-density terminal module is proposed, which comprises:

[0012] A carrier substrate unit having a plurality of openings, a vacuum nozzle action area and a terminal adhesion area; and

[0013] A group of columnar conductors are adhered to the terminal adhesion area via a layer of removable adhesive. The group of columnar conductors are erected above the terminal adhesion area and are distributed in the terminal adhesion area in a predetermined pattern.

[0014] In a possible embodiment, the material of the columnar conductor may include gold, silver, platinum, copper, nickel, tin, lead or manganese.

[0015] In possible embodiments, the material of the carrier substrate unit may include aluminum, copper, stainless steel, or glass-reinforced epoxy laminate (FR4).

[0016] In a possible embodiment, the degradable adhesive may be a low-temperature hydrolyzed adhesive, a high-temperature hydrolyzed adhesive, a cold-degradable adhesive, or a hot-degradable adhesive.

[0017] In one embodiment, the vacuum nozzle action area is used for a vacuum nozzle device to suck and pick up the terminal modules.

[0018] In one embodiment, the group of columnar conductors is used for corresponding thermal compression bonding with a circuit unit on a wafer or a circuit board to provide pins for multiple pads of the circuit unit, and the pads of the circuit unit all have a distribution pattern identical to the predetermined pattern.

[0019] In one embodiment, the openings are used to receive an over-injection resin sealing process in an over-injection mold.

[0020] In one embodiment, after the top-injection resin sealing process is completed, each circuit unit can be removed from the layer of debondable adhesive and the carrier substrate unit to which it is attached through a debonding operation.

[0021] In one embodiment, after the top-injection resin sealing process is completed, each circuit unit can be subjected to a grinding operation to remove the layer of removable adhesive and the carrier substrate unit to which it is attached.

[0022] In order to further understand the structure, features, purpose and advantages of the present invention, attached drawings and detailed description of preferred embodiments are provided below. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figures 1a to 1d A schematic diagram showing the manufacturing principle of the high-density terminal module of the utility model; and

[0024] Figures 2a to 2c Schematic diagrams of three embodiments of the high-density terminal module of the utility model are shown.

[0025] Reference numerals:

[0026] 10: Transient substrate;

[0027] 11: First, the adhesive can be debonded;

[0028] 12: Carrying substrate;

[0029] 12a: bearing area;

[0030] 13: The second can be debonded;

[0031] 14: Columnar conductor;

[0032] 15: High-density terminal module;

[0033] 15a: vacuum nozzle action area;

[0034] 15b: opening;

[0035] 15c: Terminal bonding area. DETAILED DESCRIPTION

[0036] Please refer to Figures 1a to 1d , which shows a schematic diagram of the manufacturing principle of the high-density terminal module of the utility model. Figures 1a to 1d As shown, the production principle of the high-density terminal module is as follows:

[0037] (i) A temporary substrate 10 is adhered to a carrier substrate 12 via a first removable adhesive 11. The carrier substrate 12 has a plurality of carrier areas 12a (such as Figure 2a As shown), the first debondable adhesive 11 may be a low-temperature hydrolyzed adhesive, a cold-dissolving adhesive or a thermally dissolving adhesive, wherein the low-temperature hydrolyzed adhesive has a first hydrolysis threshold temperature, the cold-dissolving adhesive has a first debonding threshold temperature lower than room temperature, and the thermally disbonding adhesive has a second debonding threshold temperature higher than room temperature;

[0038] (ii) attaching a plurality of columnar conductors 14 to the supporting areas 12a via a layer of a second removable adhesive 13, wherein the columnar conductors 14 are correspondingly erected above the supporting areas 12a and are distributed in the supporting areas 12a in a predetermined pattern, and performing a curing process on the layer of the second removable adhesive 13 to fix the columnar conductors 14. The fixing process is a heat curing process or an ultraviolet light curing process (such as Figure 2b shown);

[0039] (3) Performing a first debonding operation on the first debondable adhesive 11 to remove the temporary substrate 10 and the first debondable adhesive 11 (the situation is as follows) Figure 2c As shown), wherein, when the first debondable adhesive 11 is the low-temperature hydrolyzed adhesive, the first debonding operation includes placing the first debondable adhesive 11 in water below the first hydrolysis threshold temperature; when the first debondable adhesive 11 is the cold debondable adhesive, the first debonding operation includes placing the first debondable adhesive 11 in a space below the first debondable threshold temperature; when the first debondable adhesive 11 is the hot debondable adhesive, the first debonding operation includes placing the first debondable adhesive 11 in a space above the second debondable threshold temperature; and

[0040] (iv) A longitudinal cutting process is performed on the carrier substrate 12 along the boundaries of the carrier regions 12a to produce a plurality of high-density terminal modules 15 (such as Figure 1d shown).

[0041] Specifically, the material of the columnar conductor 14 may include gold, silver, platinum, copper, nickel, tin, lead or manganese.

[0042] In addition, the high-density terminal modules 15 are used for corresponding thermal compression bonding with multiple circuit units on a wafer or a circuit board to provide pins for multiple solder pads of each circuit unit, and the solder pads of each circuit unit have a distribution pattern that is the same as the predetermined pattern to facilitate batch installation of pins.

[0043] Please refer to Figures 2a to 2c , which shows schematic diagrams of three embodiments of the high-density terminal module 15. Figures 2a to 2c As shown, the carrying area has a vacuum nozzle action area 15a, a plurality of openings 15b and a terminal adhesion area 15c.

[0044] According to this arrangement, the method for making the high-density terminal module of the present invention can use a vacuum nozzle device (not shown in the figure) to absorb the vacuum nozzle action area 15a of the high-density terminal modules 15 to pick up the high-density terminal modules 15, wherein the nozzle diameter of the vacuum nozzle device is about 6mm. In addition, the terminal adhesion area 15c of the support area can adhere a plurality of columnar conductors 14 through a layer of a second removable adhesive 13, wherein the debonding condition of the second removable adhesive 13 is different from that of the first removable adhesive 11.

[0045] It is worth mentioning that after each high-density terminal module 15 is joined to the corresponding circuit unit, each circuit unit can be subjected to an injection-type resin sealing process in an injection-type mold through the openings 15b of the unit of the carrier substrate 12 while being adhered to a unit of the carrier substrate 12. In addition, before the injection-type resin sealing process is performed, the openings 15b can also be used to remove impurities between each circuit unit and the unit of the carrier substrate 12.

[0046] In addition, after the injection-type resin sealing process, each of the circuit units can remove a unit of the layer of second removable adhesive 13 and the unit of the carrier substrate 12 to which it is attached through a second debonding operation, or remove a unit of the layer of second removable adhesive 13 and the unit of the carrier substrate 12 to which it is attached through a grinding operation, wherein the second debonding operation is substantially mutually exclusive with the first debonding operation, for example: when the first debonding operation is a low-temperature hydrolysis operation, the second debonding operation is a high-temperature hydrolysis operation (that is, the second removable adhesive in this case is a high-temperature hydrolyzed adhesive); when the first debonding operation is a cold debonding operation, the second debonding operation is a hot debonding operation; and so on.

[0047] In addition, the material of the temporary substrate 10 may include aluminum, copper, stainless steel or glass reinforced epoxy laminate (FR4); and the material of the carrier substrate 12 may include aluminum, copper, stainless steel or glass reinforced epoxy laminate (FR4).

[0048] Alternatively, the longitudinal cutting process may be performed using a laser device.

[0049] In addition, it is worth mentioning that the thickness of the supporting substrate 12 at the boundaries of the supporting regions 12 a may be smaller than the thickness of the remaining portions to facilitate the longitudinal cutting process.

[0050] According to the above design, the utility model has the following advantages:

[0051] 1. The high-density terminal module of the utility model can be provided with multiple groups of terminals on multiple bearing areas of a tooling board through a batch terminal alignment process, and the tooling board can be cut through a batch cutting process to produce multiple terminal modules, thereby efficiently meeting the pin installation requirements of multiple circuit units on a wafer or a circuit board;

[0052] Second, the high-density terminal module of the utility model can be provided with a plurality of openings on the carrier substrate of each terminal module, so that each circuit unit can be subjected to an injection-type resin sealing process through the openings of the carrier substrate in an injection-type mold when a unit of the carrier substrate is adhered, thereby optimizing the resin sealing effect of each circuit unit;

[0053] 3. The high-density terminal module of the utility model can effectively prevent the columnar conductor from being skewed due to lateral impact during the resin sealing process, and can also allow the central area of ​​the terminal module to be fully injected with resin; and

[0054] Fourth, the high-density terminal module of the present invention can remove impurities between each circuit unit and the carrier substrate through the openings before performing the top-injection resin sealing process.

[0055] What is disclosed in the present invention is a preferred embodiment. Any local changes or modifications that are derived from the technical concept of the present invention and are easily inferred by those skilled in the art do not deviate from the scope of the patent right of the present invention.

Claims

1. A high-density terminal module, characterized in that: have: A carrier substrate unit having a plurality of openings, a vacuum nozzle action area and a terminal adhesion area; as well as A group of columnar conductors are adhered to the terminal adhesion area via a layer of removable adhesive. The group of columnar conductors are erected above the terminal adhesion area and are distributed in the terminal adhesion area in a predetermined pattern.

2. The high-density terminal module according to claim 1, characterized in that: The vacuum suction nozzle action area is used for a vacuum suction nozzle device to absorb and take the terminal modules.

3. The high-density terminal module according to claim 1, characterized in that: The group of columnar conductors is used for corresponding thermal compression bonding with a circuit unit on a wafer or a circuit board to provide pins for a plurality of welding pads of the circuit unit, and the welding pads of the circuit unit all have a distribution pattern identical to the predetermined pattern.

4. The high-density terminal module according to claim 3, characterized in that: The openings are used to receive an over-injection resin sealing process in an over-injection mold.

5. The high-density terminal module according to claim 4, characterized in that: After the top-injection resin sealing process is completed, each circuit unit can be removed from the layer of debondable adhesive and the carrier substrate unit to which it is attached through a debonding operation.

6. The high-density terminal module according to claim 4, characterized in that: After the top-injection resin sealing process is completed, each circuit unit can be subjected to a grinding operation to remove the layer of removable adhesive and the carrier substrate unit to which it is attached.

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