Integrated circuit hybrid automobile LED lamp holder module

Abstract

An integrated circuit hybrid type automobile LED lamp holder module is characterized in that an IC packaging layer and an IC packaging bottom plate are arranged, a groove is formed in the IC packaging bottom plate, a PCB substrate is arranged at the bottom of the groove, and discrete component bare silicon wafers, IC bare silicon wafers, LED wafers and ultra-small packaging resistance-capacitance components are arranged on the PCB substrate; and the IC packaging layer is arranged on the IC packaging bottom plate and wraps the discrete component bare silicon wafer, the IC bare silicon wafer, the LED wafer and the ultra-small packaging resistance-capacitance element on the PCB substrate. The integrated circuit chip has the advantages that the integrated circuit chip with the complete automobile LED lamp holder module function is obtained through the SMT and wafer bonding mixed packaging technology, and the integrated circuit chip has the advantages of being small in size, simple in structure, low in cost and easy to produce; meanwhile, external interference can be prevented, the safety of the integrated circuit is protected, and therefore the stability and reliability of the circuit are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, in particular to an integrated circuit hybrid automobile LED lamp holder module. Background Art

[0002] As the demand for lighting and decoration in automobiles increases, the number of parts for lighting or decorative lamps used in automobiles is also increasing year by year. The traditional manufacturing method uses the process of "independent lamp beads + drive circuit + SMT patch welding PCB board" for manufacturing, which has some problems: different drive circuits need to be customized for different lamps; a large number of electrical tests must be done before mass production of each new model; different components are purchased for different products, which cannot maximize the advantages of centralized procurement and the cost cannot be optimized. Utility Model Content

[0003] The utility model provides an integrated circuit hybrid automobile LED lamp holder module, which can meet the lighting and decoration requirements of the automobile through a small automobile LED lamp holder module with integrated chips.

[0004] In order to achieve the above-mentioned object, the utility model provides an integrated circuit hybrid automotive LED lamp head module, the key of which is: an IC packaging layer and an IC packaging bottom plate are provided, a groove is provided on the IC packaging bottom plate, a PCB substrate is provided at the bottom of the groove, and a discrete component bare silicon chip, an IC bare silicon chip, an LED wafer and an ultra-small packaged resistor and capacitor component are arranged on the PCB substrate;

[0005] The IC packaging layer covers the IC packaging bottom plate and wraps the discrete component bare silicon wafer, IC bare silicon wafer, LED wafer and ultra-small packaged resistor and capacitor components on the PCB substrate.

[0006] Through the above design, after miniaturizing and packaging the commonly used LED driving circuits, lamp bead wafers, driving circuit components, etc., they are integrated onto an ultra-thin PCB substrate through the hybrid packaging process of "SMT+wafer bonding", and then chip-level packaging is performed using a suitable light-transmitting method to obtain an integrated circuit chip with complete automotive LED lamp module functions; the LED lamp module product that originally used a printed circuit board PCBA to realize its function is transformed into a product that uses a chip or module package to realize the same function.

[0007] The PCB substrate has a prefabricated circuit built in;

[0008] The discrete component bare silicon chip, IC bare silicon chip, LED wafer and ultra-small packaged resistor and capacitor components are connected via the prefabricated circuit to form an LED driving circuit.

[0009] The discrete component bare silicon chip, IC bare silicon chip, LED wafer and ultra-small packaged resistor and capacitor components are arranged on a PCB substrate and connected through a prefabricated circuit in the PCB substrate to obtain an integrated circuit with the function of a complete automotive LED lamp head module.

[0010] Preferably, the discrete component bare silicon wafer, IC bare silicon wafer and LED wafer are connected to the PCB substrate through a bonding process.

[0011] The bonding process is a wire bonding method in the chip production process. It is generally used to connect the internal circuit of the chip with the packaging pin or the gold-plated copper foil of the circuit board with gold wire or aluminum wire before packaging. The ultrasonic wave from the ultrasonic generator, generally 40-140KHz, generates high-frequency vibration through the transducer and is transmitted to the splitter through the amplitude rod. When the splitter contacts the lead and the welded part, under the action of pressure and vibration, the metal surfaces to be welded rub against each other, the oxide film is destroyed, and plastic deformation occurs, causing the two pure metal surfaces to be in close contact, achieving a bond at an atomic distance, and finally forming a strong mechanical connection.

[0012] Bonding chips connect the internal circuit of the chip to the packaging pins of the circuit board through gold wires, and then precisely cover it with organic materials with special protective functions to complete the post-packaging. The chip is completely protected by organic materials and isolated from the outside world, so there is no moisture, static electricity, or corrosion. At the same time, the organic material is melted at high temperature, covered on the chip, and then dried by an instrument, making it seamlessly connected to the chip, completely eliminating physical wear of the chip and providing higher stability.

[0013] The discrete component bare silicon wafer, IC bare silicon wafer and LED wafer are connected to the PCB substrate through a bonding process, and have the characteristics of better corrosion resistance, stronger shock resistance and better stability.

[0014] Preferably, the ultra-small packaged RC components are soldered on the PCB substrate by STM process.

[0015] The SMT process is surface assembly technology, that is, surface mounting technology. It is a circuit assembly technology that mounts leadless or short-lead surface assembly components on the surface of a printed circuit board or other substrate, and assembles them by soldering through reflow soldering or dip soldering.

[0016] The SMT process can accurately install ultra-small packaged resistors and capacitors on fixed positions on the PCB substrate. It has the characteristics of high reliability, strong vibration resistance, small size of electronic products, and high assembly density.

[0017] Preferably, the PCB substrate is an ultra-thin PCB substrate.

[0018] Preferably, the IC packaging layer is made of a transparent IC packaging material.

[0019] The IC packaging layer is made of transparent IC packaging material, which ensures the lighting effect of the LED chip while realizing the overall packaging of the chip, so that the lighting effect of the LED chip will not be affected by the packaging layer.

[0020] It is also possible to combine transparent IC packaging materials and opaque IC packaging materials according to actual use requirements, set reasonable light outlets, and realize diversified lighting methods of automotive LED lamp head module chips.

[0021] Preferably, the IC packaging material is either silica gel or epoxy resin.

[0022] Preferably, the discrete component bare silicon chip is provided with a triode or a diode. Suitable components can be selected according to specific integrated circuit design requirements.

[0023] Preferably, the LED driving circuit is an LED driving circuit with a current limiting resistor, wherein the ultra-small packaged RC element is provided with a current limiting resistor, one end of the current limiting resistor is connected to an external power supply via a power pin, and the other end is connected to the anode of an LED chip, and the cathode of the LED chip is grounded.

[0024] The current limiting resistor is used for voltage division and current limiting to protect circuit safety.

[0025] Preferably, the LED driving circuit is a constant current source LED driving circuit, wherein the discrete component bare silicon wafer is provided with an NPN transistor Q1, an NPN transistor Q2 and a diode D1, the LED chip is provided with LED1 and LED2, and the ultra-small packaged RC components are provided with capacitors C1, C2, C3, C4, C5, C6, resistors R1 and R3;

[0026] The anode of the diode D1 is connected to an external power supply via a power pin, the anode of the diode D1 is connected in series with capacitors C3 and C4 in sequence and then grounded, the cathode of the diode D1 is connected to the anode of the LED1, the cathode of the diode D1 is connected in series with capacitor C5 and then grounded, and the cathode of the diode D1 is also connected to one end of the resistor R1;

[0027] The cathode of LED1 is connected to the anode of LED2, a capacitor C1 is connected in parallel between the anode and cathode of LED1, the cathode of LED2 is connected to the collector of transistor Q1, a capacitor C2 is connected in parallel between the anode and cathode of LED2;

[0028] The base of the transistor Q1 is connected to the other end of the resistor R1, the emitter of the transistor Q1 is connected in series with a resistor R3 and then grounded, and the emitter of the transistor Q1 is also connected in series with a capacitor C6 and then grounded; the other end of the resistor R1 is also connected to the collector of the transistor Q2, the base of the transistor Q2 is connected to the emitter of the transistor Q1, and the emitter of the transistor Q2 is grounded.

[0029] The constant current source LED driving circuit can ensure that the working current of the LED lamp is constant, so that the brightness and life of the LED lamp can be effectively controlled; in addition, the constant current source LED driving circuit also has the characteristics of high efficiency, stability and reliability.

[0030] Preferably, the LED driving circuit is a constant current source LED driving circuit with MCU, wherein the discrete component bare silicon wafer is provided with a diode D2, a transient suppression diode TVS1 and an electrostatic protection diode ESD1, the LED chip is provided with an LED3, the ultra-small packaged RC components are provided with a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a resistor R2 and a magnetic bead FB1, and the IC bare silicon wafer is provided with an MCU microprocessor chip IC1;

[0031] One end of the resistor R2 is connected to an external power supply via a power pin, and the other end is connected to the anode of a diode D2. The power supply is also connected in series with a transient suppression diode TVS1 and then grounded. The power supply is also connected in series with capacitors C7 and C8 in sequence and then grounded. The other end of the resistor is also connected in series with a capacitor C9 and then grounded.

[0032] The cathode of the diode D2 is connected to the cathode terminal group of the LED3, and the anode terminal group of the LED3 is correspondingly connected to the LED terminal group of the MCU microprocessor chip IC1; the cathode of the diode D2 is also connected to the power supply terminal VBAT of the MCU microprocessor chip IC1, and the power supply terminal VBAT is also connected in series with a capacitor C10 and then grounded;

[0033] The input terminal LINS of the MCU microprocessor chip IC1 obtains the lin signal through the magnetic bead FB1, and the input terminal is also connected in series with the capacitor C11 and then grounded. The input terminal is also connected in series with the magnetic bead FB1 and the electrostatic protection diode ESD1 and then grounded. The power supply terminal VDD3V3 of the MCU microprocessor chip IC1 is connected to a 3V power supply, and the power supply terminal VDD3V3 is also connected in series with the capacitor C12 and then grounded.

[0034] The constant current source LED driving circuit with MCU not only has the characteristics of a constant current source LED driving circuit, but also can control and adjust the light signal of the LED to achieve a satisfactory lighting effect.

[0035] The beneficial effects of the utility model are as follows: through the hybrid packaging process of "SMT+wafer bonding", an integrated circuit chip with complete automotive LED lamp head module functions is obtained, which has the characteristics of small size, simple structure, low cost and easy production; at the same time, it can also prevent external interference, protect the safety of the integrated circuit, thereby improving the circuit stability and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a schematic diagram of the structure of the utility model;

[0037] Figure 2 This is a packaging diagram of the LED driving circuit with a current limiting resistor in Example 1;

[0038] Figure 3 This is a packaging diagram of the constant current source LED driving circuit in Example 2;

[0039] Figure 4 This is a circuit diagram of a constant current source LED driver package with an MCU in Example 3;

[0040] Figure 5 This is the constant current source LED driving circuit diagram in Example 2;

[0041] Figure 6 This is a constant current source LED driving circuit diagram with MCU in Example 3. DETAILED DESCRIPTION

[0042] The present invention is further described in detail below in conjunction with the accompanying drawings and specific examples. The following embodiments or drawings are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0043] Embodiment 1:

[0044] like Figure 1 As shown: an integrated circuit hybrid automotive LED lamp module, the key of which is: an IC packaging layer 1 and an IC packaging base plate 2 are provided, a groove is opened on the IC packaging base plate 2, a PCB substrate 3 is provided at the bottom of the groove, and a discrete component bare silicon chip 4, an IC bare silicon chip 5, an LED chip 6 and an ultra-small packaged resistor and capacitor component 7 are arranged on the PCB substrate 3;

[0045] The PCB substrate 3 has a prefabricated circuit built therein.

[0046] The discrete component bare silicon chip 4, IC bare silicon chip 5, LED wafer 6 and ultra-small packaged resistor and capacitor components 7 are connected via the prefabricated circuit to form an LED driving circuit.

[0047] The discrete component bare silicon chip 4, IC bare silicon chip 5 and LED chip 6 are connected to the PCB substrate 3 through a bonding process.

[0048] The ultra-small packaged RC element 7 is soldered on the PCB substrate 3 by STM process.

[0049] The IC packaging layer 1 covers the IC packaging base plate 2 and wraps the discrete component bare silicon chip 4, IC bare silicon chip 5, LED chip 6 and ultra-small packaged resistor and capacitor components 7 on the PCB substrate 3.

[0050] The IC packaging layer 1 is made of a transparent IC packaging material, and the transparent IC packaging material is silica gel.

[0051] The LED driving circuit in Example 1 is an LED driving circuit with a current limiting resistor, and the LED driving circuit with a current limiting resistor is packaged as a whole. Figure 2 As shown, the ultra-small packaged RC element 7 is provided with a current limiting resistor, one end of the current limiting resistor is connected to an external power supply via a power pin, and the other end is connected to the anode of the LED chip, and the cathode of the LED chip is grounded.

[0052] Embodiment 2: Embodiment 2 is based on Embodiment 1. The difference between Embodiment 2 and Embodiment 1 is that the LED driving circuit is different. The LED driving circuit in Embodiment 2 is a constant current source LED driving circuit. The constant current source LED driving circuit is packaged as a whole. Figure 3 shown.

[0053] The discrete component bare silicon wafer 4 is provided with an NPN transistor Q1, an NPN transistor Q2 and a diode D1, the LED chip 6 is provided with an LED1 and an LED2, and the ultra-small packaged RC component 7 is provided with a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a resistor R1 and a resistor R3;

[0054] like Figure 5 As shown: the anode of the diode D1 is connected to the external power supply through the power pin, the anode of the diode D1 is connected in series with capacitors C3 and C4 in sequence and then grounded, the cathode of the diode D1 is connected to the anode of LED1, the cathode of the diode D1 is connected in series with capacitor C5 and then grounded, and the cathode of the diode D1 is also connected to one end of the resistor R1;

[0055] The cathode of LED1 is connected to the anode of LED2, a capacitor C1 is connected in parallel between the anode and cathode of LED1, the cathode of LED2 is connected to the collector of transistor Q1, a capacitor C2 is connected in parallel between the anode and cathode of LED2;

[0056] The base of the transistor Q1 is connected to the other end of the resistor R1, the emitter of the transistor Q1 is connected in series with a resistor R3 and then grounded, and the emitter of the transistor Q1 is also connected in series with a capacitor C6 and then grounded; the other end of the resistor R1 is also connected to the collector of the transistor Q2, the base of the transistor Q2 is connected to the emitter of the transistor Q1, and the emitter of the transistor Q2 is grounded.

[0057] Embodiment 3: Embodiment 3 is based on Embodiment 1. The difference between Embodiment 3 and Embodiment 1 is that the LED driving circuit is different. The LED driving circuit in Embodiment 3 is a constant current source LED driving circuit with an MCU. The constant current source LED driving circuit with an MCU is packaged as a whole. Figure 4 shown.

[0058] The discrete component bare silicon wafer 4 is provided with a diode D2, a transient suppression diode TVS1 and an electrostatic protection diode ESD1, the LED chip 6 is provided with an LED3, the ultra-small package resistor and capacitor component 7 is provided with a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a resistor R2 and a magnetic bead FB1, and the IC bare silicon wafer 5 is provided with an MCU microprocessor chip IC1;

[0059] like Figure 6 As shown: one end of the resistor R2 is connected to an external power supply through a power pin, and the other end is connected to the anode of a diode D2. The power supply is also connected in series with a transient suppression diode TVS1 and then grounded. The power supply is also connected in series with capacitors C7 and C8 in sequence and then grounded. The other end of the resistor is also connected in series with a capacitor C9 and then grounded.

[0060] The cathode of the diode D2 is connected to the cathode terminal group of the LED3, and the anode terminal group of the LED3 is correspondingly connected to the LED terminal group of the MCU microprocessor chip IC1; the cathode of the diode D2 is also connected to the power supply terminal VBAT of the MCU microprocessor chip IC1, and the power supply terminal VBAT is also connected in series with a capacitor C10 and then grounded;

[0061] The input terminal LINS of the MCU microprocessor chip IC1 obtains the lin signal through the magnetic bead FB1, and the input terminal is also connected in series with the capacitor C11 and then grounded. The input terminal is also connected in series with the magnetic bead FB1 and the electrostatic protection diode ESD1 and then grounded. The power supply terminal VDD3V3 of the MCU microprocessor chip IC1 is connected to a 3V power supply, and the power supply terminal VDD3V3 is also connected in series with the capacitor C12 and then grounded.

[0062] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An integrated circuit hybrid automotive LED lamp module, characterized in that: An IC packaging layer (1) and an IC packaging base plate (2) are provided, the IC packaging base plate (2) is provided with a groove, a PCB substrate (3) is provided at the bottom of the groove, and a discrete component bare silicon chip (4), an IC bare silicon chip (5), an LED chip (6) and an ultra-small packaged resistor and capacitor component (7) are arranged on the PCB substrate (3); The IC packaging layer (1) covers the IC packaging base plate (2) and encapsulates the discrete component bare silicon chip (4), IC bare silicon chip (5), LED chip (6) and ultra-small packaged resistor and capacitor components (7) on the PCB substrate (3); The PCB substrate (3) has a prefabricated circuit built into it; The discrete component bare silicon chip (4), the IC bare silicon chip (5), the LED chip (6) and the ultra-small packaged resistor and capacitor element (7) are connected via the prefabricated circuit to form an LED drive circuit.

2. The integrated circuit hybrid automotive LED lamp holder module according to claim 1, characterized in that: The discrete component bare silicon chip (4), the IC bare silicon chip (5) and the LED chip (6) are connected to the PCB substrate (3) through a bonding process.

3. The integrated circuit hybrid automotive LED lamp module according to claim 1, characterized in that: The ultra-small packaged resistor and capacitor components (7) are welded on the PCB substrate (3) by means of an STM process.

4. The integrated circuit hybrid automotive LED lamp module according to claim 1, characterized in that: The PCB substrate (3) is an ultra-thin PCB substrate (3).

5. The integrated circuit hybrid automotive LED lamp module according to claim 1, characterized in that: The IC packaging layer (1) is made of a transparent IC packaging material.

6. The integrated circuit hybrid automotive LED lamp module according to claim 5, characterized in that: The IC packaging material is either silica gel or epoxy resin.

7. The integrated circuit hybrid automotive LED lamp holder module according to claim 1, characterized in that: The discrete component bare silicon wafer (4) is provided with a triode or a diode.

8. The integrated circuit hybrid automotive LED lamp module according to claim 1, characterized in that: The LED driving circuit is an LED driving circuit with a current limiting resistor, wherein the ultra-small packaged resistor and capacitor element (7) is provided with a current limiting resistor, one end of the current limiting resistor is connected to an external power supply via a power pin, and the other end is connected to the anode of an LED chip, and the cathode of the LED chip is grounded.

9. The integrated circuit hybrid automotive LED lamp module according to claim 1, characterized in that: The LED driving circuit is a constant current source LED driving circuit, wherein the discrete component bare silicon chip (4) is provided with an NPN transistor Q1, an NPN transistor Q2 and a diode D1, the LED chip (6) is provided with an LED1 and an LED2, and the ultra-small packaged resistor and capacitor component (7) is provided with a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a resistor R1 and a resistor R3; The anode of the diode D1 is connected to an external power supply via a power pin, the anode of the diode D1 is connected in series with capacitors C3 and C4 in sequence and then grounded, the cathode of the diode D1 is connected to the anode of the LED1, the cathode of the diode D1 is connected in series with capacitor C5 and then grounded, and the cathode of the diode D1 is also connected to one end of the resistor R1; The cathode of LED1 is connected to the anode of LED2, a capacitor C1 is connected in parallel between the anode and cathode of LED1, the cathode of LED2 is connected to the collector of transistor Q1, a capacitor C2 is connected in parallel between the anode and cathode of LED2; The base of the transistor Q1 is connected to the other end of the resistor R1, the emitter of the transistor Q1 is connected in series with a resistor R3 and then grounded, and the emitter of the transistor Q1 is also connected in series with a capacitor C6 and then grounded; the other end of the resistor R1 is also connected to the collector of the transistor Q2, the base of the transistor Q2 is connected to the emitter of the transistor Q1, and the emitter of the transistor Q2 is grounded.

10. The integrated circuit hybrid automotive LED lamp holder module according to claim 1, characterized in that: The LED driving circuit is a constant current source LED driving circuit with an MCU, wherein the discrete component bare silicon wafer (4) is provided with a diode D2, a transient suppression diode TVS1 and an electrostatic protection diode ESD1, the LED chip (6) is provided with an LED3, the ultra-small package resistor and capacitor component (7) is provided with a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a resistor R2 and a magnetic bead FB1, and the IC bare silicon wafer (5) is provided with an MCU microprocessor chip IC1; One end of the resistor R2 is connected to an external power supply via a power pin, and the other end is connected to the anode of a diode D2. The external power supply is also connected in series with a transient suppression diode TVS1 and then grounded. The external power supply is also connected in series with capacitors C7 and C8 in sequence and then grounded. The other end of the resistor is also connected in series with a capacitor C9 and then grounded. The cathode of the diode D2 is connected to the cathode terminal group of the LED3, and the anode terminal group of the LED3 is correspondingly connected to the LED terminal group of the MCU microprocessor chip IC1; the cathode of the diode D2 is also connected to the power supply terminal VBAT of the MCU microprocessor chip IC1, and the power supply terminal VBAT is also connected in series with a capacitor C10 and then grounded; The input terminal LINS of the MCU microprocessor chip IC1 obtains the lin signal through the magnetic bead FB1, and the input terminal of the MCU microprocessor chip IC1 is also connected in series with a capacitor C11 and then grounded. The input terminal of the MCU microprocessor chip IC1 is also connected in series with a magnetic bead FB1 and an electrostatic protection diode ESD1 and then grounded; the power supply terminal VDD3V3 of the MCU microprocessor chip IC1 is connected to a 3V power supply, and the power supply terminal VDD3V3 is also connected in series with a capacitor C12 and then grounded.

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