Driving device for semiconductor wafer cleaning equipment

Abstract

The utility model relates to the technical field of semiconductor cleaning, in particular to a driving device for semiconductor wafer cleaning equipment, which comprises a box body, a water storage tank, a water pump, a spray head, a first fixing block, a servo motor and a clamping component, the rear side of the box body is connected with the water storage tank, the upper side of the water storage tank is provided with the water pump, and the upper part of the water pump is provided with the spray head; first fixing blocks are connected to the left and right of the box body, servo motors are installed on the upper portions of the first fixing blocks, and output shafts of the servo motors are connected with clamping assemblies. According to the utility model, the servo motor, the clamping assembly, the nozzle and other parts are arranged, the output shaft of the servo motor drives the rotating disc to rotate during use, so that a wafer rotates, and the upper clamping block and the lower clamping block clamp the wafer in turn under the action of the arc-shaped edge of the wedge block, so that the wafer is clamped more stably. The situation that the whole surface of the wafer cannot be completely flushed due to the fact that the clamp is blocked due to rotation is avoided, meanwhile, the flushed wafer is dried through the air dryer, and use is convenient and easy.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor cleaning, in particular to a driving device for semiconductor wafer cleaning equipment. Background Art

[0002] The process of preparing semiconductor wafers usually includes steps such as crystal growth, cutting, polishing and cleaning. Cleaning is a crucial step in the semiconductor wafer manufacturing process. Its purpose is to remove various contaminants on the surface of the wafer, such as organic matter, inorganic salts, grease and dust, to ensure the cleanliness and smoothness of the wafer surface.

[0003] After searching, the utility model patent with patent publication number CN208538807U discloses a semiconductor wafer cleaning device, which roughly includes components such as a wafer carrying mechanism, a cleaning tank and a lifting mechanism. When cleaning the wafer, the wafer is placed on the wafer carrying mechanism, and the wafer is rinsed using the liquid outlet of the circulating flushing mechanism. At the same time, the ultrasonic generating mechanism is started to provide ultrasonic waves to the deionized water in the cleaning tank, so that the surface of the wafer can be thoroughly cleaned, and the residual deionized water can be prevented from damaging the structure of the wafer surface. However, during flushing, due to partial obstruction of the wafer carrying mechanism, the entire surface of the wafer cannot be completely rinsed, which may cause uneven texture or reflectivity on the wafer surface, affecting subsequent preparation steps and test results. In view of this problem, the utility model provides a driving device for semiconductor wafer cleaning equipment to overcome the problem that the prior art cannot completely clean the wafer due to obstruction by the fixture. Utility Model Content

[0004] In order to overcome the shortcoming of the prior art that the wafer cannot be completely cleaned due to the obstruction of the clamp, the purpose of the utility model is to provide a driving device for semiconductor wafer cleaning equipment.

[0005] The technical solution is: a driving device for semiconductor wafer cleaning equipment, including a box body, a water tank, a water pump, a nozzle, a first fixed block, a servo motor and a clamping assembly. The water tank is fixedly connected to the rear side of the box body, a water pump is fixedly installed on the upper side of the water tank, a nozzle is fixedly installed on the upper part of the water pump, the first fixed blocks are fixedly connected to the left and right sides of the box body, a servo motor is fixedly installed on the upper part of the first fixed block, the output shaft of the servo motor faces the nozzle, and the output shaft of the servo motor is fixedly connected to the clamping assembly.

[0006] Furthermore, it also includes a second fixed block and an air dryer. The front part of the box body is fixedly connected to the second fixed block, and the upper part of the second fixed block is rotatably connected to the air dryer.

[0007] Furthermore, a spiral spring is also included. A spiral spring is provided on the upper part of the second fixed block. One end of the spiral spring is fixedly connected to the second fixed block, and the other end is fixedly connected to the air dryer.

[0008] Furthermore, the clamping assembly includes a rotating disk, a sliding rod, an upper clamping block, a lower clamping block, an elastic member and a wedge block. The servo motor output shaft is fixedly connected to the rotating disk. The rotating disk is slidably connected to two sliding rods on the side of the rotating disk away from the servo motor. The upper sliding rod is fixedly connected to the upper clamping block on the side away from the rotating disk. The lower sliding rod is fixedly connected to the lower clamping block on the side away from the rotating disk. An elastic member is provided between the sliding rod and the rotating disk. Both ends of the elastic member are respectively fixedly connected to the sliding rod and the rotating disk. The servo motor is fixedly connected to the wedge block on the side close to the rotating disk.

[0009] Furthermore, the clamping parts of the upper clamping block and the lower clamping block are both provided with silicone.

[0010] Furthermore, arc-shaped edges are provided at the front and rear parts of the wedge-shaped block.

[0011] The beneficial effects of the utility model are as follows: the utility model is provided with components such as a servo motor, a clamping assembly and a nozzle. When in use, the output shaft of the servo motor drives the rotating disk to rotate, thereby rotating the wafer. Under the action of the arc edge of the wedge block, the upper clamping block and the lower clamping block clamp the wafer in turn, avoiding the inability to completely rinse the entire surface of the wafer due to obstruction of the clamp caused by rotation, thereby improving the wafer processing quality. At the same time, an air dryer is provided to dry the rinsed wafer. The operation is intuitive and the use is convenient and simple. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0013] Figure 2 It is a structural schematic diagram of the box, servo motor, clamping assembly and other components of the utility model.

[0014] Figure 3 It is a cross-sectional view of the rotating disk, the upper clamping block, the lower clamping block and other components of the utility model.

[0015] Figure 4 It is a schematic structural diagram of the second fixing block, the air dryer and the scroll spring of the utility model.

[0016] Figure numbers: 1_box, 2_water tank, 3_water pump, 4_nozzle, 5_first fixed block, 6_servo motor, 7_clamping assembly, 711_rotating disk, 712_sliding rod, 713_upper clamping block, 714_lower clamping block, 715_elastic member, 716_wedge block, 8_second fixed block, 9_air dryer, 10_volute spring. DETAILED DESCRIPTION

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0018] A driving device for semiconductor wafer cleaning equipment, such as Figure 1-Figure 4As shown, it includes a box body 1, a water tank 2, a water pump 3, a nozzle 4, a first fixed block 5, a servo motor 6, a clamping assembly 7, a second fixed block 8, an air dryer 9 and a scroll spring 10. The water tank 2 is fixedly connected to the rear side of the box body 1, the water pump 3 is fixedly installed on the upper side of the water tank 2, and the nozzle 4 is fixedly installed on the upper part of the water pump 3. The spraying range of the nozzle 4 is larger than the diameter of the wafer. The first fixed blocks 5 are fixedly connected to the left and right sides of the box body 1. The servo motor 6 is fixedly installed on the upper part of the first fixed block 5. The output shaft of the servo motor 6 faces the nozzle 4. The output shaft of the servo motor 6 is fixedly connected to the clamping assembly 7. The clamping assembly 7 includes a rotating disk 711, a sliding rod 712, an upper clamping block 713, a lower clamping block 714, an elastic member 715 and a wedge block 716. The servo motor The output shaft of the machine 6 is fixedly connected with a rotating disk 711, and the rotating disk 711 is slidably connected with two sliding rods 712 on one side away from the servo motor 6. The upper sliding rod 712 is fixedly connected with an upper clamping block 713 on one side away from the rotating disk 711, and the lower sliding rod 712 is fixedly connected with a lower clamping block 714 on one side away from the rotating disk 711. The upper clamping block 713 and the lower clamping block 714 are symmetrically arranged, and the distance between the upper clamping block 713 and the lower clamping block 714 is equal to the thickness of the wafer. The clamping parts of the upper clamping block 713 and the lower clamping block 714 are both provided with silicone, which can effectively relieve the pressure of the clamp on the surface of the wafer and reduce the risk of scratches or damage to the surface due to clamping. An elastic member 715 is provided between the sliding rod 712 and the rotating disk 711, and both ends of the elastic member 715 They are fixedly connected to the sliding rod 712 and the rotating disk 711 respectively. A wedge block 716 is fixedly connected to one side of the servo motor 6 housing close to the rotating disk 711. The wedge block 716 is arc-shaped, and arc-shaped edges are provided at the front and rear parts. A second fixed block 8 is fixedly connected to the front of the box body 1. An air dryer 9 is rotatably connected to the upper part of the second fixed block 8. The drying range of the air dryer 9 is larger than the diameter of the wafer. The gas blown out by the air dryer 9 is nitrogen. Using nitrogen air drying can avoid introducing water vapor to the surface of the wafer, thereby preventing water droplets from remaining or water analysis deposition. A volute spring 10 is provided on the upper part of the second fixed block 8. One end of the volute spring 10 is fixedly connected to the second fixed block 8, and the other end is fixedly connected to the air dryer 9. First, the wafer is placed on the lower clamping block 714, and then started. Water pump 3, water pump 3 provides deionized water to nozzle 4, nozzle 4 sprays deionized water to clean the surface of the wafer. After cleaning one side of the wafer surface, servo motor 6 is started, and the output shaft of servo motor 6 drives rotating disk 711 to rotate, thereby driving upper clamping block 713 and lower clamping block 714 to rotate, thereby driving the wafer to rotate. At the same time, due to the rotation of rotating disk 711, upper sliding rod 712 is separated from wedge block 716, and lower sliding rod 712 is in contact with wedge block 716. Due to the separation of upper sliding rod 712 and wedge block 716, upper elastic member 715 is reset, thereby causing upper sliding rod 712 to slide in the direction of upper clamping block 713. Due to the sliding of upper sliding rod 712, upper clamping block 713 is driven to clamp the wafer.At the same time, because the lower sliding rod 712 and the wedge block 716 are in contact with each other, under the action of the arc edge of the wedge block 716, the lower sliding rod 712 slides toward the direction of the servo motor 6, and then the lower sliding rod 712 squeezes the lower elastic member 715, so that the lower clamping block 714 is separated from the wafer, and then the upper clamping block and the lower clamping block clamp the wafer in turn, avoiding the inability to completely rinse the entire surface of the wafer due to the obstruction of the clamp, thereby improving the wafer processing quality. After cleaning, turn off the water pump 3, then rotate the air dryer 9, and blow nitrogen into the air dryer 9 toward the wafer surface. While air drying, the servo motor 6 still drives the wafer to rotate, so that both surfaces of the wafer can be dried. At the same time, due to the rotation of the air dryer 9, the volute spring 10 stores elastic potential energy. When drying is completed, turn off the servo motor 6, release the air dryer 9, and the volute spring 10 releases the elastic potential energy, thereby driving the air dryer 9 to reset.

[0019] Although the utility model is described in detail with reference to the above embodiments, it is obvious to those skilled in the art through this disclosure that various changes or modifications can be made to the utility model without departing from the principle and spirit of the utility model defined by the claims. Therefore, the detailed description of the embodiments of the present disclosure is only used to explain, not to limit the utility model, but the scope of protection is limited by the content of the claims.

Claims

1. A driving device for semiconductor wafer cleaning equipment, comprising a housing (1), a water storage tank (2), a water pump (3) and a nozzle (4), wherein the rear side of the housing (1) is fixedly connected to the water storage tank (2), the upper side of the water storage tank (2) is fixedly mounted with the water pump (3), and the upper part of the water pump (3) is fixedly mounted with the nozzle (4), characterized in that: It also comprises a first fixed block (5), a servo motor (6) and a clamping assembly (7); the first fixed blocks (5) are fixedly connected to the left and right sides of the box body (1); the servo motor (6) is fixedly mounted on the top of the first fixed block (5); the output shaft of the servo motor (6) faces the nozzle (4); and the output shaft of the servo motor (6) is fixedly connected to the clamping assembly (7).

2. A driving device for semiconductor wafer cleaning equipment according to claim 1, characterized in that: It also comprises a second fixed block (8) and an air dryer (9); the front of the box body (1) is fixedly connected to the second fixed block (8), and the upper part of the second fixed block (8) is rotatably connected to the air dryer (9).

3. A driving device for semiconductor wafer cleaning equipment according to claim 2, characterized in that: It also includes a spiral spring (10), the spiral spring (10) is arranged on the upper part of the second fixed block (8), one end of the spiral spring (10) is fixedly connected to the second fixed block (8), and the other end is fixedly connected to the air dryer (9).

4. The driving device for semiconductor wafer cleaning equipment according to claim 3, characterized in that: The clamping assembly (7) comprises a rotating disk (711), a sliding rod (712), an upper clamping block (713), a lower clamping block (714), an elastic member (715) and a wedge block (716); the output shaft of the servo motor (6) is fixedly connected to the rotating disk (711); the side of the rotating disk (711) away from the servo motor (6) is slidably connected to two sliding rods (712); the side of the upper sliding rod (712) away from the rotating disk (711) is fixedly connected to the upper clamping block (713); the side of the lower sliding rod (712) away from the rotating disk (711) is fixedly connected to the lower clamping block (714); an elastic member (715) is provided between the sliding rod (712) and the rotating disk (711); two ends of the elastic member (715) are respectively fixedly connected to the sliding rod (712) and the rotating disk (711); and the side of the servo motor (6) close to the rotating disk (711) is fixedly connected to the wedge block (716).

5. The driving device for semiconductor wafer cleaning equipment according to claim 4, characterized in that: The clamping parts of the upper clamping block (713) and the lower clamping block (714) are both provided with silica gel.

6. The driving device for semiconductor wafer cleaning equipment according to claim 5, characterized in that: The front and rear parts of the wedge-shaped block (716) are both provided with arc-shaped edges.

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