High-density power unit
By setting up a PIM integrated module, a large capacity capacitor cell and a heat dissipation device in the power unit, the problems of large volume, low heat dissipation efficiency and complex wiring are solved, and the design of high-density power units is realized, which improves the heat dissipation efficiency and power density.
Patent Information
- Application Number
- CN202420272055.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2034-02-04
AI Technical Summary
Traditional power units have problems such as large size, low heat dissipation efficiency, complex capacitor installation and messy wiring, resulting in low power density.
Design a high-density power unit. By setting up a PIM integration module, a large-capacity capacitor cell device, a heat dissipation device and an input and output copper bar in the structural components, the heat dissipation device is set around the PIM integration module to improve the heat dissipation efficiency; the large-capacity capacitor cell device is set up On the structural components, the drive plates are arranged separately from the power devices, simplifying capacitor installation and connecting the PIM integrated module and capacitor cell through cables to reduce wiring complexity.
It improves the heat dissipation efficiency and power density of the power unit, simplifies capacitor installation, reduces the number and volume of devices, facilitates wiring, and saves internal space.
Smart Images
Figure CN222356193U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power devices, in particular to a high-density power unit. Background Art
[0002] Traditional power units are composed of inverter modules, rectifier modules, and brake circuits. There are many types of devices, which occupy scattered space and are not conducive to improving the power density of the unit. It has the following specific disadvantages:
[0003] Traditional power units usually use aluminum fin heat sinks with excellent thermal conductivity to dissipate heat for power devices inside. When the power devices are concentrated together, the heat generated by the aluminum substrate in contact with the devices will accumulate rapidly, increasing the local temperature rise.
[0004] The single capacitor capacity selected in traditional power units is low, and the ability to absorb voltage spikes and parasitic inductance is limited. The same capacity unit needs to be configured with a large number of capacitors, and the gap space for capacitor installation is greatly wasted;
[0005] Traditional power units place the driver board above the power devices, which makes wiring difficult and wastes space inside the unit. Utility Model Content
[0006] The technical problem to be solved by the utility model is that the device is large in size, the heat dissipation efficiency is low, the capacitor installation is complicated and the wiring is messy. The purpose is to provide a high-density power unit, which includes a structural component, a PIM integrated module, a large-capacity capacitor pool device, a heat dissipation device, an input and output copper bus and a drive plate arranged in the structural component; the heat dissipation device is arranged around the PIM integrated module to dissipate heat, thereby improving the heat dissipation efficiency; the large-capacity capacitor pool device is arranged on the structural component, and the drive plate is arranged separately from the adapter plate on the power device, thereby reducing the complexity of wiring, facilitating wiring, saving internal space and improving the power density of the power unit; and the PIM integrated module is arranged to be connected to the large-capacity capacitor pool through a cable, thereby improving the simplicity of capacitor installation.
[0007] The utility model is realized by the following technical solutions:
[0008] A high-density power unit includes a structural component, and a PIM integrated module, a large-capacity capacitor pool device, a heat sink and an input and output copper busbar arranged in the structural component;
[0009] The heat dissipation device is arranged around the PIM integrated module;
[0010] The PIM integrated module is connected to a large-capacity capacitor pool device through a cable.
[0011] The utility model includes a structural component, and a PIM integrated module, a large-capacity capacitor pool device, a heat sink and an input and output copper busbar arranged in the structural component; the heat sink is arranged around the PIM integrated module to dissipate heat, thereby improving heat dissipation efficiency; the large-capacity capacitor pool device is arranged on the structural component, and the drive plate and the adapter plate on the power device are arranged separately, thereby reducing wiring complexity, facilitating wiring, saving internal space, and improving the power density of the power unit; and the PIM integrated module is arranged to be connected to the large-capacity capacitor pool through a cable, thereby improving the simplicity of capacitor installation.
[0012] Furthermore, the PIM integrated module is positioned and installed on the heat dissipation device by means of bolts. The contact stability of the device is improved by means of bolt positioning and installation, and the heat dissipation efficiency of the PIM integrated module is ensured.
[0013] Furthermore, the heat dissipation device includes an aluminum fin heat sink and a heat pipe, and the heat pipe is pre-buried in the aluminum fin heat sink. The fins of the steel aluminum fin tube heat sink are closely combined with the heat pipe, which increases the heat dissipation area and reduces the air flow resistance, so that the heat can be transferred quickly.
[0014] Furthermore, the heat pipe is arranged at the bottom of the PIM integrated module, and the heat pipe is a plurality of evenly arranged pipes, which can improve the heat dissipation efficiency of the PIM integrated module and ensure the heat dissipation uniformity of the PIM integrated module.
[0015] Furthermore, the large-capacity capacitor pool device includes a laminated busbar and a capacitor unit, wherein the laminated busbar is fixed on the capacitor unit, and the capacitor unit is fixed on the driving plate, thereby improving the neatness of capacitor arrangement and reducing the occupied area.
[0016] Furthermore, the capacitor unit includes a capacitor C1 and a capacitor C2 connected in parallel, and the capacitor C1 and the capacitor C2 are connected in parallel, which effectively reduces the gap between the capacitors, thereby improving the integration density.
[0017] 3 Further, the input and output copper busbar includes a R / S / T three-phase power input port and a U / V three-phase power output port.
[0018] Furthermore, the rectifier unit is connected to the R / S / T three-phase power input port; the gate bipolar transistor IGBT unit is connected to the U / V single power output port. The three-phase power input ports R, S and T and the output ports U and V are directly connected to the input and output copper busbars through the PIM integrated module, reducing wiring.
[0019] Compared with the prior art, the utility model has the following advantages and beneficial effects:
[0020] The utility model includes a structural component, a PIM integrated module, a large-capacity capacitor pool device, a heat sink, an input and output copper bus and a driving plate arranged in the structural component; the heat sink is arranged around the PIM integrated module to dissipate heat, thereby improving heat dissipation efficiency; the large-capacity capacitor pool device is arranged on the structural component; the driving plate and the adapter plate on the power device are arranged separately, thereby facilitating wiring while saving internal space and improving the power density of the power unit; the PIM integrated module is connected to the large-capacity capacitor pool through a cable, thereby improving the convenience of capacitor installation;
[0021] The utility model replaces the original inverter module, rectifier unit, and brake circuit with a PIM integrated module, which reduces the types of devices and greatly reduces the volume occupied by the devices;
[0022] The utility model adopts a heat pipe with high heat transfer performance, good temperature uniformity and constant temperature performance, relying on the characteristics of phase change absorption and release of latent heat of the working fluid in the heat pipe and high-speed steam flow heat transfer, to quickly introduce the heat concentrated at the bottom of the power device into the periphery of the radiator, achieving the effect of uniform temperature, thereby improving the overall heat dissipation efficiency of the heat dissipation device;
[0023] The utility model uses a single capacitor with a larger capacity, which reduces the number of capacitors required to be configured for units with the same capacity, thereby reducing the device installation gap and improving the power density of the power unit;
[0024] The utility model arranges the capacitor vertically and reserves space on the upper part for the unit driving board, which greatly facilitates wiring and saves internal space, thereby improving the power density of the power unit. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The drawings described herein are used to provide a further understanding of the embodiments of the present utility model, constitute a part of this application, and do not constitute a limitation of the embodiments of the present utility model. In the drawings:
[0026] Figure 1 This is a diagram of the overall device structure in an embodiment of the utility model;
[0027] Figure 2 This is a structural diagram of the connection between the PIM integrated module and the large-capacity capacitor pool in the embodiment of the utility model;
[0028] Figure 3 This is a structural diagram of the connection between a large-capacity capacitor device and a heat sink in an embodiment of the utility model;
[0029] Figure 4 In the embodiment of the utility model Figure 1 The upward view is the input and output copper busbar structure diagram;
[0030] Marks and corresponding parts names in the attached drawings:
[0031] 1. PIM integrated module; 11. IGBT unit; 12. Rectifier unit; 2. Large-capacity capacitor pool device; 21. Capacitor unit; 3. Heat dissipation device; 31. Aluminum fin heat sink; 32. Heat pipe; 4. Input and output copper busbars; 5. Drive board; 6. Structural components. DETAILED DESCRIPTION
[0032] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below in conjunction with embodiments and drawings. The schematic implementation manner of the utility model and its description are only used to explain the utility model and are not intended to limit the utility model.
[0033] As a possible implementation, Figure 1 As shown, this embodiment provides a high-density power unit, including a structural component 6, and a PIM integrated module 1, a large-capacity capacitor pool device 2, a heat sink 3, and an input-output copper bus 4 arranged in the structural component 6; the heat sink 3 is arranged around the PIM integrated module 1; the large-capacity capacitor pool device 2 is arranged on the structural component 6; and the PIM integrated module 1 is connected to the large-capacity capacitor pool device 2 through a cable. By setting a structural component 6, and a PIM integrated module 1, a large-capacity capacitor pool device 2, a heat sink 3, an input-output copper bus 4, and a drive board 5 arranged in the structural component 6; the heat sink 3 is arranged around the PIM integrated module 1 to dissipate heat, thereby improving the heat dissipation efficiency, the large-capacity capacitor pool device 2 is arranged on the structural component 6, and the drive board 5 is arranged separately from the adapter board on the power device, thereby reducing the wiring complexity, facilitating the wiring, and saving the internal space, thereby improving the power density of the power unit, and setting the PIM integrated module 1 to be connected to the large-capacity capacitor pool through a cable, thereby improving the simplicity of capacitor installation.
[0034] In some possible embodiments, the PIM integrated module 1 is positioned and installed on the heat dissipation device 3 by bolts. The contact stability of the device is improved by bolt positioning and installation, and the heat dissipation efficiency of the PIM integrated module 1 is ensured.
[0035] In some possible embodiments, Figure 3 As shown, the heat dissipation device 3 includes an aluminum fin heat sink 31 and a heat pipe 32, and the heat pipe 32 is pre-buried in the aluminum fin heat sink 31. The fins of the steel aluminum fin tube heat sink are closely combined with the heat pipe 32, which increases the heat dissipation area and reduces the air flow resistance, so that heat can be quickly transferred. The heat pipe 32 is arranged at the bottom of the PIM integrated module 1, and the heat pipe 32 is a plurality of evenly arranged pipes. Through the even arrangement, the heat dissipation efficiency of the PIM integrated module 1 is accelerated, and the heat dissipation uniformity of the PIM integrated module 1 is ensured.
[0036] Specifically, since the heat is concentrated at the bottom of the PIM integrated module 1, it is not conducive to uniform heat dissipation. In order to solve the above disadvantages, the present invention pre-buries a heat pipe 32 on the substrate of the aluminum fin heat sink 31. The heat pipe 32 relies on the characteristics of phase change absorption and release of latent heat and high-speed steam flow heat transfer of the working fluid in the heat pipe 32 to quickly introduce the heat concentrated at the bottom of the power device to the periphery of the heat sink, achieving a uniform temperature effect, thereby improving the overall heat dissipation efficiency of the heat sink 3 and making up for the shortcomings of the PIM integrated module 1.
[0037] In some possible embodiments, Figure 2 and Figure 4 As shown, the large-capacity capacitor pool device 2 includes a laminated busbar and a capacitor unit 21, the laminated busbar is fixed on the capacitor unit 21, and the capacitor unit 21 is fixed on the structural component 6. The arrangement of the capacitors is improved and the occupied area is reduced.
[0038] In some possible embodiments, the capacitor unit 21 includes a capacitor C1 and a capacitor C2 connected in parallel, and the capacitor C1 and the capacitor C2 are connected in parallel, which effectively reduces the gap between the capacitors, thereby improving the integration density.
[0039] In some possible embodiments, the PIM integrated module 1 includes a first IGBT unit 11 and a second IGBT unit 11 connected in parallel; a first rectifier unit 12, a second rectifier unit 12 and a third rectifier unit 12 connected in parallel; the first rectifier unit 12 includes a diode D1 and a diode D4, the diode D1 and the diode D4 are connected in series, the second rectifier unit 12 includes a diode D2 and a diode D5, the diode D2 and the diode D5 are connected in series, and the third rectifier unit 12 includes a diode D3 and a diode D6, the diode D3 and the diode D6 are connected in series. Among them, the IGBT unit is an insulated gate bipolar transistor, which is a composite fully controlled voltage-driven power semiconductor device composed of a BJT (bipolar transistor) and a MOS (insulated gate field effect transistor), and has the advantages of both the high input impedance of a MOSFET and the low conduction voltage drop of a GTR. The GTR has a low saturation voltage drop and a large current density, but a large driving current; the MOSFET has a very small driving power and a fast switching speed, but a large conduction voltage drop and a small current density. The IGBT combines the advantages of the above two devices, with low driving power and low saturation voltage drop.
[0040] The IGBT unit 11 and three rectifier units 12 in the PIM integrated module 1 are used to perform AC / DC conversion, rectify and filter the electrical data, and reduce the occupied area while ensuring performance. The input and output copper bus 4 includes an R / S / T three-phase power input port and a U / V single-phase power output port. The rectifier unit 12 is connected to the R / S / T three-phase power input port; the IGBT unit 11 is connected to the U / V single-phase power output port. The three-phase power input ports R, S and T are respectively connected to a rectifier unit 12; the single-phase power output ports U and V are respectively connected to an IGBT unit 11. The PIM integrated module 1 is directly connected to the input and output copper bus 4 to reduce wiring.
[0041] Specifically, in this embodiment, after the three R / S / T inputs, the PIM integrated module 1 is used to complete the process of converting AC into DC and DC into AC, and a large-capacity capacitor is used to filter the rectified DC. The devices used in the process of realizing the principle include a PIM integrated module 1 and a small number of large-capacity capacitors, which can save the variety and quantity of devices, occupy a small space, and is conducive to compressing the unit's external dimensions.
[0042] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only the specific implementation method of the utility model and is not used to limit the protection scope of the utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.
Claims
1. A high-density power unit, characterized in that: It comprises a structural component (6), and a PIM integrated module (1), a large-capacity capacitor pool device (2), a heat sink (3), and an input and output copper busbar (4) arranged in the structural component (6); The heat dissipation device (3) is arranged around the PIM integrated module (1); The PIM integrated module (1) is connected to a large-capacity capacitor pool device (2) via a cable.
2. The high-density power unit according to claim 1, characterized in that: The PIM integrated module (1) is positioned and installed on the heat dissipation device (3) by means of bolts.
3. The high-density power unit according to claim 1, characterized in that: The heat dissipation device (3) comprises an aluminum fin heat sink (31) and a heat pipe (32), wherein the heat pipe (32) is pre-buried in the aluminum fin heat sink (31).
4. The high-density power unit according to claim 3, characterized in that: The heat pipe (32) is arranged at the bottom of the PIM integrated module (1), and the heat pipe (32) is a plurality of evenly arranged pipes.
5. The high-density power unit according to claim 1, characterized in that: The large-capacity capacitor pool device (2) comprises a laminated busbar and a capacitor unit (21), wherein the laminated busbar is fixed on the capacitor unit (21), and the capacitor unit (21) is fixed on the structural component (6).
6. The high-density power unit according to claim 5, characterized in that: The capacitor unit (21) comprises a capacitor C1 and a capacitor C2 connected in parallel, and the capacitor C1 and the capacitor C2 are connected in parallel.
7. The high-density power unit according to claim 6, characterized in that: The input and output copper busbar (4) comprises an R / S / T three-phase power input port and a U / V single-phase power output port.