Standard microwave power source

Abstract

The utility model provides a standard microwave power source which comprises a shell, the shell comprises a cover body and a bottom plate, and the cover body covers the bottom plate; the electronic element is arranged on one side of the bottom plate in the length direction of the bottom plate, and the heat absorption part is arranged above the electronic element, attached to the electronic element and used for absorbing heat of the electronic element; the cooling fan is arranged on the side, away from the electronic element, of the bottom plate and used for blowing away heat of the heat absorption piece. The standard microwave power source is attached to the upper portion of the electronic element through the heat absorption piece, heat generated by the electronic element can be effectively absorbed and prevented from being retained around the electronic element, the heat dissipation fan can rapidly take away the heat absorbed by the heat absorption piece, the working temperature of the electronic element is effectively reduced, and the service life of the electronic element is prolonged. The cooling fan and the electronic component are arranged at the two ends of the bottom plate respectively, the influence of noise of the cooling fan can be reduced, and the cooling efficiency and stability of the microwave power source are improved.

Description

Technical Field

[0001] The present application relates to the technical field of microwave power sources, and in particular to a standard microwave power source. Background Art

[0002] Microwave power sources play an important role in radar systems, communication equipment and other fields, and are used to generate reliable microwave signals. However, as the power and frequency of the equipment increase, the heat dissipation problem under long-term high load becomes increasingly prominent, affecting the stability and reliability of the equipment.

[0003] Existing microwave power sources usually include two heat dissipation methods: air cooling and water cooling. The water cooling method has a significant heat dissipation effect, but it is costly and there are problems such as leakage or pipe blockage, and it has higher requirements on the environment. Common air cooling uses a cooling fan to blow away heat, but it is still difficult to effectively reduce the temperature of electronic components during long-term high-load operation, and the noise generated by the cooling fan will affect the stability of the microwave signal. Therefore, a better heat dissipation structure is needed to solve the heat dissipation problem of the microwave power source. Utility Model Content

[0004] In view of this, it is necessary to provide a standard microwave power source with efficient heat dissipation to solve the above problems.

[0005] An embodiment of the present application provides a standard microwave power source, comprising:

[0006] The housing comprises a cover body and a bottom plate, wherein the cover body is arranged on the bottom plate;

[0007] An electronic component, disposed on one side of the bottom plate along the length direction of the bottom plate, for controlling the operation of the microwave power source;

[0008] A heat absorbing member is disposed above the electronic component and attached to the electronic component to absorb heat from the electronic component;

[0009] A heat dissipation fan is arranged on a side of the bottom plate away from the electronic components and is used to blow away the heat of the heat absorbing element.

[0010] In at least one embodiment of the present application, the base plate is provided with an electrical cavity, the electronic components are arranged in the electrical cavity, the cooling fan is arranged outside the electrical cavity, the electrical cavity includes a first cavity and a second cavity arranged along the length direction of the base plate, and the first cavity is close to the cooling fan.

[0011] In at least one embodiment of the present application, the base plate is provided with an electrical cavity, and the base plate further includes a plurality of baffles, one end of the plurality of baffles is provided at the bottom of the electrical cavity, and the other end is against the top of the electrical cavity, and the plurality of baffles and the base plate enclose a plurality of accommodating grooves for isolating heat interaction between the electronic components.

[0012] In at least one embodiment of the present application, the electronic component includes a microwave generating element and a power supply, the power supply is disposed in the first cavity, and the microwave generating element is disposed in the second cavity.

[0013] In at least one embodiment of the present application, the microwave power source further includes heat dissipation fins, and the heat dissipation fins are provided on the heat absorbing element to accelerate the dissipation of heat from the heat absorbing element.

[0014] In at least one embodiment of the present application, the heat dissipation fins are arranged along the length direction of the shell to increase the heat dissipation area of ​​the heat dissipation fins.

[0015] In at least one embodiment of the present application, an air channel is formed between every two adjacent fins of the heat dissipation fins, the air channel faces the heat dissipation fan, and the heat dissipation fan, the air channel and the external environment are interconnected.

[0016] In at least one embodiment of the present application, the top of the heat dissipation fin and the four sides of the heat absorption component are in contact with the inner surface of the cover body.

[0017] In at least one embodiment of the present application, the shell is made of metal iron.

[0018] In at least one embodiment of the present application, a sound absorbing layer is provided on the bottom plate to absorb the noise of the cooling fan.

[0019] The standard microwave power source provided above is attached to the top of the electronic component through the heat absorption piece, which can effectively absorb the heat generated by the electronic component and prevent the heat from being retained around the electronic component, thereby reducing the overheating of the electronic component. The heat dissipation fan can quickly take away the heat absorbed by the heat absorption piece, effectively reducing the working temperature of the electronic component. The heat dissipation fan and the electronic component are respectively arranged at both ends of the bottom plate, which can reduce the influence of the heat dissipation fan noise and improve the heat dissipation efficiency and stability of the microwave power source. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional diagram of a standard microwave power source in one embodiment of the present application.

[0021] Figure 2 for Figure 1 A three-dimensional exploded diagram of a standard microwave power source.

[0022] Figure 3 for Figure 1 A side view of a standard microwave power source.

[0023] Figure 4 for Figure 1 A side cross-sectional view of a standard microwave power source.

[0024] Figure 5 for Figure 1 A three-dimensional diagram of the bottom plate of a standard microwave power source.

[0025] Main component symbols

[0026] 100. A standard microwave power source; 10. Shell; 11. Cover; 12. Bottom plate; 121. Electrical cavity; 121a. First cavity; 121b. Second cavity; 122. Baffle; 122a. Accommodating groove; 123. Sound absorbing layer; 20. Heat absorbing element; 30. Cooling fan; 40. Cooling fins; 41. Wind channel. DETAILED DESCRIPTION

[0027] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0028] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0029] An embodiment of the present application provides a standard microwave power source, comprising:

[0030] The housing comprises a cover body and a bottom plate, wherein the cover body is arranged on the bottom plate;

[0031] An electronic component, disposed on one side of the bottom plate along the length direction of the bottom plate, for controlling the operation of the microwave power source;

[0032] A heat absorbing member is disposed above the electronic component and attached to the electronic component to absorb heat from the electronic component;

[0033] A heat dissipation fan is arranged on a side of the bottom plate away from the electronic components and is used to blow away the heat of the heat absorbing element.

[0034] The standard microwave power source provided above is attached to the top of the electronic component through the heat absorption piece, which can effectively absorb the heat generated by the electronic component and prevent the heat from being retained around the electronic component, thereby reducing the overheating of the electronic component. The heat dissipation fan can quickly take away the heat absorbed by the heat absorption piece, effectively reducing the working temperature of the electronic component. The heat dissipation fan and the electronic component are respectively arranged at both ends of the bottom plate, which can reduce the influence of the heat dissipation fan noise and improve the heat dissipation efficiency and stability of the microwave power source.

[0035] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0036] See also Figure 1-Figure 5 An embodiment of the present application provides a standard microwave power source 100 , including a housing 10 , an electronic component 20 , a heat absorbing member 30 , and a heat dissipation fan 40 .

[0037] The shell 10 includes a cover body 11 and a bottom plate 12, wherein the cover body 11 is covered on the bottom plate 12; an electronic component 20 (not shown) is arranged on one side of the bottom plate 12 along the length direction of the bottom plate 12, for controlling the operation of the microwave power source; a heat absorbing component 30 is arranged above the electronic component 20 and attached to the electronic component 20, for absorbing the heat of the electronic component 20; a cooling fan 40 is arranged on the side of the bottom plate 12 away from the electronic component 20, for blowing away the heat of the heat absorbing component 30.

[0038] Specifically, the cover 11 and the bottom plate 12 provide external protection and support structures for the microwave power source. The cover 11 covers the bottom plate 12, plays a role in protecting the internal electronic components 20 and the heat absorber 30, and prevents the external environment from interfering with the internal components. The electronic components 20 are located on one side of the bottom plate 12. These electronic components 20 are the control core of the microwave power source and are responsible for managing the operation of the microwave power source, including adjusting the output power, frequency and other parameters to ensure the normal operation of the device.

[0039] Furthermore, the heat absorbing member 30 is located above the electronic component 20 and is attached thereto. Its function is to absorb the heat generated by the electronic component 20 and prevent the heat from accumulating around the electronic component 20, thereby maintaining the normal operating temperature of the electronic component 20 and improving the stability and reliability of the device. The cooling fan 40 is located on the other side of the bottom plate 12, away from the electronic component 20. Its function is to blow away the heat absorbed by the heat absorbing member 30, promote the dissipation of heat and air circulation, and maintain the heat dissipation effect of the device.

[0040] Furthermore, by attaching the heat absorbing member 30 to the top of the electronic component 20, the heat generated by the electronic component 20 is absorbed and quickly taken away by the heat dissipation fan 40, which effectively reduces the working temperature of the electronic component 20 and prevents the occurrence of overheating, thereby improving the stability and reliability of the device. The heat dissipation fan 40 and the electronic component 20 are respectively arranged at both ends of the bottom plate 12, which can effectively reduce the impact of the noise generated by the heat dissipation fan 40 on the electronic component 20. Such a design separates the working area of ​​the heat dissipation fan 40 and the electronic component 20. Through the reasonable layout and coordination of the heat absorbing member 30 and the heat dissipation fan 40, the heat dissipation structure of the microwave power source is effectively optimized. Heat is quickly absorbed from the electronic component 20 and quickly taken away, so that the device can maintain a low operating temperature, improve the heat dissipation efficiency and stability, and extend the service life of the device.

[0041] In a specific embodiment, the base plate 12 is provided with an electrical cavity 121, the electronic component 20 is disposed in the electrical cavity 121, and the cooling fan 40 is disposed outside the electrical cavity 121. The electrical cavity 121 includes a first cavity 121a and a second cavity 121b arranged along the length direction of the base plate 12, and the first cavity 121a is close to the cooling fan 40.

[0042] Specifically, the electrical cavity 121 is a space opened inside the bottom plate 12 for accommodating the electronic components 20 and other related components. By placing the electronic components 20 inside the electrical cavity 121, the internal circuit can be effectively isolated from the external environment, thereby improving the stability and safety of the device. Placing the electronic components 20 in the electrical cavity 121 can effectively protect them from interference and damage from the external environment, while facilitating the optimization of the layout of the electronic components 20 and improving the overall performance and reliability of the device.

[0043] Furthermore, the cooling fan 40 is located outside the electrical cavity 121, and its main function is to dissipate heat. Placing the cooling fan 40 outside the electrical cavity 121 is conducive to reducing the operating temperature of the electronic components 20, improving the heat dissipation efficiency and the stability of the equipment. The electrical cavity 121 is divided into a first cavity 121a and a second cavity 121b. By arranging them along the length direction of the bottom plate 12, a more reasonable layout and organization are achieved. The first cavity 121a is close to the cooling fan 40, which is conducive to optimizing and improving the heat dissipation effect.

[0044] Furthermore, the setting of the electrical cavity 121 enables the electronic component 20 to work in a relatively closed environment, reduces the interference of the external environment on the electronic component 20, and improves the stability and reliability of the device. The heat dissipation fan 40 is located outside the electrical cavity 121, and can promptly take away the heat generated inside the electrical cavity 121, reducing the operating temperature of the electronic component 20, thereby extending the service life and stability of the device. The electrical cavity 121 is divided into a first cavity 121a and a second cavity 121b, so that the heat transfer between the heat dissipation fan 40 and the electronic component 20 is smoother, which is conducive to optimizing the heat dissipation structure, improving the heat dissipation efficiency and the stability of the device.

[0045] In a specific embodiment, the base plate 12 further includes a plurality of baffles 122, one end of the plurality of baffles 122 is disposed at the bottom of the electrical cavity 121, and the other end abuts against the top of the electrical cavity 121, and the plurality of baffles 122 and the base plate 12 enclose a plurality of accommodating grooves 122a for isolating heat interaction between the electronic components 20.

[0046] Specifically, a plurality of baffles 122 are provided on the bottom plate 12. The function of these baffles 122 is to isolate and separate the inside of the electrical cavity 121 to prevent heat interaction between the electronic components 20, thereby optimizing the heat dissipation structure. One end of the baffle 122 is provided at the bottom of the electrical cavity 121, and the other end abuts against the top of the electrical cavity 121: one end of the baffle 122 is fixed to the bottom of the electrical cavity 121, and the other end abuts against the top of the electrical cavity 121. Through this arrangement, a closed receiving groove 122a is formed, which effectively isolates the heat transfer between each electronic component 20. The multiple baffles 122 on the bottom plate 12 and the bottom plate 12 itself enclose a plurality of receiving grooves 122a, and each receiving groove 122a contains one or more electronic components 20, forming independent heat exchange spaces, thereby avoiding the mutual influence of heat between the electronic components 20.

[0047] Furthermore, the interior of the electrical cavity 121 is divided into a plurality of accommodating grooves 122a by the baffle 122, which can effectively isolate the heat interaction between the electronic components 20. When a certain electronic component 20 generates heat, the electronic components 20 in the other accommodating grooves 122a will not be affected, which is conducive to maintaining the stable working state of each electronic component 20. The setting of the baffle 122 makes the heat transfer more orderly, reduces the heat transfer path, and thus optimizes the overall heat dissipation structure. By effectively isolating the heat interaction, the heat accumulation and mutual influence between the electronic components 20 are reduced, which helps to improve the stability and reliability of the device.

[0048] In a specific embodiment, the electronic component 20 includes a microwave generating element 21 (not shown) and a power supply 22 (not shown), the power supply 22 is disposed in the first cavity 121a, and the microwave generating element 21 is disposed in the second cavity 121b.

[0049] Specifically, the electronic component 20 is divided into two parts, one part is the microwave generating element 21, which is responsible for generating microwave signals; the other part is the power supply 22, which provides the required power supply and control signals. Dividing the electronic component 20 into two parts, the microwave generating element 21 and the power supply 22, is conducive to modular design and management. The power supply 22 is placed inside the first cavity 121a. The purpose of this design is to separate the power supply 22 from the microwave generating element 21, to avoid the heat of the power supply 22 directly affecting the microwave generating element 21, and to ensure the stable operation of the microwave generating element 21. The microwave generating element 21 is placed inside the second cavity 121b. Such a setting can place the microwave generating element 21 relatively independently in a closed space, effectively isolate its working environment, reduce external interference and the heat impact of the power supply 22, and improve the stability and reliability of the microwave generating element 21.

[0050] Furthermore, placing the power supply 22 in the first cavity 121a close to the cooling fan 40 can dissipate heat more effectively. Since the power supply 22 usually generates more heat, placing it close to the cooling fan 40 can take the generated heat away from the power supply 22 more quickly, thereby improving the heat dissipation efficiency and helping to maintain a stable operating temperature of the power supply 22. At the same time, placing the microwave generating element 21 in the second cavity 121b relatively far away from the cooling fan 40 can reduce the impact of the noise generated by the cooling fan 40 on it. The microwave generating element 21 is usually very sensitive to noise, and excessive noise may interfere with its normal operation and affect the performance of the device. Placing it at a relatively far distance can effectively reduce the impact of noise on it and improve the stability and reliability of the equipment.

[0051] In a specific embodiment, the microwave power source further includes heat dissipation fins 50 , which are disposed on the heat absorbing element 30 to accelerate the dissipation of heat from the heat absorbing element 30 .

[0052] Specifically, the heat sink fins 50 are directly mounted on the surface of the heat absorber 30 and fit closely with the heat absorber 30. Such a design can maximize the contact area between the heat sink fins 50 and the heat absorber 30, thereby improving the heat transfer efficiency. The main function of the heat sink fins 50 is to accelerate the heat transfer and heat dissipation process on the heat absorber 30 through its surface area expansion and shape design. The heat is quickly conducted to the fin surface through the heat sink fins 50, and then dissipated to the surrounding environment by convection and radiation, thereby reducing the temperature of the heat absorber 30.

[0053] In a specific embodiment, the heat dissipation fins 50 are arranged along the length direction of the housing 10 to increase the heat dissipation area of ​​the heat dissipation fins 50 .

[0054] Specifically, the heat dissipation fins 50 are arranged along the length direction of the housing 10 so that they cover a larger surface area, thereby increasing the surface area for heat dissipation. Such a design can more effectively conduct the generated heat to the surface of the heat dissipation fins 50, accelerate the heat dissipation, and improve the heat dissipation efficiency. Increasing the heat dissipation area of ​​the heat dissipation fins 50 can effectively reduce the temperature inside the device. By increasing the surface area of ​​the heat dissipation fins 50, heat can be conducted from the inside of the device to the external environment more quickly, thereby reducing the operating temperature of the device.

[0055] In a specific embodiment, an air channel 51 is formed between every two adjacent fins of the heat dissipation fins 50 , and the air channel 51 faces the heat dissipation fan 40 . The heat dissipation fan 40 , the air channel 51 and the external environment are interconnected.

[0056] Specifically, the wind channel 51 formed between the heat sink fins 50 allows air to flow along the channel. Such a design can guide the air flow and increase the heat exchange efficiency on the surface of the heat sink fins 50. The position of the wind channel 51 is directly opposite to the heat sink fan 40, ensuring that the wind generated by the heat sink fan 40 can blow directly to the heat sink fins 50, thereby enhancing the heat transfer and heat dissipation effect. The heat sink fan 40 and the wind channel 51 are connected to the external environment, so that the external fresh air can smoothly enter the heat sink fin 50 area, take away the heat absorbed by the heat sink fins 50, and maintain the heat dissipation efficiency.

[0057] Furthermore, through the provision of the wind channel 51, an effective air flow channel is formed between the heat dissipation fins 50. When the heat dissipation fan 40 is working, the generated airflow can be blown directly to the heat dissipation fins 50 through the wind channel 51, which accelerates the transfer and dissipation of heat and enhances the heat dissipation effect. The provision of the wind channel 51 not only increases the air flow, but also can effectively introduce fresh external air into the heat dissipation fin 50 area. In this way, the freshness of the air can be maintained, the heat exchange efficiency on the surface of the heat dissipation fins 50 can be improved, and the heat dissipation can be accelerated.

[0058] In a specific embodiment, the top of the heat dissipation fin 50 and the surrounding surfaces of the heat absorption component 30 are in contact with the inner surface of the cover body 11 .

[0059] Specifically, by closely fitting the top of the heat dissipating fins 50 and the surrounding surfaces of the heat absorbing element 30 with the inner surface of the cover body 11, heat can be effectively transferred to the shell 10 and then dissipated from the shell 10 to the external environment, thereby improving the efficiency of heat transfer and ensuring that the temperature inside the cover body 11 is not too high.

[0060] In a specific embodiment, the housing 10 is made of metal iron.

[0061] Specifically, the shell of the microwave power source is made of metal iron material. Metal iron has good thermal conductivity and mechanical strength, is suitable for high temperature and high power working environment, can effectively withstand the heat generated inside the device and the pressure of the external environment, and protect the internal electronic components 20. Metal iron has good thermal conductivity and can quickly conduct heat to the external surface of the device, which helps the heat dissipation fins 50 and the heat dissipation fan 40 to effectively dissipate heat into the environment.

[0062] Furthermore, the mechanical strength of metal iron is high, which can effectively protect the internal electronic components 20 from external impact or vibration, thereby improving the stability and durability of the device. Metal iron can withstand high temperature environments, is not easily deformed or melted, and can ensure the normal operation of the device under high temperature working conditions. Metal iron has strong corrosion resistance, can resist the erosion of moisture or chemicals, and prolong the service life of the device.

[0063] In a specific embodiment, a sound absorbing layer 123 is disposed on the bottom plate 12 to absorb the noise of the cooling fan 40 .

[0064] Specifically, the sound absorbing layer 123 can effectively absorb the noise generated by the cooling fan 40, reduce the spread and impact of the noise, and reduce the noise level when the device is running. When the cooling fan 40 is working, the noise generated will be transmitted to the bottom plate 12 through vibration, and the sound absorbing layer 123 will absorb these noise vibrations and convert them into weak heat energy instead of transmitting them to the surrounding environment, thereby reducing the noise level. Then, the weak heat energy is absorbed by the heat absorbing element 30 and dissipated into the external environment.

[0065] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. A standard microwave power source, characterized in that: include: The housing comprises a cover body and a bottom plate, wherein the cover body is arranged on the bottom plate; An electronic component, disposed on one side of the bottom plate along the length direction of the bottom plate, for controlling the operation of the microwave power source; A heat absorbing member is disposed above the electronic component and attached to the electronic component to absorb heat from the electronic component; A heat dissipation fan is arranged on a side of the bottom plate away from the electronic components and is used to blow away the heat of the heat absorbing element.

2. A standard microwave power source according to claim 1, characterized in that: The bottom plate is provided with an electrical cavity, the electronic components are arranged in the electrical cavity, the cooling fan is arranged outside the electrical cavity, the electrical cavity includes a first cavity and a second cavity arranged along the length direction of the bottom plate, and the first cavity is close to the cooling fan.

3. A standard microwave power source according to claim 2, characterized in that: The bottom plate also includes a plurality of baffles, one end of each of which is disposed at the bottom of the electrical cavity and the other end of each of which abuts against the top of the electrical cavity. The baffles and the bottom plate enclose a plurality of accommodating grooves for isolating heat interaction between the electronic components.

4. A standard microwave power source according to claim 3, characterized in that: The electronic component comprises a microwave generating element and a power supply, wherein the power supply is arranged in the first cavity, and the microwave generating element is arranged in the second cavity.

5. A standard microwave power source according to claim 1, characterized in that: The microwave power source further comprises heat dissipation fins, which are arranged on the heat absorbing element and are used to accelerate the dissipation of heat from the heat absorbing element.

6. A standard microwave power source according to claim 5, characterized in that: The heat dissipation fins are arranged along the length direction of the shell to increase the heat dissipation area of ​​the heat dissipation fins.

7. A standard microwave power source according to claim 6, characterized in that: An air channel is formed between every two adjacent fins of the heat dissipation fins, the air channel faces the heat dissipation fan, and the heat dissipation fan, the air channel and the external environment are interconnected.

8. A standard microwave power source according to claim 5, characterized in that: The top of the heat dissipation fin and the surrounding surfaces of the heat absorption component are all in contact with the inner surface of the cover body.

9. A standard microwave power source according to claim 1, characterized in that: The shell is made of metal iron.

10. A standard microwave power source according to claim 1, characterized in that: The bottom plate is provided with a sound absorbing layer for absorbing the noise of the heat dissipation fan.

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