Membrane method gas dehumidification device

Abstract

The utility model discloses a membrane method gas dehumidification device which comprises a gas inlet chamber and a gas outlet chamber arranged on one side of the gas inlet chamber, and the gas inlet chamber is connected with the gas outlet chamber through a hollow fiber membrane. The exhaust end of the air inlet chamber is connected with a refrigeration chamber, the refrigeration chamber is connected with the exhaust chamber through a semiconductor refrigeration sheet, the refrigeration surface of the semiconductor refrigeration sheet is connected with the air inlet chamber, and the heating surface of the semiconductor refrigeration sheet is connected with the exhaust chamber; the joint of the exhaust chamber and the semiconductor chilling plate is of a variable-diameter structure, and the inner diameter of the variable-diameter structure is gradually reduced in the gas flowing direction. And a first fan is arranged in the reducing structure. According to the utility model, the Bernoulli effect is utilized, the gas flow rate is changed through ingenious design, and a pressure difference is formed on the two sides of the fiber membrane, so that the fiber membrane is dehumidified.

Description

Technical Field

[0001] The utility model relates to the technical field of membrane dehumidification, in particular to a membrane gas dehumidification device. Background Art

[0002] Membrane dehumidification technology is an efficient gas separation process that uses the selective permeability characteristics of specific membrane materials to remove water vapor from gas mixtures. The core of membrane dehumidification technology is to use the selective permeability characteristics of membranes to separate gases. Membranes are usually porous and have different permeabilities to water vapor and air. In order to achieve effective separation, pressure needs to be applied to one side of the membrane while the other side is kept at low pressure or atmospheric pressure. This pressure difference prompts water vapor to pass through the membrane, while air is blocked. Compressed air applies pressure on the feed side (high pressure side) of the membrane, and the pressure difference formed is the driving force for water vapor to pass through the membrane to the other side (low pressure or vacuum side). The efficiency and economy of this technology rely heavily on the use of compressed air as an operating parameter. However, the use of compressed air as a working medium faces a series of challenges, which not only involve technical and economic aspects, but also include the complexity of operation and maintenance. Compressed air equipment has strict requirements. Compressors, membrane components and related auxiliary equipment (such as pressure vessels, pipelines, connectors, etc.) need to adopt high-standard design and manufacturing specifications, which not only increases the initial cost of the equipment, but also increases the subsequent maintenance requirements; the gas temperature will rise during the compression process, which will not only affect the dehumidification efficiency of the membrane, but may also have a negative impact on the stability and life of the membrane material. Therefore, cooling equipment may be required to control the temperature of the air entering the membrane component. This temperature control not only increases the complexity of the system, but may also lead to additional energy consumption. In addition, there are problems such as excessive noise from the air compressor and high maintenance costs. Utility Model Content

[0003] The purpose of the utility model is to provide a membrane gas dehumidification device to solve the problems raised in the above-mentioned background technology, utilize the Bernoulli effect, change the gas flow rate through ingenious design, form a pressure difference on both sides of the fiber membrane, thereby promoting the fiber membrane to dehumidify.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A membrane gas dehumidification device comprises an air inlet chamber and an exhaust chamber arranged on one side of the air inlet chamber, wherein the air inlet chamber and the exhaust chamber are connected via a hollow fiber membrane; the exhaust end of the air inlet chamber is connected with a refrigeration chamber, and the refrigeration chamber is connected to the exhaust chamber via a semiconductor refrigeration plate, wherein the cooling surface of the semiconductor refrigeration plate is connected to the air inlet chamber, and the heating surface is connected to the exhaust chamber; the connection between the exhaust chamber and the semiconductor refrigeration plate is a variable diameter structure, and the inner diameter of the variable diameter structure gradually decreases along the gas flow direction; a first fan is arranged in the variable diameter structure.

[0006] Furthermore, there are two exhaust chambers, which are respectively arranged on both sides of the air inlet chamber.

[0007] Furthermore, the inner wall cross section of the exhaust chamber is rectangular.

[0008] Furthermore, a second fan is provided at the air inlet end of the air inlet chamber.

[0009] Furthermore, the temperature difference between the heating surface and the cooling surface of the semiconductor refrigeration plate is greater than 50°C.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The utility model adopts a progressive variable diameter structure in the design of the exhaust chamber, which increases the flow rate of gas when it passes through, thereby reducing the air pressure and forming a sufficient pressure difference on both sides of the hollow fiber membrane, so that water vapor in the air can be transferred from one side of the membrane to the other side, thereby realizing the dehumidification function. The dehumidification process does not require compressed air, but is achieved by using the air flow under normal pressure environment, which not only reduces the energy consumption of the system, but also simplifies the design and operation of the system. In addition, since the design of the air duct allows air to flow under normal pressure, it also reduces possible airflow turbulence and resistance, optimizes the airflow dynamics performance, and makes the dehumidification process smoother and more efficient. This design not only improves the dehumidification efficiency, but also helps to reduce the noise level of the system, making it suitable for spaces that require a quiet environment.

[0012] The cooling surface of the semiconductor refrigeration plate lowers the temperature of the gas, and on the other hand, it also plays a role in cooling and dehumidification. The heating surface of the refrigeration plate increases its ability to accommodate water vapor by raising the temperature of the gas in the exhaust chamber, thereby taking away more water vapor faster, maintaining the pressure difference of the water vapor, and improving the dehumidification effect.

[0013] By designing the air duct of the exhaust chamber into a rectangular cross-section, the contact area with the semiconductor refrigeration plate is significantly increased, and the air flow is cleverly guided to ensure that each air molecule can contact the surface of the refrigeration plate more evenly and fully. The expanded contact area makes the heat exchange process more efficient, which means that more heat can be quickly transferred out of the air in the same amount of time, accelerating the entire cooling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a side view of the utility model;

[0015] Figure 2 This is the front view of the utility model;

[0016] Figure 3 This is a rear view of the utility model;

[0017] In the figure: 1-air inlet chamber, 2-exhaust chamber, 21-variable diameter structure, 3-hollow fiber membrane, 4-refrigeration chamber, 5-semiconductor refrigeration plate, 6-first fan, 7-second fan. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] In the description of the present utility model, it should be noted that the terms "upper", "lower", "left", "right", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model.

[0020] See also Figure 1-3A membrane gas dehumidification device comprises an air inlet chamber 1, an exhaust chamber 2 arranged on both sides of the air inlet chamber 1, the air inlet chamber 1 and the exhaust chamber 2 are connected through a hollow fiber membrane 3; the exhaust end of the air inlet chamber 1 is connected with a refrigeration chamber 4, the refrigeration chamber 4 is connected to the exhaust chamber 2 through a semiconductor refrigeration sheet 5, the cooling surface of the semiconductor refrigeration sheet 5 is connected to the air inlet chamber 1, and the heating surface is connected to the exhaust chamber 2; the connection between the exhaust chamber 2 and the semiconductor refrigeration sheet 5 is a variable diameter structure 21, the inner diameter of the variable diameter structure 21 gradually decreases from the gas flow direction; a first fan 6 is arranged in the variable diameter structure 21. The hollow fiber membrane has an extremely high surface area and an optimized microporous structure, which can quickly absorb water molecules in the air and make the treated air dry. This feature enables the membrane material to show excellent efficiency in the dehumidification process, greatly reducing the humidity in the air, and creating ideal conditions for the subsequent cooling process. The air to be treated enters from the air inlet end on the right side of the air inlet chamber 1, and the moisture in the air diffuses to the exhaust chambers 2 on both sides through the hollow fiber membrane 3, and the dry gas is discharged from the exhaust end on the left side of the air inlet chamber 1. The semiconductor refrigeration plate 5 has one end surface for heating and one end surface for cooling. Its cooling surface is connected to the refrigeration chamber 4, so that the temperature in the air inlet chamber 1 drops, and the high gas temperature affects the dehumidification efficiency of the fiber membrane, thereby increasing the service life of the fiber membrane material. At the same time, the heating surface of the semiconductor refrigeration plate 5 is connected to the exhaust chamber 2, heating the hot and humid gas therein to increase its kinetic energy, and combined with the variable diameter structure 21 with a gradually reduced inner diameter and the first fan 6, the hot air is blown to the exhaust port on the right. The variable diameter structure 21 increases the flow rate of the passing gas and reduces the pressure. According to the Bernoulli effect, the pressure difference formed by the gas on both sides of the hollow fiber membrane 3 will further promote its dehumidification.

[0021] Furthermore, there are two exhaust chambers 2, which are respectively arranged on both sides of the air inlet chamber 1. In other embodiments, four exhaust chambers 2 may also be arranged, which are distributed on the periphery of the air inlet chamber 1 in a cross shape.

[0022] Furthermore, the inner wall cross-section of the exhaust chamber 2 is rectangular, so that the air can contact the semiconductor cooling plate 5 more evenly and fully, and the contact area is enlarged to make the heat exchange process more efficient, which means that more heat can be quickly transferred out of the air in the same time, accelerating the entire cooling process. At the same time, the design of the rectangular air duct also takes into account the importance of airflow distribution. By maintaining the airflow flowing through the semiconductor cooling plate 5 at a more constant speed, the energy loss and the dead corners or vortices with uneven temperatures caused by unstable airflow are effectively reduced.

[0023] Furthermore, a second fan 7 is provided at the air inlet end of the air inlet chamber 1 , and the second fan guides the gas to be treated to enter from the air inlet end of the air inlet chamber 1 .

[0024] Furthermore, the temperature difference between the heating surface and the cooling surface of the semiconductor refrigeration sheet 5 is more than 50°C, which is large enough to give the gas in the exhaust chamber 2 a sufficiently high kinetic energy. Under the action of the first fan 6 and the variable diameter structure 21, the gas flow is accelerated, and the pressure difference on both sides of the hollow fiber membrane 3 is increased, further improving the dehumidification effect of the fiber membrane. The semiconductor refrigeration sheet 5 utilizes the Peltier effect, and by applying a DC electric field, a temperature difference is generated at both ends of the thermocouple, thereby achieving refrigeration. Compared with traditional compression refrigeration, semiconductor refrigeration sheets do not need to use refrigerants such as Freon, which helps to further reduce the temperature of the air and enhance the dehumidification performance of the system.

[0025] When the utility model is in operation, the air to be treated enters from the air inlet end of the air inlet chamber 1, and the moisture in the air enters the exhaust chambers 1 on both sides through the hollow fiber membranes 3, and the dry air continues to move forward, and is cooled down by the action of the semiconductor cooling sheet 5, and the dry and cool air is discharged from the exhaust end of the air inlet chamber 1. In the exhaust chamber 2, the humidity of the gas is very high, and at the same time, the temperature rises and the kinetic energy increases under the action of the semiconductor cooling sheet 5. The first fan 6 blows towards the hot air, so that the humid hot air passes through the variable diameter structure 21, and the gas flow rate is accelerated based on the Bernoulli effect, and the humid hot gas is quickly discharged from the exhaust port on the right.

[0026] Although this specification is described according to implementation modes, not every implementation mode includes only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0027] Therefore, the above description is only a preferred embodiment of the present application and is not intended to limit the scope of implementation of the present application; that is, all equivalent changes made according to the scope of the claims of the present application are within the protection scope of the claims of the present application.

Claims

1. A membrane gas dehumidification device, characterized in that: The invention comprises an air inlet chamber (1) and an exhaust chamber (2) arranged on one side of the air inlet chamber (1), wherein the air inlet chamber (1) and the exhaust chamber (2) are connected via a hollow fiber membrane (3); the exhaust end of the air inlet chamber (1) is connected to a refrigeration chamber (4), wherein the refrigeration chamber (4) is connected to the exhaust chamber (2) via a semiconductor refrigeration plate (5), wherein the cooling surface of the semiconductor refrigeration plate (5) is connected to the air inlet chamber (1), and the heating surface is connected to the exhaust chamber (2); the connection between the exhaust chamber (2) and the semiconductor refrigeration plate (5) is a variable diameter structure (21), wherein the inner diameter of the variable diameter structure (21) gradually decreases in the direction of gas flow; and a first fan (6) is arranged in the variable diameter structure (21).

2. The membrane gas dehumidification device according to claim 1, characterized in that: There are two exhaust chambers (2), which are respectively arranged on both sides of the air inlet chamber (1).

3. The membrane gas dehumidification device according to claim 1, characterized in that: The inner wall cross section of the exhaust chamber (2) is rectangular.

4. The membrane gas dehumidification device according to claim 1, characterized in that: A second fan (7) is provided at the air inlet end of the air inlet chamber (1).

5. The membrane gas dehumidification device according to claim 1, characterized in that: The temperature difference between the heating surface and the cooling surface of the semiconductor refrigeration sheet (5) is greater than 50°C.

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