Copper-clad plate surface impurity removing equipment for pcb (printed circuit board) production

Abstract

The utility model relates to impurity removing equipment, in particular to copper-clad plate surface impurity removing equipment for pcb (printed circuit board) production. A copper-clad plate surface impurity removing device for pcb production comprises a supporting frame, a mounting frame, an ultrasonic cleaning machine, a drainage pipe, a guide plate and the like. The front side and the rear side of the top of the supporting frame are each connected with two installation frames, the left portion of the supporting frame is connected with an ultrasonic cleaning machine, the lower portion of the ultrasonic cleaning machine is connected and communicated with a drainage pipe, a rodless air cylinder is installed between the two installation frames on the front side, a guide plate is connected between the two installation frames on the rear side, and a guide groove is formed in the guide plate. According to the copper-clad plate cleaning device, the cleaned copper-clad plates are scanned and inspected through the optical module, the uncleaned copper-clad plates are quickly screened according to the inspection result, manual taking inspection is not needed, careless mistakes are reduced, secondary pollution caused by manual taking inspection after cleaning can be reduced, and the cleaning effect is improved.

Description

Technical Field

[0001] The utility model relates to impurity removing equipment, in particular to impurity removing equipment on the surface of a copper-clad plate used in the production of a PCB plate. Background Art

[0002] Impurities in copper clad laminate substrates refer to opaque or transparent impurities or black spots on the surface of the substrate. There are various reasons for the generation of substrate impurities and black spots. The substrate is brought in during gluing, or when stacking materials, the operating environment is contaminated by dust and impurities, and the operator accidentally brings them into the product. Substrate impurities and black spots not only affect the appearance of the product, but may also affect other properties of the substrate.

[0003] A Chinese patent with application number CN202320796517.0 discloses a cleaning device for copper clad laminate production, including a bottom plate, both sides of the top of the bottom plate are fixedly connected to side plates, the opposite end of the side plate is fixedly connected to a conveying device, the middle of the top of the side plate is fixedly connected to a U-shaped plate, the left sides of the front and rear ends of the U-shaped plate are provided with slide grooves, the left and right ends of the slide groove are slidably connected to a second fixed frame, the inner wall of the rear end of the second fixed frame is rotatably connected to a drive shaft, and the outer wall of the drive shaft is fixedly connected to a water absorption roller. The above device The problem of insufficient scrubbing during cleaning of the copper clad laminate resulting in residual water stains on the copper clad laminate, which affects the subsequent use of the copper clad laminate, is solved. Part of the water stains on the copper clad laminate can be scraped off, and then the water absorption roller is brought into contact with the copper clad laminate to absorb the water stains on the copper clad laminate, thereby maintaining the dry effect of the copper clad laminate and reusing water resources, thereby saving water resources. However, after cleaning, it cannot be guaranteed that there are no unclean copper clad laminates, and manual inspection and screening are required. There may be omissions during manual screening, and secondary pollution will be caused during manual inspection.

[0004] In view of this, the utility model provides a copper clad laminate surface impurity removal device for PCB board production, which can inspect the cleaned copper clad laminate and quickly screen the uncleaned copper clad laminate according to the inspection results, without the need for manual inspection, thus reducing omissions and reducing secondary pollution during manual inspection after cleaning, thereby improving the impurity removal effect. Utility Model Content

[0005] In order to overcome the shortcomings that the existing equipment cannot ensure that there are no unclean copper clad laminates after cleaning, manual inspection is required for screening, there may be omissions during manual screening, and secondary pollution will be caused during manual inspection, the purpose is to provide a copper clad laminate surface impurity removal equipment for PCB board production that can inspect the cleaned copper clad laminates and quickly screen uncleaned copper clad laminates according to the inspection results, without the need for manual inspection, reducing omissions, and can reduce secondary pollution during manual inspection after cleaning, thereby improving the impurity removal effect.

[0006] The technical scheme is: a device for removing impurities from the surface of copper-clad boards produced by PCB boards, comprising a support frame, a mounting frame, an ultrasonic cleaning machine, a drain pipe, a guide plate, a connecting rod, a card plate, a spring, a rodless cylinder, a slider, a connecting plate, an upper shell, a lower shell, an air intake pipe, an optical module and a conveying device. Two mounting frames are connected to the front and rear sides of the top of the support frame. The left part of the support frame is connected to an ultrasonic cleaning machine, and the lower part of the ultrasonic cleaning machine is connected and connected to a drain pipe. A rodless cylinder is installed between the two mounting frames on the front side, and a guide plate is connected between the two mounting frames on the rear side. A guide groove is opened on the guide plate. A slider is slidably provided on the left part of the rodless cylinder, and a connecting plate is slidably provided on the inner side of the front of the slider. A connecting rod is fixedly provided at the lower part of the connecting plate, and the connecting rod is slidably connected to the guide plate. Two card plates are slidably provided on the connecting rod, and two springs are wound around the outer side of the connecting rod. The two ends of the spring are respectively connected to the connecting rod and the card plate on the same side, and the two card plates are symmetrically arranged front and back.

[0007] The upper part of the guide plate is connected to the upper shell, the lower part of the guide plate is connected to the lower shell, the top of the upper shell and the bottom of the lower shell are connected and communicated with the air intake pipe, the air intake pipe is provided with an air intake joint, optical modules are installed on the right side of the top of the upper shell and the right side of the bottom of the lower shell, the two optical modules are symmetrically arranged, and a conveying device is installed on the right part of the support frame, and the conveying device consists of a frame, a transmission motor and two sets of synchronous belt groups.

[0008] Furthermore, it also includes a connecting frame and a grinder. The connecting frame is welded on the front side of the right part of the rodless cylinder, and the grinder is installed at the lower part of the connecting frame.

[0009] Furthermore, it also includes a fixed plate, a mounting plate and a top block. The top blocks are fixedly connected to the card plate plates, the mounting plate is connected to the front right side of the guide plate, and the fixed plates are symmetrically arranged on the front and rear left sides of the mounting plate.

[0010] Furthermore, it also includes a hopper, which is installed on the support frame near the ultrasonic module, and a plurality of water leakage holes are opened on the lower shell.

[0011] Furthermore, the distance between the two synchronous belts on the conveying device is smaller than the width of the copper clad laminate.

[0012] Compared with the prior art, the utility model has the following advantages: the utility model scans and inspects the cleaned copper clad laminate through an optical module, and quickly screens the uncleaned copper clad laminate according to the inspection results, without the need for manual inspection, thus reducing omissions, and can reduce secondary contamination during manual inspection after cleaning, thereby improving the cleaning effect.

[0013] The utility model can automatically unload the copper-clad plate on the card plate through the cooperation of the top block and the fixed plate, without manually moving the card plate to unload the material, and the equipment has continuous action and is relatively efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0015] Figure 2 This is a schematic diagram of the three-dimensional structure of the utility model without the conveying device.

[0016] Figure 3 It is a three-dimensional structural schematic diagram of the components such as the mounting frame, ultrasonic cleaning machine and hopper of the utility model.

[0017] Figure 4 It is a three-dimensional structural schematic diagram of the rodless cylinder, slider, connecting plate and other components of the utility model.

[0018] Figure 5 It is a three-dimensional structural schematic diagram of the upper shell, lower shell, air intake pipe and other components of the utility model.

[0019] Figure 6 This is a schematic diagram of the cooperation between the top block and the fixed plate and the change of the position of the card plate of the utility model.

[0020] Figure 7 It is a three-dimensional structural schematic diagram of the lower shell of the utility model.

[0021] Explanation of the accompanying drawings: 1_support frame, 2_mounting frame, 21_ultrasonic cleaning machine, 22_drain pipe, 3_guide plate, 4_connecting rod, 41_card block, 42_spring, 5_rodless cylinder, 51_slider, 52_connecting plate, 6_upper shell, 61_lower shell, 62_inlet pipe, 63_hopper, 7_optical module, 8_fixing plate, 80_mounting plate, 81_top block, 9_conveying device, 10_connecting frame, 11_grinder. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Embodiment 1: A device for removing impurities from the surface of a copper-clad laminate produced by a PCB board, such as Figure 1-7As shown, it includes a support frame 1, a mounting frame 2, an ultrasonic cleaning machine 21, a drain pipe 22, a guide plate 3, a connecting rod 4, a card plate 41, a spring 42, a rodless cylinder 5, a slider 51, a connecting plate 52, an upper shell 6, a lower shell 61, an air inlet pipe 62, an optical module 7 and a conveying device 9. Two mounting frames 2 are connected to the front and rear sides of the top of the support frame 1. The left part of the support frame 1 is connected to the ultrasonic cleaning machine 21. The ultrasonic cleaning machine 21 is composed of a cleaning tank and an ultrasonic module. The ultrasonic wave emitted by the ultrasonic cleaning machine 21 propagates in the liquid, so that the liquid and the cleaning tank vibrate together at the ultrasonic frequency. The liquid and the cleaning tank have their own natural frequencies when vibrating, and a cavitation effect is generated in the liquid to perform cleaning work. The lower part of the ultrasonic cleaning machine 21 is connected and communicated with the drain pipe 22. A rodless air cylinder for moving materials is installed between the two mounting frames 2 on the front side. Cylinder 5, a guide plate 3 for changing the height position of the material during the material shifting process is connected between the two mounting frames 2 at the rear side, a guide groove is opened on the guide plate 3, and the guide groove is connected by two parallel grooves and an arc groove, the left part of the rodless cylinder 5 is slidably provided with a slider 51 that slides at a uniform speed and can stop moving at any time, and a connecting plate 52 is slidably provided on the inner side of the front of the slider 51, and the connecting plate 52 is used for guiding and directional movement, a connecting rod 4 is fixedly provided at the lower part of the connecting plate 52, and the connecting rod 4 is slidably connected to the guide plate 3, and two card plates 41 for flattening the copper-clad laminate are slidably provided on the connecting rod 4, and two springs 42 are wound around the outer side of the connecting rod 4, and the two ends of the spring 42 are respectively connected to the connecting rod 4 and the card plate 41 on the same side, and the two card plates 41 are symmetrically arranged front and back, and the distance between the two card plates 41 is consistent with the width of the copper-clad laminate that needs to remove impurities;

[0024] The upper part of the guide plate 3 is connected to the upper shell 6, and the lower part of the guide plate 3 is connected to the lower shell 61. The top of the upper shell 6 and the bottom of the lower shell 61 are both connected and communicated with an air intake pipe 62, and an air intake joint is provided on the air intake pipe 62. When the card block 41 moves to the right, it will pass between the shell 6 and the lower shell 61. Optical modules 7 are installed on the right side of the top of the upper shell 6 and the right side of the bottom of the lower shell 61. The two optical modules 7 are symmetrically arranged to scan the upper and lower surfaces of the moving copper-clad board respectively. A conveying device 9 is installed on the right part of the support frame 1. The conveying device 9 is composed of a frame, a transmission motor and two sets of synchronous belt groups. The optical module 7 is connected to the conveying device 9 through a signal, and the conveying device will change the conveying direction according to the results of the scanning inspection of the optical module 7.

[0025] Initially, the slider 51 is located at the left position of the rodless cylinder 5, and the two card plates 41 are waiting for material at the left position of the equipment. An appropriate amount of cleaning liquid for cleaning impurities on the surface of the copper-clad laminate is injected into the ultrasonic cleaning machine 21. The copper-clad laminate to be cleaned of impurities is placed flat between the two card plates 41. The distance between the card plates 41 is set to be consistent with the width of the copper-clad laminate to be cleaned and impurities removed. Then the rodless cylinder 5 is controlled to drive the slider 51 to slide, and the two card plates 41 move to the right with the slider 51. The rear end of the connecting rod 4 slides in the guide groove on the guide plate 3 and will slide into the lower part of the arc-shaped guide groove. The connecting rod 4 will move to the lower right. An ultrasonic cleaning machine 21 is arranged below the lower part of the guide groove. The card plate 41 and the copper-clad plate on the connecting rod 4 will move downward for a distance as the position of the connecting rod 4 moves. At this time, the copper-clad plate on the card plate 41 will move to the inside of the ultrasonic cleaning machine 21 and be immersed in the cleaning water. When the copper-clad plate is immersed in the liquid, the rodless cylinder 5 is controlled to stop, and the ultrasonic cleaning machine 21 is started. The copper-clad plate is surface cleaned in the ultrasonic cleaning machine 21. When the cleaning is completed, the rodless cylinder 5 is controlled to continue to slide the slider 51 to the right, driving the connecting rod 4 to slide to the right. The connecting rod 4 slides to the upper right in the arc groove, and when it reaches the highest point of the guide groove, it starts to move parallel to the right. In this process, the copper-clad plate on the card plate 41 will enter the upper shell 6 and the lower shell 6. 1, the air inlet pipe 62 is connected to the external high-pressure air through the air inlet joint, and blows out between the upper shell 6 and the lower shell 61, and blows to the upper and lower surfaces of the copper-clad board. The airflow with a faster flow rate will blow down the residual liquid on the surface of the copper-clad board after cleaning, and the blown liquid will fall into the lower shell 61 under the action of gravity. The rodless cylinder 5 drives the card plate 41 to continue to move to the right, and the optical module 7 located on the upper shell 6 and the lower shell 61 will check the upper and lower surfaces of the copper-clad board moving to the right, and feed back the inspection results to the transmission motor of the conveying device 9. The transmission motor controls the transmission direction of the synchronous belt group according to the inspection results: when the surface of the copper-clad board is clean and free of residual impurities after cleaning, the transmission motor The synchronous belt group is controlled to rotate backward to transfer the unloading. When there are impurities remaining on the surface of the copper clad laminate after cleaning, the transmission motor will control the synchronous belt group to rotate forward to transfer. When the slider 51 on the rodless cylinder 5 moves to the top of the conveying device 9 on the right side of the equipment, the two card blocks 41 are slid toward the front and rear sides. The cleaned copper clad laminate in the card block 41 will fall on the synchronous belt of the conveying device 9 below. People can rework the copper clad laminate transmitted forward, scan the cleaned copper clad laminate through the optical module 7, and quickly screen the uncleaned copper clad laminate according to the inspection results. There is no need for manual picking up and inspection, which reduces omissions and can reduce secondary pollution during manual picking up and inspection after cleaning, thereby improving the cleaning effect.

[0026] Embodiment 2: Based on embodiment 1, Figure 1-2As shown, it also includes a connecting frame 10 and a grinder 11. A connecting frame 10 for installation and support is welded on the front right side of the rodless cylinder 5. The grinder 11 is installed at the lower part of the connecting frame 10. The grinder 11 is composed of a driving motor and a grinding roller. The grinding roller is a fine grinding roller with a larger mesh number and will slightly contact the copper clad plate on the conveying device 9.

[0027] like Figure 1 , Figure 2 , Figure 5 and Figure 6 As shown, it also includes a fixed plate 8, a mounting plate 80 and a top block 81. The top blocks 81 are fixedly connected to the card blocks 41, the mounting plate 80 is connected to the front side of the right part of the guide plate 3, and the left side of the mounting plate 80 is symmetrically provided with fixed plates 8. The two top blocks 81 will contact the fixed plates 8 on the same side during the sliding process to the right. A bending plate is provided on the right side of the fixed plate 8. When the top block slides along the bending part of the right part of the two fixed plates 8, the two card blocks 41 will open to the front and rear sides opposite to each other and gradually separate from the copper clad laminate.

[0028] like Figure 3 and Figure 6 As shown, a hopper 63 is also included. A hopper 63 for collecting liquid is installed on the support frame 1 near the ultrasonic module. A plurality of leakage holes are opened on the lower shell 61. Liquid falling on the lower shell 61 will flow into the hopper 63 below the lower shell 61 through the leakage holes.

[0029] When the airflow blown out from the air inlet pipe 62 blows off the residual liquid on the surface of the copper-clad laminate, the liquid dropped on the lower shell 61 will flow into the hopper 63 below the lower shell 61 through the leaking hole to be collected for centralized cleaning. When the slider 51 moves to the right of the rodless cylinder 5, the two top blocks 81 on the card plate 41 will contact the fixed plate 8 on the same side respectively, and when the slider 51 drives the card plate 41 to move to the right, along the right bending part of the two fixed plates 8, the two card plates 41 open to the front and rear sides and gradually separate from the copper-clad laminate. When the top block 81 moves to the fixed plate 8, at this time, the card plate 41 and the copper clad laminate are just located above the conveying device 9, the card plate 41 is separated from the copper clad laminate, and the copper clad laminate on the card plate 41 will fall onto the conveying device 9 for transmission, and there is no need to manually move the card plate 41 to unload the material. The equipment moves continuously and is more efficient. When the conveying device 9 conveys the copper clad laminate forward, the grinder 11 located above the conveying device 9 starts to work, and the grinder 11 will slightly contact the conveyed copper clad laminate, so that the impurities remaining on the board surface after cleaning the copper clad laminate can be cleaned to a certain extent, reducing the workload of manual rework.

[0030] In a preferred embodiment, the distance between the two synchronous belts on the conveying device 9 is smaller than the width of the copper clad laminate. When the copper clad laminate falls onto the conveying device 9, the two synchronous belts on the conveying device 9 can hold the copper clad laminate steadily.

[0031] It should be understood that this embodiment is only used to illustrate the present invention and is not used to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the claims attached to this application.

Claims

1. A device for removing impurities from the surface of a copper-clad laminate in the production of a PCB, comprising a support frame (1), a mounting frame (2), an ultrasonic cleaning machine (21), a drain pipe (22), a guide plate (3), a connecting rod (4), a card plate (41), a spring (42), a rodless cylinder (5), a slider (51) and a connecting plate (52), wherein two mounting frames (2) are connected to both the front and rear sides of the top of the support frame (1), the left part of the support frame (1) is connected to the ultrasonic cleaning machine (21), the lower part of the ultrasonic cleaning machine (21) is connected and communicated with the drain pipe (22), and a rodless cylinder (5) is installed between the two mounting frames (2) on the front side. A guide plate (3) is connected between the two mounting frames (2) at the rear side, a guide groove is provided on the guide plate (3), a slider (51) is slidably provided on the left side of the rodless cylinder (5), a connecting plate (52) is slidably provided on the inner side of the front of the slider (51), a connecting rod (4) is fixedly provided at the lower part of the connecting plate (52), and the connecting rod (4) is slidably connected to the guide plate (3), two card plates (41) are slidably provided on the connecting rod (4), two springs (42) are wound around the outer side of the connecting rod (4), two ends of the spring (42) are respectively connected to the connecting rod (4) and the card plate (41) on the same side, and the two card plates (41) are symmetrically arranged front and back; Its characteristics are: The invention also comprises an upper shell (6), a lower shell (61), an air intake pipe (62), an optical module (7) and a conveying device (9); the upper part of the guide plate (3) is connected to the upper shell (6); the lower part of the guide plate (3) is connected to the lower shell (61); the top of the upper shell (6) and the bottom of the lower shell (61) are both connected and communicated with the air intake pipe (62); the air intake pipe (62) is provided with an air intake joint; the optical module (7) is installed on the right side of the top of the upper shell (6) and the right side of the bottom of the lower shell (61); the two optical modules (7) are symmetrically arranged; the conveying device (9) is installed on the right side of the support frame (1); the conveying device (9) is composed of a frame, a transmission motor and two sets of synchronous belt groups.

2. The device for removing impurities from the surface of copper-clad boards for PCB production according to claim 1 is characterized in that: It also includes a connecting frame (10) and a grinder (11). The connecting frame (10) is welded on the front right side of the rodless cylinder (5), and the grinder (11) is installed at the bottom of the connecting frame (10).

3. The device for removing impurities from the surface of copper-clad boards for PCB production according to claim 2 is characterized in that: It also includes a fixing plate (8), a mounting plate (80) and a top block (81), the top block (81) is fixedly connected to each of the card plate sections (41), the mounting plate (80) is connected to the front right side of the guide plate (3), and the fixing plate (8) is symmetrically arranged on the left side of the mounting plate (80) in a front-rear manner.

4. The device for removing impurities from the surface of copper-clad boards for PCB production according to claim 3 is characterized in that: It also includes a hopper (63), which is installed on the support frame (1) near the ultrasonic module, and a plurality of water leakage holes are opened on the lower shell (61).

5. The device for removing impurities from the surface of copper-clad boards for PCB production according to claim 4 is characterized in that: The distance between the two synchronous belts on the conveying device (9) is smaller than the width of the copper-clad laminate.

Images