Electronic product tin soldering device
By designing a solder device containing a welding slag cleaning mechanism, the problem of difficulty in cleaning the welding slag during the soldering process is solved, and the clean maintenance of the circuit board surface is achieved.
Patent Information
- Application Number
- CN202421194513.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-29
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-05-29
AI Technical Summary
Existing electronic product soldering devices cannot effectively clean the welding slag generated during the soldering process, resulting in untidy circuit board surfaces.
A soldering device including a base, a bracket, a support plate, a flip mechanism, a moving mechanism, a soldering machine, a slag collection box, a slag cleaning mechanism and a clamping mechanism is designed, and is composed of an electric telescopic rod, a motor and a brush disk. The welding slag cleaning mechanism realizes automatic cleaning of welding slag through flip and move mechanism.
It realizes convenient cleaning of welding slag during soldering and maintains the tidy state of the circuit board.
Smart Images

Figure CN222359407U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of soldering, in particular to a soldering device for electronic products. Background Art
[0002] Solder is an important industrial raw material for welding electronic components. It is a metal solder with a low melting point, mainly referring to solder made of tin-based alloys. The production method of solder is to first make ingots by melting, and then pressure process them into materials.
[0003] When producing electronic products, soldering devices are often used to solder the circuit boards of electronic products. Chinese patent CN206952319U discloses a soldering device for the production of electronic products, including a first fixed plate and a second fixed plate, the first fixed plate and the second fixed plate are connected by a receiving rod, a mounting head is fixedly provided on the top of the receiving rod, and pre-tightening blocks are movably provided on the connecting surfaces of the two ends of the receiving rod and the first fixed plate and the second fixed plate, and the first clamping plate is movably provided at one end of the first fixed plate and the second fixed plate, and the first clamping plates at one end of the first fixed plate and the second fixed plate are mutually connected by a connecting rod. The utility model improves the fixing effect of the electric soldering iron by setting a movable cavity, a second clamping plate, a first fixed seat, a second fixed seat, a second spring and a limiting block, and cooperates with each other to avoid displacement and angle deviation of the electric soldering iron, thereby ensuring the quality of the welding of electronic products, and at the same time, ensuring the advantages of the fixing effect of electric soldering irons of different specifications and models.
[0004] In the actual soldering process, some solder slag often appears on the circuit board, and the above patent does not have the function of cleaning the solder slag and cannot ensure the cleanliness of the circuit board surface. Therefore, in view of the above situation, it is urgent to develop an electronic product soldering device that is convenient for cleaning the solder slag generated during soldering and keeping the circuit board clean, so as to overcome the shortcomings in current practical applications and meet current needs. Utility Model Content
[0005] The purpose of the utility model is to provide a soldering device for electronic products to solve the problems raised in the above background technology.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A soldering device for electronic products, comprising a base, a bracket, a support plate, a flip mechanism, a moving mechanism, a soldering machine, a soldering slag collection box, a soldering slag cleaning mechanism and a clamping mechanism, wherein the base is fixed with a bracket, the top of the bracket is equipped with a soldering machine, the soldering machine is equipped with a soldering head, the bracket is equipped with a moving mechanism for driving the soldering head to move, the base is equipped with a support plate, the left and right sides of the support plate are both fixed with a rotating shaft, the rotating shaft is rotatably connected to the base, the support plate is provided with a positioning groove, the bottom of the support plate is provided with a A clamping mechanism extending into the positioning groove is installed, a flip mechanism for driving the rotating shaft and the support plate to rotate is installed on the base, a welding slag collection box is installed on the base below the support plate, a welding slag cleaning mechanism is installed in the welding slag collection box, and the welding slag cleaning mechanism includes: a second electric telescopic rod, a base plate, a third motor and a brush plate, the second electric telescopic rod is installed in the welding slag collection box, the output end of the second electric telescopic rod is fixed to the base plate, the third motor is fixed on the upper side of the base plate, and a brush plate is installed on the output shaft of the third motor.
[0008] Preferably: the flipping mechanism comprises: a first motor, a first gear and a second gear, the first motor is fixed on the base, a first gear is installed on the output shaft of the first motor, a second gear meshing with the first gear is installed on one side of the first gear, and the second gear is installed on the rotating shaft.
[0009] Preferably: the moving mechanism includes: a second motor, a lead screw, a threaded sleeve, a limit rod, a first electric telescopic rod and a lifting plate, the second motor is fixed on the bracket, the lead screw is rotatably connected in the bracket, the output shaft of the second motor is connected to the lead screw, a threaded sleeve is installed on the lead screw, a limit rod inserted into the bracket is fixed on the upper side of the threaded sleeve, the first electric telescopic rod is fixed on the lower side of the threaded sleeve, and the output end of the first electric telescopic rod is fixed to the lifting plate.
[0010] Preferably, the limiting rod is slidably connected to the bracket, and the bracket is provided with a limiting sliding groove for the movement of the limiting rod.
[0011] Preferably: the soldering head is fixed on the lifting plate.
[0012] Preferably, the clamping mechanism comprises: a third electric telescopic rod and a clamping plate, the third electric telescopic rod is fixed to the bottom of the support plate, and the output end of the third electric telescopic rod is fixed to the clamping plate.
[0013] Preferably, the clamping plate is inserted into the positioning groove.
[0014] The beneficial effect of the utility model is as follows: when the electronic product soldering device is used, the circuit board is placed in the positioning groove, and then the circuit board is clamped in the positioning groove by the clamping mechanism, and then the second motor drives the lead screw to rotate, and the lead screw rotates to drive the threaded sleeve, the first electric telescopic rod and the lifting plate to move left and right, and the lifting plate drives the soldering head to move left and right, and then adjusts the position of the soldering head. After adjustment, the lifting plate and the soldering head are driven downward by the first electric telescopic rod, so that the soldering head is attached to the circuit board for soldering (the soldering wire is placed at the position to be soldered on the circuit board). After soldering is completed, the rotating shaft and the support plate are driven to flip up and down by the flip mechanism, and the circuit board is driven to flip up and down by the support plate, and then the third motor and the brush plate are driven upward by the second electric telescopic rod, so that the brush plate is attached to the circuit board, and then the brush plate is driven to rotate by the third motor, and the solder slag on the circuit board is cleaned by the brush plate, and the solder slag is collected by the solder slag collection box. In summary, the utility model is convenient for soldering of circuit boards, and convenient for cleaning the solder slag generated during soldering, which is convenient for keeping the circuit board clean. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The three-dimensional structure of the utility model is shown in FIG. Figure 1 .
[0016] Figure 2 The three-dimensional structure of the utility model is shown in FIG. Figure 2 .
[0017] Figure 3 It is a partial structure diagram of the utility model Figure 1 .
[0018] Figure 4 It is a partial structure diagram of the utility model Figure 2 .
[0019] Figure 5 It is a partial structure diagram of the utility model Figure 3 .
[0020] Figure 6 It is an internal cross-sectional view of the welding slag collection box in the utility model.
[0021] Legend:
[0022] 1. Base; 2. Bracket; 201. Limiting slide groove; 3. Support plate; 301. Positioning groove; 302. Rotating shaft; 4. Flipping mechanism; 401. First motor; 402. First gear; 403. Second gear; 5. Moving mechanism; 501. Second motor; 502. Lead screw; 503. Threaded sleeve; 504. Limiting rod; 505. First electric telescopic rod; 506. Lifting plate; 6. Soldering machine; 601. Soldering head; 602. Wire; 7. Welding slag collecting box; 8. Welding slag cleaning mechanism; 801. Second electric telescopic rod; 802. Base plate; 803. Third motor; 804. Brush plate; 9. Clamping mechanism; 901. Third electric telescopic rod; 902. Clamping plate. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] Specific examples are given below.
[0025] See also Figure 1 to Figure 6 In an embodiment of the utility model, a soldering device for electronic products includes a base 1, a bracket 2, a support plate 3, a flip mechanism 4, a moving mechanism 5, a soldering machine 6, a soldering slag collection box 7, a soldering slag cleaning mechanism 8 and a clamping mechanism 9. The base 1 is fixed with a bracket 2, a soldering machine 6 is installed on the top of the bracket 2, a soldering head 601 is installed on the soldering machine 6, and the soldering head 601 is electrically connected to the soldering machine 6 through a wire 602. The bracket 2 is installed with a moving mechanism 5 for driving the soldering head 601 to move, a support plate 3 is installed on the base 1, a rotating shaft 302 is fixed on both sides of the support plate 3, and the rotating shaft 302 is rotatably connected to the base 1, a positioning groove 301 is provided on the support plate 3, and a bottom of the support plate 3 is provided with a extending to the positioning groove 301. The clamping mechanism 9 inside, the turning mechanism 4 for driving the rotating shaft 302 and the supporting plate 3 to rotate is installed on the base 1, and a welding slag collecting box 7 is installed on the base 1 below the supporting plate 3, and a welding slag cleaning mechanism 8 is installed in the welding slag collecting box 7. When in use, the circuit board is placed in the positioning groove 301, and then the circuit board is clamped into the positioning groove 301 by the clamping mechanism 9, and then the soldering head 601 is driven to move by the moving mechanism 5, and the circuit board is soldered by the soldering head 601 (a person places the soldering wire to the position to be soldered on the circuit board). After the soldering is completed, the rotating shaft 302 and the supporting plate 3 are turned up and down by the turning mechanism 4, and then the soldering slag on the circuit board is cleaned by the soldering slag cleaning mechanism 8, and the soldering slag is collected by the soldering slag collecting box 7.
[0026] The flipping mechanism 4 includes: a first motor 401, a first gear 402 and a second gear 403. The first motor 401 is fixed on the base 1. The first gear 402 is installed on the output shaft of the first motor 401. A second gear 403 meshing with the first gear 402 is installed on one side of the first gear 402. The second gear 403 is installed on the rotating shaft 302. When in use, the first motor 401 drives the first gear 402 and the second gear 403 to rotate, and the rotation of the second gear 403 drives the rotating shaft 302 and the support plate 3 to flip up and down, and the circuit board is driven to flip up and down through the support plate 3.
[0027] The moving mechanism 5 includes: a second motor 501, a lead screw 502, a threaded sleeve 503, a limiting rod 504, a first electric telescopic rod 505 and a lifting plate 506. The second motor 501 is fixed on the bracket 2, the lead screw 502 is rotatably connected in the bracket 2, the output shaft of the second motor 501 is connected to the lead screw 502, the lead screw 502 is installed with a threaded sleeve 503, the upper side of the threaded sleeve 503 is fixed with a limiting rod 504 inserted into the bracket 2, the limiting rod 504 is slidably connected with the bracket 2, and a limiting slide groove 201 for moving the limiting rod 504 is provided on the bracket 2, and the movement of the threaded sleeve 503 is limited by the limiting rod 504 so that it cannot rotate but can only move in a straight line. Movement, a first electric telescopic rod 505 is fixed to the lower side of the threaded sleeve 503, the output end of the first electric telescopic rod 505 is fixed to the lifting plate 506, and the soldering head 601 is fixed on the lifting plate 506. When in use, the second motor 501 drives the lead screw 502 to rotate, and the threaded sleeve 503, the first electric telescopic rod 505 and the lifting plate 506 are driven to move left and right through the rotation of the lead screw 502, and the soldering head 601 is driven to move left and right through the lifting plate 506, and then the position of the soldering head 601 is adjusted. After adjustment, the lifting plate 506 and the soldering head 601 are driven downward by the first electric telescopic rod 505, so that the soldering head 601 is attached to the circuit board for soldering.
[0028] The welding slag cleaning mechanism 8 includes: a second electric telescopic rod 801, a base plate 802, a third motor 803 and a brush plate 804. The second electric telescopic rod 801 is installed in the welding slag collecting box 7. The output end of the second electric telescopic rod 801 is fixed to the base plate 802. The third motor 803 is fixed on the upper side of the base plate 802. The brush plate 804 is installed on the output shaft of the third motor 803. When in use, the third motor 803 and the brush plate 804 are driven to move upward by the second electric telescopic rod 801, so that the brush plate 804 is attached to the circuit board, and then the brush plate 804 is driven to rotate by the third motor 803, and the welding slag on the circuit board is cleaned by the brush plate 804.
[0029] The clamping mechanism 9 includes: a third electric telescopic rod 901 and a clamping plate 902. The third electric telescopic rod 901 is fixed to the bottom of the support plate 3. The output end of the third electric telescopic rod 901 is fixed to the clamping plate 902. The clamping plate 902 is inserted into the positioning groove 301. When in use, the clamping plate 902 is driven to move by the third electric telescopic rod 901, and the circuit board is clamped into the positioning groove 301 by the clamping plate 902.
[0030] Working principle: When the electronic product soldering device is used, the circuit board is placed in the positioning groove 301, and then the clamping mechanism 9 clamps the circuit board into the positioning groove 301, and then the second motor 501 drives the lead screw 502 to rotate, and the lead screw 502 rotates to drive the threaded sleeve 503, the first electric telescopic rod 505 and the lifting plate 506 to move left and right, and the lifting plate 506 drives the soldering head 601 to move left and right, and then adjust the position of the soldering head 601. After the adjustment, the lifting plate 506 and the soldering head 601 are driven downward by the first electric telescopic rod 505 to make the soldering head 601 move downward. The soldering head 601 is attached to the circuit board for soldering (a person places the soldering wire at the position on the circuit board to be soldered). After the soldering is completed, the rotating shaft 302 and the support plate 3 are driven to flip up and down through the flipping mechanism 4, and the circuit board is driven to flip up and down through the support plate 3. Then, the third motor 803 and the brush plate 804 are driven to move upward through the second electric telescopic rod 801, so that the brush plate 804 is attached to the circuit board, and then the brush plate 804 is driven to rotate through the third motor 803, and the soldering slag on the circuit board is cleaned by the brush plate 804, and the soldering slag is collected by the soldering slag collection box 7.
[0031] The above are only preferred specific implementation methods of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the utility model, who makes equivalent replacements or changes based on the technical scheme and utility model concept of the utility model, should be covered by the protection scope of the utility model.
Claims
1. An electronic product soldering device, characterized in that: The invention comprises a base (1), a bracket (2), a support plate (3), a turning mechanism (4), a moving mechanism (5), a soldering machine (6), a soldering slag collecting box (7), a soldering slag cleaning mechanism (8) and a clamping mechanism (9), wherein the base (1) is fixed with a bracket (2), a soldering machine (6) is installed on the top of the bracket (2), a soldering head (601) is installed on the soldering machine (6), a moving mechanism (5) for driving the soldering head (601) to move is installed on the bracket (2), a support plate (3) is installed on the base (1), a rotating shaft (302) is fixed on both the left and right sides of the support plate (3), and the rotating shaft (302) is rotatably connected to the base (1), a positioning groove (301) is provided on the support plate (3), and a positioning groove (301) is installed on the bottom of the support plate (3) The invention relates to a clamping mechanism (9) in a rotating shaft (301), a turning mechanism (4) for driving the rotating shaft (302) and the supporting plate (3) to rotate is installed on the base (1), a welding slag collecting box (7) is installed on the base (1) below the supporting plate (3), a welding slag cleaning mechanism (8) is installed in the welding slag collecting box (7), and the welding slag cleaning mechanism (8) comprises: a second electric telescopic rod (801), a base plate (802), a third motor (803) and a brush plate (804), the second electric telescopic rod (801) is installed in the welding slag collecting box (7), the output end of the second electric telescopic rod (801) is fixed to the base plate (802), the third motor (803) is fixed on the upper side of the base plate (802), and the brush plate (804) is installed on the output shaft of the third motor (803).
2. The electronic product soldering device according to claim 1, characterized in that: The flipping mechanism (4) comprises: a first motor (401), a first gear (402) and a second gear (403); the first motor (401) is fixed on the base (1); the first gear (402) is mounted on the output shaft of the first motor (401); a second gear (403) meshing with the first gear (402) is mounted on one side of the first gear (402); and the second gear (403) is mounted on the rotating shaft (302).
3. The electronic product soldering device according to claim 1, characterized in that: The moving mechanism (5) comprises: a second motor (501), a lead screw (502), a threaded sleeve (503), a limiting rod (504), a first electric telescopic rod (505) and a lifting plate (506); the second motor (501) is fixed on the bracket (2); the lead screw (502) is rotatably connected in the bracket (2); the output shaft of the second motor (501) is connected to the lead screw (502); the lead screw (502) is mounted with a threaded sleeve (503); the upper side of the threaded sleeve (503) is fixed with a limiting rod (504) inserted into the bracket (2); the lower side of the threaded sleeve (503) is fixed with the first electric telescopic rod (505); and the output end of the first electric telescopic rod (505) is fixed to the lifting plate (506).
4. The electronic product soldering device according to claim 3, characterized in that: The limiting rod (504) is slidably connected to the bracket (2), and the bracket (2) is provided with a limiting sliding groove (201) for moving the limiting rod (504).
5. The electronic product soldering device according to claim 3, characterized in that: The soldering head (601) is fixed on the lifting plate (506).
6. The electronic product soldering device according to claim 1, characterized in that: The clamping mechanism (9) comprises: a third electric telescopic rod (901) and a clamping plate (902); the third electric telescopic rod (901) is fixed to the bottom of the support plate (3); and the output end of the third electric telescopic rod (901) is fixed to the clamping plate (902).
7. The electronic product soldering device according to claim 6, characterized in that: The clamping plate (902) is inserted into the positioning groove (301).
Citation Information
Patent Citations
Soldering device is used in electronic product production
CN206952319U