Inductor outgoing line welding jig

By designing the inductor lead wire welding fixture, using the installation slot, magnet positioning and anti-detachment mechanism, the problem of damage to the inductor winding enameled copper wire caused by tin bead sputtering is solved, and the stability of the welding process and product reliability are improved. .

CN222359411UActive Publication Date: 2025-01-17SHENZHEN ZHENHUA FU ELECTRONICS
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Patent Information

Application Number
CN202323497272.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-20
Publication Date
2025-01-17
Estimated Expiration
2033-12-20

AI Technical Summary

Technical Problem

During the lead wire welding process of winding inductors, tin beads sputtered onto the enameled copper wire of the inductor winding, resulting in damage to the paint film and short circuit, affecting product reliability.

Method used

A kind of inductor lead wire welding fixture is designed, including a mounting groove, a positioning mechanism and an anti-detachment mechanism. The mounting groove is used to protect the inductor. The positioning mechanism keeps the inductor stable through magnet adsorption, and the anti-detachment mechanism passes through baffle and torsion spring. Prevent the inductor from being disengaged and reduce sputtering and shaking of the tin beads.

Benefits of technology

It effectively reduces the risk of sputtering tin beads to copper wires, ensures the stability and reliability of the inductor, and avoids short-circuit problems in subsequent use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model is suitable for the technical field of inductors, and particularly relates to an inductor outgoing line welding jig which comprises a bearing body, a positioning mechanism and an anti-falling mechanism. A mounting groove is formed in the bearing body, the mounting groove is used for arranging an inductor needing to be welded with a leading-out wire, a guide groove is formed in a notch of the mounting groove, and the guide groove is used for containing the leading-out wire and leading the leading-out wire to the outside of the mounting groove; the positioning mechanism is used for positioning the inductor in the mounting groove; the anti-disengaging mechanism is used for preventing the inductor from disengaging from the mounting groove. The utility model aims to reduce the risk that tin beads are sputtered on an enameled copper wire of an inductor winding.
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Description

Technical Field

[0001] The present application relates to the technical field of inductors, and more specifically, to a welding jig for inductor lead wires. Background Art

[0002] When soldering the lead wires of wound inductors, tin beads are inevitably produced during the dip soldering process. There is a risk that the tin beads will spatter onto the enameled copper wire of the inductor winding, causing damage to the paint film of the enameled copper wire of the inductor winding, resulting in a short circuit in the winding during subsequent use, affecting product reliability. Utility Model Content

[0003] The purpose of the present application is to provide an inductor lead wire welding fixture, aiming to reduce the risk of tin beads sputtering onto the enameled copper wire of the inductor winding.

[0004] To achieve the above purpose, the technical solution adopted by the present application is: the present application provides an inductor lead wire welding fixture, comprising:

[0005] A carrier, wherein a mounting groove is provided on the carrier, wherein the mounting groove is used to place an inductor to which a lead wire is to be welded, and a guide groove is provided at a notch of the mounting groove, wherein the guide groove is used to accommodate the lead wire and lead the lead wire to the outside of the mounting groove; and

[0006] A positioning mechanism, the positioning mechanism is used to position the inductor in the mounting groove;

[0007] The anti-dropout mechanism is used to prevent the inductor from falling out of the mounting groove. First, the mounting groove is set. When soldering, due to the protection of the mounting groove, the splashing tin liquid will not splash onto the copper wire, effectively ensuring that the copper wire will not be damaged, ensuring the reliability of the inductor in the later use, and because of the positioning mechanism and the anti-dropout mechanism, it can effectively ensure that the inductor is stably kept in the mounting groove during the soldering process, and will not fall out or shake at will, ensuring the reliability of soldering.

[0008] In one embodiment, the shape of the mounting groove is matched with the shape of the inductor. When the shape of the mounting groove is matched with the shape of the inductor, the inductor can be well mounted in the mounting groove, and the matching assembly can also reduce the gap between the mounting groove and the inductor to prevent tin beads from splashing in.

[0009] In one embodiment, the positioning mechanism is a magnet disposed in the mounting groove, and the magnet is used to adsorb the magnetic core of the inductor so that the inductor is positioned in the mounting groove. The magnet can generate an adsorption force with the magnetic core, and under the action of this adsorption force, the magnetic core can be well positioned in the mounting groove without shaking, thereby ensuring the stability of the magnetic core and the inductor.

[0010] In one embodiment, a receiving groove is provided at the bottom of the mounting groove, the magnet is provided in the receiving groove and the top surface of the magnet is flush with the bottom of the mounting groove, and the receiving groove and the magnet are both cylindrical. By providing a receiving groove to place the magnet, the space of the mounting groove is not occupied, so that the inductor can be well placed in the mounting groove, and because the top surface of the magnet is flush with the notch of the receiving groove, the top surface of the magnet can fit the magnetic core of the inductor to achieve firm adsorption.

[0011] In one embodiment, the guide groove is provided on the surface of the carrier body for providing the mounting groove, one end of the guide groove is connected to the mounting groove, and the other end passes through the side surface of the carrier body, and there are two guide grooves, which are respectively located on both sides of the mounting groove, and the two guide grooves are respectively used to accommodate the lead wires. The position and form of the guide groove make it possible to smoothly and conveniently lead the lead wire out of the mounting groove and perform the tinning operation, which is equivalent to guiding the lead wire so that it extends along a preset direction, facilitating the soldering operation.

[0012] In one embodiment, the carrier is a strip structure with an isosceles trapezoidal cross section, the mounting groove is provided on the largest surface of the carrier, and handle bars are provided at both ends of the carrier. If the carrier is a strip structure, multiple mounting grooves can be provided at the same time, and multiple carriers can be provided accordingly, so that the lead wires of multiple inductors can enter below the tin liquid at the same time. After the multiple lead wires on the same side have completed the tinning operation, the carrier is turned over, and the multiple lead wires on the other side are again allowed to enter below the tin liquid surface, thereby completing the operation.

[0013] In one embodiment, the anti-slip mechanism comprises:

[0014] a first baffle, wherein a first rotating shaft is disposed at one end of the first baffle, the first rotating shaft is rotatably assembled on the carrier, and the first baffle is used to prevent the inductor from escaping from the mounting groove;

[0015] a torsion spring, the torsion spring being arranged between the first rotating shaft and the carrier to drive the first rotating shaft to rotate; and

[0016] The limiting protrusion is provided on the carrier, and the limiting protrusion is used to stop the first baffle so that the first baffle is stopped at the notch of the installation groove. The first baffle is provided to prevent the inductor from falling out of the installation groove, and the position adjustment of the first baffle is achieved by rotating and cooperating with a torsion spring, which is very convenient to operate.

[0017] In one embodiment, the side of the first baffle is further connected to a second baffle, and when the first baffle is stopped at the notch, the second baffle is located at the guide groove to prevent the lead wire from falling out. The second baffle is connected to the first baffle and moves with the movement of the first baffle. When the first baffle moves to the notch position of the mounting groove, the second baffle moves to the position of the guide groove, thereby preventing the lead wire from falling out.

[0018] In one embodiment, the second baffle plate is provided with a through hole, a pressing plate is provided in the through hole, the pressing plate can move along the length direction of the through hole, the pressing plate is used to align the guide groove and press the lead-out wire in the guide groove. The second baffle plate is provided with a through hole, a pressing plate is provided in the through hole, the pressing plate can move along the length direction of the through hole, the pressing plate is used to align the guide groove and press the lead-out wire in the guide groove.

[0019] In one embodiment, a third baffle is provided on the second baffle, one end of the third baffle is rotatably connected to the second baffle via a second rotating shaft, and the third baffle is used to swing to the through hole and contact the pressing plate to keep the pressing plate in a pressed state. The effect of this embodiment is to ensure the stability of the lead wire so that it will not shake during the soldering process.

[0020] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the structure of an inductor lead wire welding fixture provided in some embodiments of the present application;

[0023] Figure 2 for Figure 1A schematic diagram of the enlarged structure at A in the middle;

[0024] Figure 3 A schematic diagram of the structure of an inductor lead wire welding fixture provided in some embodiments of the present application;

[0025] Figure 4 for Figure 3 A schematic diagram of the enlarged structure at B in the middle;

[0026] Figure 5 The figure is a schematic diagram of the structure of an inductor suitable for the inductor lead wire welding fixture provided in this embodiment.

[0027] In the figure, 1, carrier; 2, mounting groove; 3, inductor; 4, lead wire; 5, guide groove; 6, magnet; 7, handle bar; 8, first baffle; 9, second baffle; 10, third baffle; 11, first rotating shaft; 12, pressure plate; 13, limiting protrusion. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0031] In the description of the present application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0033] See also Figure 5 The wound inductor 3 includes a magnetic core and a winding wound on the magnetic core. The winding generally uses enameled copper wire. The two lead wires 4 of the winding need to be soldered. Usually, a layer of tin is coated on the lead wires 4 by dip soldering, that is, the lead wires 4 are immersed in tin liquid during operation. In normal operation, tin beads will splash during dip soldering. When the tin beads splash onto the enameled copper wire, they will cause damage, affecting the reliability of the inductor 3.

[0034] Based on this, see Figure 1 and Figure 2 The present application provides an inductor lead wire welding fixture, including a carrier 1, a positioning mechanism, and an anti-slip mechanism. The carrier 1 is provided with a mounting groove 2, and the mounting groove 2 is used to set the inductor 3 to be welded with the lead wire 4. A guide groove 5 is provided at the notch of the mounting groove 2, and the guide groove 5 is used to accommodate the lead wire 4 and lead the lead wire 4 to the outside of the mounting groove 2; the positioning mechanism is used to position the inductor 3 in the mounting groove 2; and the anti-slip mechanism is used to prevent the inductor 3 from falling out of the mounting groove 2. It should be noted that in Figure 1 and Figure 2 The anti-slip mechanism is not shown.

[0035] Specifically, the carrier 1 is used to carry the inductor 3, specifically the inductor 3 is installed in the mounting groove 2 on the carrier 1, and is positioned in the mounting groove 2, but the lead wire 4 of the inductor 3 extends from the mounting groove 2, specifically from the guide groove 5, and extends to the outside of the mounting groove 2, but at this time the magnetic core part and the winding part are still located in the mounting groove 2. During the specific operation, the carrier 1 is held or mechanically clamped, and the lead wire 4 is put into the tin liquid to achieve the soldering operation. Since the winding is located in the mounting groove 2 at this time, it is equivalent to the mounting groove 2 forming a protection for the winding, and the tin beads cannot be splashed onto the copper wire, thereby avoiding damage to the copper wire.

[0036] In order to prevent the inductor 3 from falling out of the mounting groove 2 during the handling of the carrier 1, the present embodiment further provides a positioning mechanism and an anti-falling mechanism, which can position the inductor 3 in the mounting groove 2 and prevent it from falling out, thereby ensuring the stability of the inductor 3 during soldering.

[0037] Therefore, the effect of the welding fixture provided in this embodiment is that, firstly, the mounting groove 2 is provided. When soldering, due to the protection of the mounting groove 2, the splashing tin liquid will not splash onto the copper wire, which effectively ensures that the copper wire will not be damaged, and ensures the reliability of the later use of the inductor 3. Moreover, due to the positioning mechanism and the anti-dropping mechanism, it can effectively ensure that the inductor 3 is stably maintained in the mounting groove 2 during the soldering process, and will not fall out or shake at will, thereby ensuring the reliability of soldering.

[0038] In some embodiments, the shape of the mounting slot 2 provided in the present application is compatible with the shape of the inductor 3 .

[0039] When the shapes of the mounting groove 2 and the inductor 3 are matched, the inductor 3 can be well mounted in the mounting groove 2 , and the matched assembly can also reduce the gap between the mounting groove 2 and the inductor 3 to prevent solder beads from splashing in.

[0040] See also Figure 2 In some embodiments, the positioning mechanism is a magnet 6 disposed in the mounting groove 2 , and the magnet 6 is used to adsorb the magnetic core of the inductor 3 to position the inductor 3 in the mounting groove 2 .

[0041] Specifically, the magnet 6 can generate an adsorption force with the magnetic core, and under the action of this adsorption force, the magnetic core can be well positioned in the mounting groove 2 without shaking, thereby ensuring the stability of the magnetic core and the inductor 3.

[0042] The position of the magnet 6 can be set as needed or specifically according to the shape of the groove body of the installation groove 2 , and can be set on the side wall of the installation groove 2 or at the bottom of the installation groove 2 .

[0043] In some embodiments, see Figure 2 A receiving groove is opened at the bottom of the installation groove 2, and the magnet 6 is arranged in the receiving groove and the top surface of the magnet 6 is flush with the bottom of the installation groove 2. The receiving groove and the magnet 6 are both cylindrical.

[0044] The present application provides a specific location for setting the magnet 6, which can be set at the bottom of the installation groove 2. In order not to affect the placement of the inductor 3, this embodiment provides a receiving groove at the bottom of the installation groove 2, and the receiving groove is used to set the magnet 6.

[0045] Specifically, the shape of the receiving groove can be the same as that of the magnet 6. When the magnet 6 is placed in the receiving groove, the magnet 6 just fills the receiving groove, and the top surface of the magnet 6 is flush with the notch of the receiving groove. When the inductor 3 is set in the installation groove 2, the bottom surface of the magnetic core just fits the bottom surface of the groove of the installation groove 2, and also fits with the magnet 6 in the receiving groove to achieve mutual adsorption. In order to enhance the use effect, the receiving groove and the magnet 6 both adopt a cylindrical structure for easy operation.

[0046] The effect of this embodiment is that by placing the magnet 6 in the form of a receiving groove, the space of the installation groove 2 will not be occupied, so that the inductor 3 can be well placed in the installation groove 2, and because the top surface of the magnet 6 is flush with the notch of the receiving groove, the top surface of the magnet 6 can fit the magnetic core of the inductor 3 to achieve firm adsorption.

[0047] In some embodiments of this application, please refer to Figure 2 The guide groove 5 is opened on the surface of the carrier 1 for opening the mounting groove 2. One end of the guide groove 5 is connected to the mounting groove 2, and the other end passes through the side of the carrier 1. There are two guide grooves 5 and they are respectively located on both sides of the mounting groove 2. The two guide grooves 5 are respectively used to accommodate the lead wires 4.

[0048] Specifically, the carrier 1 has a certain three-dimensional shape. When in use, the mounting groove 2 is opened on one surface of the carrier 1. The function of the guide groove 5 is to lead the lead wire 4 out of the mounting groove 2. Therefore, based on this, the guide groove 5 in the present application is opened on the surface of the carrier 1 used to open the mounting groove 2, specifically one end is connected to the mounting groove 2, and the other end passes through the other side of the carrier 1, so that the lead wire 4 can be led out of the mounting groove 2 through the guide groove 5, which is convenient for the tin dipping operation.

[0049] Since there are two lead-out wires 4 , two guide grooves 5 are provided accordingly. One end of the two guide grooves 5 is connected to the mounting groove 2 , and the other end thereof passes through two opposite side surfaces of the carrier 1 .

[0050] This embodiment provides the position and form of the guide groove 5, so that the lead wire 4 can be smoothly and conveniently led out from the installation groove 2 and the tinning operation can be performed, which is equivalent to guiding the lead wire 4 to extend along the preset direction, facilitating the soldering operation.

[0051] See also Figure 1 As a preferred embodiment of the present application, the carrier 1 is a strip structure with an isosceles trapezoidal cross section, the mounting groove 2 is provided on the largest surface of the carrier 1, and handle bars 7 are provided at both ends of the carrier 1.

[0052] When using the present carrier 1 to perform tin immersion operation on the lead wire 4 of the inductor 3 in the mounting groove 2, it is carried out as follows: after the inductor 3 is set in the mounting groove 2 and the lead wire 4 is led out from the guide groove 5, the carrier 1 is picked up so that the carrier 1 is located above the tin liquid surface, and the carrier 1 is rotated so that the surface where the mounting groove 2 is located stands upright, that is, the lead wire 4 is formed in a vertical manner and located at the lower side of the carrier 1, and then the carrier 1 is lowered to allow the lead wire 4 to enter the tin liquid, and then it is translated for a distance, and then the carrier 1 is lifted. Therefore, based on this, when the lead wire 4 enters the tin liquid, it is necessary to avoid contact between the carrier 1 and the tin liquid surface as much as possible, so the present application sets the carrier 1 to have an isosceles trapezoidal cross-section, and when the lead wire 4 enters, the side of the carrier 1 is tilted upward, which can well avoid contact with the tin liquid surface.

[0053] The carrier 1 provided in this embodiment is a strip-shaped structure, and multiple installation slots 2 can be opened at the same time, and multiple inductors 3 are arranged accordingly, so that the lead wires 4 of multiple inductors 3 can enter the tin liquid at the same time. After the multiple lead wires 4 on the same side are completed with the tinning operation, the carrier 1 is turned over, and the multiple lead wires 4 on the other side are again placed below the tin liquid surface, thereby completing the operation.

[0054] See also Figure 3 and Figure 4 In one embodiment, the anti-slip mechanism includes a first baffle 8, a torsion spring, and a limiting protrusion 13.

[0055] A first rotating shaft 11 is disposed at one end of the first baffle 8 . The first rotating shaft 11 is rotatably assembled on the carrier 1 . The first baffle 8 is used to prevent the inductor 3 from escaping from the mounting groove 2 .

[0056] The torsion spring is disposed between the first rotating shaft 11 and the carrier 1 to drive the first rotating shaft 11 to rotate.

[0057] The limiting protrusion 13 is disposed on the carrier 1 , and the limiting protrusion 13 is used to stop the first baffle plate 8 so that the first baffle plate 8 stops at the notch of the installation groove 2 .

[0058] Specifically, in order to further prevent the inductor 3 from falling out of the mounting groove 2 and increase stability, an anti-falling mechanism is also provided in this embodiment. The anti-falling mechanism can be specifically as follows: it is blocked at the notch of the mounting groove 2 by means of the first baffle 8, thereby preventing the inductor 3 from falling out.

[0059] During the specific operation, when the inductor 3 needs to be placed in the installation groove 2, the first baffle 8 is moved to make the first baffle 8 avoid the notch of the installation groove 2, and then the inductor 3 is placed in. The first baffle 8 swings under the rebound force of the torsion spring and stops after contacting the limiting protrusion 13. At this time, it is exactly located at the notch, thereby preventing the inductor 3 from escaping.

[0060] The effect of this embodiment is that the first baffle 8 is provided to prevent the inductor 3 from falling out of the mounting groove 2, and the position of the first baffle 8 is adjusted by rotating and cooperating with a torsion spring, which is very convenient to operate.

[0061] See also Figure 4 As a further embodiment, the side of the first baffle 8 is also connected to the second baffle 9, and when the first baffle 8 stops at the notch, the second baffle 9 is located at the guide groove 5 to prevent the lead wire 4 from falling out.

[0062] Since the guide groove 5 is used to guide the lead wire 4, it is best to prevent the lead wire 4 from escaping from the guide groove 5, and it is also for the purpose of positioning the lead wire 4 during soldering.

[0063] Based on this, this embodiment also provides a second baffle 9, which is connected to the first baffle 8 and moves with the movement of the first baffle 8. When the first baffle 8 moves to the slot position of the mounting slot 2, the second baffle 9 moves to the position of the guide groove 5, thereby preventing the lead wire 4 from falling out.

[0064] In order to increase the use effect, the present embodiment is also arranged such that the second baffle 9 is provided with a through hole, and a pressure plate 12 is provided in the through hole. The pressure plate 12 can move along the length direction of the through hole, and the pressure plate 12 is used to align the guide groove 5 and to press the lead-out wire 4 in the guide groove 5.

[0065] Since the lead wire 4 may be in a bent state in the guide groove 5, a pressing plate 12 is provided, and the lead wire 4 can be pressed by the pressing plate 12. The pressing plate 12 will not fall out of the through hole, and the pressing plate 12 can be set to be an I-shaped, thinner in the middle, and with limit parts at both ends to prevent it from falling out of the through hole. The lead wire 4 can be pressed by manually pressing the pressing plate 12.

[0066] See also Figure 4 Furthermore, a third baffle 10 is provided on the second baffle 9, one end of the third baffle 10 is rotatably connected to the second baffle 9 via a second rotating shaft, and the third baffle 10 is used to swing to the through hole and contact the pressing plate 12 to keep the pressing plate 12 in a pressed state.

[0067] Specifically, when the pressing plate 12 is pressed and the pressing plate 12 presses the lead wire 4, in order to prevent the pressing plate 12 from moving back or to maintain the pressing force on the lead wire 4, a third baffle 10 is provided. The third baffle 10 swings to the upper side of the pressing plate 12 and fits with the pressing plate 12, so that the pressing plate 12 can be kept in a pressed state, thereby positioning the lead wire 4 in the guide groove 5, but a part of the lead wire 4 extends out from the guide groove 5, and this part is used to enter the tin liquid.

[0068] The effect of this embodiment is to ensure the stability of the lead wire 4 so that it will not shake during the soldering process.

[0069] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An inductor lead wire welding fixture, characterized in that: include: A carrier, wherein a mounting groove is provided on the carrier, wherein the mounting groove is used to place an inductor to which a lead wire is to be welded, and a guide groove is provided at the notch of the mounting groove, wherein the guide groove is used to accommodate the lead wire and lead the lead wire to the outside of the mounting groove; as well as A positioning mechanism, the positioning mechanism is used to position the inductor in the mounting groove; The anti-slip mechanism is used to prevent the inductor from slipping out of the mounting groove.

2. The inductor lead wire welding jig according to claim 1, characterized in that: The shape of the mounting groove is matched with the shape of the inductor.

3. The inductor lead wire welding jig according to claim 1, characterized in that: The positioning mechanism is a magnet disposed in the installation slot, and the magnet is used to absorb the magnetic core of the inductor to position the inductor in the installation slot.

4. The inductor lead wire welding jig according to claim 3, characterized in that: A receiving groove is provided at the bottom of the installation groove, the magnet is arranged in the receiving groove and the top surface of the magnet is flush with the bottom of the installation groove, and the receiving groove and the magnet are both cylindrical.

5. The inductor lead wire welding jig according to claim 4, characterized in that: The guide groove is opened on the surface of the carrier for opening the installation groove. One end of the guide groove is connected to the installation groove, and the other end passes through the side of the carrier. There are two guide grooves and they are respectively located on both sides of the installation groove. The two guide grooves are respectively used to accommodate lead wires.

6. The inductor lead wire welding jig according to claim 5, characterized in that: The carrier is a strip-shaped structure with an isosceles trapezoidal cross section. The mounting groove is provided on the surface of the carrier with the largest area. Handle bars are also provided at both ends of the carrier.

7. The inductor lead wire welding jig according to any one of claims 1 to 6, characterized in that: The anti-slip mechanism comprises: a first baffle, wherein a first rotating shaft is disposed at one end of the first baffle, the first rotating shaft is rotatably assembled on the carrier, and the first baffle is used to prevent the inductor from escaping from the mounting groove; a torsion spring, the torsion spring being arranged between the first rotating shaft and the carrier to drive the first rotating shaft to rotate; and A limiting protrusion is provided on the carrier, and is used to stop the first baffle plate so that the first baffle plate stops at the notch of the installation groove.

8. The inductor lead wire welding jig according to claim 7, characterized in that: The side of the first baffle is also connected to a second baffle. When the first baffle is stopped at the notch, the second baffle is located at the guide groove to prevent the lead wire from falling out.

9. The inductor lead wire welding jig according to claim 8, characterized in that: The second baffle is provided with a through hole, in which a pressing plate is provided. The pressing plate can move along the length direction of the through hole, and the pressing plate is used to align the guide groove and to press the lead-out wire in the guide groove.

10. The inductor lead wire welding jig according to claim 9, characterized in that: A third baffle is provided on the second baffle, one end of the third baffle is rotatably connected to the second baffle via a second rotating shaft, and the third baffle is used to swing to the through hole and contact the pressing plate to keep the pressing plate in a pressed state.

Citation Information

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