Large-size screen laminating device

Abstract

The utility model relates to the technical field of screen laminating, in particular to a large-size screen laminating device which comprises a workbench. The positioning assembly is arranged on the workbench and used for positioning the cover plate; the adsorption assembly is used for adsorbing a module so that the module can be attached to the cover plate; wherein the cover plate is arranged on the lower portion, and the module is arranged on the upper portion. According to the application, through the fitting mode that the cover plate is arranged on the lower portion and the module is arranged on the upper portion, as the cover plate is high in hardness and not easy to collapse and bend, the cover plate and the module can be smoothly fitted, and the phenomena of bubbles and mura occurring in the fitting process are avoided as much as possible. And by arranging the positioning assembly and the adsorption assembly, the cover plate can be conveniently positioned, the module can be conveniently adsorbed, the laminating efficiency can be improved, and a better laminating effect can be achieved.

Description

Technical Field

[0001] The present application relates to the technical field of screen lamination, and in particular to a large-size screen lamination device. Background Art

[0002] With the development of LCD touch technology, industrial control touch screens are increasingly used in the industrial field. Currently, the main industrial touch screens on the market are capacitive touch screens and resistive touch screens. The touch panel is fixed on the LCD screen through industrial touch screen bonding technology. We generally divide the LCD touch screen into three components, from top to bottom, they are glass cover, touch panel (CTP or RTP), and LCD screen. Only after these three parts are bonded through bonding technology can a complete industrial touch screen be formed. There are three types of industrial touch screen bonding technologies: full bonding technology, frame bonding technology, and zero bonding technology.

[0003] At present, when laminating large-size screens, the glass cover is first laminated with OCA (special adhesive for bonding transparent optical elements) and then with the module, with the module at the bottom and the glass cover at the top. However, since large-size screen modules are prone to deformation, the modules are prone to slight downward deformation under their own gravity during lamination, resulting in mura (mura refers to the uneven brightness in LCD displays, i.e., dark or inconsistent brightness areas on the screen) and bubbles between the glass cover and the module during lamination. Utility Model Content

[0004] Based on this, it is necessary to provide a large-size screen bonding device to address the problem that mura and bubbles are easily generated when large-size screens are bonded.

[0005] According to one aspect of the present application, a large-size screen laminating device is provided, comprising:

[0006] Workbench;

[0007] A positioning assembly is arranged on a workbench, and is used to position the cover plate;

[0008] The adsorption component is used for adsorbing the module. The adsorption component is arranged above the workbench and can move in a vertical direction relative to the workbench so as to make the module fit with the cover plate.

[0009] In one of the embodiments, the positioning component includes a positioning frame, a placement groove is formed on the positioning frame, a plurality of mounting holes are formed in the positioning frame, and an elastic component is disposed in each of the mounting holes, and the elastic component supports the positioning frame.

[0010] In one embodiment, the elastic component includes a connecting column, a supporting column and an elastic member, the connecting column is arranged in the mounting hole, a connecting groove is formed in the connecting column, the elastic member is arranged in the connecting groove, at least a portion of the supporting column is arranged in the connecting groove, one end of the elastic member contacts the bottom wall of the connecting groove, and the other end contacts the supporting column, and the elastic member is configured to undergo recoverable deformation when the supporting column supports the positioning frame.

[0011] In one of the embodiments, the positioning frame is provided with notches, the notches are arranged at four corners of the placement slot, and the notches are communicated with the placement slot.

[0012] In one of the embodiments, a taking-and-placing groove is provided on the positioning frame, and the taking-and-placing groove is communicated with the placement groove to facilitate taking and placing of the cover plate.

[0013] In one of the embodiments, a buffer hole is opened on the top wall of the positioning frame, a buffer column and a buffer spring are arranged in the buffer hole, the buffer spring is arranged in the buffer hole, one end of the buffer column is in contact with the buffer spring, the buffer column is used to contact the adsorption component, and the buffer spring is configured to undergo a recoverable deformation when the buffer column contacts the adsorption component.

[0014] In one of the embodiments, the adsorption assembly includes an adsorption plate and a suction cup, wherein the suction cup is mounted on the adsorption plate and is provided in a plurality of numbers, the suction cup is used to adsorb the module, and a vacuum suction piece is externally connected to the suction cup, and the vacuum suction piece is communicated with the suction cup.

[0015] In one of the embodiments, a lifting component is installed on the workbench, the lifting component is rotatably connected to the workbench, and the lifting component is connected to the adsorption component.

[0016] In one embodiment, the lifting assembly includes a lifting rod, a lifting slot is defined in the lifting rod, a lifting column is disposed in the lifting slot, a lifting spring is sleeved on the lifting column, one end of the lifting spring is in contact with the adsorption assembly, and the other end is in contact with the bottom wall of the lifting slot, and the lifting spring is configured to undergo a recoverable deformation when in contact with the adsorption assembly.

[0017] In one of the embodiments, a loading platform is provided on one side of the workbench, the loading platform is used to place the module, and the adsorption component can move between the workbench and the loading platform.

[0018] The above-mentioned large-size screen laminating device is provided with the cover plate at the bottom and the module at the top. Since the cover plate is hard and not easy to collapse or bend, the cover plate and the module can be smoothly laminated, and bubbles and mura phenomena in the laminating process can be avoided as much as possible. The positioning component and the adsorption component are provided to facilitate the positioning of the cover plate and the adsorption of the module, which helps to improve the laminating efficiency and achieve a better laminating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG. 1 is a schematic structural diagram of a large-size screen laminating device in the prior art.

[0020] FIG. 2 is a schematic diagram of the structure of a large-size screen bonding device in an embodiment of the present application.

[0021] Figure 3 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0022] Figure 4 It is a top view of a positioning frame in one embodiment of the present application.

[0023] Figure 5 Schematic diagram of the structure of an elastic component in one embodiment of the present application.

[0024] Figure 6 It is a cross-sectional view of a positioning frame in one embodiment of the present application.

[0025] Figure 7 Schematic diagram of the structure of a lifting assembly in one embodiment of the present application.

[0026] Figure 8 Schematic diagram of the positional relationship between the loading platform and the workbench in one embodiment of the present application.

[0027] Description of reference numerals:

[0028] 10. Workbench; 110. Module; 120. Cover; 20. Positioning assembly; 210. Positioning frame; 220. Placement slot; 230. Notch; 240. Mounting hole; 250. Buffer hole; 260. Buffer column; 270. Buffer spring; 280. Pick-and-place slot; 30. Adsorption assembly; 310. Adsorption plate; 320. Suction cup; 330. Vacuum adsorption component; 40. Elastic assembly; 410. Connecting column; 4110. Connecting slot; 420. Support column; 430. Elastic component; 50. Lifting assembly; 510. Lifting rod; 520. Lifting slot; 530. Lifting column; 540. Lifting spring; 60. Loading table. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0030] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0031] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0032] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0033] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0035] Referring to FIG. 1 , FIG. 1 is a schematic diagram of the structure of laminating a large-size screen in the prior art. At present, when laminating a large-size screen, the cover plate 120 is firstly laminated with the OCA and then with the module 110, wherein the module 110 is at the bottom and the glass cover plate 120 is at the top. However, since the large-size screen module 110 is easy to deform, during lamination, the module 110 is easy to deform slightly downward under the action of its own gravity, resulting in mura and bubbles between the glass cover plate 120 and the module 110 during lamination.

[0036] See Figure 2 and Figure 3 , FIG2 shows a schematic diagram of the structure of a large-size screen bonding device in an embodiment of the present application. The large-size screen bonding device provided in an embodiment of the present application includes a workbench 10, on which a positioning assembly 20 is provided, and the positioning assembly 20 is used to position the cover plate 120. It also includes an adsorption assembly 30, and the adsorption assembly 30 is used to adsorb the module 110. After the adsorption assembly 30 adsorbs the module 110, the module 110 is moved to the top of the cover plate 120 for bonding. Since the cover plate 120 has a high hardness and is not easy to collapse and bend, by setting the cover plate 120 at the bottom and the module 110 at the top, the cover plate 120 and the module 110 can be bonded smoothly, and bubbles and mura phenomena that occur during the bonding process can be avoided as much as possible.

[0037] For details, see Figure 3 and Figure 4The positioning assembly 20 includes a positioning frame 210, which is fixed on the workbench 10. The positioning frame 210 is provided with a placement groove 220, which is used to place the cover plate 120. The positioning frame 210 is also provided with a pick-up and placement groove 280, which is connected to the placement groove 220 and extends to the side wall of the positioning frame 210, so as to facilitate the pick-up and placement operation of the cover plate 120.

[0038] See also Figure 3 and Figure 4 The positioning frame 210 is also provided with a notch 230, which is connected with the placement groove 220. The notch 230 is arranged at the four corners of the placement groove 220. By setting the notch 230, the cover plate 120 is placed into the inner opening of the placement groove 220, which can reduce the contact area between the cover plate 120 and the inner wall of the placement groove 220, and try to avoid vacuum adsorption between the cover plate 120 and the placement groove 220. After the cover plate 120 and the module 110 are bonded, it is convenient to remove the cover plate 120.

[0039] See also Figure 3 and Figure 4 The positioning frame 210 is also provided with a plurality of mounting holes 240, which are arranged at intervals on the positioning frame 210. Each mounting hole 240 is connected to the placement slot 220, and the mounting holes 240 are arranged at the four corners of the placement slot 220. An elastic component 40 is arranged in each mounting hole 240, combined with Figure 5 The elastic component 40 includes a connecting column 410, a supporting column 420 and an elastic member 430. The connecting column 410 is fixed in the mounting hole 240. A connecting groove 4110 with a top opening is provided in the connecting column 410. The elastic member 430 is arranged in the connecting groove 4110. One end of the supporting column 420 is arranged in the connecting groove 4110. One end of the elastic member 430 is in contact with the inner bottom wall of the connecting groove 4110, and the other end is in contact with the bottom wall of the supporting column 420. The supporting column 420 is used to support the cover plate 120. The elastic member 430 is configured to undergo a recoverable deformation when the supporting column 420 supports the positioning frame 210.

[0040] In this embodiment, the elastic member 430 is specifically a spring. By providing the elastic component 40, when the cover plate 120 and the module 110 are attached, the rigid contact between the cover plate 120 and the positioning frame 210 can be avoided as much as possible, so that the cover plate 120 can be protected during the attachment, which helps to achieve a better attachment effect. In some embodiments, a rubber column can be provided in the mounting hole 240, and the rubber column contacts the cover plate 120 to achieve flexible contact between the cover plate 120 and the positioning frame 210.

[0041] It is understandable that in some embodiments, the positioning frame 210 is detachably connected to the workbench 10, and the positioning frame 210 can be fixed to the workbench 10 by screws, so that the positioning frame 210 can be easily replaced, and different positioning frames 210 can be replaced to adapt to covers 120 of different sizes.

[0042] See also Figure 4 and Figure 6 A plurality of buffer holes 250 are provided on the top wall of the positioning frame 210. The plurality of buffer holes 250 are arranged at intervals on the positioning frame 210. A buffer column 260 and a buffer spring 270 are arranged in the buffer hole 250. The buffer spring 270 is configured to be deformed in a restorable manner when the buffer column 260 contacts the adsorption component 30. One end of the buffer spring 270 contacts the inner bottom wall of the buffer hole 250, and the other end contacts the buffer column 260. Figure 3 The top wall of the buffer column 260 is used to contact the adsorption assembly 30. By providing the buffer spring 270, when the cover plate 120 and the module 110 are pressed together, it can play a buffering role for the adsorption assembly 30, and try to avoid damage to the cover plate 120 and the module 110 caused by excessive pressing force, thereby protecting the cover plate 120 and the module 110.

[0043] For details, see Figure 7 , the adsorption component 30 can be independently arranged on one side of the workbench 10, or can be installed on the workbench 10. In the present embodiment, the adsorption component 30 is preferably installed on the workbench 10. A lifting component 50 is installed on the workbench 10, and the lifting component 50 is arranged on the workbench 10. The lifting component 50 includes a lifting rod 510, and the lifting rod 510 is rotatably installed on the workbench 10. A lifting slot 520 is provided in the lifting rod 510, and a lifting column 530 is provided in the lifting slot 520, and the adsorption component 30 is arranged on the lifting column 530. A lifting spring 540 is sleeved on the lifting column 530, and one end of the lifting spring 540 contacts the adsorption component 30, and the other end contacts the bottom wall of the lifting slot 520. The lifting spring 540 is configured to undergo a recoverable deformation when in contact with the adsorption component 30. Under the action of the pressing device or other external force, the adsorption component 30 is driven to move downward, and the adsorption component 30 compresses the lifting spring 540, and the lifting spring 540 contracts until the cover plate 120 and the module 110 are attached to each other, and then the external force is removed, and the adsorption component 30 is reset under the action of the spring. Figure 3 A guide assembly 70 is provided on the other side of the workbench. The structure of the guide assembly 70 is the same as that of the lifting assembly 50 and will not be repeated here. However, the guide assembly 70 and the adsorption assembly 30 are only in contact but not connected. It is only used to guide the lifting and lowering of the adsorption assembly 30 to ensure stable lifting and lowering of the adsorption assembly 30.

[0044] See also Figure 3The adsorption assembly 30 includes an adsorption plate 310 and a suction cup 320. The adsorption plate 310 is fixed on the lifting rod 510. The suction cup 320 is installed on the adsorption plate. There are several suction cups 320, which are arranged at the four corners of the adsorption plate 310. The suction cups 320 are used to adsorb the four corners of the module 110. The suction cup 320 is externally connected to a vacuum adsorption component 330. The vacuum adsorption component 330 is specifically a vacuum pump in this application. The vacuum adsorption component 330 is connected to the suction cup 320 through a pipeline. The vacuum adsorption component 330 can be fixed on the adsorption plate 310 or arranged outside the workbench 10, which is not limited here. Under the adsorption action of the vacuum adsorption component 330, the module 110 is adsorbed and positioned, so that the module 110 can be moved to the top of the cover plate 120 to achieve bonding.

[0045] In some embodiments, see Figure 3 and Figure 8 , the lifting component 50 can also be rotatably connected to the workbench 10. The lifting component 50 can be directly driven to rotate by a motor, or driven to rotate by a motor and a gear set (not shown in the figure), which is not limited here. A loading platform 60 can be provided on one side of the workbench 10. The loading platform 60 is used to place the module 110. The lifting component 50 drives the adsorption component 30 to rotate between the loading platform 60 and the workbench 10 to absorb the module 110 on the loading platform 60, and then rotate the module 110 to move it above the workbench 10. It should be noted that there is no connection between the adsorption component and the guide component, and it will not limit the rotation of the adsorption component between the loading platform 60 and the workbench 10.

[0046] It is understandable that, in some embodiments, a robotic arm may be provided on one side of the workbench 10 , and the adsorption assembly 30 may be connected via the robotic arm to achieve the transportation and adsorption of the module 110 , which is not limited here.

[0047] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A large-size screen laminating device, characterized in that: include: Workbench; A positioning assembly is arranged on a workbench, and is used to position the cover plate; The adsorption component is used for adsorbing the module. The adsorption component is arranged above the workbench and can move in a vertical direction relative to the workbench so as to make the module fit with the cover plate.

2. The large-size screen laminating device according to claim 1, characterized in that: The positioning component comprises a positioning frame, a placement slot is provided on the positioning frame, a plurality of mounting holes are provided in the positioning frame, and an elastic component is provided in each of the mounting holes, and the elastic component supports the positioning frame.

3. The large-size screen laminating device according to claim 2, characterized in that: The elastic component includes a connecting column, a supporting column and an elastic member, the connecting column is arranged in the mounting hole, a connecting groove is opened in the connecting column, the elastic member is arranged in the connecting groove, at least a part of the supporting column is arranged in the connecting groove, one end of the elastic member contacts the bottom wall of the connecting groove, and the other end contacts the supporting column, and the elastic member is configured to undergo restorable deformation when the supporting column supports the positioning frame.

4. The large-size screen laminating device according to claim 2, characterized in that: The positioning frame is provided with notches, which are arranged at the four corners of the placement slot and are communicated with the placement slot.

5. The large-size screen laminating device according to claim 2, characterized in that: The positioning frame is provided with a taking-and-placing groove, which is communicated with the placing groove, so as to facilitate taking and placing of the cover plate.

6. The large-size screen laminating device according to claim 2, characterized in that: A buffer hole is provided on the top wall of the positioning frame, and a buffer column and a buffer spring are arranged in the buffer hole. The buffer spring is arranged in the buffer hole, and one end of the buffer column is in contact with the buffer spring. The buffer column is used to contact the adsorption component, and the buffer spring is configured to undergo a recoverable deformation when the buffer column contacts the adsorption component.

7. The large-size screen laminating device according to claim 1, characterized in that: The adsorption assembly includes an adsorption plate and a suction cup, wherein the suction cup is mounted on the adsorption plate and is provided in a plurality of pieces, and the suction cup is used to adsorb the module, and a vacuum suction piece is externally connected to the suction cup, and the vacuum suction piece is communicated with the suction cup.

8. The large-size screen laminating device according to claim 1, characterized in that: A lifting component is installed on the workbench, the lifting component is rotatably connected to the workbench, and the lifting component is connected to the adsorption component.

9. The large-size screen laminating device according to claim 8, characterized in that: The lifting assembly includes a lifting rod, a lifting slot is provided in the lifting rod, a lifting column is arranged in the lifting slot, a lifting spring is sleeved on the lifting column, one end of the lifting spring contacts the adsorption assembly, and the other end contacts the bottom wall of the lifting slot, and the lifting spring is configured to undergo restorable deformation when in contact with the adsorption assembly.

10. The large-size screen laminating device according to claim 1, characterized in that: A loading platform is provided on one side of the workbench, and the loading platform is used to place the module, and the adsorption component can move between the workbench and the loading platform.

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